Water-jet guided laser processing system for sheet material

Abstract

The utility model provides a water-jet guided laser processing system for sheet materials. The water-jet guided laser processing system comprises a laser; a spectroscope; a focus lens; a water guide processing head; the to-be-machined thin plate is subjected to water-guided laser cutting machining through water jet; the array porous supporting thin plate is attached to the bottom of the to-be-machined thin plate from the bottom direction, and an integrated supporting structure is formed for the to-be-machined thin plate; the first clamp is used for clamping the thin plate to be machined and the array porous supporting thin plate from the upper surface of the thin plate to be machined and the lower surface of the array porous supporting thin plate; and the drainage device is positioned below the array porous supporting thin plate. Thin plate deformation control and water flow control of a water guide laser system are achieved by optimizing the thin plate supporting design, the direction and strength of water flow are accurately controlled, interference of water flow to the thin plate is reduced, the cooling effect and the laser transmission mode are improved, deformation and displacement of thin plate materials are effectively restrained, and the machining precision, stability and surface quality are improved. The problems that in the prior art, thin plate machining precision is poor, and the surface is unstable are solved.

Description

Technical Field

[0001] This utility model relates to the field of water-guided laser processing technology, and more specifically to a water-guided laser processing system for thin sheet materials. Background Technology

[0002] In existing water-guided laser machining of thin sheet materials, the diffusion effect of the water flow easily causes displacement or deformation of the material during processing, leading to a decrease in machining accuracy. Especially during thin sheet machining, the uneven action of the water flow subjects the sheet to unbalanced forces, resulting in minute movements or warping, affecting machining stability. This deformation caused by the water flow not only leads to irregular cutting lines and dimensional deviations in water-guided machining, but also causes thermal stress cracks on the machined surface.

[0003] Through long-term testing and research, the inventor of the utility model discovered that the main reason for the above problems is that the diffusion effect of water flow is not effectively controlled, and the processing system lacks the ability to dynamically adapt to thin plate materials. It cannot accurately compensate for the deformation or displacement caused by water flow, and cannot meet the requirements of high-precision processing of thin plate materials, resulting in problems such as poor precision, poor stability and unstable surface quality in thin plate processing. Utility Model Content

[0004] The purpose of this invention is to provide a water-guided laser processing system for thin sheet materials, which optimizes the support of the thin sheet, realizes water flow control, avoids defects such as deformation, displacement and warping caused by water flow, improves processing accuracy and surface quality, and reduces the defect rate.

[0005] According to a first aspect of the present invention, a water-guided laser processing system for thin sheet materials is provided, comprising:

[0006] Laser;

[0007] Beam splitter;

[0008] Focusing lens;

[0009] A water-guided machining head is used to eject a water jet for machining by coupling a light beam with a water beam.

[0010] The thin plate to be processed, located below the water-guided processing head, is subjected to water-guided laser cutting via the water jet;

[0011] An array of porous support plates is attached to the bottom of the sheet to be processed from the bottom direction, forming an integral support structure for the sheet to be processed.

[0012] The first fixture clamps the sheet metal to be processed and the arrayed porous support sheet metal from the upper surface of the sheet metal to be processed and the lower surface of the arrayed porous support sheet metal; and

[0013] A drainage device located below the array of porous support plates.

[0014] In a further embodiment, the perforations of the arrayed porous support plate are circular or regular hexagonal.

[0015] In a further embodiment, the diameter of the hole is set to 1-5 mm.

[0016] In a further embodiment, the array of porous support plates is a plate supported by a material whose coefficient of thermal expansion matches that of the plate to be processed.

[0017] In a further embodiment, the first fixture uses a multi-point positioning method to clamp the thin plate to be processed and the array of perforated support plates.

[0018] In a further embodiment, the water-guided laser processing system is equipped with a CCD camera to capture images of the cutting area at a set sampling frequency, thereby obtaining images of the processed area.

[0019] In a further embodiment, the control system of the water-guided laser processing system is connected to a CCD camera, and the sampling frequency of the CCD camera is set to capture one frame of image every 0.1 mm movement of the water-guided processing head.

[0020] The significant advantages of the water-guided laser processing system for thin sheet materials described above are:

[0021] To address the defects in processing quality caused by deformation, warping, and movement of thin sheet materials during water-guided laser processing in existing technologies, this utility model proposes a water-guided laser processing system for thin sheet materials. This system features an array of perforated support plates at the bottom of the sheet to be processed, which adhere to the sheet from the bottom to form an integrated support structure. This prevents the sheet from deforming during processing due to the impact of the water jet and other factors, reducing dimensional deviations, cracks, and thermal deformation caused by sheet deformation, and ensuring processing accuracy. Attached Figure Description

[0022] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component shown in the various figures may be denoted by the same reference numeral. For clarity, not every component is labeled in each figure. Embodiments of various aspects of the present invention will now be described by way of example and with reference to the accompanying drawings.

[0023] Figure 1 This is a schematic diagram of a water-guided laser processing system for thin sheet materials according to an embodiment of the present invention.

[0024] Figure 2This is a schematic diagram of an array of porous support plates for a water-guided laser processing system for thin sheet materials according to an embodiment of the present invention.

[0025] Figure 3 This is a schematic diagram of the clamping method of a water-guided laser processing system for thin sheet materials according to an embodiment of the present invention. Detailed Implementation

[0026] To better understand the technical content of this utility model, specific embodiments are provided below in conjunction with the accompanying drawings.

[0027] Various aspects of the present invention are described in this disclosure with reference to the accompanying drawings, which illustrate numerous illustrative embodiments. The embodiments disclosed herein are not necessarily intended to include all aspects of the present invention. It should be understood that the various concepts and embodiments described above, as well as those described in more detail below, can be implemented in any of many ways, because the concepts and embodiments disclosed herein are not limited to any particular implementation. Furthermore, some aspects of the present invention can be used alone or in any suitable combination with other aspects disclosed herein.

[0028] Combination Figure 1-3 The water-guided laser processing system for thin sheet materials shown in the embodiment includes a laser 1, a beam splitter 2, a focusing lens 3, a water-guided processing head 4, a first fixture 6, a drainage device 50, and a control system.

[0029] Combination Figure 1 As shown, the water-guided processing head 4 emits a water jet 5 through coupling of a light beam and a water beam. The thin plate 10 to be processed is held by the first clamp 6 and positioned below the water-guided processing head 4, where it is subjected to water-guided laser cutting by the water jet 5.

[0030] Combination Figure 1 , Figure 2 As shown, the array of porous support plates 20 are attached to the bottom of the sheet 10 to be processed from the bottom direction, forming an integral support structure for the sheet 10 to be processed.

[0031] The first clamp 6 clamps the sheet 10 to be processed and the arrayed porous support sheet 20 from the upper surface of the sheet 10 to be processed and the lower surface of the arrayed porous support sheet 20.

[0032] Preferably, the first clamp 6 uses a multi-point positioning method to clamp the thin plate 10 to be processed and the arrayed perforated support thin plate 20. Combined with... Figure 2 , Figure 3 As shown, for the thin plate 10 to be processed, it is clamped at multiple points from its four corner edges.

[0033] Combination Figure 1As shown, a drainage device 50 is also provided below the array of porous support plates 20 to receive the water flow from the water guide process and discharge it through the guide design.

[0034] As an optional embodiment, the perforated array support plate 20 may have circular or regular hexagonal perforations. The following description uses a regular hexagonal perforation as an example, illustrated in conjunction with the figures.

[0035] The diameter of the hole is set to 1-5mm.

[0036] In a particularly preferred embodiment, the array porous support plate 20 is a plate supported by a material whose coefficient of thermal expansion matches that of the plate to be processed 10, especially by a support material with the same coefficient of thermal expansion. For example, for aluminum alloys, stainless steel, ceramic materials, composite fiber reinforced metal materials (such as CFRP plates), corresponding materials with similar or the same coefficient of thermal expansion can be used for support.

[0037] Based on the above embodiments, this invention addresses the problem of thin-plate displacement and deformation caused by water flow diffusion during water-guided laser processing of thin-plate materials, which in turn affects processing accuracy and surface quality. Existing technologies fail to effectively control water flow diffusion, leading to uneven stress on the thin-plate material during processing, causing displacement or warping, particularly noticeable in high-precision machining. Furthermore, existing technologies lack sufficient control over thermal stress and deformation, and lack effective dynamic compensation mechanisms, resulting in instability during processing. Therefore, this invention optimizes water flow control and improves thin-plate deformation through a thin-plate support design. It can precisely control the direction and intensity of water flow, reduce the impact of water flow diffusion, and simultaneously improve cooling efficiency, preventing deformation caused by thermal stress. This solves the problems of poor processing accuracy, poor stability, and unstable surface quality in existing thin-plate technologies.

[0038] In this embodiment, combined with Figure 1 As shown, the water-guided laser processing system is equipped with a CCD camera 8, which is used to capture images of the cutting area at a set sampling frequency to obtain images of the processing area.

[0039] The control system of the water-guided laser processing system is connected to the CCD camera 8, and the sampling frequency of the CCD camera 8 is set to capture one frame of image every 0.1mm movement of the water-guided processing head 4.

[0040] The control system can be configured with an image processing system, which can calculate the angular deviation between the cut and the vertical direction based on image processing, as the perpendicularity deviation of the cut. Based on the obtained perpendicularity deviation, the perpendicularity deviation of the cut can be corrected through feedback adjustment via dynamic optical adjustment, processing head motion mechanism, etc., to improve processing accuracy and quality.

[0041] The aforementioned embodiment 1 of this utility model designs a water-guided laser processing system with optimized support for thin plate materials. By optimizing the thin plate support design, it achieves deformation control of the thin plate and water flow control of the water-guided laser system. It precisely controls the direction and intensity of the water flow, reduces the interference of the water flow on the thin plate, improves the cooling effect and laser transmission mode, effectively suppresses the deformation and displacement of the thin plate material, and solves the problems of poor processing accuracy and surface instability of thin plates in the prior art.

[0042] Traditional processing of thin plates results in uneven cut edges with burrs and gaps. However, the design proposed in this invention produces cut edges with smooth transitions and no defects such as chipping, burrs, cracks, or gaps. The water-guided laser processing system for thin plate materials designed in this invention can significantly improve processing accuracy, stability, and surface quality.

[0043] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this invention shall be determined by the claims.

Claims

1. A water guided laser processing system for sheet material, characterized in that The invention relates to a water-guided laser processing system, comprising: a laser (1); a beam splitter (2); a focusing lens (3); a water guide processing head (4) for emitting a water jet (5) for processing by coupling a light beam with a water beam; a sheet to be processed (10) located below the water guide processing head (4) for water guide laser processing via the water jet (5); an arrayed porous support sheet (20) attached to the bottom of the sheet to be processed (10) from the bottom direction to form an integrated support structure for the sheet to be processed (10); a first clamp (6) for clamping the sheet to be processed (10) and the arrayed porous support sheet (20) from the upper surface of the sheet to be processed (10) and the lower surface of the arrayed porous support sheet (20); and a drainage device (50) located below the arrayed porous support sheet (20).

2. The water guided laser processing system for sheet material of claim 1, wherein, The arrayed porous support sheet (20) has circular or regular hexagonal holes.

3. A water guided laser processing system for sheet material according to claim 2, characterized in that The diameter of the holes is 1-5 mm.

4. The water-guided laser processing system for sheet materials according to claim 1, characterized by The arrayed porous support sheet (20) is made of a material that matches the thermal expansion coefficient of the sheet to be processed (10).

5. A water guided laser processing system for sheet material according to claim 4, characterized in that The first clamp (6) uses a multi-point positioning method to clamp the sheet to be processed (10) and the arrayed porous support sheet (20).

6. A water guided laser processing system for sheet material according to any one of claims 1-5, characterized in that The water guide laser processing system is provided with a CCD camera (8) for capturing images of the cutting area at a set sampling frequency.

7. A water guided laser processing system for sheet material according to any one of claims 1-5, characterized in that The control system of the water guide laser processing system is connected to the CCD camera (8), and the sampling frequency of the CCD camera (8) is set to take one frame of image every 0.1 mm movement of the water guide processing head (4).

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