Pad pasting tool and machining equipment
By using pad-laying fixtures during the processing of single-crystal SiC substrates, the automated flattening and positioning of processing pads was achieved, solving the problem of difficulty in achieving the required flatness and improving the yield of wafer processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-18
- Publication Date
- 2026-03-13
AI Technical Summary
In the existing technology, during the processing of single-crystal SiC substrates, it is difficult to achieve the required flatness of the processing pads, which leads to a decrease in wafer processing yield.
A pad-applying fixture is used, including a base, an adsorption component, a flattening component, and a lifting component. The adsorption, flattening, and lifting mechanisms enable automated flattening and positioning of the processing pad, and the fixture is adjusted and controlled in real time using pressure and distance sensors.
It improves the flatness and efficiency of the processing pad, simplifies the pad placement process, and increases the yield of wafer processing.
Smart Images
Figure CN223989392U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of substrate processing technology, and more specifically, relates to a pad mounting fixture and processing equipment. Background Technology
[0002] Currently, the ultra-precision machining of single-crystal SiC substrates mainly employs traditional mechanical grinding and polishing methods. The grinding stage primarily involves planarization of the diced wafers to remove traces and other defects. This generally consists of two steps: the first step utilizes cast iron discs, hard abrasive pads, and ultrahard abrasives such as boron carbide and diamond for highly efficient material removal; the second step uses softer abrasive pads and smaller diamond abrasive particles for further material removal. Subsequent polishing processes then yield a high-quality silicon carbide substrate.
[0003] For the double grinding and double polishing processes, grinding pads or polishing pads, hereinafter collectively referred to as processing pads, are required. Since processing pads have a limited lifespan, they need to be replaced frequently. The quality of the processing pad application directly affects the wafer processing yield; large wrinkles in the processing pad can even lead to wafer scrap. However, as the size of double grinding and double polishing machines gradually increases, the difficulty of manually applying pads becomes increasingly high, and achieving the required pad flatness is challenging.
[0004] Based on the above, the technical problem to be solved by this application is that the flatness of the pad is difficult to meet the requirements. Utility Model Content
[0005] The purpose of this application is to address the aforementioned problems in the prior art by proposing a pad-applying fixture and processing equipment, which solves the problem that the flatness of manual pad application is difficult to meet the requirements, simplifies the pad application process, and improves the flatness of the pad application.
[0006] The objective of this application can be achieved through the following technical solution: a pad-applying fixture, comprising: a base having a rotational degree of freedom, the upper surface of the base being used to place a processing pad; an adsorption member disposed within the base and acting on the upper surface of the base to adsorb the processing pad; a flattening assembly comprising: a pressing pad movably disposed on the base; a driving member acting on the pressing pad to give the pressing pad a vertical degree of freedom of movement and a horizontal degree of freedom of rotation; and a lifting assembly disposed below the base and acting on the base to give the upper surface of the base a vertical degree of freedom of movement. Understandably, the upper surface of the base is flat. When applying the pad, the processing pad needs to be laid flat on the upper surface of the base. Then, the suction component adheres to the processing pad, ensuring that the processing pad is basically fixed to the base. The processing pad generally also has a processing layer, an adhesive layer, and a protective film. The processing layer is attached to the upper surface of the base, and the adhesive layer is located between the processing layer and the protective film. After the processing pad is flattened on the upper surface of the base, the protective film can be peeled off, exposing the adhesive layer. Then, the base is lifted, and the adhesive layer is bonded to the required position of the grinding or polishing equipment, thus achieving pad application. Among them, the pressing pad component mainly plays the role of flattening the processing pad, and the driving component mainly plays the role of moving the pressing pad component. This allows the pressing pad component to make way for the processing pad when it is placed, and after the pad is placed, it can press down on the processing pad and move to flatten it. During pressing, the base can be rotated manually or mechanically. The pressing pad component and the base can rotate in opposite directions, thereby improving the flattening efficiency. The lifting assembly is mainly for the flattened processing pad. It lifts the base, thereby indirectly raising the processing pad to the required work position for bonding.
[0007] In the aforementioned padding fixture, the flatness of the bottom surface of the padding component is ≤3μm, and the length of the bottom surface of the padding component is not less than the radius of the upper surface of the base. For example, the upper surface of the base is circular or annular. It is understood that by configuring the flatness of the bottom surface of the padding component to ≤3μm, a high degree of flatness is ensured after the padding component is pressed onto the processed pad. Furthermore, by configuring the length of the bottom surface of the padding component to be not less than the radius of the upper surface of the base, it is ensured that the padding component can cover the entire upper surface of the base after rotation.
[0008] In the aforementioned padding fixture, the driving component includes: a rotating module that acts on the padding member to drive it to rotate; and a vertical module connected to one side of the base, which acts on the rotating module to drive it to move vertically. For example, the rotating module is a motor, and the vertical module is an electric cylinder. The output shaft of the motor rotates, causing the padding member to rotate, and the output end of the electric cylinder drives the motor to move vertically, thereby indirectly driving the padding member to move vertically.
[0009] In the aforementioned padding fixture, a pressure sensor is installed within the base. This pressure sensor acts on the upper surface of the base and is communicatively connected to the drive component. It is understood that the pressure sensor detects and acquires the pressure on the upper surface of the base in real time, thereby determining whether the force applied to the padding area is uniform. This data is transmitted to the drive component, which can then adaptively adjust the padding based on this data, such as increasing / decreasing its movement speed or rotational speed, or adjusting the pressure application height.
[0010] In the aforementioned padding fixture, the lifting assembly includes a drive motor positioned below the base. The drive motor has an output shaft with a gear meshing with it. The gear meshes with a rack, the end of which is rotatably connected to the base. It can be understood that by using gears, racks, and other transmission components, the rotational motion of the drive motor's output shaft can be converted into the linear motion of the rack, thereby causing the base to move vertically up and down.
[0011] In the aforementioned padding fixture, there are multiple sets of lifting components, and these multiple sets of lifting components are arranged symmetrically around the center of the upper surface of the base. It can be understood that by symmetrically arranging multiple sets of lifting components below the base, the stability of the base's lifting is improved, and the upper surface of the base remains parallel to the horizontal plane after lifting.
[0012] In the aforementioned padding fixture, a distance sensor is also provided on the base. The distance sensor has a detection end that faces away from the upper surface of the base, and the distance sensor is communicatively connected to the lifting assembly. It can be understood that by setting a distance sensor on the base, the distance between the base and the grinding or polishing equipment can be detected, and by communicating with the lifting assembly, data can be transmitted in real time to control the lifting assembly's movement.
[0013] In the aforementioned pad-attaching fixture, the adsorption element is a conductive layer, which electrostatically adsorbs the processing pad; alternatively, the adsorption element is a vacuum adsorption layer, which vacuum-adsorbs the processing pad. It can be understood that by energizing the conductive layer to achieve electrostatic adsorption of the processing pad, or by evacuating the vacuum adsorption layer to achieve vacuum adsorption of the processing pad, both methods can quickly adsorb and fix the processing pad, or quickly detach it from the processing pad.
[0014] In the aforementioned padding fixture, a clearance opening is provided through the base, which is used for installation clearance. It can be understood that by providing a clearance opening on the base, clearance is made for grinding or polishing equipment.
[0015] Another object of this application is to provide a processing apparatus, including the pad-applying fixture described above. It is understood that the processing apparatus is a grinding or polishing apparatus. After applying the pad-applying fixture of this application, the processing apparatus can achieve rapid pad application with a high degree of flatness.
[0016] Compared with the prior art, this application has the following beneficial effects:
[0017] 1. This application uses a pressure pad to flatten the processing pad and a driving component to move the pressure pad, so that the pressure pad can make way for the processing pad when the pad is placed, and can press down on the processing pad and move to flatten it after the pad is placed. When pressing the pad, the base can be rotated manually or mechanically, and the pressure pad and the base can rotate in opposite directions, thereby improving the flattening efficiency.
[0018] 2. This application uses a pressure sensor to detect and obtain the pressure on the upper surface of the base in real time, thereby determining whether the force in the action area of the pressure pad is uniform, and transmitting the data information to the driving component. The driving component can then adjust the pressure pad adaptively based on the data information.
[0019] 3. This application can detect the distance between the base and the grinding or polishing equipment by setting a distance sensor on the base, and can transmit data in real time by communicating with the lifting component to control the lifting of the lifting component. Attached Figure Description
[0020] Figure 1 This is a three-dimensional structural diagram of the padding fixture of this application;
[0021] Figure 2 This is a simplified structural diagram of the base of this application;
[0022] Figure 3 This is a simplified structural diagram of the lifting assembly of this application;
[0023] In the diagram, 100 is the base; 110 is the pressure sensor; 120 is the distance sensor; 130 is the clearance port; 200 is the adsorption component; 300 is the flattening assembly; 310 is the pressure pad; 320 is the driving component; 321 is the rotating module; 322 is the vertical module; 400 is the lifting assembly; 410 is the drive motor; 411 is the output shaft; 420 is the gear; and 430 is the rack. Detailed Implementation
[0024] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0025] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0027] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0028] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0029] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0030] Please refer to the attached diagram in the instruction manual. Figure 1 The pad-applying fixture of this application includes a base 100, an adsorption component 200, a flattening assembly 300, and a lifting assembly 400. The base 100 has rotational freedom, and its upper surface is used to place the processing pad. The adsorption component 200 is disposed within the base 100 and acts on the upper surface of the base 100 to adsorb the processing pad. The flattening assembly 300 includes a pressing pad 310 and a driving component 320. The pressing pad 310 is movably disposed on the base 100, and the driving component 320 acts on the pressing pad 310 to give it vertical movement and horizontal rotation freedom. The lifting assembly 400 is disposed below the base 100 and acts on the base 100 to give the upper surface of the base 100 vertical movement freedom. Understandably, the upper surface of the base 100 is configured as a flat surface. When applying the pad, the processing pad needs to be laid flat on the upper surface of the base 100, and then the adsorption component 200 is used to adsorb the processing pad to ensure that the processing pad is basically fixed to the base 100. The processing pad generally also has a processing layer, an adhesive layer and a protective film. The processing layer is attached to the upper surface of the base 100, and the adhesive layer is located between the processing layer and the protective film. After the processing pad is laid flat on the upper surface of the base 100, the protective film can be peeled off to expose the adhesive layer. Then the base 100 is lifted to bond the adhesive layer to the required position of the grinding or polishing equipment, thereby realizing the pad application. The pressing component 310 of the flattening assembly 300 primarily serves to flatten the processing pad, while the driving component 320 mainly drives the pressing component 310 to move. This allows the pressing component 310 to make way for the processing pad when it is placed, and to press down on the processing pad and flatten it after placement. During pressing, the base 100 can be rotated manually or mechanically, and the pressing component 310 and the base 100 can rotate in opposite directions, thereby improving flattening efficiency. The lifting assembly 400 is mainly for the flattened processing pad, lifting the base 100 to indirectly lift the processing pad to the required position for bonding.
[0031] In some embodiments, the upper surface of the base 100 is circular or annular, the flatness of the bottom surface of the pressure pad 310 is ≤3μm, and the length of the bottom surface of the pressure pad 310 is not less than the radius of the upper surface of the base 100. It is understood that by configuring the flatness of the bottom surface of the pressure pad 310 to ≤3μm, a high degree of flatness is ensured after the pressure pad 310 is pressed down onto the processed pad. Furthermore, by configuring the length of the bottom surface of the pressure pad 310 to be not less than the radius of the upper surface of the base 100, it is ensured that the pressure pad 310 can cover the entire upper surface of the base 100 after rotation.
[0032] In some embodiments, the drive unit 320 includes a rotating module 321 and a vertical module 322. The rotating module 321 acts on the pressure pad 310 to drive the pressure pad 310 to rotate. The vertical module 322 is connected to one side of the base 100 and acts on the rotating module 321 to drive the vertical module 322 to move vertically. For example, the rotating module 321 is a motor, and the vertical module 322 is an electric cylinder. The rotation of the output shaft 411 of the drive motor 410 drives the pressure pad 310 to rotate, and the output end of the electric cylinder drives the drive motor 410 to move vertically, thereby indirectly driving the pressure pad 310 to move vertically.
[0033] See Figure 2 In some embodiments, a pressure sensor 110 is provided within the base 100. The pressure sensor 110 acts on the upper surface of the base 100 and is communicatively connected to the drive unit 320. It is understood that the pressure sensor 110 detects and acquires the pressure on the upper surface of the base 100 in real time, thereby determining whether the force applied to the area of the pressure pad 310 is uniform. This data is then transmitted to the drive unit 320, which can then adaptively adjust the pressure pad 310 based on the data, such as increasing / decreasing its moving speed or rotational speed, or adjusting the pressure application height.
[0034] Continue to refer to Figure 2 In some embodiments, a distance sensor 120 is also provided on the base 100. The distance sensor 120 has a detection end that faces away from the upper surface of the base 100, and the distance sensor 120 is communicatively connected to the lifting assembly 400. It is understood that by providing the distance sensor 120 on the base 100, the distance between the base 100 and the grinding or polishing equipment can be detected, and by communicating with the lifting assembly 400, data can be transmitted in real time to control the lifting of the lifting assembly 400.
[0035] See Figure 3In some embodiments, the lifting assembly 400 includes a drive motor 410, which is disposed below the base 100. The drive motor 410 has an output shaft 411, on which a gear 420 is mounted. The gear 420 meshes with a rack 430, and the end of the rack 430 is rotatably connected to the base 100. It is understood that by providing transmission components such as the gear 420 and rack 430, the rotational motion of the output shaft 411 of the drive motor 410 can be converted into the linear motion of the rack 430, thereby driving the base 100 to move vertically up and down.
[0036] In some embodiments, there are multiple sets of lifting components 400, and the multiple sets of lifting components 400 are arranged symmetrically about the center of the upper surface of the base 100. It can be understood that by symmetrically arranging multiple sets of lifting components 400 below the base 100, the stability of the lifting of the base 100 is improved, and the upper surface of the base 100 after lifting remains parallel to the horizontal plane.
[0037] In some embodiments, the adsorption element 200 is a conductive layer that electrostatically adsorbs the processing pad; or, the adsorption element 200 is a vacuum adsorption layer that vacuum adsorbs the processing pad. It is understood that by energizing the conductive layer to achieve electrostatic adsorption of the processing pad, or by evacuating the vacuum adsorption layer to achieve vacuum adsorption of the processing pad, both methods can quickly adsorb and fix the processing pad, or quickly detach it from the processing pad.
[0038] In some embodiments, a clearance opening 130 is provided through the base 100 for mounting clearance. It is understood that by providing the clearance opening 130 on the base 100, clearance is provided for grinding or polishing equipment.
[0039] The processing equipment of this application (not shown in the figure) includes the pad-applying fixture of this application. It is understood that the processing equipment is a grinding equipment or a polishing equipment. After the processing equipment uses the pad-applying fixture of this application, it can achieve rapid pad application and the flatness of the pad is high.
[0040] Beneficial effects:
[0041] This application uses a pressure pad 310 to flatten the processing pad, and a drive unit 320 to move the pressure pad 310. This allows the pressure pad to make way for the processing pad when it is placed, and to press down on the processing pad and flatten it after placement. During pressure, the base 100 can be rotated manually or mechanically, and the pressure pad 310 and the base 100 can rotate in opposite directions, thereby improving the flattening efficiency. A pressure sensor 110 detects and acquires the pressure on the upper surface of the base 100 in real time, thereby determining whether the force in the area of action of the pressure pad 310 is uniform. The data is transmitted to the drive unit 320, which can adaptively adjust the pressure pad 310 based on the data. A distance sensor 120 is installed on the base 100 to detect the distance between the base 100 and the grinding or polishing equipment. By communicating with the lifting assembly 400, the distance sensor 120 can transmit data in real time to control the lifting assembly 400.
[0042] The specific embodiments described herein are merely illustrative examples of the spirit of this application. Those skilled in the art to which this application pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of this application or exceeding the scope defined by the appended claims.
Claims
1. A patch tool, characterized by, The utility model relates to a processing platform, including: a base (100) with a rotating freedom degree, the upper surface of the base (100) is used for placing a processing pad; a suction accessory (200) arranged in the base (100) and acting on the upper surface of the base (100) to adsorb the processing pad; a flattening assembly (300) including: a pressing pad (310) movably arranged on the base (100); a driving member (320) acting on the pressing pad (310) to make the pressing pad (310) have the freedom degree of vertical movement and horizontal rotation; and a lifting assembly (400) arranged below the base (100) and acting on the base (100) to make the upper surface of the base (100) have the freedom degree of vertical movement.
2. The pad tooling of claim 1, wherein, The upper surface of the base (100) is circular or annular, the flatness of the bottom surface of the pressing pad (310) is less than or equal to 3 microns, and the length of the bottom surface of the pressing pad (310) is not less than the radius of the upper surface of the base (100).
3. The pad tooling of claim 1, wherein, The driving member (320) includes: a rotating module (321) acting on the pressing pad (310) to drive the pressing pad (310) to rotate; a vertical module (322) connected to one side of the base (100), the vertical module (322) acting on the rotating module (321) to drive the vertical module (322) to move vertically.
4. The pad assembly tool of claim 1, wherein The base (100) is provided with a pressure sensor (110) acting on the upper surface of the base (100), and the pressure sensor (110) is communicatively connected to the driving member (320).
5. The pad assembly tool of claim 1, wherein The lifting assembly (400) includes a driving motor (410) arranged below the base (100), the driving motor (410) has an output shaft (411), the output shaft (411) is provided with a gear (420), the gear (420) is meshingly connected to a rack (430), and the end of the rack (430) is rotatably connected to the base (100).
6. The pad tool of claim 5, wherein The lifting assembly (400) is multiple groups, and the multiple groups of lifting assemblies (400) are symmetrically arranged at the center of the upper surface of the base (100).
7. The paster tooling of claim 1, wherein, The base (100) is further provided with a distance sensor (120) having a detection end facing away from the upper surface of the base (100), and the distance sensor (120) is communicatively connected to the lifting assembly (400).
8. The pad assembly tool of claim 1, wherein, The suction accessory (200) is a conductive layer for electrostatically adsorbing the processing pad, or the suction accessory (200) is a vacuum adsorption layer for vacuum adsorbing the processing pad.
9. The paster tooling of claim 1, wherein, The base (100) is provided with a through-positioning opening (130) for installing a positioning device.
10. A processing apparatus characterized by comprising: The kit includes the pad of any one of claims 1-9.