Temperature control module of power supply structure

Abstract

The utility model discloses a temperature control module of a power supply structure, which relates to the technical field of power supply thermal management and comprises a shell and a radiating assembly. The shell comprises a plurality of installation cavities penetrating through the two ends of the shell and used for embedding a power source, the inner wall of each installation cavity comprises a plurality of heat conduction walls and a plurality of inner concave walls, the heat conduction walls and the inner concave walls are arranged at intervals around the axis of the installation cavity, and the inner concave walls are arranged in a concave mode in the direction towards the inner cavity of the shell to form heat dissipation air channels penetrating through the two ends of the shell. The heat dissipation assembly comprises a phase change filler and a fan assembly; according to the technical scheme of the utility model, temperature control processing can be performed on a plurality of power supply structures at the same time, switching of a plurality of cooling modes can be realized through combination of two heat dissipation structures, and efficient cooling processing on a plurality of power supplies can be realized in the actual use process.

Description

Technical Field

[0001] This utility model relates to the field of power supply thermal management technology, and in particular to a temperature control module for a power supply structure. Background Technology

[0002] Energy storage power supplies provide power to various electrical devices during use. However, the power supply structure itself generates heat during operation. If this heat is not managed promptly, it can lead to overheating, affecting the power supply's normal operation. Therefore, fans are typically used to dissipate heat. Traditional cooling structures are mostly single-layer designs and cannot combine multiple cooling mechanisms to control and regulate the power supply temperature. Their cooling effect is limited and often fails to meet actual usage requirements. Utility Model Content

[0003] The main purpose of this utility model is to propose a temperature control module for a power supply structure, which aims to solve the problem that most traditional heat dissipation structures are single structures and cannot control and adjust the power supply temperature by combining multiple cooling structures according to the power supply temperature. As a result, the cooling and heat dissipation effect is limited during use and cannot meet the actual use needs.

[0004] To achieve the above objectives, the temperature control module of the power supply structure proposed in this utility model includes:

[0005] A housing includes multiple mounting cavities extending through its two ends for mounting a power supply. The inner walls of each mounting cavity include multiple heat-conducting walls and multiple concave walls, which are alternately arranged around the axis of the mounting cavity. The concave walls are recessed towards the inner cavity of the housing to form heat dissipation channels extending through both ends of the housing.

[0006] The heat dissipation assembly includes a phase change filler and a fan assembly. The phase change filler is filled in the inner cavity of the housing, and the fan assembly is disposed on the housing at one end corresponding to one of the plurality of mounting cavities to facilitate the exhaust of hot air from the heat dissipation duct.

[0007] In one embodiment, the thermally conductive wall has a high thermal conductivity layer on one side corresponding to the mounting cavity; and / or,

[0008] The heat-conducting wall has a continuous corrugated inner wall structure on one side of the inner cavity of the shell.

[0009] In one embodiment, the high thermal conductivity layer is composed of a composite of copper and graphene materials; and / or,

[0010] The shell is made of metal.

[0011] In one embodiment, the phase change filler comprises a composite material of paraffin and nano-aluminum powder, and its phase change temperature is between 53°C and 57°C.

[0012] In one embodiment, a heat sink is provided in the heat dissipation duct, and the heat sink is located between one end of each of the two heat-conducting walls.

[0013] In one embodiment, the temperature control module of the power supply structure further includes a circuit board structure, which is mounted on the end of the housing away from the fan assembly, and heat dissipation holes are formed on the circuit board structure corresponding to each of the heat dissipation channels.

[0014] In one embodiment, the circuit board structure is provided with a plurality of conductive parts and a plurality of plug-in parts. Each conductive part is respectively provided at one end of each mounting cavity for electrical connection to a power source. The plurality of plug-in parts are respectively provided at opposite ends of the circuit board for connection to external devices.

[0015] In one embodiment, the housing has a cover portion corresponding to one end of the fan assembly, the cover portion being mounted on one end of the mounting cavity to confine the power supply within the mounting cavity, and the cover portion avoiding the plurality of heat dissipation air ducts.

[0016] In one embodiment, the fan assembly includes a plurality of fans, each of which is mounted on one end of the housing, and one fan corresponds to a plurality of mounting cavities.

[0017] In one embodiment, the housing is further provided with a mounting bracket portion, which is disposed on the outer peripheral wall of the housing for mounting the housing to an external structure; and / or,

[0018] The housing is provided with a protective steel mesh at the end corresponding to the outward direction of the fan.

[0019] This invention provides a solution for simultaneously controlling the temperature of multiple power supply structures. The cooling and heat dissipation structure combines a phase change filler and a fan cooling structure. Specifically, the fan cooling structure and the phase change heat absorption structure are integrated into the same structural feature. While the fan cools the power supply through the cooling duct, it also removes some of the accumulated heat from the casing and phase change filler. Therefore, the combination of these two cooling structures enables switching between multiple cooling modes, achieving efficient cooling for multiple power supplies in practical applications. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 A top view of an embodiment of the temperature control module of the power supply structure provided by this utility model;

[0022] Figure 2 for Figure 1 A side view of the power supply structure provided in the image;

[0023] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure at point AA;

[0024] Figure 4 for Figure 3 A magnified structural diagram of point A in the middle.

[0025] Explanation of icon numbers:

[0026] 100. Temperature control module of power supply structure; 1. Housing; 11. Mounting cavity; 111. Heat-conducting wall; 112. Concave wall; 113. Heat dissipation duct; 114. High thermal conductivity layer; 2. Phase change filler; 3. Heat sink; 4. Fan; 41. Protective steel mesh; 5. Circuit board structure; 51. Connecting part; 21. Movable frame; 6. Cover part; 7. Mounting frame part.

[0027] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0029] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0030] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0031] Energy storage power supplies provide power to various electrical devices during use. However, the power supply structure itself generates heat during operation. If this heat is not managed promptly, it can lead to overheating, affecting the power supply's normal operation. Therefore, fans are typically used to dissipate heat. Traditional cooling structures are mostly single-layer designs and cannot combine multiple cooling mechanisms to control and regulate the power supply temperature. Their cooling effect is limited and often fails to meet actual usage requirements.

[0032] This utility model proposes a temperature control module 100 with a power supply structure to solve the above problems.

[0033] Please see Figure 1 , Figure 3 and Figure 4 In one embodiment of this utility model, the temperature control module 100 of the power supply structure includes a housing 1 and a heat dissipation assembly. The housing 1 includes a plurality of mounting cavities 11 extending through both ends for mounting a power supply. The inner wall of the mounting cavity 11 includes a plurality of heat-conducting walls 111 and a plurality of concave walls 112. Each heat-conducting wall 111 and each concave wall 112 is arranged alternately around the axis of the mounting cavity 11, and the concave wall 112 is recessed toward the inner cavity of the housing 1 to form a heat dissipation duct 113 extending through both ends of the housing 1. The heat dissipation assembly includes a phase change filler 2 and a fan 4 assembly. The phase change filler 2 fills the inner cavity of the housing 1, and the fan 4 assembly is disposed on the housing 1 at one end corresponding to one end of the plurality of mounting cavities 11 to promote the exhaust of hot air in the heat dissipation duct 113.

[0034] In the above embodiment, when the entire temperature control module is in use, multiple power supplies can be placed in multiple mounting cavities 11 respectively. When the power supply is placed inside the mounting cavity 11, multiple heat-conducting walls 111 in the inner wall of the mounting cavity 11 are in contact with the side wall of the power supply. The power supply will generate a certain amount of heat during operation. At this time, the heat-conducting walls 111 that abut against the side wall of the power supply have good thermal conductivity and can transfer the heat generated when in contact with the power supply to the phase change filler 2 inside. The phase change filler 2 has good heat absorption properties. After absorbing a large amount of heat, it can change its storage form, thereby effectively absorbing the heat generated during the operation of the power supply. In addition, in this embodiment, a concave wall 112 is provided between two adjacent heat-conducting walls 111. The concave wall 112 protrudes towards the inner cavity of the housing 1, which can form a heat dissipation channel 113 on one side of the battery sidewall. To enhance heat dissipation, multiple heat-conducting walls 111 are provided, resulting in multiple corresponding heat dissipation ducts 113 formed around the axis of the mounting cavity 11. Both ends of the multiple heat dissipation ducts 113 are connected to the outside of the end of the housing 1. When the fan 4 assembly is operating, it effectively promotes airflow within the heat dissipation ducts, allowing cool air to enter from one end of the heat dissipation duct 113 and heated air to be efficiently exhausted from the other end, thus promoting a decrease in the power supply temperature. The multiple mounting cavities 11 are evenly spaced, effectively ensuring temperature consistency across all battery modules during the entire operation of the temperature control module, minimizing the risk of localized overheating of the battery modules.

[0035] As can be seen from the above, the temperature control module structure is a composite structure that integrates phase change material cooling and air cooling on the housing 1. The heat exchange points are effectively located inside the mounting cavity 11, effectively reducing the overall size of the temperature control module. Furthermore, it employs a wraparound cooling structure, which, compared to traditional localized cooling structures, not only provides better cooling but also more uniform cooling. It is conceivable that the phase change material cooling and the cooling via the fan 4 assembly can be independently controlled during the use of the temperature control module. This allows for targeted cooling regulation at different power supply temperatures. For example, a corresponding temperature sensing element can be placed in the mounting cavity 11 near the power supply. When the power supply temperature is detected at 55 degrees Celsius, cooling can be achieved solely through the phase change filler 2. When the power supply temperature is detected at approximately 60 degrees Celsius, the fan 4 assembly can be activated, achieving efficient cooling of the power supply through the combined action of the phase change material and air cooling. The above-mentioned control methods can help save energy to a certain extent.

[0036] To further improve the thermal conductivity of the heat-conducting wall 111, in one embodiment of this invention, the specific structure of the heat-conducting wall 111 is improved. Specifically, a high thermal conductivity layer 114 is provided on the side of the heat-conducting wall 111 corresponding to the mounting cavity 11. The high thermal conductivity layer 114 is composed of copper and graphene composite materials, with a thermal conductivity ≥600W / (m·K). In actual use, the high thermal conductivity layer 114 directly contacts the power supply sidewall, thereby better transferring the heat from the power supply to the inner wall of the mounting cavity 11. Furthermore, to further improve the heat absorption efficiency of the phase change material, the side of the heat-conducting wall 111 corresponding to the inner cavity of the housing 1 can be configured as a continuous corrugated inner wall structure, such as... Figure 3 As shown, the heat-conducting wall 111 has a wavy sidewall structure corresponding to the inner cavity of the housing 1. This can increase the contact area between the inner cavity of the housing 1 and the phase change filler 2 to a certain extent, thereby maximizing the efficiency of heat conduction and preventing the phase change filler 2 from failing to absorb the heat at the heat-conducting wall 111 in a timely and effective manner, which would lead to a problem of high local temperature in the power supply.

[0037] It is conceivable that setting the side wall structure of the heat-conducting wall 111 corresponding to the inner cavity of the housing 1 in a wavy shape is to increase the heat exchange area. In actual installation, in addition to setting the wall structure as disclosed in the above embodiments, an arc-shaped protrusion structure can also be directly set on the side wall of the heat-conducting wall 111 corresponding to the inner cavity of the housing 1, or the overall side wall structure corresponding to the position of the heat-conducting wall 111 can be set in a wavy shape, including the side wall structure corresponding to the mounting cavity 11. Thus, the entire heat-conducting wall 111 can be set as a partition wall structure with uniform thickness. On the side wall corresponding to the mounting cavity 11, the end that contacts the power supply can be set to a shape corresponding to the side wall of the power supply through the high thermal conductivity layer 114, thereby ensuring sufficient contact with the power supply and achieving a uniform and efficient heat conduction effect.

[0038] The shell 1 is made of metal, which inherently possesses good thermal conductivity. The phase change filler 2 filling its interior effectively absorbs the heat transferred from the shell 1. Specifically, the phase change filler 2 comprises a composite material of paraffin wax and nano-aluminum powder, with a phase change temperature between 53°C and 57°C. When cooling the power supply structure, the phase change filler 2 maintains good heat absorption capacity even when the temperature rises to over 50°C, effectively controlling the power supply temperature within a certain range.

[0039] In order to further improve the heat dissipation effect of the heat dissipation duct 113, in one embodiment of the present invention, a heat sink 3 is provided in the heat dissipation duct 113, and the heat sink 3 is disposed between one end of each of the two heat-conducting walls 111.

[0040] In the above embodiment, the heat sink 3 is made of a highly thermally conductive metal material, and its two ends are connected to two adjacent heat-conducting walls 111. When the entire temperature control module is in use, the heat-conducting walls 111 are in direct contact with the power supply, so their temperature is relatively high. At this time, the heat on the heat-conducting walls 111 can be effectively transferred to the heat sink 3. The heat sink 3 is located in the heat dissipation duct 113, and its two ends have a through-type structure, allowing heat to be discharged outwards. While performing efficient heat dissipation, the fan 4 assembly provides airflow power, which can effectively remove the heat from the heat sink 3 in a timely manner, thereby achieving efficient cooling.

[0041] In another embodiment of this utility model, the end of the heat-conducting wall 111 and the concave wall 112 are transitioned by an arc. Multiple heat sinks 3 can be provided, and these multiple heat sinks 3 can be evenly spaced on the end of the heat-conducting wall 111 and the concave wall 112. Inside the heat dissipation duct 113, the multiple heat sinks 3 are all arranged along the axial direction of the mounting cavity 11, and together with the fan 4 assembly, can achieve a highly efficient heat dissipation effect of the heat dissipation duct 113.

[0042] In one embodiment of this utility model, the temperature control module 100 of the power supply structure further includes a circuit board structure 5. The circuit board structure 5 is mounted on the end of the housing 1 away from the fan 4 assembly. Each heat dissipation duct 113 on the circuit board structure 5 has heat dissipation holes. The circuit board structure 5 is located at one end of the housing 1 corresponding to the plurality of mounting cavities 11, and can electrically connect to the power supplies within the plurality of mounting cavities 11. The circuit board structure 5 is equipped with a corresponding control device, allowing the power supplies within the plurality of mounting cavities 11 to achieve series and parallel output under the control of the circuit board structure 5, thereby adapting to various output requirements and satisfying different output needs. Simultaneously, the plurality of heat dissipation ducts 113 corresponding to the mounting cavities 11 have corresponding clearance portions on the circuit board structure 5, which do not affect the through ventilation effect of the heat dissipation ducts 113, thus achieving efficient heat dissipation of the power supply.

[0043] The circuit board structure 5 is provided with multiple conductive parts and multiple plug-in parts 51. Each conductive part is provided at one end of each mounting cavity 11 for electrical connection to a power source. The multiple plug-in parts 51 are respectively provided at opposite ends of the circuit board for connecting to external devices.

[0044] Specifically, the circuit board structure 5 has multiple conductive parts corresponding to the multiple mounting cavities 11. After the power supply is installed in the mounting cavity 11, the power supply can be electrically connected to the circuit board through the conductive parts, thereby enabling the series and parallel output control of multiple power supplies through the circuit board structure 5. One end of each of the multiple plug-in parts 51 protrudes from the outer wall of the housing 1. In actual use, external devices can be connected to the circuit board structure 5 through the multiple plug-in parts 51, thereby supplying energy through multiple power supplies.

[0045] To ensure the stability of the power supply within the mounting cavity 11, a cover 6 is provided at one end of the housing 1 corresponding to the fan 4 assembly. The cover 6 is installed at one end of the mounting cavity 11 to confine the power supply within the mounting cavity 11, and the cover 6 avoids the plurality of heat dissipation ducts 113. Figure 1 As shown, the cover portion 6 is located at one end of the mounting cavity 11. A flexible contact portion can be provided on the inner side of the cover portion 6. During installation, the cover portion 6 can be installed on the housing 1 by multiple positioning bolts. The cover portion 6 is provided with multiple clearance portions. After the cover portion 6 is installed, the multiple clearance portions can clearance one end of the multiple heat dissipation air ducts 113, so as not to affect the air circulation in the heat dissipation air ducts 113.

[0046] The fan assembly 4 includes multiple fans 4, each of which is mounted on one end of the housing 1, and each fan 4 corresponds to multiple mounting cavities 11. In this embodiment, there are specifically sixteen mounting cavities 11, and the housing 1 is also a cubic structure. Multiple fans 4 are mounted on one end of the housing 1, and it should be noted that each fan 4 corresponds to multiple mounting cavities 11. In this embodiment, one fan 4 corresponds to four mounting cavities 11. During actual cooling, multiple fans 4 can be used in combination according to the power supply temperature to achieve multi-level heat dissipation control, which also helps to save energy to a certain extent.

[0047] Other examples Figure 1 and Figure 2As shown, to facilitate the installation of the entire structure, a mounting bracket 7 is also provided on the housing 1. The mounting bracket 7 is located on the outer peripheral wall of the housing 1 for mounting the housing 1 onto an external structure. It is conceivable that the specific shape of the mounting bracket 7 is not limited; it can be a single bottom mounting bracket 7, or multiple separate mounting brackets 7 around the perimeter of the housing 1, or even an irregularly shaped bracket, etc., and can be specifically designed according to the external installation environment and requirements. Furthermore, to protect the fan 4, a protective steel mesh 41 is provided on the housing 1 at the end corresponding to the outward direction of the fan 4.

[0048] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A temperature control module of a power supply structure, characterized by, The application relates to a power supply structure, which comprises a shell, a plurality of mounting cavities penetrating through two ends of the shell for embedding power supplies, inner walls of the mounting cavities comprising a plurality of heat-conducting walls and a plurality of concave walls, each of the heat-conducting walls and the concave walls being arranged alternately around an axis of the mounting cavities, and the concave walls being concave towards an inner cavity of the shell to form heat dissipation air ducts penetrating through two ends of the shell. The application also relates to a heat dissipation assembly, which comprises a phase change filler filled in the inner cavity of the shell and a fan assembly arranged on the shell corresponding to one end of the mounting cavities for promoting the exhaust of hot air in the heat dissipation air ducts. The heat-conducting wall is provided with a high-heat-conducting layer corresponding to one side of the mounting cavity; and / or The heat-conducting wall is formed with a continuous corrugated inner wall structure corresponding to one side of the inner cavity of the shell.

2. The temperature-controlled module of claim 1, wherein the temperature-controlled module is configured to be mounted on a printed circuit board (PCB) of a power supply structure. The high-heat-conducting layer is composed of copper and graphene materials; and / or The shell is made of a metal material.

3. The temperature-controlled module of claim 2, wherein the temperature-controlled module is configured to be mounted on a printed circuit board (PCB) of a power supply structure. The phase change filler comprises paraffin and nano-aluminum powder composite materials, and the phase change temperature is between 53 DEG C and 57 DEG C. The heat dissipation air duct is provided with a heat dissipation fin arranged between two ends corresponding to the heat-conducting walls.

4. The temperature-controlled module of claim 3, wherein the temperature-controlled module is configured to be mounted on a printed circuit board (PCB) of a power supply structure. The temperature control module of the power supply structure further comprises a circuit board structure mounted on one end of the shell away from the fan assembly, and the circuit board structure is formed with a heat dissipation hole corresponding to each heat dissipation air duct.

5. The temperature-controlled module of claim 1, wherein the temperature-controlled module is configured to be mounted on a printed circuit board (PCB) of a power supply structure. The circuit board structure is provided with a plurality of conducting parts and a plurality of plug-in parts, each of the conducting parts is arranged corresponding to one end of each mounting cavity for electrically connecting the power supply, and the plug-in parts are arranged on opposite ends of the circuit board for connecting external devices.

6. The temperature-controlled module of claim 5, wherein the temperature-controlled module is configured to be mounted on a printed circuit board (PCB) of a power supply structure. The shell is provided with a cover corresponding to one end of the fan assembly, the cover is mounted on one end of the mounting cavity for limiting the power supply in the mounting cavity, and the cover avoids the heat dissipation air ducts.

7. The temperature-controlled module of claim 6, wherein the temperature-controlled module is configured to be mounted on a printed circuit board (PCB) of a power supply structure. The fan assembly comprises a plurality of fans, each of the fans is mounted on one end of the shell, and one fan is arranged corresponding to a plurality of mounting cavities.

8. The temperature control module of the power supply structure as described in claim 1, characterized in that, The shell is further provided with a mounting rack arranged on the peripheral wall of the shell for mounting the shell on an external structure; and / or 9. The temperature control module of the power supply structure as described in claim 1, characterized in that, The shell is provided with a protective steel mesh corresponding to an outward end of the fan.

10. The temperature-controlled module of claim 9, wherein the temperature-controlled module is configured to be mounted on a printed circuit board (PCB) of a power supply structure. ​ ​

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