Circuit assembly, battery protection board and electronic equipment

Abstract

The utility model provides a circuit assembly, a battery protection board and electronic equipment, and relates to the technical field of battery protection boards. According to the circuit assembly provided by the utility model, the accommodating part with the accommodating space is arranged on the board main body of the circuit board, and at least part of the chip is accommodated in the accommodating space, so that compared with a scheme in which the chip is directly overlapped on the board main body of the circuit board in the prior art, the circuit assembly provided by the invention has the advantages that the structure is simple; according to the circuit assembly provided by the embodiment of the invention, at least part of the thickness of the chip can be effectively ensured to be arranged in the accommodating space, so that the overall thickness of the circuit assembly is reduced, and the space occupied by the overall structure of the circuit assembly is reduced.

Description

Technical Field

[0001] This application relates to the field of battery protection board technology, and in particular to a circuit assembly, battery protection board and electronic device. Background Technology

[0002] In the field of battery protection boards, existing technologies directly mount components, such as ICs (integrated circuits), onto the surface of PCBs (Printed Circuit Boards). This results in the components' height being directly superimposed on the PCB surface, increasing the overall thickness of the PCB and occupying structural space. Utility Model Content

[0003] In view of this, this application provides a circuit assembly, a battery protection board, and an electronic device, with the aim of solving the above-mentioned technical problems to a certain extent.

[0004] According to a first aspect of this application, a circuit assembly is provided, the circuit assembly comprising:

[0005] A circuit board, the circuit board including a board body, the board body having a receiving portion defining a receiving space within the board body, the receiving portion having an opening communicating the receiving space with the external environment;

[0006] A chip, the chip including a chip body, at least a portion of the chip body being housed within the housing space;

[0007] An electrical component is connected to the side of the chip facing the external environment and is electrically connected to the chip.

[0008] Based on the above technical solutions, optionally, the chip body is completely housed within the accommodating space.

[0009] Optionally, based on any of the above technical solutions, the electrical component is located within the accommodating space.

[0010] Optionally, based on any of the above technical solutions, the chip body includes a top and a bottom, the receiving portion is formed as a groove in the board body, wherein the top of the chip body faces the bottom of the groove, and the electrical components are soldered to the bottom of the chip body.

[0011] Based on any of the above technical solutions, optionally, the chip includes pins, and the chip body also includes a side portion extending between the top and bottom of the chip body, the pins are located on the side portion, and the distance between the pins and the top is greater than the distance between the pins and the bottom.

[0012] The board body further includes a first pad corresponding to the pin, the first pad being disposed on the outer edge of the opening, and the pin being soldered to the first pad.

[0013] Optionally, based on any of the above technical solutions, the pin includes a pin body and a second pad disposed on the pin body, the board body has a thickness direction, the second pad and the first pad are disposed opposite to each other in the thickness direction, and the second pad is soldered to the first pad.

[0014] Optionally, based on any of the above technical solutions, the length of the pin is 0.2-0.9mm.

[0015] Optionally, based on any of the above technical solutions, the electrical component includes a capacitor.

[0016] According to a second aspect of this application, a battery protection board is provided, the battery protection board including the circuit components described above.

[0017] According to a third aspect of this application, an electronic device is provided, the electronic device including the battery protection board as described above.

[0018] According to the circuit assembly provided in this application, a receiving portion with a receiving space is provided on the main body of the circuit board, and at least a portion of the chip is received in the receiving space. Compared with the related art solution of directly stacking the chip on the main body of the circuit board, the circuit assembly provided in the embodiment of this application can effectively ensure that at least a portion of the thickness of the chip is set in the receiving space, thereby reducing the overall thickness of the circuit assembly and reducing the space occupied by the overall structure of the circuit assembly.

[0019] According to the circuit assembly provided in this application, electrical components are arranged on the side of the chip facing the external environment. This is equivalent to transferring a portion of the space for arranging electrical components that should have been provided by the main body of the circuit board to the chip. Thus, compared with the circuit assemblies in related technologies, the circuit assembly provided in the embodiments of this application achieves the purpose of increasing the space for device arrangement by utilizing the chip.

[0020] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of a three-dimensional circuit assembly provided according to an embodiment of this application is shown;

[0023] Figure 2 A schematic diagram of a three-dimensional view of a chip of a circuit assembly provided according to an embodiment of this application is shown.

[0024] Figure label:

[0025] 10-Circuit board; 11-Board body; 12-Receiving part; 13-Opening; 14-First pad;

[0026] 20-Chip; 21-Chip body; 22-Pin; 23-Bottom; 24-Top; 25-Side; 30-Electrical component. Detailed Implementation

[0027] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0031] According to a first aspect of the embodiments of this application, a circuit component is provided, which will be described below in conjunction with... Figure 1 and Figure 2 Describe in detail the structure and operation of the circuit components.

[0032] The circuit assembly provided according to the embodiments of this application includes a circuit board 10, a chip 20, and electrical components 30.

[0033] In an embodiment, the circuit board 10 includes a board body 11, on which a receiving portion 12 is provided, defining a receiving space within the board body 11. The receiving portion 12 has an opening 13 that connects the receiving space to the external environment.

[0034] In one embodiment, chip 20 includes a chip body 21, at least a portion of which is housed within a receiving space. In another embodiment, an electrical component 30 is connected to a side 25 of chip 20 facing the external environment, and is electrically connected to chip 20.

[0035] Thus, according to the circuit assembly provided in the embodiments of this application, a receiving portion 12 with a receiving space is provided on the board body 11 of the circuit board 10, and at least a portion of the chip 20 is received in the receiving space. Compared with the related art solution of directly stacking the chip 20 on the board body 11 of the circuit board 10, the circuit assembly provided in the embodiments of this application can effectively ensure that at least a portion of the thickness of the chip 20 is set in the receiving space, thereby reducing the overall thickness of the circuit assembly and reducing the space occupied by the overall structure of the circuit assembly.

[0036] Furthermore, according to the circuit assembly provided in the embodiments of this application, electrical components 30 are provided on the side 25 of the chip 20 facing the external environment. This is equivalent to transferring a portion of the arrangement space of the electrical components 30, which should have been provided by the board body 11 of the circuit board 10, to the chip 20. Thus, compared with the circuit assemblies in the related art, the circuit assembly provided in the embodiments of this application achieves the purpose of increasing the device arrangement space by utilizing the chip 20.

[0037] In the embodiments, the chip 20 mentioned in the above description is, for example, an IC. As an example, the circuit board 10 can be, for example, a printed circuit board 10, i.e., a PCB. Therefore, the board body 11 of the circuit board 10 is the board body 11 of the printed circuit board 10.

[0038] In the embodiment, the receiving portion 12 opened on the plate body 11 can be a defective part obtained by means of removing material, such as cutting, so the receiving space provided by the receiving portion 12 is essentially a cavity.

[0039] In an embodiment, as an example, the receiving portion 12 may be a groove occupying a portion of the thickness of the board body 11 of the circuit board 10. In other words, the receiving portion 12 may not be formed to penetrate the board body 11 of the circuit board 10, but may still retain a portion of the thickness of the board body 11 of the circuit board 10 as the bottom 23 of the receiving portion 12 formed as a groove.

[0040] In this embodiment, the recessed receiving portion 12 offers several advantages in mounting the chip body 21. It should be noted that, in this embodiment, the shape of the recess can be adapted to the shape of the chip body 21, and its size can, for example, be slightly larger than the size of the chip body 21, to facilitate mounting the chip body 21 into the recess. Furthermore, a significant advantage of using the recess to mount the chip body 21 is that the depth to which the chip body 21 can be mounted into the recess is directly determined by the processing depth of the recess (which is actually the depth of the recess itself) directly determined during the fabrication stage of the circuit board 10.

[0041] Based on the above installation concept, for ease of description, the side of the chip body 21 facing the external environment through the opening 13 of the groove is referred to as the outer side of the chip body 21, and the side of the chip body 21 facing the bottom 23 of the groove is referred to as the inner side of the chip body 21. In this embodiment, the inner side of the chip body 21 can directly abut against the bottom 23 of the groove after being installed in the groove. In this way, the inner side of the chip body 21 fits against the bottom surface of the groove, so that the chip body 21 is reduced in size relative to the main body 11 of the circuit board 10 according to the thickness of the chip body 21 accommodated by the groove.

[0042] Thus, according to the circuit assembly provided in the embodiments of this application, when the chip body 21 is mounted using the groove on the board body 11 of the circuit board 10, the chip body 21 can be determined to exceed the size of the board body 11 during the processing stage of the circuit board 10, instead of needing to position the chip body 21 relative to the board body 11 during installation in order to first ensure that the chip body 21 exceeds the size of the board body 11.

[0043] Therefore, in one example, the depth of the groove is greater than or equal to the thickness of the chip body 21, so that in this example, the groove can completely accommodate the chip body 21, so that the thickness of the chip body 21 itself is not reflected in the overall thickness of the circuit assembly.

[0044] In addition, it should be noted that the “overall thickness of the circuit assembly” mentioned in the above description is also determined by the thickness direction of the board body 11 of the circuit board 10. Specifically, it refers to the size of the circuit assembly in the thickness direction of the board body 11.

[0045] In other examples, the depth of the recess may be less than the thickness of the chip body 21. Therefore, it is obvious that the chip body 21 is not completely contained within the recess, but rather partially exposed to the external environment. In this example, since the circuit assembly typically also includes other components arranged on the circuit board 10, forming a circuit together with the conductive patterns on the circuit board 10, the dimensions of these components themselves, exceeding those of the board body 11, also contribute to the overall thickness of the circuit assembly.

[0046] Therefore, since the aforementioned components inevitably contribute a portion of the overall thickness of the circuit assembly, the chip body 21 can occupy this portion of the thickness already provided by these components, thereby not increasing the overall thickness of the circuit assembly.

[0047] For example, the plate body 11 has two opposing sides, referred to here as the first side and the second side. The first side and the second side are the two sides with the largest area in the plate body 11, and are also the sides used to provide space for arranging components and conductive patterns as described above. As an example, the opening 13 of the receiving portion 12 formed as a groove above can be located on the first side.

[0048] Based on this, in an embodiment, if a component is also arranged on the first side, the component will protrude outward from the first side by a certain dimension, which is a portion of the overall thickness of the circuit assembly provided by the component as described above. In an embodiment where the chip body 21 is not fully contained in the recess, the dimension of the portion of the chip body 21 exposed outside the recess beyond the first side is less than or equal to the protruding dimension of the component, which is the thickness already occupied by the component. Therefore, even if a portion of the chip body 21 is not contained in the recess, it does not substantially increase the overall thickness of the circuit assembly.

[0049] In this embodiment, the connection between the chip body 21 and the board body 11 can include two aspects: electrical connection and mechanical connection. Regarding the electrical connection, since the chip 20 itself has pins 22 connected to the chip body 21, these pins 22 can be soldered to conductive patterns on the board body 11 to electrically connect to the circuit formed by the various components and conductive patterns. In this embodiment, this soldering provides both an electrical connection between the chip body 21 and the circuit, and a mechanical connection between the chip body 21 and the board body 11.

[0050] In an embodiment, as an example, additionally, an adhesive such as thermally conductive adhesive may still be provided between the inner side of the chip body 21 and the bottom 23 of the recess to further provide a mechanical connection between the chip body 21 and the board body 11, so as to ensure the mounting strength of the chip body 21.

[0051] In this embodiment, the electrical components 30 disposed on the chip body 21 may also be located within the receiving space. In other words, in this example, the sum of the height of the electrical components 30 and the thickness of the chip body 21 may be less than or equal to the depth of the recess.

[0052] Furthermore, in other examples, considering the height of the components mounted on the board body 11 of the circuit board 10, the height of the electrical component 30 can also occupy the height dimension already occupied by these components without substantially increasing the overall thickness of the circuit assembly. In other words, in such examples, the electrical component 30 can also be partially or entirely located in the external environment outside the recess, but still lower than these components already arranged on the board body 11 of the circuit board 10, thus not substantially increasing the overall thickness of the circuit assembly.

[0053] In the embodiments, the chip body 21 can be essentially flipped in the groove, that is, the inner side of the chip body 21 as described above is the top 24 of the chip body 21, and the outer side of the chip body 21 as described above is the bottom 23 of the chip body 21.

[0054] Furthermore, in an example not shown, the receiving portion 12 can also completely penetrate the board body 11 of the circuit board 10 as a through hole. Therefore, the receiving portion 12, as a through hole, has two openings 13 located opposite each other on the first and second sides, respectively. During the mounting process of the chip 20, the depth of the through hole can be greater than the thickness of the chip body 21, so that the chip 20 can be completely accommodated within the through hole. Furthermore, as described above, when the chip body 21 is mounted into the through hole, a tooling can be used in the lower opening 13 to provide support for the chip 20, thereby positioning the chip 20 relative to the board body of the circuit board 10.

[0055] According to the circuit assembly provided in the embodiments of this application, as an example, the electrical component 30 can be soldered to the bottom 23 of the chip body 21. For example, a pad electrically connected to the internal circuitry of the chip body 21 is provided on the bottom 23 of the chip body 21, and then the electrical component 30 is soldered to the pad by means such as soldering, so as to realize the electrical connection and mechanical connection between the electrical component 30 and the chip body 21.

[0056] As an example, in an embodiment, electrical element 30 may be, for example, a capacitor, that is, electrical element 30 is essentially a chip 20 capacitor.

[0057] According to the circuit assembly provided in the embodiments of this application, as an example, the chip body 21 further includes a side portion 25 extending between the top 24 and the bottom 23 of the chip body 21. For example, the chip body 21 may be cuboid in shape, and the side portion 25 may be formed by four side surfaces. In the embodiments, pins 22 may be located on the side portion 25, and the distance between the pins 22 and the top 24 may be greater than the distance between the pins 22 and the bottom 23. That is, the pins 22 may be closer to the bottom 23 facing the external environment than to the top 24 of the board body facing the circuit board 10.

[0058] In this embodiment, the board body 11 further includes a first pad 14 corresponding to the pin 22. The first pad 14 can be disposed at the outer edge of the opening 13, that is, as described above, the pin 22 and the first pad 14 can be disposed at the outer edge of the opening 13 on the first side of the recess receiving portion 12. In this embodiment, the first pad 14 substantially electrically connects the pin 22 to the circuit formed by various components and conductive patterns on the circuit board 10.

[0059] According to the circuit assembly provided in the embodiments of this application, as an example, pin 22 may include a pin 22 body and a second pad disposed on the pin 22 body. The second pad is disposed opposite to the first pad 14 in the thickness direction, and the second pad is soldered to the first pad 14. In other words, the second pad on pin 22 faces the first pad 14 on the board body 11, thus avoiding the pin 22 from bending in space to solder to the board body 11, thereby further reducing the space occupied by the chip 20 after it is mounted on the board body 11.

[0060] According to the circuit assembly provided in the embodiments of this application, as an example, the length of pin 22 is 0.2-0.9 mm. In the embodiments, if the length of pin 22 is too short, it will be difficult to solder; if the length of pin 22 is too long, it will excessively occupy the space of the board body 11. As an example, in the embodiments, the length of pin 22 can be, for example, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, or 0.9 mm.

[0061] According to a second aspect of this application, a battery protection board is provided, which includes the circuit components described above and has the aforementioned beneficial effects, which will not be repeated here. Furthermore, the circuit formed by the components and conductive patterns mentioned above can be, for example, the protection circuit and power circuit present in existing battery protection boards.

[0062] According to a third aspect of this application, an electronic device is provided. The electronic device includes the battery protection board as described above. In embodiments, the electronic device may further include, for example, a pouch battery, which is electrically connected to the battery protection board. The battery protection board protects the pouch battery during charging and discharging. In embodiments, the electronic device may be, for example, a 3C digital device, such as a portable communication device like a mobile phone, or a portable office device like a laptop computer.

[0063] The above are merely preferred embodiments of this application and do not limit the scope of protection of this application. Any equivalent structural transformations made based on the innovative concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A circuit assembly, characterized by The circuit assembly comprises: a circuit board comprising a board body, the board body being provided with a receiving portion, a receiving space being defined in the board body by the receiving portion, the receiving portion having an opening, the opening being in communication with the receiving space and an external environment; a chip comprising a chip body, at least a portion of the chip body being received in the receiving space; an electrical element connected to a side of the chip facing the external environment, the electrical element being electrically connected to the chip.

2. The circuit assembly of claim 1, wherein, The chip body is completely received in the receiving space.

3. The circuit assembly of claim 1, wherein, The electrical element is located in the receiving space.

4. The circuit assembly of claim 1, wherein, The chip body comprises a top portion and a bottom portion, the receiving portion being formed as a groove provided in the board body, wherein the top portion of the chip body faces a bottom portion of the groove, and the electrical element is welded to the bottom portion of the chip body.

5. The circuit assembly according to any of claims 1 to 4, characterized in that, The chip comprises a pin, the chip body further comprises a side portion extending between the top portion of the chip body and the bottom portion of the chip body, the pin being located on the side portion, and a distance between the pin and the top portion is greater than a distance between the pin and the bottom portion. The board body further comprises a first pad corresponding to the pin, the first pad being provided at an outer edge of the opening, and the pin is welded to the first pad.

6. The circuit assembly of claim 5, wherein, The pin comprises a pin body and a second pad provided on the pin body, the board body has a thickness direction, the second pad and the first pad are oppositely arranged in the thickness direction, and the second pad is welded to the first pad.

7. The circuit assembly of claim 6, wherein, The length of the pin is 0.2-0.9mm.

8. The circuit assembly according to any of claims 1 to 4, characterized in that The electrical element comprises a capacitor.

9. A battery protection plate, characterized in that The battery protection board comprises the circuit assembly according to any one of claims 1-8.

10. An electronic device, comprising: The electronic device comprises the battery protection board according to claim 9.

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