Battery protection plate and battery with same

Abstract

The utility model provides a battery protection board and a battery with the same. The battery protection board comprises a PCB (Printed Circuit Board); the protection wafer is adhered to the front surface of the PCB; the first end of the protection binding line is connected with the protection wafer, and the second end of the protection binding line is connected with the PCB; and the pouring glue layer is arranged on the front surface of the PCB, and the pouring glue layer wraps the outer side of the protection wafer and the outer side of the protection binding wire. Through the technical scheme provided by the invention, the problem that the thickness increase of the battery protection plate product in the related technology conflicts with the lightweight requirement of a customer on the battery protection plate product can be solved.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and more specifically, to a battery protection board and a battery having the same. Background Technology

[0002] To meet user demands, most mobile phone products now aim for rapid battery charging (accumulating as much power as possible in a short time), necessitating increased charging current. Current mobile phone battery protection boards require a maximum current carrying capacity of over 12A. With this increased charging current, the PCB temperature rises significantly, easily leading to overheating during charging. High temperatures have a significant impact on the battery, posing a risk of explosion. Solving the heat dissipation problem in the current mobile phone battery protection board's PCM (Protection Circuit Module) design has become an industry-wide challenge, as PCM heat generation directly affects electrical performance and battery safety.

[0003] In related technologies, battery protection boards include protection circuits and PCB boards. After the components of the protection circuit are attached to the PCB board, a plastic sealant with a certain thermal conductivity is used to seal the PCB board and the components together to form a complete unit. The heat dissipated by the power devices will be evenly distributed through the plastic sealant, thereby reducing the possibility of individual power devices being damaged due to high temperature during operation and reducing the risk of thermal failure of the battery protection board product.

[0004] However, the encapsulant used in related technologies needs to cover all components mounted on the PCB board, which means that the highest point of the encapsulant needs to be higher than the highest component. This results in an increase in the thickness of the battery protection board, which conflicts with customers' requirements for lightweight battery protection board products. Utility Model Content

[0005] This utility model provides a battery protection board and a battery having the same, in order to solve the problem of the conflict between the increased thickness of battery protection board products in related technologies and customers' requirements for lightweight battery protection board products.

[0006] According to one aspect of the present invention, a battery protection board is provided, comprising: a PCB board; a protective wafer, which is pasted on the front side of the PCB board; a protective bonding line, the first end of which is connected to the protective wafer and the second end of which is connected to the PCB board; and a potting adhesive layer, which is disposed on the front side of the PCB board and covers the outer side of the protective wafer and the outer side of the protective bonding line.

[0007] Furthermore, a recessed groove is provided on the front side of the PCB board, and the protective wafer is placed at the bottom of the recessed groove. The battery protection board also includes a MOS element, which is placed on the front side of the PCB board and located outside the recessed groove. The MOS element is electrically connected to the PCB board, and a potting adhesive layer is wrapped around the outside of the MOS element.

[0008] Furthermore, the PCB board includes: a board body, a recessed groove disposed on the front side of the board body; circuit pads, including an upper pad and a lower pad, the upper pad being disposed on the front side of the board body and located outside the recessed groove, the lower pad being disposed at the bottom of the recessed groove, the second end of a protective bonding wire being connected to the lower pad, a MOS component being electrically connected to the upper pad, and a potting adhesive layer being disposed on the front side of the board body and wrapping around the upper pad and the lower pad.

[0009] Furthermore, along the thickness direction of the PCB board, the highest point of the protection bonding line is lower than or flush with the highest point of the MOS component.

[0010] Furthermore, the MOS element is soldered to the upper pad.

[0011] Furthermore, the battery protection board also includes MOS components and MOS bonding wires. The MOS components are pasted on the front side of the PCB board, the first end of the MOS bonding wire is connected to the PCB board, the second end of the bonding wire is connected to the MOS components, and the potting adhesive layer wraps the outside of the MOS bonding wires and the outside of the MOS components.

[0012] Furthermore, the PCB board includes: a board body; circuit pads disposed on the front side of the board body; a second end of a protective bonding wire connected to the circuit pads; a second end of a MOS bonding wire connected to the circuit pads; and a potting adhesive layer disposed on the front side of the board body and covering the outer side of the circuit pads.

[0013] Furthermore, the circuit pads include: a first pad, to which the second end of the protection bonding line is connected; and a second pad, to which the second end of the MOS bonding line is electrically connected.

[0014] Furthermore, the first pad is located on the side of the protective wafer away from the MOS element, and / or the second pad is located on the side of the MOS element away from the protective wafer.

[0015] Furthermore, the battery protection board also includes a bonding wire, the first end of which is connected to the protection wafer, the second end of which is connected to the MOS element, and a potting adhesive layer is wrapped around the outside of the bonding wire.

[0016] Furthermore, the first end of the connection bonding line is located on the side of the protective wafer facing the MOS element, and the second end of the connection bonding line is located on the side of the MOS element facing the protective wafer.

[0017] According to another aspect of the present invention, a battery is provided, the battery including the battery protection board provided above.

[0018] The battery protection board using the technical solution of this utility model includes a PCB board, a protective wafer, protective bonding lines, and a potting adhesive layer. The protective wafer is electrically connected to the PCB board through the protective bonding lines to measure the battery charging and discharging current of the PCB board. The potting adhesive layer needs to cover all components mounted on the PCB board, so that the highest point of the potting adhesive layer needs to be higher than the highest point of all components mounted on the PCB board. Since the protective wafer is pasted on the front side of the PCB board and the protective bonding lines are used to achieve electrical connection between the protective wafer and the PCB board, compared with the protection chip in the prior art, this embodiment uses a bare wafer structure for the protective wafer, which can reduce the thickness requirement of the encapsulation layer and reduce the thickness of the battery protection board to meet the customer's requirements for lightweight battery protection board products. Attached Figure Description

[0019] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0020] Figure 1 A cross-sectional view of the battery protection board provided in Embodiment 1 of this utility model is shown;

[0021] Figure 2 A cross-sectional view of the battery protection board provided in Embodiment 2 of this utility model is shown;

[0022] Figure 3 A cross-sectional view of a battery protection board provided by the prior art is shown.

[0023] The above figures include the following reference numerals:

[0024] 1. PCB board; 2. MOS components; 3. Encapsulation layer; 4. Wafer protection layer; 5. Frame; 6. Adhesive layer; 7. Chip encapsulation; 8. Bonding wires; 9. Electrodes;

[0025] 10. PCB board; 11. Sink; 12. Board body; 13. Circuit pads; 131. Upper pad; 132. Lower pad; 133. First pad; 134. Second pad;

[0026] 20. Protect the wafer;

[0027] 30. Protect the binding wire;

[0028] 40. Inject adhesive layer;

[0029] 50. MOS element; 60. MOS bonding wire; 70. Connecting bonding wire. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0031] like Figure 3 As shown, the battery protection board provided by the prior art includes a PCB board 1, a protection chip, a MOS element 2, and a potting adhesive layer 3. The protection chip and the MOS element 2 are both disposed on the front side of the PCB board. The potting adhesive layer 3 is disposed on the front side of the PCB board 1 and wraps around the outside of the protection chip and the outside of the MOS element 2. The protection chip includes a protection wafer 4, a frame 5, an adhesive layer 6, a chip sealant 7, a bonding wire 8, and an electrode 9. The protection wafer 4 is attached to the upper surface of the frame 5 through the adhesive layer 6. The first end of the bonding wire 8 is connected to the protection wafer 4, and the second end of the bonding wire 8 is connected to the electrode 9. The chip sealant 7 wraps around the outside of the protection wafer 4, the frame 5, the adhesive layer 6, the bonding wire 8, and the electrode 9. The chip sealant 7 has an electrode notch. The lower electrode notch of the electrode 9 is soldered to the circuit pads of the PCB board 1 through a solder layer. The potting adhesive layer 3 needs to cover all the components set on the PCB board 1, so that the highest point of the potting adhesive layer 3 needs to be higher than the highest point of all the components set on the PCB board 1. The packaging structure of the protection chip in the prior art makes the overall thickness of the protection chip require a high thickness of the potting adhesive layer 340, resulting in a large battery protection board thickness, which cannot meet the customer's requirements for lightweight battery protection board products.

[0032] like Figure 1 and Figure 2 As shown, this utility model embodiment provides a battery protection board, which includes a PCB board 10, a protection wafer 20, a protection bonding line 30, and a potting adhesive layer 40. The protection wafer 20 is pasted on the front side of the PCB board 10. The first end of the protection bonding line 30 is connected to the protection wafer 20, and the second end of the protection bonding line 30 is connected to the PCB board 10. The potting adhesive layer 40 is disposed on the front side of the PCB board 10 and wraps around the outside of the protection wafer 20 and the outside of the protection bonding line 30.

[0033] The battery protection board provided in this embodiment includes a PCB board 10, a protection wafer 20, protection bonding lines 30, and a potting adhesive layer 40. The protection wafer 20 is electrically connected to the PCB board 10 through the protection bonding lines 30 to measure the battery charging and discharging current of the PCB board 10. The potting adhesive layer 40 needs to cover all components disposed on the PCB board 10, so that the highest point of the potting adhesive layer 40 needs to be higher than the highest point of all components disposed on the PCB board. Since the protection wafer 20 is pasted on the front side of the PCB board 10 and the protection bonding lines 30 are used to achieve electrical connection between the protection wafer 20 and the PCB board 10, compared with the protection chip in the prior art, the protection wafer 20 with a bare wafer structure in this embodiment can reduce the thickness requirement of the potting adhesive layer 40 and reduce the thickness of the battery protection board to meet the customer's requirements for lightweight battery protection board products.

[0034] It should be noted that the phrase "the potting adhesive layer 40 wraps around the outside of the protective bonding line 30" means that during the potting process of the potting adhesive layer 40, the liquid adhesive submerges the protective bonding line 30, thereby enveloping the protective bonding line 30. After the liquid adhesive cures, it forms the potting adhesive layer 40, which then wraps around the outside of the protective bonding line 30.

[0035] like Figure 1 As shown, a recessed groove 11 is provided on the front side of the PCB board 10, and the protection wafer 20 is disposed at the bottom of the recessed groove 11. The battery protection board also includes a MOS element 50, which is disposed on the front side of the PCB board 10 and located outside the recessed groove 11. The MOS element 50 is electrically connected to the PCB board 10, and a potting compound layer 40 is wrapped around the outside of the MOS element 50. When the battery state changes, the circuit connection state of the PCB board 10 can be changed by switching the switching state of the MOS element 50, thereby protecting the battery. By setting the recessed groove 11 and placing the protection wafer 20 at the bottom of the recessed groove 11, the height of the protection bonding line 30 and the protection wafer 20 can be reduced, the thickness requirement of the potting compound layer 40 for the protection bonding line 30 and the protection wafer 20 can be reduced, and the thickness of the battery protection board can be reduced to meet the customer's requirements for lightweight battery protection board products.

[0036] It should be noted that, in the thickness direction of the PCB board 10, the bottom of the recessed groove 11 is lower than the plane where the MOS element 50 is located.

[0037] like Figure 1As shown, the PCB board 10 includes a board body 12 and circuit pads 13. A recessed groove 11 is disposed on the front side of the board body 12. The circuit pads 13 include an upper pad 131 and a lower pad 132. The upper pad 131 is disposed on the front side of the board body 12 and located outside the recessed groove 11. The lower pad 132 is disposed at the bottom of the recessed groove 11. The second end of the protective bonding line 30 is connected to the lower pad 132. The MOS component 50 is electrically connected to the upper pad 131. The potting adhesive layer 40 is disposed on the front side of the board body 12 and wraps around the outer side of the upper pad 131 and the outer side of the lower pad 132. Because the second end of the protective bonding line 30 is connected to the lower pad 132, the height of the highest point of the protective bonding line 30 can be reduced, thereby reducing the thickness requirement of the potting adhesive layer 40 for the protective bonding line 30, reducing the thickness of the battery protection board, and meeting the customer's requirements for lightweight battery protection board products.

[0038] like Figure 1 As shown, along the thickness direction of the PCB board 10, the highest point of the protective bonding line 30 is lower than or flush with the highest point of the MOS component 50. By reducing the height of the highest point of the protective bonding line 30, the thickness requirement of the potting adhesive layer 40 for the protective bonding line 30 can be reduced, thereby reducing the thickness of the battery protection board to meet the customer's requirements for lightweight battery protection board products.

[0039] In this embodiment, the MOS element 50 is soldered to the upper pad 131, which helps to improve the connection structure strength between the MOS element 50 and the upper pad 131.

[0040] like Figure 2 As shown, the battery protection board also includes a MOS element 50 and a MOS bonding wire 60. The MOS element 50 is attached to the front side of the PCB board 10. The first end of the MOS bonding wire 60 is connected to the PCB board 10, and the second end of the bonding wire 60 is connected to the MOS element 50. A potting compound layer 40 covers the outer side of the MOS bonding wire 60 and the outer side of the MOS element 50. When the battery state changes, the connection state of the main circuit 11 is changed by switching the switching state of the MOS element, thus protecting the battery. Furthermore, attaching the MOS element 50 to the front side of the PCB board 10 and using the MOS bonding wire 60 to achieve electrical connection between the MOS element 50 and the PCB board 10 reduces the thickness requirement of the potting compound layer 40 for the MOS element 50, thereby reducing the thickness of the battery protection board and meeting the customer's requirements for lightweight battery protection board products.

[0041] It should be noted that the potting adhesive layer 40 wrapping around the outside of the MOS bonding line 60 means that during the potting process of the potting adhesive layer 40, the liquid adhesive submerges the MOS bonding line 60, thereby encapsulating the MOS bonding line 60 with the liquid adhesive. After the liquid adhesive cures, it forms the potting adhesive layer 40, which then wraps around the outside of the MOS bonding line 60.

[0042] like Figure 2 As shown, the PCB board 10 includes a board body 12 and circuit pads 13. The circuit pads 13 are disposed on the front side of the board body 12. The second end of the protective bonding line 30 is connected to the circuit pads 13. The second end of the MOS bonding line 60 is connected to the circuit pads 13. The potting adhesive layer 40 is disposed on the front side of the board body 12 and wraps the outside of the circuit pads 13.

[0043] like Figure 2 As shown, the circuit pad 13 includes a first pad 133 and a second pad 134. The second end of the protection bonding line 30 is connected to the first pad 133, and the second end of the MOS bonding line 60 is electrically connected to the second pad 134.

[0044] like Figure 2 As shown, the first pad 133 is located on the side of the protective wafer 20 away from the MOS element 50, and the second pad 134 is located on the side of the MOS element 50 away from the protective wafer 20.

[0045] like Figure 2 As shown, the battery protection board also includes a connection bonding line 70. The first end of the connection bonding line 70 is connected to the protection wafer 20, and the second end is connected to the MOS element 50. A potting compound layer 40 is wrapped around the outside of the connection bonding line 70. Using the connection bonding line 70 to achieve signal connection between the MOS element 50 and the protection wafer 20 has the advantages of simple structure, low cost, and easy installation, facilitating flexible connection based on the relative positions of the MOS element 50 and the protection wafer 20.

[0046] It should be noted that the phrase "the potting adhesive layer 40 wraps around the outside of the connecting bonding line 70" means that during the potting process of the potting adhesive layer 40, the liquid adhesive submerges the connecting bonding line 70, thereby wrapping the connecting bonding line 70 with the liquid adhesive. After the liquid adhesive cures, it forms the potting adhesive layer 40, which wraps around the outside of the connecting bonding line 70.

[0047] like Figure 2 As shown, the first end of the connection bonding line 70 is located on the side of the protective wafer 20 facing the MOS element 50, and the second end of the connection bonding line 70 is located on the side of the MOS element 50 facing the protective wafer 20. Using this connection layout, the length of the connection bonding line 70 can be shortened while maintaining the relative positions between the protective wafer 20 and the MOS element 50.

[0048] In Embodiments 1 and 2, the battery protection board further includes a sampling resistor. The sampling resistor is located on the front side of the PCB board 10 and electrically connected to it. A potting compound layer 40 wraps around the outside of the sampling resistor. The protection wafer 20 measures the voltage drop generated by the current flowing through the sampling resistor. The protection wafer 20 calculates the battery charging / discharging current of the PCB board 10 based on the voltage drop and the resistance value of the sampling resistor. The protection wafer 20 controls the switching state of the MOS element 50 according to the battery status and the battery charging / discharging current of the PCB board 10, thereby protecting the battery.

[0049] Another embodiment of this utility model provides a battery, which includes the battery protection board provided above. Using the battery provided in this embodiment, the protective wafer 20 is also able to be attached to the front side of the PCB board 10, and the protective bonding wire 30 is used to achieve electrical connection between the protective wafer 20 and the PCB board 10. Compared with the protection chip in the prior art, the protective wafer 20 using a bare wafer structure in this embodiment can reduce the thickness requirement of the potting adhesive layer 40, thereby reducing the thickness of the battery protection board and meeting customers' requirements for lightweight battery protection board products.

[0050] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0051] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0052] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0053] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0054] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0055] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A battery protection plate, characterized in that, The battery protection plate comprises: a PCB board (10); a protection wafer (20) attached to the front surface of the PCB board (10); a protection binding wire (30) having a first end connected to the protection wafer (20) and a second end connected to the PCB board (10); a perfusion adhesive layer (40) arranged on the front surface of the PCB board (10) and wrapping the outside of the protection wafer (20) and the outside of the protection binding wire (30).

2. The battery protection plate of claim 1, wherein, The front surface of the PCB board (10) is provided with a sunken groove (11), and the protection wafer (20) is arranged on the groove bottom of the sunken groove (11). The battery protection plate further comprises a MOS element (50) arranged on the front surface of the PCB board (10) and located outside the sunken groove (11), and the MOS element (50) is electrically connected to the PCB board (10). The perfusion adhesive layer (40) wraps the outside of the MOS element (50).

3. The battery protection plate of claim 2, wherein, The PCB board (10) comprises: a board body (12), and the sunken groove (11) is arranged on the front surface of the board body (12); a circuit pad (13) comprising an upper pad (131) arranged on the front surface of the board body (12) and located outside the sunken groove (11) and a lower pad (132) arranged on the groove bottom of the sunken groove (11), wherein the second end of the protection binding wire (30) is connected to the lower pad (132), the MOS element (50) is electrically connected to the upper pad (131), and the perfusion adhesive layer (40) is arranged on the front surface of the board body (12) and wraps the outside of the upper pad (131) and the outside of the lower pad (132).

4. The battery protection plate of claim 3, wherein, In the thickness direction of the PCB board (10), the highest point of the protection binding wire (30) is lower than or flush with the highest point of the MOS element (50).

5. The battery protection plate according to claim 3 or 4, characterized in that, The MOS element (50) is welded to the upper pad (131).

6. The battery protection plate of claim 1, wherein, The battery protection plate further comprises a MOS element (50) and a MOS binding wire (60), wherein the MOS element (50) is attached to the front surface of the PCB board (10), the first end of the MOS binding wire (60) is connected to the PCB board (10), the second end of the protection binding wire (30) is connected to the MOS element (50), and the perfusion adhesive layer (40) wraps the outside of the MOS binding wire (60) and the outside of the MOS element (50).

7. The battery protection plate of claim 6, wherein, The PCB board (10) comprises: a board body (12); a circuit pad (13) arranged on the front surface of the board body (12), wherein the second end of the protection binding wire (30) is connected to the circuit pad (13), the second end of the MOS binding wire (60) is connected to the circuit pad (13), and the perfusion adhesive layer (40) is arranged on the front surface of the board body (12) and wraps the outside of the circuit pad (13).

8. The battery protection plate of claim 7, wherein, The circuit pad (13) comprises: a first pad (133) to which a second end of the protection bonding wire (30) is connected; a second pad (134) to which a second end of the MOS bonding wire (60) is electrically connected.

9. The battery protection plate of claim 8, wherein, The first pad (133) is located on a side of the protection wafer (20) facing away from the MOS element (50), and / or the second pad (134) is located on a side of the MOS element (50) facing away from the protection wafer (20).

10. The battery protection plate according to any one of claims 6 to 9, characterized in that, The battery protection plate further comprises a connecting bonding wire (70), a first end of the connecting bonding wire (70) is connected to the protection wafer (20), a second end of the connecting bonding wire (70) is connected to the MOS element (50), and the potting adhesive layer (40) is wrapped outside the connecting bonding wire (70).

11. The battery protection plate of claim 10, wherein, The first end of the connecting bonding wire (70) is located on a side of the protection wafer (20) facing the MOS element (50), and the second end of the connecting bonding wire (70) is located on a side of the MOS element (50) facing the protection wafer (20).

12. A battery, characterized by The battery comprises the battery protection plate according to any one of claims 1 to 11.

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