Workpiece stripping mechanism and processing equipment
By coordinating the fixed base, connecting components, and peeling drive components of the workpiece peeling mechanism, and utilizing the temperature regulation and state transition of the adhesive medium, the problems of insufficient efficiency and yield in existing ingot peeling methods are solved, achieving damage-free and efficient peeling.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-14
- Publication Date
- 2026-03-13
AI Technical Summary
Existing ingot stripping methods cannot balance yield and efficiency; mechanical stripping, thermal stripping, and chemical stripping all have shortcomings.
The workpiece peeling mechanism, through the cooperation of the fixed base, connecting components and peeling drive components, utilizes the temperature regulation and state transition of the adhesive medium to achieve stable fixation and non-destructive peeling of the workpiece.
It improves the efficiency and yield of the workpiece stripping process, ensures that the workpiece is undamaged during the stripping process, and meets the high requirements of the semiconductor processing process.
Smart Images
Figure CN223993871U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor processing technology, and in particular to a workpiece stripping mechanism and processing equipment. Background Technology
[0002] With the continuous advancement of semiconductor processing technology and the diversification of semiconductor product applications, the requirements for semiconductor processing are becoming increasingly stringent. In semiconductor manufacturing, ingots (cylindrical blocks of materials such as single-crystal silicon, silicon carbide, and sapphire) need to undergo processes such as cutting, thinning, polishing, and peeling to form wafers. Laser processing technology forms a modified layer inside the ingot by precisely controlling energy, and can be combined with stress release to achieve ingot peeling.
[0003] Commonly used ingot stripping methods include mechanical stripping, thermal stripping, and chemical stripping, but these methods cannot simultaneously achieve both high yield and high efficiency in ingot stripping. Utility Model Content
[0004] Therefore, it is necessary to provide a workpiece stripping mechanism and processing equipment to address the aforementioned technical problems.
[0005] A workpiece stripping mechanism, applicable to a workpiece transport substrate, includes:
[0006] A fixed base is provided, and the workpiece transport base plate is detachably connected to the fixed base, wherein the workpiece is fixedly mounted on the workpiece transport base plate;
[0007] A connecting component is fixedly connected to the workpiece via an adhesive medium, such that the workpiece is located between the substrate and the connecting component in the height direction of the workpiece peeling mechanism.
[0008] A peeling drive assembly is connected to the connecting assembly to drive the connecting assembly to move relative to the fixed base, thereby peeling off the workpiece.
[0009] In one embodiment, the fixing base includes a fixing drive component, a fixing component, and a mounting base. The fixing drive component is disposed on the mounting base, and the output end of the fixing drive component is connected to the fixing component to drive the fixing component to fix the workpiece transport substrate to the mounting base.
[0010] In one embodiment, the fixing base further includes a vertical limiting member that can abut against the outside of the fixing member.
[0011] In one embodiment, there are multiple fixed drive components, fixed components, and vertical limiting components, all of which are symmetrically spaced on the mounting base.
[0012] In one embodiment, the connecting component is a temperature-regulating connecting component capable of changing the temperature of the adhesive medium. The temperature-regulating connecting component includes an adhesive component and a temperature-regulating unit. The adhesive component is connected to the temperature-regulating unit, and the adhesive contact surface of the adhesive component can be bonded to the workpiece through the adhesive medium.
[0013] In one embodiment, the temperature regulating unit includes a cooling element and a temperature regulating element, one side of the cooling element being connected to the energy conduction surface of the adhesive component, and the other side of the cooling element being connected to one side of the temperature regulating element.
[0014] In one embodiment, the refrigeration component includes a cooling medium inlet, a cooling medium outlet, and a cooling medium channel. The cooling medium inlet and the cooling medium outlet are located on both sides of the refrigeration component. One end of the cooling medium channel is connected to the cooling medium inlet, and the other end of the cooling medium channel is connected to the cooling medium outlet.
[0015] In one embodiment, the temperature regulating element includes a pyrolysis medium inlet, a pyrolysis medium outlet, and a pyrolysis medium channel. The pyrolysis medium inlet and the pyrolysis medium outlet are disposed on both sides of the refrigeration element. One end of the pyrolysis medium channel is connected to the pyrolysis medium inlet, and the other end of the pyrolysis medium channel is connected to the pyrolysis medium outlet.
[0016] In one embodiment, the temperature regulating unit further includes a plurality of temperature sensors, which are spaced apart on the cooling element and the temperature regulating element.
[0017] A processing device, comprising:
[0018] Such as the workpiece stripping mechanism mentioned above;
[0019] The workpiece transport base plate is detachably connected to the fixing base, and the workpiece is fixedly mounted on the workpiece transport base plate.
[0020] The technical effects of the embodiments provided in this application are as follows:
[0021] The aforementioned workpiece stripping mechanism, when a workpiece (such as a crystal ingot) needs to be stripped, detachably connects a workpiece transport substrate, on which the workpiece is fixedly mounted, to a fixed base. The connecting component is fixedly connected to the workpiece via an adhesive medium, such that the workpiece is positioned between the substrate and the connecting component in the height direction of the workpiece stripping mechanism. The stripping drive component connected to the connecting component drives the connecting component to move relative to the fixed base to strip out the sub-workpiece (e.g., stripping a wafer from a crystal ingot). The workpiece transport substrate is then removed from the fixed base and enters the next process together with the workpiece. This improves the speed at which the workpiece flows to the next process after stripping, and can improve the workpiece stripping efficiency while ensuring no damage during the stripping process. This addresses the problem of not being able to balance workpiece stripping yield and efficiency due to workpiece stripping methods such as mechanical stripping, thermal stripping, and chemical stripping, effectively meeting the higher demands of the semiconductor processing process. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 This is a schematic diagram of the workpiece stripping mechanism in one embodiment;
[0024] Figure 2 This is a schematic diagram of the specific structure of the fixing base 10 in one embodiment;
[0025] Figure 3 This is a schematic diagram of the specific structure of the connecting component 20 in one embodiment;
[0026] Figure 4 This is a schematic diagram of the specific structure of the temperature regulation unit 220 in one embodiment. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0028] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0029] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0031] Figure 1 This is a schematic diagram of the workpiece stripping mechanism in one embodiment.
[0032] In this embodiment, as Figure 1 As shown, the workpiece stripping mechanism includes a fixed base 10, a connecting assembly 20, a stripping drive assembly 30, and a tension / compression sensor 40. The workpiece stripping mechanism can be applied to a workpiece transport substrate 50. The workpiece transport substrate 50 is detachably connected to the fixed base 10, and a workpiece 60 is fixedly mounted on the workpiece transport substrate 50.
[0033] The workpiece transport substrate 50 can be a functional structure that can closely adhere to the lower surface of the workpiece 60, support and fix the workpiece 60, and transport it between different workstations, thus protecting the workpiece 60. Optionally, the workpiece 60 can be a crystal ingot, etc., and the workpiece transport substrate 50 can be a crystal ingot transport substrate 50.
[0034] like Figure 2 As shown, the fixing base 10 includes a fixing drive component 110, a fixing component 120, a mounting base 130, and a vertical limiting component 140, which are connected to the lower surface of the workpiece 60. The fixing drive component 110 is disposed on the mounting base 130, and the output end of the fixing drive component 110 is connected to the fixing component 120 to drive the fixing component 120 to fix the workpiece transport substrate 50 to the mounting base 130. The vertical limiting component 140 can abut against the outer side of the fixing component 120.
[0035] The number of fixed driving components 110, fixed components 120 and vertical limiting components 140 is multiple. The multiple fixed driving components 110, multiple fixed components 120 and multiple vertical limiting components 140 are symmetrically distributed at intervals on the mounting base 130, which can realize the enhanced uniform and stable fixing effect on the workpiece transport base 50 on the outside of the workpiece transport base 50 on which the workpiece 60 is fixedly set.
[0036] The fixing base 10 can be a functional component connected to the bottom of the workpiece 60, capable of positionally constraining the workpiece 60 from its bottom. The fixing drive component 110 can be a functional component capable of providing a driving action to the fixing component 120. The fixing component 120 can be a functional component capable of fully contacting the side of the workpiece transport substrate 50 and fixing the workpiece transport substrate 50 from its side. The mounting body 130 can be a functional component connected to the fixing drive component 110 and the vertical limiting component 140, capable of providing support and bearing for the fixing drive component 110 and the vertical limiting component 140. The vertical limiting component 140 can be a functional component sleeved on the outside of the fixing component 120, capable of restricting the vertical degree of freedom of the fixing component 120.
[0037] Optionally, the fixed drive component 110 can be a drive structure such as a pneumatic cylinder, an electric cylinder, or a hydraulic cylinder. The fixed component 120 can be a fixed structure such as a clamping block, a clamping seat, or a clamping plate. The mounting base 130 can be a main structure such as a mounting seat, a mounting block, or a mounting plate. The vertical limiting component 140 can be a limiting structure such as a vertical limiting block, a vertical limiting seat, or a vertical limiting plate.
[0038] It should be noted that, in order to ensure sufficient and stable contact between the fixing component 120 and the workpiece transport substrate 50, the contact parts of the two can be designed to match each other. For example, the contact part of the fixing component 120 is provided with a protrusion and the contact part of the workpiece transport substrate 50 is provided with a groove, thereby improving the clamping effect and stability of the fixing component 120 and the workpiece transport substrate 50.
[0039] In addition, during the actual wafer stripping process, the fixing seat 10 can also be other types of limiting structures, such as an adsorption limiting structure adsorbed on the lower surface of the workpiece transport substrate 50, or a pressing limiting structure pressed on both sides of the workpiece transport substrate 50, which can be adapted to different application scenarios.
[0040] The connecting component 20 can be fixedly connected to the workpiece 60 via the adhesive medium 70, such that the workpiece 60 is located between the substrate 50 and the connecting component 20 in the height direction of the workpiece peeling mechanism. Optionally, the connecting component 20 can be a temperature-regulating connecting component capable of changing the temperature of the adhesive medium 70.
[0041] The connecting component 20 may be connected to the output end of the peeling drive component 30, facing the upper surface of the modified layer formed on the workpiece 60, and capable of moving along the direction close to the upper surface of the modified layer formed on the workpiece 60 under the action of the peeling drive component 30. It is also capable of cooling and curing or heating and liquefying the adhesive medium 70 adhering to the upper surface of the modified layer formed on the workpiece 60 and / or the adhesive contact surface of the adhesive component 210. The adhesive medium 70 may be coated on the upper surface of the modified layer formed on the workpiece 60 and / or the adhesive contact surface of the adhesive component 210, and is a medium capable of switching between solid and liquid states according to changes in temperature conditions.
[0042] Optionally, the adhesive medium 70 is a combination of one or more of water, organic media and inorganic media.
[0043] The temperature regulating connection assembly includes an adhesive component 210 and a temperature regulating unit 220. The adhesive component 210 is connected to the temperature regulating unit 220, and the adhesive contact surface of the adhesive component 210 can be bonded to the workpiece 60 through the adhesive medium 70.
[0044] The bonding component 210 can be a functional component capable of receiving cooling or heating energy from the temperature regulating unit 220, and capable of cooling and curing the adhesive medium 70 between the upper surface of the modified layer attached to the workpiece 60 and the bonding contact surface of the bonding component 210 under the action of cooling energy, or heating and liquefying the adhesive medium 70 under the action of heating energy. The temperature regulating unit 220 can be a functional unit capable of conducting cooling energy to the bonding contact surface of the bonding component 210 when it is supplied with a cooling medium or heating energy to the bonding contact surface when it is pyrolyzed.
[0045] Optionally, the bonding component 210 can be a clamping structure such as a bonding contact block, a bonding contact plate, or a bonding contact seat.
[0046] like Figure 3 and Figure 4 As shown, the temperature control unit 220 includes a cooling component 2210, a temperature control component 2220, and a temperature sensor 2230. The adhesive contact surface of the adhesive component 210 can be fixedly connected to the workpiece 60 through the adhesive medium 70. One side of the cooling component 2210 is connected to the energy conduction surface of the adhesive component 210, and the other side of the cooling component 2210 is connected to one side of the temperature control component 2220. There are multiple temperature sensors 2230, which are distributed at intervals between the cooling component 2210 and the temperature control component 2220.
[0047] Cooling and curing treatment can be a process in which a cooling medium is introduced into the temperature regulating unit 220, which can cool and cure the adhesive medium 70 that is attached to the upper surface of the modified layer of the workpiece 60 and the adhesive contact surface of the adhesive component 210, so as to increase the adhesion between the adhesive medium 70.
[0048] It should be noted that the adhesive stress between the adhesive media 70 after cooling and curing is greater than the internal stress of the modified layer of the workpiece 60. Therefore, when the workpiece 60 is pulled after the adhesive media 70 between the bonding contact surface and the upper surface of the modified layer has cooled and cured, the wafer to be peeled off on the workpiece 60 will separate from the modified layer of the workpiece 60.
[0049] The heating liquefaction treatment can be a process in which the temperature regulating unit 220 introduces a pyrolysis medium to heat and liquefy the adhesive medium 70 that is attached to the upper surface of the modified layer of the workpiece 60 and the adhesive contact surface of the adhesive component 210, so as to reduce the stickiness between the adhesive medium 70.
[0050] It should be noted that the process of the connecting component 20 being fixedly connected to the workpiece 60 through the adhesive medium 70 can be understood as the process of the adhesive medium 70 achieving bonding. The bonding methods achieved by the adhesive medium 70 include: cooling bonding, pressure-sensitive bonding based on pressure-sensitive adhesive, thermosetting bonding based on thermosetting medium, ultraviolet curing bonding, and moisture curing bonding, etc. The specific method can be selected according to the different scenarios.
[0051] Similarly, the process of peeling the workpiece 60 off the connecting component 20 can be understood as the process of the adhesive medium 70 achieving de-adhesion. The methods of achieving de-adhesion by the adhesive medium 70 include: heating de-adhesion, photon de-adhesion based on photon radiation, magneto-controlled de-adhesion based on magnetic field, solvent de-adhesion based on solvent dissolution effect, and ultrasonic de-adhesion based on ultrasonic vibration. The specific method can be selected according to the different scenarios.
[0052] The cooling component 2210 includes a cooling medium inlet, a cooling medium outlet, and a cooling medium channel. The cooling medium inlet and outlet are located on both sides of the cooling component. One end of the cooling medium channel is connected to the cooling medium inlet, and the other end is connected to the cooling medium outlet. The cooling medium channels are evenly distributed, which can realize that the cooling energy is evenly applied to the energy conduction surface of the adhesive component 210, thereby improving the cooling efficiency of the cooling component 2210 and thus improving the efficiency of the cooling and curing treatment of the adhesive medium 70.
[0053] like Figure 4As shown, the temperature regulating component 2220 includes a pyrolysis medium inlet 2220a, a pyrolysis medium outlet 2220b, and a pyrolysis medium channel 2220c. The pyrolysis medium inlet 2220a and the pyrolysis medium outlet 2220b are disposed on both sides of the cooling component 2210. One end of the pyrolysis medium channel 2220c is connected to the pyrolysis medium inlet 2220a, and the other end of the pyrolysis medium channel 2220c is connected to the pyrolysis medium outlet 2220b. The pyrolysis medium channel 2220c is evenly distributed, which can realize that the heating energy is evenly applied to the energy conduction surface of the adhesive component 210, thereby improving the heating efficiency of the temperature regulating component 2220 and thus improving the efficiency of the heating and liquefaction treatment of the adhesive medium 70.
[0054] By separating the cooling component 2210 and the temperature regulating component 2220 in the temperature regulating unit 220, the problem of poor freezing or thawing efficiencies caused by the traditional refrigeration structure and heating structure sharing the same medium channel can be improved (e.g., the cooling medium in the medium channel needs to be cleaned before switching from refrigeration to heating, and the pyrolysis medium in the medium channel needs to be cleaned before switching from heating to refrigeration). This can improve the timeliness of the cooling and curing treatment or heating and liquefaction treatment of the adhesive medium 70 during the peeling process of the workpiece 60, and further improve the peeling efficiency of the workpiece 60.
[0055] The peeling drive assembly 30 is connected to the connecting assembly 20 to drive the connecting assembly 20 to move relative to the fixed base 10 to peel off the workpiece 60; the peeling drive assembly 30 includes a peeling drive component and a peeling drive connecting component 310, and a tension / compression sensor 40 is connected to the peeling drive connecting component 310.
[0056] The peeling drive assembly 30 can drive the connecting assembly 20 to move towards or away from the fixed seat 10 via the electric cylinder connecting block. The tension and pressure sensor 40 can sense the pressure and tension values of the connecting assembly 20 when it is acted upon by the peeling drive assembly 30. Optionally, the peeling drive can be a drive structure such as an electric cylinder, a pneumatic cylinder, or a hydraulic cylinder; the peeling drive connecting component 310 can be one of a connecting block, a connecting plate, or a connecting seat.
[0057] For example, when the workpiece 60 is a crystal ingot, during the process of peeling off the wafer to be peeled off the crystal ingot, the adhesive medium 70 is uniformly dripped, spin-coated, or scraped onto the upper surface of the modified layer formed by the crystal ingot and / or the adhesive contact surface of the connecting component 20; after coating, the peeling drive component 30, in conjunction with the tension and pressure sensor 40, drives the connecting component 20 and the fixing seat 10 to move towards each other, and maintains the driving force when the adhesive contact surface of the adhesive component 210 contacts the upper surface of the modified layer, so that the adhesive medium 70 is uniformly distributed on the upper surface of the modified layer formed by the crystal ingot.
[0058] When the temperature regulating unit 220 cools down, the cooling energy is transferred through the adhesive contact surface of the adhesive component 210 to the adhesive medium 70 between the adhesive contact surface and the upper surface of the modified layer. The temperature regulating unit 220 maintains the cooling for a certain period of time so that the adhesive medium 70 changes from liquid to solid under the action of low temperature until it is completely cured, and the viscosity increases as the temperature decreases, so as to achieve a tight connection between the adhesive contact surface and the upper surface of the modified layer. After the adhesive medium 70 is converted into solid, the peeling drive component 30, in conjunction with the tension and pressure sensor 40, drives the connecting component 20 to move in a direction away from the fixed seat 10. That is, after the adhesive medium 70 between the adhesive contact surface and the upper surface of the modified layer is cooled and cured, it pulls the crystal ingot until the wafer to be peeled off on the crystal ingot is separated from the modified layer of the crystal ingot.
[0059] When the temperature regulating unit 220 heats up, the heating energy is transferred through the adhesive contact surface of the adhesive component 210 (such as the adhesive contact block) to the adhesive medium 70 between the adhesive contact surface and the upper surface of the modified layer. The temperature regulating unit 220 maintains the heating for a certain period of time so that the adhesive medium 70 liquefies with the temperature and the viscosity decreases as the temperature rises, thereby achieving the separation of the adhesive contact surface and the upper surface of the modified layer.
[0060] By combining the peeling drive component 30 and the tension / compression sensor 40, the adhesive medium 70 can be evenly distributed on the upper surface of the modified layer of the ingot while ensuring that the ingot is free from damage, thereby improving the yield and efficiency of the ingot peeling process. Furthermore, by utilizing the characteristic that the adhesive stress between the adhesive medium 70 after cooling and curing is greater than the internal stress of the modified layer of the ingot, the wafer to be peeled off on the ingot can be separated from the modified layer of the ingot, which can improve the ingot peeling efficiency while ensuring that the ingot peeling process is free from damage.
[0061] It should be noted that the temperature regulating unit 220 controls the bonding contact surface of the adhesive component 210 to be either a cooling surface or a heating surface by switching the incoming medium. When the temperature regulating unit 220 introduces a cooling medium, the bonding contact surface of the adhesive component 210 (such as an adhesive contact block) is a cooling surface. When the temperature regulating unit 220 introduces a pyrolysis medium, the bonding contact surface of the adhesive component 210 (such as an adhesive contact block) is a heating surface. The temperature regulating unit 220 controls the temperature of the adhesive component 210 (such as an adhesive contact block) between -50℃ and 80℃. The initial operating temperature of the temperature regulating unit 220 is room temperature. The peeling drive connection component 310 (such as an electric cylinder connection block) is controlled by an electric cylinder, enabling it to move along the axial direction of the electric cylinder. The initial position is the highest point of the electric cylinder.
[0062] When workpiece 60 (such as a crystal ingot) needs to be peeled off, the workpiece transport substrate 50, on which workpiece 60 is fixedly mounted, is connected to the fixing base 10. This improves the problem of accidental slippage of workpiece 60 due to lack of bottom limit during peeling. The connecting component 20 is fixedly connected to workpiece 60 through adhesive medium 70, so that workpiece 60 is located between substrate 50 and connecting component 20 in the height direction of workpiece peeling mechanism. The peeling drive component 30 connected to the connecting component 20 drives the connecting component 20 to move relative to the fixing base 10 to peel off workpiece 60 (such as wafer peeling from crystal ingot). By utilizing the adhesive characteristics of adhesive medium 70, it is possible to ensure no damage during the peeling process of workpiece 60 while also improving the peeling efficiency of workpiece 60. This improves the problem that the peeling yield and efficiency of workpiece 60 cannot be balanced due to mechanical peeling, thermal peeling and chemical peeling, effectively meeting the higher requirements of semiconductor processing.
[0063] This application also provides a processing device, which includes a workpiece stripping mechanism and a workpiece transport substrate as described in the above embodiments. The workpiece transport substrate is detachably connected to a fixed base, and the workpiece is fixedly disposed on the workpiece transport substrate. Before the workpiece is stripped, the workpiece transport substrate and the workpiece enter the stripping process together. After the workpiece is stripped, the workpiece transport substrate and the workpiece enter the next process together. This can improve the speed at which the workpiece is transferred to the next process after stripping is completed, and can also ensure that there is no damage during the workpiece stripping process.
[0064] The division of the various modules in the above-described workpiece stripping mechanism is only for illustrative purposes. In other embodiments, the workpiece stripping mechanism can be divided into different modules as needed to complete all or part of the functions of the above-described workpiece stripping mechanism.
[0065] The workpiece stripping mechanism and processing equipment provided in the above embodiments, when the wafer needs to be stripped, the fixing seat limits the substrate connected to the lower surface of the ingot, which improves the problem of accidental slippage due to lack of limiting at the bottom of the ingot during the stripping process. The adhesive contact surface of the adhesive component in the connecting assembly and / or the upper surface of the modified layer formed by the ingot are coated with an adhesive medium. The adhesive contact surface is first pressed onto the upper surface of the modified layer, and after pressing, the temperature regulating connecting assembly cools and cures the adhesive medium. After cooling and curing, the adhesive component drives the wafer to be stripped from the modified layer of the ingot. By utilizing the characteristic of the adhesive medium changing state with temperature, it is possible to ensure no damage during the workpiece stripping process while also improving the workpiece stripping efficiency. This effectively improves the problem that the workpiece stripping yield and efficiency cannot be balanced due to mechanical stripping, thermal stripping and chemical stripping methods, effectively meeting the higher requirements of the semiconductor processing process, and has important economic value and practical application value.
[0066] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0067] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A workpiece stripping mechanism applicable to a workpiece transport substrate, characterized by, The workpiece stripping mechanism comprises: a fixing seat, to which a workpiece conveying substrate is detachably connected, the workpiece being fixedly arranged on the workpiece conveying substrate; a connecting assembly, which is fixedly connected to the workpiece through an adhesive medium, so that the workpiece is located between the substrate and the connecting assembly in the height direction of the workpiece stripping mechanism; a stripping driving assembly, which is connected to the connecting assembly to drive the connecting assembly to move relative to the fixing seat to strip the workpiece.
2. The workpiece stripping mechanism of claim 1, wherein, The fixing seat comprises a fixing driving component, a fixing component and a mounting seat body, the fixing driving component being arranged on the mounting seat body, and an output end of the fixing driving component being connected to the fixing component to drive the fixing component to fix the workpiece conveying substrate on the mounting seat body.
3. The workpiece stripping mechanism of claim 2, wherein, The fixing seat further comprises a vertical limiting component, which can abut against the outside of the fixing component.
4. The workpiece stripping mechanism of claim 3, wherein, The fixing driving component, the fixing component and the vertical limiting component are multiple in number, and the multiple fixing driving components, the multiple fixing components and the multiple vertical limiting components are symmetrically and spacedly distributed on the mounting seat body.
5. The workpiece stripping mechanism of claim 1, wherein, The connecting assembly is a temperature-adjusting connecting assembly capable of changing the temperature of the adhesive medium, the temperature-adjusting connecting assembly comprising a bonding component and a temperature-adjusting unit, the bonding component being connected to the temperature-adjusting unit, and a bonding contact surface of the bonding component being capable of being bonded to the workpiece through the adhesive medium.
6. The workpiece stripping mechanism of claim 5, wherein, The temperature-adjusting unit comprises a refrigeration component and a temperature-adjusting component, one side of the refrigeration component being connected to an energy-conducting surface of the bonding component, and the other side of the refrigeration component being connected to one side of the temperature-adjusting component.
7. The workpiece stripping mechanism of claim 6, wherein, The refrigeration component comprises a cooling medium inlet, a cooling medium outlet and a cooling medium channel, the cooling medium inlet and the cooling medium outlet being arranged on two sides of the refrigeration component, and one end of the cooling medium channel being communicated with the cooling medium inlet and the other end of the cooling medium channel being communicated with the cooling medium outlet.
8. The workpiece stripping mechanism of claim 6, wherein, The temperature-adjusting component comprises a thermal dissociation medium inlet, a thermal dissociation medium outlet and a thermal dissociation medium channel, the thermal dissociation medium inlet and the thermal dissociation medium outlet being arranged on two sides of the refrigeration component, and one end of the thermal dissociation medium channel being communicated with the thermal dissociation medium inlet and the other end of the thermal dissociation medium channel being communicated with the thermal dissociation medium outlet.
9. The workpiece stripping mechanism of claim 6, wherein, The temperature-adjusting unit further comprises a plurality of temperature sensors, which are spacedly distributed on the refrigeration component and the temperature-adjusting component.
10. A processing apparatus characterized by comprising: The workpiece stripping mechanism according to any one of claims 1 to 9; a workpiece conveying substrate, which is detachably connected to the fixing seat, the workpiece being fixedly arranged on the workpiece conveying substrate.