Semiconductor jacking mechanism and semiconductor processing equipment

Abstract

The utility model relates to the technical field of semiconductor equipment, and discloses a semiconductor jacking mechanism and semiconductor processing equipment. Wherein the bearing plate is arranged above the first supporting plate, the bearing plate is used for bearing a wafer, the first supporting plate is provided with a plurality of first guide holes, and the bearing plate is provided with a plurality of second guide holes; the second supporting plate is arranged below the first supporting plate, and the first supporting plate and the second supporting plate are both fixed in the process cavity; the jacking assembly comprises an electric cylinder, a driving plate and a plurality of ejector pins, the electric cylinder is connected to the second supporting plate, fixing of the electric cylinder is achieved, the driving plate is located between the first supporting plate and the second supporting plate, the electric cylinder is in driving connection with the driving plate, and the ejector pins are arranged on the side, close to the first supporting plate, of the driving plate; and the electric cylinder is used for driving the driving plate to ascend and descend, stable jacking of the wafer is achieved, meanwhile, the stopping precision is guaranteed, and the stability of jacking of the wafer is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a semiconductor lifting mechanism and semiconductor processing equipment. Background Technology

[0002] The development of semiconductor technology has gradually increased the requirements for equipment. Most of the equipment in semiconductor manufacturing is carried out in a vacuum environment or in a closed space at the bottom. The process cavity requires rising ejector pins as a transfer medium to interact with the robotic arm for wafer transfer.

[0003] In the existing technology, the lifting pin uses pneumatic power as the power source. However, the pneumatically driven lifting pin will cause the lifting pin to rise and fall rapidly. During the lifting process, the lifting pin will exert a large impact force on the wafer, which can easily damage the wafer or reduce the wafer's positional accuracy.

[0004] Therefore, there is an urgent need for a semiconductor lifting mechanism and semiconductor processing equipment to solve the aforementioned problems. Utility Model Content

[0005] Based on the above, the purpose of this utility model is to provide a semiconductor lifting mechanism and semiconductor processing equipment to achieve stable wafer lifting, while ensuring stopping accuracy and improving the stability of wafer lifting.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] On one hand, a semiconductor lifting mechanism is provided, disposed within a cavity, the semiconductor lifting mechanism comprising:

[0008] A first support plate and a carrier plate, wherein the carrier plate is disposed above the first support plate and is used to support the wafer; the first support plate is provided with a plurality of first guide holes and the carrier plate is provided with a plurality of second guide holes;

[0009] The second support plate is disposed below the first support plate, and both the first support plate and the second support plate are fixed inside the process cavity;

[0010] The lifting assembly includes an electric cylinder, a drive plate, and a plurality of ejector pins. The electric cylinder is connected to the second support plate, and the drive plate is located between the first support plate and the second support plate. The electric cylinder is driven and connected to the drive plate. The plurality of ejector pins are disposed on the side of the drive plate near the first support plate. The ejector pins, the first guide hole, and the second guide hole correspond one-to-one. The electric cylinder is used to drive the drive plate to rise and fall so that the ejector pins pass through the first guide hole and the second guide hole.

[0011] As a preferred technical solution for a semiconductor lifting mechanism, the lifting assembly further includes a guide component, the guide component includes a guide shaft connected to the drive plate, the second support plate is provided with a third guide hole, and the guide shaft is slidably connected to the third guide hole.

[0012] As a preferred technical solution for a semiconductor lifting mechanism, the guide component further includes a linear bearing, which is disposed within the third guide hole, and the guide shaft passes through the linear bearing.

[0013] As a preferred technical solution for a semiconductor lifting mechanism, the guide components are multiple.

[0014] As a preferred technical solution for a semiconductor lifting mechanism, the ejector pin is sealed to the inner wall of the first guide hole.

[0015] As a preferred technical solution for a semiconductor lifting mechanism, at least two sealing rings are provided at intervals in the first guide hole, and the ejector pin passes through the sealing rings.

[0016] As a preferred technical solution for a semiconductor lifting mechanism, the outer wall of the sealing ring is coated with vacuum grease.

[0017] As a preferred technical solution for a semiconductor lifting mechanism, the drive plate is provided with a first threaded hole, and the bottom end of the ejector pin is provided with an external thread, which is threadedly connected to the first threaded hole.

[0018] As a preferred technical solution for a semiconductor lifting mechanism, the lifting assembly further includes a locking nut, the side wall of the ejector pin is provided with a polygonal flange, the external thread is sequentially threaded to the locking nut and the first threaded hole, and the polygonal flange abuts against the locking nut.

[0019] On the other hand, a semiconductor processing apparatus is provided, including a robot and a semiconductor lifting mechanism as described in any of the above embodiments. The semiconductor processing apparatus is provided with a process cavity, and both the robot and the semiconductor lifting mechanism are disposed within the process cavity. The robot is used to transfer wafers.

[0020] The beneficial effects of this utility model are as follows:

[0021] This invention provides a semiconductor lifting mechanism and semiconductor processing equipment. When a wafer needs to be lifted, an electric cylinder on the second support plate drives the drive plate to rise. Multiple ejector pins pass through the first and second guide holes and lift the wafer on the support plate, facilitating interaction between the wafer and the robotic arm. This invention uses an electric cylinder drive, which can easily achieve smooth acceleration or deceleration settings without causing instantaneous impact to the wafer. After lifting, the smooth deceleration and stopping process achieves stable wafer lifting while ensuring stopping accuracy. Furthermore, the multiple ejector pins supporting the wafer improve the stability of wafer lifting. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the semiconductor lifting mechanism provided in a specific embodiment of the present invention;

[0024] Figure 2 This is an exploded view of the semiconductor lifting mechanism provided in a specific embodiment of this utility model.

[0025] The markings in the image are as follows:

[0026] 1. First support plate; 2. Bearing plate; 21. Second guide hole; 3. Second support plate; 4. Lifting assembly; 41. Electric cylinder; 42. Drive plate; 43. Ejector pin; 431. External thread; 432. Polygonal flange; 44. Guide component; 441. Guide shaft; 442. Linear bearing; 45. Locking nut; 46. First washer; 47. Connecting block. Detailed Implementation

[0027] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0028] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0029] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0030] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0031] like Figure 1 and Figure 2As shown, this embodiment provides a semiconductor lifting mechanism, which includes a first support plate 1, a carrier plate 2, a second support plate 3, and a lifting assembly 4. Specifically, the carrier plate 2 is disposed above the first support plate 1 and is used to support the wafer. The first support plate 1 is provided with a plurality of first guide holes, and the carrier plate 2 is provided with a plurality of second guide holes 21. The second support plate 3 is disposed below the first support plate 1, and both the first support plate 1 and the second support plate 3 are fixed in the process cavity. The lifting assembly 4 includes an electric cylinder 41, a drive plate 42, and a plurality of ejector pins 43. The electric cylinder 41 is connected to the second support plate 3 to fix the electric cylinder 41. The drive plate 42 is located between the first support plate 1 and the second support plate 3, and the electric cylinder 41 is driven and connected to the drive plate 42. The plurality of ejector pins 43 are disposed on the side of the drive plate 42 near the first support plate 1. The ejector pins 43, the first guide holes, and the second guide holes 21 correspond one-to-one. The electric cylinder 41 is used to drive the drive plate 42 to rise and fall so that the ejector pins 43 pass through the first guide holes and the second guide holes 21. In this embodiment, the support plate 2 can be a vacuum suction cup.

[0032] When the wafer needs to be lifted, the electric cylinder 41 on the second support plate 3 drives the drive plate 42 to rise. Multiple ejector pins 43 pass through the first guide hole and the second guide hole 21 and lift the wafer on the carrier plate 2, facilitating interaction between the wafer and the robot. In this embodiment, the electric cylinder 41 is used for driving, which can easily achieve smooth acceleration or deceleration settings without causing instantaneous impact to the wafer. After lifting, the smooth deceleration and stopping process achieves stable wafer lifting while ensuring stopping accuracy. Furthermore, the multiple ejector pins 43 support the wafer, improving the stability of wafer lifting.

[0033] Preferably, the lifting assembly 4 further includes a guide component 44, which includes a guide shaft 441 connected to the drive plate 42. The second support plate 3 is provided with a third guide hole, and the guide shaft 441 is slidably connected to the third guide hole. When the drive plate 42 is raised or lowered, the guide shaft 441 moves within the third guide hole, improving the movement accuracy of the drive plate 42. In this embodiment, the guide component 44 also includes a first screw and a first washer 46. The top end of the guide shaft 441 is provided with a first threaded hole, and the drive plate 42 is provided with a first through hole. The first screw passes through the first washer 46 and the first through hole and is threadedly connected to the first threaded hole, thus connecting the guide shaft 441 to the drive plate 42.

[0034] More preferably, the guide component 44 further includes a linear bearing 442, which is disposed in the third guide hole, and the guide shaft 441 passes through the linear bearing 442. The linear bearing 442 is used to assist the vertical movement of the guide shaft 441. In this embodiment, the linear bearing 442 is fixed to the second support plate 3 by screws.

[0035] Preferably, there are multiple guide components 44. In this embodiment, there are three guide components 44, and the drive plate 42 is guided by three guide shafts 441, which further improves the movement accuracy and movement stability.

[0036] In this embodiment, the ejector pin 43 is sealed to the inner wall of the first guide hole so that the cavity containing the wafer on the carrier plate 2 is sealed.

[0037] In this embodiment, at least two sealing rings are spaced apart within the first guide hole, and the ejector pin 43 passes through the sealing rings. In this embodiment, two sealing rings are spaced apart within the first guide hole, and the ejector pin 43 is sealed to the first guide hole through the two sealing rings, thus improving the sealing performance.

[0038] Preferably, the outer wall of the sealing ring is coated with vacuum grease to reduce the friction between the ejector pin 43 and the sealing ring when the ejector pin 43 moves up and down, making it easier for the ejector pin 43 to be inserted, reducing the wear of the sealing ring, and improving its service life.

[0039] In this embodiment, the drive plate 42 is provided with a first threaded hole, and the bottom end of the ejector pin 43 is provided with an external thread 431. The external thread 431 is threadedly connected to the first threaded hole so that the ejector pin 43 is connected to the drive plate 42.

[0040] Preferably, the lifting assembly 4 further includes a locking nut 45, and the side wall of the ejector pin 43 is provided with a polygonal flange 432. An external thread 431 is sequentially threaded to the locking nut 45 and the first threaded hole, and the polygonal flange 432 abuts against the locking nut 45. When the ejector pin 43 is turned, the operator uses a tool to loosen the polygonal flange 432 to facilitate rotation of the ejector pin 43. When the polygonal flange 432 abuts against the locking nut 45, the locking nut 45 acts as a washer, ensuring that the ejector pin 43 is tightly abutted against the locking nut 45. The ejector pin 43 and the drive plate 42 are in a fixed state, preventing the ejector pin 43 from falling off or loosening. In this embodiment, the locking nut 45 is a hexagonal nut, and the polygonal flange 432 is a hexagonal flange.

[0041] In this embodiment, the electric cylinder 41 is provided with an electric rod, and a receiving groove is provided on one side of the drive plate 42. A second through hole is provided at the bottom of the receiving groove, and a connecting block 47 is provided in the receiving groove. The connecting block 47 acts as a gasket and is provided with a third through hole. A third threaded hole is provided at the end of the electric rod. A second screw passes through the third through hole and the second through hole and is threadedly connected to the third threaded hole, thereby realizing the connection of the drive plate 42 to the electric rod.

[0042] In this embodiment, the electric cylinder 41 is an AC servo motor with an absolute encoder. The power of the electric cylinder 41 is transmitted through a ball screw, which can achieve smooth acceleration or deceleration.

[0043] This embodiment also provides a semiconductor processing equipment, including a robot and the aforementioned semiconductor lifting mechanism. The semiconductor processing equipment is provided with a process cavity, and both the robot and the semiconductor lifting mechanism are disposed within the process cavity. The robot is used to transfer wafers.

[0044] This embodiment also provides the workflow of the semiconductor processing equipment, including the following steps:

[0045] Step 1: The robotic arm carries the wafer through the wafer transfer port into the process cavity and is positioned above the carrier plate 2;

[0046] Step 2: The electric cylinder 41 drives the drive plate 42 to rise, and the drive plate 42 drives the ejector pin 43 to rise; so that the height of the ejector pin 43 is higher than the surface of the robot arm. At this time, the ejector pin 43 lifts the wafer and detaches the wafer from the robot arm.

[0047] Step 3: The robotic arm exits the process chamber;

[0048] Step 4: The electric cylinder 41 drives the drive plate 42 to descend, and the drive plate 42 drives the ejector pin 43 to descend, so that the wafer falls onto the carrier plate 2. At this time, the height of the ejector pin 43 is lower than the surface of the carrier plate 2.

[0049] Step 5: Processing begins in the process chamber;

[0050] Step Six: Processing in the process chamber is complete;

[0051] Step 7: The electric cylinder 41 drives the drive plate 42 to rise, and the drive plate 42 drives the ejector pin 43 to rise, so that the ejector pin 43 rises again to lift the wafer.

[0052] Step 8: The robotic arm enters the process chamber through the transfer port;

[0053] Step 9: The ejector pin 43 descends, causing the wafer to fall onto the robotic arm, and the ejector pin 43 detaches from the wafer;

[0054] Step 10: The robotic arm carries the wafer out of the process chamber, and the wafer handling process ends.

[0055] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A semiconductor lift mechanism disposed in a cavity, the mechanism comprising: The semiconductor jacking mechanism comprises: a first support plate (1) and a bearing plate (2) arranged above the first support plate (1), the bearing plate (2) being used for bearing a wafer, the first support plate (1) being provided with a plurality of first guide holes, and the bearing plate (2) being provided with a plurality of second guide holes (21); a second support plate (3) arranged below the first support plate (1), the first support plate (1) and the second support plate (3) being fixed in a process cavity; a jacking assembly (4) comprising an electric cylinder (41), a driving plate (42) and a plurality of jacking pins (43), the electric cylinder (41) being connected to the second support plate (3), the driving plate (42) being located between the first support plate (1) and the second support plate (3), the electric cylinder (41) being drivingly connected to the driving plate (42), and the plurality of jacking pins (43) being arranged on one side of the driving plate (42) close to the first support plate (1), the jacking pins (43), the first guide holes and the second guide holes (21) corresponding to each other, and the electric cylinder (41) being used for driving the driving plate (42) to ascend and descend so that the jacking pins (43) are arranged in the first guide holes and the second guide holes (21).

2. The semiconductor top-up mechanism according to claim 1, wherein The jacking assembly (4) further comprises a guide component (44), the guide component (44) comprising a guide shaft (441), the guide shaft (441) being connected to the driving plate (42), the second support plate (3) being provided with a third guide hole, and the guide shaft (441) being slidingly connected to the third guide hole.

3. The semiconductor top-up mechanism according to claim 2, wherein The guide component (44) further comprises a linear bearing (442), the linear bearing (442) being arranged in the third guide hole, and the guide shaft (441) being arranged in the linear bearing (442).

4. The semiconductor top-up mechanism according to claim 2, wherein The guide component (44) is a plurality of.

5. The semiconductor top-up mechanism according to claim 1, wherein The jacking pin (43) is sealingly connected to the inner wall of the first guide hole.

6. The semiconductor top-up mechanism according to claim 5, wherein At least two sealing rings are arranged in the first guide hole at intervals, and the jacking pin (43) is arranged in the sealing rings.

7. The semiconductor top-up mechanism according to claim 6, wherein The outer wall of the sealing ring is coated with vacuum lubricating grease.

8. The semiconductor top-up mechanism according to claim 1, wherein The driving plate (42) is provided with a first threaded hole, the bottom end of the jacking pin (43) is provided with an external thread (431), and the external thread (431) is threadedly connected to the first threaded hole.

9. The semiconductor top-up mechanism according to claim 8, wherein The jacking assembly (4) further comprises a locking nut (45), the side wall of the jacking pin (43) is provided with a polygonal flange (432), the external thread (431) is threadedly connected to the locking nut (45) and the first threaded hole in sequence, and the polygonal flange (432) abuts against the locking nut (45).

10. A semiconductor processing apparatus, characterized by comprising: The semiconductor processing equipment comprises a manipulator and a semiconductor jacking mechanism as claimed in any one of claims 1-9, the semiconductor processing equipment is provided with a process cavity, the manipulator and the semiconductor jacking mechanism are arranged in the process cavity, and the manipulator is used for conveying a wafer.

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