Power module
By adopting a vertically arranged packaging structure in the power module, the problems of large packaging area and parasitic effects caused by planar arrangement are solved, achieving a reduction in packaging area and an improvement in performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-09
- Publication Date
- 2026-03-13
AI Technical Summary
The planar arrangement of multiple power switching devices in existing power modules results in a large package area and an increased current loop, generating strong parasitic effects and affecting module performance.
The packaging structure adopts a vertical arrangement, in which the power switching devices are placed in the groove of the metal bracket and electrically connected through different surface circuit layers of the circuit board to form a vertical arrangement to shorten the current loop.
The reduced packaging area and parasitic effects have facilitated the miniaturization and performance improvement of power modules.
Smart Images
Figure CN223993893U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a power module. Background Technology
[0002] In power modules with embedded packaging structures, power switching devices such as MOSFET chips and IGBT chips can be packaged inside the circuit board. Furthermore, metal brackets connecting the power switching devices can be placed within the circuit board, utilizing these brackets for high-current transmission and promoting rapid heat dissipation.
[0003] The power module with the above structure usually includes multiple power switching devices. In the prior art, multiple power switching devices are generally arranged in a planar manner on a metal bracket. This planar arrangement structure not only results in a large package area, but also increases the length of the line connection between the power switching devices and its current loop. The increase in the current loop will cause the power module to generate stronger parasitic effects (such as parasitic capacitance or inductance), resulting in a decrease in the performance of the power module. Utility Model Content
[0004] In view of the shortcomings of the prior art, the main purpose of this utility model is to provide an improved power module in which the power switching devices adopt a vertically arranged packaging structure to further reduce the packaging area and reduce parasitic effects.
[0005] To achieve the aforementioned main objectives, this utility model discloses a power module, comprising:
[0006] A circuit board having a first circuit layer on its upper surface and a second circuit layer on its lower surface;
[0007] A metal bracket is disposed within the circuit board and electrically connected to the first circuit layer and / or the second circuit layer; wherein the metal bracket has a first groove facing the upper surface and a second groove facing the lower surface, the first groove and the second groove at least partially overlapping in the vertical direction;
[0008] A first power switching device is disposed in the first groove and is electrically connected to the metal bracket and the first circuit layer;
[0009] A second power switching device is disposed in the second groove and is electrically connected to the metal bracket and the second circuit layer.
[0010] According to a specific embodiment of the present invention, both the first power switching device and the second power switching device are MOSFET chips.
[0011] Furthermore, the source and gate of the first power switching device are electrically connected to the first circuit layer, the source and gate of the second power switching device are electrically connected to the second circuit layer, and the drains of both the first and second power switching devices are electrically connected to the metal support.
[0012] Furthermore, the circuit board is also equipped with a capacitor, the two terminals of which are electrically connected to the first power switching device and the second power switching device, respectively.
[0013] According to a specific embodiment of the present invention, the circuit board includes a component core board, a first adhesive sheet and a second adhesive sheet respectively disposed on the upper and lower sides of the core board component, and the first circuit layer and the second circuit layer are respectively disposed on the first adhesive sheet and the second adhesive sheet.
[0014] Furthermore, the core board assembly includes multiple core boards, which are bonded together by a third adhesive sheet; the metal bracket is disposed within the core board assembly and is bonded to the core boards by the third adhesive sheet.
[0015] Furthermore, the first adhesive sheet and the second adhesive sheet respectively fill the remaining space in the first groove and the second groove.
[0016] Furthermore, the first power switch device is completely disposed inside the first groove, and the second power switch device is completely disposed inside the second groove.
[0017] Furthermore, the metal support is a copper support, and the first groove and the second groove preferably have an upper and lower symmetrical structure.
[0018] Furthermore, the first circuit layer and the second circuit layer are electrically connected through conductive vias penetrating the circuit board.
[0019] The technical solution of this utility model has the following beneficial effects:
[0020] In the power module of this utility model, the metal bracket has a first groove and a second groove facing the upper and lower surfaces of the circuit board, respectively. The first power switch device and the second power switch device are respectively disposed in the first groove and the second groove to form a vertical arrangement. This vertical arrangement packaging structure can not only reduce the packaging area of the power module, but also shorten the current loop to reduce parasitic effects.
[0021] To more clearly illustrate the purpose, technical solution, and advantages of this utility model, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the power module in the embodiment;
[0023] Figure 2 This is a schematic diagram of the metal support structure in the embodiment;
[0024] Figure 3 This is a circuit diagram of the power module in the embodiment. Detailed Implementation
[0025] The technical solution of this utility model is described in detail below with reference to specific embodiments. However, this utility model can also be implemented in other variations based on this description. Therefore, the protection scope of this utility model is not limited to the specific embodiments disclosed below.
[0026] like Figure 1 As shown, the power module of this embodiment includes a circuit board 10 and a metal bracket 20 disposed within the circuit board 10. The upper surface of the circuit board 10 has a first wiring layer 11, and the lower surface has a second wiring layer 12. The first wiring layer 11 and the second wiring layer 12 are electrically connected through conductive vias 13 penetrating the circuit board 10. Specifically, the circuit board 10 includes a core board assembly 100, a first adhesive sheet 101 and a second adhesive sheet 102 respectively disposed on the upper and lower sides of the core board assembly 100, and the first wiring layer 11 and the second wiring layer 12 are respectively disposed on the first adhesive sheet 101 and the second adhesive sheet 102.
[0027] A metal support 20 is disposed within the core board assembly 100, and the metal support 20 is electrically connected to the first circuit layer 11 and / or the second circuit layer 12. In the embodiment, the metal support 20 is electrically connected to the first circuit layer 11 through a metal conductive hole 111 penetrating the first adhesive sheet 101, and is electrically connected to the second circuit layer 12 through a metal conductive hole 121 penetrating the second adhesive sheet 102. In this invention, the metal support 20 is preferably a copper support, but is not limited thereto.
[0028] Preferably, the core board assembly 100 includes multiple core boards (e.g., FR-4 core boards), which are bonded together by a third adhesive sheet. The metal support 20 is bonded to the core boards by the third adhesive sheet. During manufacturing, through holes can be machined in the core boards and the semi-cured third adhesive sheet corresponding to the positions of the metal support 20. After the multiple core boards and the third adhesive sheet are stacked, the metal support 20 is placed in the through holes and pressed together. The adhesive flow from the third adhesive sheet is used to bond the metal support 20 together.
[0029] Furthermore, the circuit board 10 may also have internal layer circuitry (not shown in the figure) that is electrically connected to the first circuit layer 11 and / or the second circuit layer 12. For example, the core board may be a core board with a copper-clad layer, and the internal layer circuitry may be processed on the copper-clad layer of the core board before lamination.
[0030] Combination Figure 1 and Figure 2 As shown, the metal bracket 20 has a first groove 21 facing the upper surface of the circuit board 10 and a second groove 22 facing the lower surface of the circuit board 10; wherein the first groove 21 and the second groove 22 at least partially overlap in the vertical direction, and preferably have a symmetrical structure. A first power switch device 201 is disposed in the first groove 21, and a second power switch device 202 is disposed in the second groove 22. A first adhesive sheet 101 and a second adhesive sheet 102 respectively fill the remaining space (i.e., the space not occupied by the power switch devices) in the first groove 11 and the second groove 21.
[0031] Preferably, the first power switch device 201 is completely disposed inside the first groove 21, and the second power switch device 202 is completely disposed inside the second groove 22; that is, the first power switch device 201 and the second power switch device 202 are configured not to protrude from the metal bracket 20. In this way, the metal bracket 20 can reduce the pressure on the first power switch device 201 and the second power switch device 202 during the pressing process, so as to prevent damage to the first power switch device 201 and the second power switch device 202 due to excessive pressure.
[0032] It should be noted that there can be one or more first grooves 21 and second grooves 22. Each first groove 21 may contain one or more first power switching devices 201, and each second groove 22 may contain one or more second power switching devices 202. Preferably, the number of first power switching devices 201 and second power switching devices 202 is equal.
[0033] For example, both the first power switching device 201 and the second power switching device 202 are MOSFET chips, with a drain D on one side surface and a source S and a gate G on the opposite side surface. The source S and gate G of the first power switching device 201 are electrically connected to the first circuit layer 11 through their respective metal conductive holes 112, and the source S and gate G of the second power switching device 202 are electrically connected to the second circuit layer 12 through their respective metal conductive holes 122. The drain D of both the first power switching device 201 and the second power switching device 202 are electrically connected to the metal support 20, for example, by means of welding or conductive adhesive bonding.
[0034] Please continue reading. Figure 1 One or more capacitors 300 may also be provided inside the circuit board 10 / core board assembly 100. For example... Figure 3As shown, the first power switching device 201 and the second power switching device 202 constitute a half-bridge rectifier circuit, and the two terminals of the capacitor 300 are electrically connected to the first power switching device 201 and the second power switching device 202, respectively. For example, as shown... Figure 1 As shown, one pole of capacitor 300 is electrically connected to the first circuit layer 11 through metal conductive hole 113, and then electrically connected to the drain D of the first power switching device 201; the other pole of capacitor 300 is electrically connected to the second circuit layer 12 through metal conductive hole 123, and then electrically connected to the source S of the second power switching device 202.
[0035] In this embodiment, the metal bracket 20 has a first groove 21 and a second groove 22 facing the upper and lower surfaces of the circuit board 10, respectively. The first power switch device 201 and the second power switch device 202 are respectively disposed in the first groove 21 and the second groove 22, forming a package structure in which the first power switch device 201 and the second power switch device 202 are arranged vertically. This vertical arrangement structure is beneficial in two ways: firstly, it reduces the current loop, thereby reducing the parasitic effects of the circuit (such as parasitic capacitance and parasitic inductance); secondly, it reduces the space occupied by the power switch devices, so as to facilitate the encapsulation of electronic components such as capacitor 300 inside the circuit board 10, and promotes the miniaturization of the power module.
[0036] Although the present invention has been disclosed above with reference to specific embodiments, these embodiments are not intended to limit the scope of the present invention. Any person skilled in the art may make some modifications or variations without departing from the scope of the present invention; that is, all equivalent changes made in accordance with the present invention should be covered by the protection scope of the present invention.
Claims
1. A power module, characterized by The application relates to a circuit board and a power switch device. The circuit board comprises a first circuit layer on the upper surface and a second circuit layer on the lower surface. A metal support is arranged in the circuit board and is electrically connected to the first circuit layer and / or the second circuit layer. The metal support has a first groove facing the upper surface and a second groove facing the lower surface, and the first groove and the second groove at least partially overlap in the up-down direction. A first power switch device is arranged in the first groove and is electrically connected to the metal support and the first circuit layer.
2. The power module of claim 1, characterized in that: A second power switch device is arranged in the second groove and is electrically connected to the metal support and the second circuit layer.
3. The power module according to claim 1 or 2, characterized in that: The first power switch device and the second power switch device are both MOSFET chips.
4. The power module of claim 3, characterized in that: The source and the gate of the first power switch device are electrically connected to the first circuit layer, and the source and the gate of the second power switch device are electrically connected to the second circuit layer.
5. The power module of claim 1, wherein: The drain of the first power switch device and the drain of the second power switch device are both electrically connected to the metal support.
6. The power module of claim 5, characterized in that: The circuit board further comprises a capacitor, and the two poles of the capacitor are electrically connected to the first power switch device and the second power switch device, respectively.
7. The power module of claim 5, characterized in that: The circuit board comprises a core board assembly, a first adhesive sheet and a second adhesive sheet arranged on the upper and lower sides of the core board assembly, respectively, and the first circuit layer and the second circuit layer are arranged on the first adhesive sheet and the second adhesive sheet, respectively.
8. The power module of claim 1, wherein: The core board assembly comprises a plurality of core boards, and the plurality of core boards are connected by a third adhesive sheet.
9. The power module of claim 1, wherein: The metal support is arranged in the core board assembly and is connected to the core boards by the third adhesive sheet.
10. The power module of claim 1, wherein: The first adhesive sheet and the second adhesive sheet fill the remaining space in the first groove and the second groove, respectively. The first power switch device is completely arranged in the first groove, and the second power switch device is completely arranged in the second groove. The metal support is a copper support, and the first groove and the second groove have an up-down symmetric structure. The first circuit layer and the second circuit layer are electrically connected by a conductive via hole penetrating through the circuit board.