SOT vertical-row lead frame

Abstract

The utility model relates to the technical field of semiconductors, and discloses an SOT vertical-row lead frame, which comprises a frame body, a lead frame group is arranged on the frame body, at least two rows of lead frame units which are vertically arranged are arranged on the lead frame group, every two lead frame units are connected through a first pin, and a second pin is arranged between every two adjacent lead frame units. The lead frame units are vertically arranged, and every two adjacent lead frame units are connected through the corresponding first pin, so that compared with traditional transverse arrangement, materials are effectively saved, the material utilization rate is increased, and the production cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a SOT vertical lead frame. Background Technology

[0002] In the field of electronics, the design and optimization of circuit boards and their components have always been key factors driving improvements in electronic product performance and reductions in cost. Traditional circuit board designs often employ a planar layout, arranging various electronic components such as resistors, capacitors, diodes, and integrated circuits according to specific circuit logic and connection requirements. However, this design approach may be space-constrained in certain application scenarios, especially in modern electronic devices that strive for miniaturization and high integration.

[0003] Currently, most SOT lead frames adopt a horizontal design, which occupies a large amount of space in the horizontal direction. Because sufficient clearance must be left between each product unit to prevent pin short circuits, this greatly limits the number of products that can be arranged on a unit area of ​​substrate, resulting in low space utilization. To achieve a certain production scale, a larger area of ​​substrate material is required, which directly increases raw material costs. Moreover, in various production processes, such as etching, electroplating, and packaging, handling large-area horizontal lead frames consumes more energy and time, further driving up production costs. Utility Model Content

[0004] This invention addresses the shortcomings of existing technologies by providing a vertical SOT lead frame. Through optimized structural design, it improves material utilization, reduces material waste, and enhances chip electrical performance and packaging reliability.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A vertical SOT lead frame includes a frame body, on which a lead frame group is provided, and on which at least two rows of vertically arranged lead frame units are provided, with each pair of lead frame units connected by a pin.

[0007] Preferably, there are multiple lead frame groups, and longitudinal ribs are provided between every two lead frame groups.

[0008] Preferably, the lead frame unit includes a base island and pin 2. Pin 2 is connected to pin 1. Pin 2 is respectively located on the upper and lower sides of the base island. Pin 2 is an internal pin. Pin 2 can not only efficiently transmit electrical signals, but also assist in chip heat dissipation.

[0009] Preferably, the base island is provided with a locking hole located at the edge of the base island, and the base island is provided with locking grooves on the upper and lower sides. The locking hole and locking groove can firmly fix the chip or other components to the base island, thereby enhancing the bonding force between the chip and the base island.

[0010] Preferably, the base island is provided with an anti-overflow groove, which is located on the side of the base island near the glue-locking hole. The anti-overflow groove can effectively prevent glue from overflowing during the filling process.

[0011] Preferably, the lead frame unit further includes a connecting rib, which is located at the connection between the lead frame unit and the lead frame assembly. The connecting rib can prevent the pins from deforming, bending or breaking due to external forces, thus ensuring the integrity of the frame structure.

[0012] Preferably, pin two is provided with a precision pressing line. The precision pressing line on pin two helps to accurately process and shape pin two during the manufacturing process, ensuring the dimensional accuracy and shape accuracy of pin two.

[0013] Preferably, the frame body is provided with multiple positioning holes evenly on the upper and lower sides. These positioning holes facilitate the precise positioning and installation of the SOT vertical lead frame during the circuit board assembly process, ensuring that its installation position on the circuit board is accurate and improving the accuracy and efficiency of installation.

[0014] Preferably, the anti-overflow groove is triangular with an angle range of 55° to 65° and a depth of 0.01 to 0.038 mm. The triangular anti-overflow groove structure has a good function of guiding and accommodating glue spillage. The specific angle range can better guide the flow of glue and prevent glue from spreading to other areas when it overflows.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] By vertically arranging the lead frame units and connecting adjacent lead frame units through pin 1, compared with the traditional horizontal arrangement, materials are effectively saved, material utilization is improved, and production costs are reduced.

[0017] By using pins 2 on the top and bottom sides of the base island as internal pins, signal delay is reduced, circuit performance is improved, and the chip's heat dissipation efficiency is enhanced, ensuring stable chip operation. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a structural view of the frame body of this utility model;

[0021] Figure 3 This is a structural view of the lead frame unit of this utility model.

[0022] Drawing number explanation: 1. Frame body; 11. Positioning hole; 2. Lead frame assembly; 3. Longitudinal rib; 4. Pin 1; 5. Lead frame unit; 51. Base island; 52. Locking hole; 53. Anti-overflow groove; 54. Connecting rib; 55. Locking groove; 56. Pin 2; 57. Precision pressing wire. Detailed Implementation

[0023] The present invention will now be described in further detail with reference to the accompanying drawings.

[0024] The following description is intended to disclose the present invention so that those skilled in the art can implement it. The preferred embodiments described below are merely examples, and other obvious modifications will be apparent to those skilled in the art. The basic principles of the present invention defined in the following description can be used in other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0025] Those skilled in the art should understand that in the disclosure of this utility model, the terms "longitudinal", "lateral", "up", "down", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or position based on the orientation or positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this utility model and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limitations on this utility model.

[0026] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple, and the term "a" should not be understood as a limitation on the number. Example

[0027] Please see Figure 1-3 A vertical SOT lead frame mainly includes a frame body 1, which serves as the basic support structure for the entire lead frame. A lead frame group 2 is provided on the frame body 1. At least two rows of vertically arranged lead frame units 5 are provided on the lead frame group 2. Each pair of lead frame units 5 is connected by a pin 4. Compared with the traditional horizontal arrangement, this vertical arrangement is more efficient in material utilization and can effectively save material costs.

[0028] Frame body 1 and lead wire frame group 2: There are multiple lead wire frame groups 2, and longitudinal ribs 3 are provided between every two lead wire frame groups 2. The setting of longitudinal ribs 3 enhances the overall structural strength of the frame body 1, making it more stable and less prone to deformation during processing and use.

[0029] The lead frame unit 5 includes a base island 51 and pin 2 56. Pin 2 56 is connected to pin 1 4, and pin 2 56 is respectively located on the upper and lower sides of the base island 51. This layout optimizes the signal transmission path, reduces signal delay, and helps improve circuit performance. At the same time, as an internal pin, pin 2 56 can not only transmit electrical signals efficiently, but also assist in chip heat dissipation.

[0030] The base island 51 is provided with a locking hole 52, which is located on the edge of the base island 51 to facilitate the injection of adhesive and ensure that the chip can be firmly fixed on the base island 51, thereby improving the reliability of the package. In addition, the base island 51 is also provided with locking grooves 55 on the upper and lower sides. The locking grooves 55 can increase the contact area between the molding compound and the product, making the molding more secure and further improving the sealing and stability of the product, thereby improving the reliability and service life of the product.

[0031] An anti-overflow groove 53 is provided on the side of the base island 51 near the glue-locking hole 52. The anti-overflow groove 53 is triangular with an angle range of 55°~65° and a depth of 0.01~0.038mm. This shape, angle and depth design can effectively prevent glue from overflowing during the encapsulation process, avoid contaminating other parts, and at the same time facilitate the flow and distribution of glue in the groove, ensuring product quality.

[0032] The lead frame unit 5 also includes a connecting rib 54, which is located at the connection between the lead frame unit 5 and the lead frame group 2. The width of the connecting rib 54 is smaller than the width of the base island 51. While ensuring the connection strength, it is easy to disconnect the connecting rib 54 with a small force in the later stage of packaging, so as to separate the lead frame unit 5. The pin 2 56 is provided with a precision pressing line 57. During the packaging cutting process, precise cutting can be achieved along the precision pressing line 57 to ensure the integrity and consistency of each lead frame unit 5.

[0033] Multiple positioning holes 11 are evenly provided on the upper and lower sides of the frame body 1. These positioning holes 11 play a role in precise positioning during the packaging process, which helps to improve production efficiency and packaging accuracy.

[0034] Select a suitable metal sheet and, according to the design requirements, use stamping or etching processes to create the prototypes of the base island 51, pin 1 4, pin 2 56, and connecting rib 54 on a single complete sheet, ensuring that they are an integral structure in the initial state.

[0035] Based on the aforementioned plate containing base island 51, pin 1 4, pin 2 56 and connecting rib 54, a frame body 1 is further processed. Multiple positioning holes 11 are evenly processed on the upper and lower sides of the frame body 1 to facilitate precise positioning during subsequent packaging.

[0036] On the frame body 1, the position of the lead frame group 2 is determined according to the design layout. Between every two lead frame groups 2, longitudinal ribs 3 are formed to ensure the connection between the longitudinal ribs 3 and the frame body 1 and the lead frame group 2, thereby enhancing the overall structural strength.

[0037] Locking holes 52 are machined on the edge of the base island 51, and locking grooves 55 are machined on the upper and lower sides of the base island 51. At the same time, an anti-overflow groove 53 is made on the side of the base island 51 near the locking holes 52, with a triangular shape, an angle of 55°~65°, and a depth of 0.01~0.038mm.

[0038] A precision pressing line 57 is provided on pin 2 56. The position and shape of the precision pressing line 57 should meet the precision requirements during package cutting.

[0039] After the above steps, the basic structure of the entire SOT vertical lead frame has been formed. In the later stage of packaging, the lead frame unit 5 and the lead frame group 2 are appropriately separated along the connecting rib 54 through a specific process. At the same time, the pins 56 are cut along the precision pressing line 57 to ensure the integrity and consistency of each lead frame unit 5, and finally complete the manufacturing of the SOT vertical lead frame.

[0040] The SOT vertical lead frame manufactured in the above manner can achieve the goals of improving material utilization, enhancing structural strength, optimizing electrical performance, improving packaging reliability, and increasing production efficiency.

[0041] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functions and structural principles of the present invention have been shown and explained in the embodiments. Without departing from the stated principles, the implementation of the present invention may have any variations or modifications.

Claims

1. A SOT portrait lead frame, characterized by, The application relates to a lead frame group, which comprises a frame body (1), a lead frame group (2) arranged on the frame body (1), at least two rows of vertically arranged lead frame units (5) arranged on the lead frame group (2), and a pin (4) arranged between every two lead frame units (5).

2. The SOT vertical lead frame according to claim 1, wherein: The lead frame group (2) is provided with a plurality of groups, and a longitudinal rib (3) is arranged between every two lead frame groups (2).

3. The SOT vertical lead frame according to claim 2, wherein: The lead frame unit (5) comprises a base island (51) and a pin (56), the pin (56) is connected with the pin (4), and the pin (56) is arranged on the upper and lower sides of the base island (51) respectively.

4. The SOT vertical lead frame according to claim 3, wherein: The base island (51) is provided with a glue locking hole (52), the glue locking hole (52) is arranged at the edge of the base island (51), and glue locking grooves (55) are arranged on the upper and lower sides of the base island (51).

5. The SOT vertical lead frame according to claim 4, wherein: The base island (51) is provided with an anti-overflow groove (53), and the anti-overflow groove (53) is arranged at the side of the base island (51) and close to the glue locking hole (52).

6. The SOT vertical lead frame according to claim 5, wherein: The lead frame unit (5) further comprises a connecting rib (54), and the connecting rib (54) is arranged at the connecting position of the lead frame unit (5) and the lead frame group (2).

7. The SOT vertical lead frame according to claim 6, wherein: The pin (56) is provided with a fine pressing line (57).

8. The SOT vertical lead frame according to claim 7, wherein: The frame body (1) is uniformly provided with a plurality of positioning holes (11) on the upper and lower sides.

9. The SOT vertical lead frame according to claim 5, wherein: The anti-overflow groove (53) is triangular, the angle range is 55-65 degrees, and the depth is 0.01-0.038 mm.

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