Electronic component universal joint die bonding and glue dipping device and glue supply device

Abstract

The utility model relates to the technical field of die bonding equipment, and particularly discloses a die bonding and glue dipping device and a glue supply device for a universal joint of an electronic component, the glue supply device comprises a container and a rotating shaft, and a stirring blade is arranged on a shaft section of the rotating shaft positioned in the container; the die bonding and glue dipping device comprises a rack and a rotating table, a first threaded sleeve and a second threaded sleeve are arranged on the rotating table, the first threaded sleeve is in threaded connection with a first stud, a wafer suction head is arranged at the bottom of the first stud, the second threaded sleeve is in threaded connection with a second stud, and a glue supply head is arranged at the bottom of the second stud. When a wafer is pasted, the driving shaft controls the second screw sleeve to rotate through the rotation driving mechanism, the second screw sleeve is synchronously controlled in the rotating process of the rotating table, the wafer suction head is moved to the position where glue is dispensed on the substrate, the glue supply head is lifted, the wafer suction head is synchronously lowered, and orderly glue dispensing and wafer fixing operation is achieved. And the die bonding efficiency of the die bonding equipment is improved.

Description

Technical Field

[0001] This utility model relates to the field of die bonding equipment technology, specifically to a die bonding adhesive applicator and adhesive supply device for electronic component universal joints. Background Technology

[0002] A die bonder, also known as a die attacher, wafer bonding machine, or chip bonding machine, is a type of machinery used for fixing crystals and semiconductor packaging. It is primarily used in lead frame plates of various gold wire ultrasonic welding equipment, as well as in various nozzles, ejector pins, dispensing heads, ceramic nozzles, guide pins, motors, carbon brushes, encoders, drive belts, and various spare parts for automated equipment, instruments, and meters.

[0003] In existing die bonding equipment, adhesive is first applied to the substrate using a dispensing head before the wafer is bonded. After dispensing, a swing arm is used to control the movement of the wafer pick-up head, which then completes the wafer pick-up and wafer fixation process. Since the dispensing process is completed in advance, the adhesive on the substrate will solidify during long periods of non-use, affecting the bonding effect of the adhesive on the wafer and thus affecting the stability of the wafer fixation. Utility Model Content

[0004] The purpose of this invention is to provide a die bonding and adhesive application device and an adhesive supply device for electronic component universal joints, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A die-bonding adhesive applicator for electronic component universal joints includes a frame and a rotating stage. A drive shaft is rotatably mounted on the frame, and the rotating stage is fixedly connected to the drive shaft. A first threaded sleeve and a second threaded sleeve are symmetrically arranged on the rotating stage, both of which are rotatably connected to the rotating stage. The first and second threaded sleeves are connected by a second synchronous belt. A first stud is threaded onto the inner side of the first threaded sleeve, and a die-picking head is provided at the bottom of the first stud. A second stud is threaded onto the inner side of the second threaded sleeve, and a glue-dispensing head is provided at the bottom of the second stud. Guide rods are mounted on both the first and second threaded sleeves, and the guide rods are slidably connected to the rotating stage.

[0007] As a further embodiment of this utility model: the drive shaft controls the rotation of the second threaded sleeve through a rotation drive mechanism. The rotation drive mechanism includes a first bevel gear, a second bevel gear, a third bevel gear, and a fourth bevel gear. The first bevel gear is fixedly mounted on the drive shaft. The second bevel gear is rotatably mounted on the frame through a first rotating shaft. The third bevel gear is rotatably mounted on the rotating table through a second rotating shaft. The fourth bevel gear is fixedly mounted on the second threaded sleeve. The first bevel gear meshes with the second bevel gear, and the third bevel gear meshes with the fourth bevel gear. The first rotating shaft is connected to a connecting rod through a universal joint, and the connecting rod is connected to the second rotating shaft through a second universal joint.

[0008] As a further embodiment of this utility model: a top plate is installed on the frame, and a gearbox and a drive motor are installed on the top plate. The gearbox has an input shaft, a first output shaft, and a second output shaft. The output end of the drive motor is connected to the input shaft, and the first output shaft of the gearbox is connected to the drive shaft.

[0009] A glue supply device includes a container and a rotating shaft rotatably mounted on the container. The upper end of the rotating shaft is connected to the second output shaft of the gearbox via a first synchronous belt. A stirring blade is fixedly mounted on the shaft section of the rotating shaft inside the container.

[0010] As a further improvement of this utility model: two push plates are symmetrically slidably installed on the left and right sides inside the container, and the push plates are connected to the inner wall of the container by at least one connecting spring.

[0011] As a further improvement of this utility model: the container has an inlet and an outlet at the bottom. The inlet is connected to a push plate on one side via a connecting pipe, which is a flexible hose.

[0012] As a further improvement of this utility model: the outlet of the container is connected to the dispensing head at the bottom of the second stud via a glue supply tube.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model sets up a die bonding adhesive device on the die bonding equipment. When the wafer is bonded, the drive shaft rotates, and the drive shaft controls the rotation of the turntable. The drive shaft also controls the rotation of the second screw sleeve through a rotation drive mechanism with a universal joint structure. Thus, during the rotation of the turntable, the second screw sleeve is synchronously controlled, moving the wafer pick-up head to the position on the substrate where adhesive has been applied, and raising the adhesive supply head so that the wafer pick-up head is lowered synchronously. This achieves the orderly execution of adhesive application and die bonding operations, improving the die bonding efficiency of the die bonding equipment. During use, the amount of adhesive in the container of this utility model continuously decreases, and the pusher plate moves, pushing the adhesive out of the outlet, thus improving the adhesive discharge efficiency. Attached Figure Description

[0014] Figure 1 Schematic diagram of the die bonding and adhesive application device for universal joints of electronic components Figure 1 .

[0015] Figure 2 Schematic diagram of the die bonding and adhesive application device for universal joints of electronic components Figure 2 .

[0016] Figure 3 This is a side view of the die bonding and adhesive application device for electronic component universal joints.

[0017] Figure 4 This is a front view of the die bonding and adhesive application device for electronic component universal joints.

[0018] Figure 5 This is a cross-sectional view of the glue supply device.

[0019] In the diagram: 10-Frame, 11-Top plate, 12-Gearbox, 13-Drive motor, 14-First synchronous belt, 15-Drive shaft, 151-First bevel gear, 152-Second bevel gear, 16-Connecting rod, 161-Third bevel gear, 162-Fourth bevel gear, 20-Glue supply device, 21-Container, 211-Inlet, 212-Outlet, 22-Rotating shaft, 221-Stirring blade, 23-Push plate, 24-Connecting spring, 25-Connecting pipe, 30-Rotating table, 31-First threaded sleeve, 32-First stud, 33-Second threaded sleeve, 34-Second synchronous belt, 35-Second stud, 36-Guide rod, 37-Glue supply pipe. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figures 1-5In this embodiment of the present invention, a die bonding and adhesive application device for an electronic component universal joint includes a frame 10, an adhesive supply device 20, and a rotating table 30. In this embodiment, the frame 10 is connected to the swing arm of the die bonding equipment. The swing arm has multiple degrees of freedom. During the use of the adhesive application device, the swing arm is used to control the movement of the frame 10. A drive shaft 15 is rotatably mounted on the frame 10. The rotating table 30 is fixedly connected to the drive shaft 15. When the drive shaft 15 is in a rotating state, it controls the rotation of the rotating table 30. A first threaded sleeve 31 and a second threaded sleeve 33 are symmetrically arranged on the rotating table 30. Both the first threaded sleeve 31 and the second threaded sleeve 33 are rotatably connected to the rotating table 30. The first and second threaded sleeves 31 and 33 are connected by a second synchronous belt 34. The inner thread of the first threaded sleeve 31 is connected to a first stud 32, and a wafer pick-up head is located at the bottom of the first stud 32. The inner thread of the second threaded sleeve 33 is connected to a second stud 35, and a glue supply head is located at the bottom of the second stud 35. Guide rods 36 are installed on both the first and second threaded sleeves 31 and 33. The guide rods 36 are slidably connected to the rotating table 30. When the first and second threaded sleeves 31 and 33 rotate, they respectively control the movement of the first stud 32 and the second stud 35 along the rotating table 30, causing the first stud 32 to drive the wafer pick-up head to move up and down, and causing the second stud 35 to drive the glue supply head to move up and down. Figure 1 As shown, when the second stud 35 drives the glue dispensing head to move downward, the glue dispensing head dispenses glue to the substrate. At this time, the first stud 32 drives the wafer pick-up head to move upward. After the glue dispensing is completed, the drive shaft 15 controls the rotary table 30 to rotate, so that the wafer pick-up head reaches the position on the substrate where glue has been dispensed. Then, the first stud 32 drives the wafer pick-up head to move downward, fixing the wafer picked up by the wafer pick-up head onto the substrate.

[0022] Furthermore, in this embodiment, the drive shaft 15 controls the rotation of the second threaded sleeve 33 via a rotation drive mechanism. The rotation drive mechanism includes a first bevel gear 151, a second bevel gear 152, a third bevel gear 161, and a fourth bevel gear 162. The first bevel gear 151 is fixedly mounted on the drive shaft 15. The second bevel gear 152 is rotatably mounted on the frame 10 via a first rotating shaft. The third bevel gear 161 is rotatably mounted on the rotating table 30 via a second rotating shaft. The fourth bevel gear 162 is fixedly mounted on the second threaded sleeve 33. The first bevel gear 151 meshes with the second bevel gear 152, and the third bevel gear... Wheel 161 meshes with fourth bevel gear 162. The first rotating shaft is connected to connecting rod 16 via universal joint. Connecting rod 16 is connected to second rotating shaft via second universal joint. When drive shaft 15 rotates, drive shaft 15 controls rotating table 30 to rotate. Drive shaft 15 also controls second screw sleeve 33 to rotate via rotation drive mechanism. Thus, the second screw sleeve 33 is synchronously controlled during the rotation of rotating table 30. That is, after the glue dispensing head dispenses glue to the substrate, rotating table 30 rotates, moving wafer pick-up head to the glued position on the substrate. At this time, first screw sleeve 31 and second screw sleeve 33 rotate synchronously, thereby raising glue dispensing head and lowering wafer pick-up head.

[0023] In this embodiment of the application, a top plate 11 is installed on the frame 10, and a gearbox 12 and a drive motor 13 are installed on the top plate 11. The gearbox 12 has an input shaft, a first output shaft and a second output shaft. The output end of the drive motor 13 is connected to the input shaft, and the first output shaft of the gearbox 12 is connected to the drive shaft 15. The drive motor 13 controls the rotation of the drive shaft 15 through the gearbox 12.

[0024] like Figure 1 as well as Figure 5 As shown in the figure, this application embodiment also discloses an adhesive supply device 20, which includes a container 21 and a rotating shaft 22 rotatably mounted on the container 21. The upper end of the rotating shaft 22 is connected to the second output shaft of the gearbox 12 through a first synchronous belt 14. The drive motor 13 controls the rotation of the rotating shaft 22 through the gearbox 12. Two push plates 23 are symmetrically slidably mounted on the left and right sides inside the container 21. The push plates 23 are connected to the inner wall of the container 21 through at least one connecting spring 24. A stirring blade 221 is fixedly mounted on the shaft section of the rotating shaft 22 inside the container 21. When the rotating shaft 22 rotates, the rotating shaft 22 controls the stirring blade 221 to rotate, so that the stirring blade 221 stirs the adhesive inside the container 21 and prevents the adhesive from solidifying.

[0025] Furthermore, in this embodiment of the application, the container 21 is provided with an inlet 211 and an outlet 212 at the bottom. The inlet 211 is connected to a push plate 23 on one side through a connecting pipe 25. The connecting pipe 25 is a flexible tube. It can be understood that the inlet 211 is used to add adhesive. During the use of the adhesive supply device 20, the amount of adhesive inside the container 21 continuously decreases. During this process, the push plate 23 moves, pushing the adhesive out of the outlet 212 to improve the discharge efficiency of the adhesive.

[0026] It should also be noted that, in this embodiment of the application, the outlet 212 of the container 21 is connected to the dispensing head at the bottom of the second stud 35 via a glue supply pipe 37, and the glue supply pipe 37 is used to supply glue to the dispensing head.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0028] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An adhesive supplying device characterized by comprising: The container (21) and the rotating shaft (22) are rotatably installed on the container (21), the upper end of the rotating shaft (22) is connected with the second output shaft of the gear box (12) through the first synchronous belt (14), and the shaft section of the rotating shaft (22) located in the container (21) is fixedly installed with the stirring blade (221).

2. The glue feeding apparatus according to claim 1, wherein Two push plates (23) are symmetrically and slidably installed on the left and right sides in the container (21), and the push plate (23) is connected with the inner wall of the container (21) through at least one connecting spring (24).

3. The glue feeding apparatus according to claim 2, wherein The container (21) is provided with a feeding port (211), the bottom of the container (21) is provided with a discharging port (212), the feeding port (211) is connected with the push plate (23) on one side through the connecting pipe (25), and the connecting pipe (25) is in a hose structure.

4. The glue feeding apparatus according to claim 3, wherein The discharging port (212) of the container (21) is provided with a glue supply pipe (37), and the glue supply pipe (37) is used for connecting a glue head.

5. An electronic component universal joint die bonding glue dispensing device comprising the glue dispensing device as claimed in any one of claims 1-4, characterized in that, The machine frame (10) and the rotating table (30) are further included, the driving shaft (15) is rotatably installed on the machine frame (10), and the rotating table (30) is fixedly connected with the driving shaft (15); the first screw sleeve (31) and the second screw sleeve (33) are symmetrically arranged on the rotating table (30), the first screw sleeve (31) and the second screw sleeve (33) are rotatably connected with the rotating table (30), the first screw sleeve (31) and the second screw sleeve (33) are drivingly connected through the second synchronous belt (34), the inner side of the first screw sleeve (31) is threadedly connected with the first screw post (32), the bottom of the first screw post (32) is provided with a wafer suction head, the inner side of the second screw sleeve (33) is threadedly connected with the second screw post (35), the bottom of the second screw post (35) is provided with a glue supply head, the first screw sleeve (31) and the second screw sleeve (33) are both provided with the guide rod (36), and the guide rod (36) is slidably connected with the rotating table (30).

6. The apparatus according to claim 5, wherein the apparatus further comprises a plurality of the electronic component universal joint pick-and-place devices. The driving shaft (15) controls the rotation of the second screw sleeve (33) through a rotating driving mechanism, the rotating driving mechanism comprises a first bevel gear (151), a second bevel gear (152), a third bevel gear (161) and a fourth bevel gear (162), the first bevel gear (151) is fixedly installed on the driving shaft (15), the second bevel gear (152) is rotatably installed on the machine frame (10) through a first rotating shaft, the third bevel gear (161) is rotatably installed on the rotating table (30) through a second rotating shaft, the fourth bevel gear (162) is fixedly installed on the second screw sleeve (33), the first bevel gear (151) is engaged with the second bevel gear (152), the third bevel gear (161) is engaged with the fourth bevel gear (162), the first rotating shaft is connected with the connecting rod (16) through a universal joint, and the connecting rod (16) is connected with the second rotating shaft through a second universal joint.

7. The apparatus according to claim 5, wherein the apparatus further comprises a plurality of the electronic component universal joint pick-and-place devices. The rack (10) is provided with a top plate (11), a gear box (12) and a driving motor (13) are installed on the top plate (11), the gear box (12) has an input shaft, a first output shaft and a second output shaft, the output end of the driving motor (13) is connected with the input shaft, and the first output shaft of the gear box (12) is connected with the driving shaft (15).

Images