Sorting device for automatic detection of double-sided appearance of thermistor chip

By designing an automated double-sided appearance inspection device for thermistor chips, and utilizing upper and lower inspection cameras and a cylinder pusher plate, the automated sorting of chips is achieved, solving the problems of low efficiency and low accuracy of manual inspection, improving inspection efficiency and accuracy, and reducing labor costs.

CN223996685UActive Publication Date: 2026-03-17JIXI KAIOU MINING TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-07
Publication Date
2026-03-17

AI Technical Summary

Technical Problem

The current method of inspecting the appearance of thermistor chips mainly relies on manual labor, which results in low efficiency, low accuracy, and increased labor costs.

Method used

A sorting device for automated double-sided appearance inspection of thermistor chips was designed. The device uses vertically distributed inspection cameras to simultaneously inspect the upper and lower surfaces of the chip, and uses a cylinder to drive a pusher plate to send the chip to the corresponding conveying mechanism to achieve automated sorting.

Benefits of technology

It improves detection efficiency and accuracy, reduces manpower input, avoids chip contamination caused by manual detection, and achieves efficient automated sorting.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223996685U_ABST
Patent Text Reader

Abstract

The utility model provides a sorting device for automatic detection of double-sided appearances of thermistor chips, which belongs to the field of thermistor chip detection and sorting and comprises a chip conveying mechanism, a good product conveying mechanism and an inferior-quality product conveying mechanism. The detection platform is located among the chip conveying mechanism, the non-defective product conveying mechanism and the defective product conveying mechanism, detection cameras are arranged on the upper side and the lower side of the glass plate, and a second push plate connected with the defective product conveying mechanism is installed at the output end of a second air cylinder; and a material guide plate which is matched with the chip conveying mechanism and can convey the chip to the glass plate is mounted on the detection table. According to the utility model, the upper surface and the lower surface of the chip can be detected at the same time by using the detection cameras which are distributed up and down, and the detection efficiency and the detection accuracy are improved, so that the working efficiency is improved, the manpower investment is reduced, the chip can be conveyed, and the situation that the chip is polluted due to manual screening is also avoided.
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Description

Technical Field

[0001] This utility model relates to the field of thermistor chip detection and sorting technology, and in particular to a sorting device for automated double-sided appearance detection of thermistor chips. Background Technology

[0002] After the thermistor chip is manufactured, its appearance needs to be inspected to check whether it is complete and free of defects, and unqualified products are sorted out.

[0003] Existing methods for inspecting the appearance of thermistor chips are mostly manual, relying on the naked eye to check whether the appearance of the thermistor chips meets the standards. This is prone to false positives, resulting in low efficiency and low accuracy in the appearance inspection of thermistor chips, while also increasing labor costs. To address this, this application proposes a sorting device for automated double-sided appearance inspection of thermistor chips. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a sorting device for automated double-sided appearance inspection of thermistor chips.

[0005] An embodiment of this utility model provides a sorting device for automated double-sided appearance inspection of thermistor chips, comprising:

[0006] Chip conveying mechanism, good product conveying mechanism, defective product conveying mechanism;

[0007] A testing platform is located between the chip conveying mechanism, the good product conveying mechanism, and the defective product conveying mechanism. A glass plate is installed through the middle of the testing platform, and testing cameras are provided on the upper and lower sides of the glass plate. A first cylinder and a second cylinder are installed on the testing platform. A first push plate opposite to the good product conveying mechanism is installed at the output end of the first cylinder, and a second push plate connected to the defective product conveying mechanism is installed at the output end of the second cylinder. A guide plate is installed on the testing platform to cooperate with the chip conveying mechanism to convey the chip onto the glass plate.

[0008] Furthermore, the chip conveying mechanism, the good product conveying mechanism, and the defective product conveying mechanism each include two conveying rollers, and a conveyor belt is sleeved on the outside of the two conveying rollers.

[0009] Furthermore, a bracket is installed on the testing platform, the guide plate is rotatably mounted on the bracket, and the chip conveying mechanism is located on the upper side of the guide plate.

[0010] Furthermore, the upper end of the glass plate is flush with the upper end of the testing platform.

[0011] Furthermore, two extension plates are fixed on the testing platform, and the good product conveying mechanism and the defective product conveying mechanism are located on the lower side of the extension plates.

[0012] Furthermore, the upper end of the second push plate is flush with the upper end of the output end of the second cylinder, and the bottom of both the first and second push plates are covered with a PTFE film. The first and second push plates slide on the testing table.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] This invention utilizes top-and-bottom distributed inspection cameras to simultaneously inspect the top and bottom of the chip, improving inspection efficiency and accuracy, thereby increasing work efficiency, reducing manpower input, and also enabling chip transportation, thus avoiding chip contamination caused by manual screening. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a sorting device for automated double-sided appearance inspection of thermistor chips as described in this embodiment of the utility model.

[0016] Figure 2 This is a rear view of a sorting device for automated double-sided appearance inspection of thermistor chips as described in this embodiment of the utility model.

[0017] Figure 3 This is a schematic diagram of the guide plate in a sorting device for automated double-sided appearance inspection of thermistor chips, as described in an embodiment of this utility model.

[0018] In the above attached figures: 1 chip conveying mechanism, 2 good product conveying mechanism, 3 defective product conveying mechanism, 4 inspection table, 5 glass plate, 6 mounting bracket, 7 inspection camera, 8 first cylinder, 9 first push plate, 10 guide plate, 11 second cylinder, 12 second push plate, 13 bracket, 14 mounting plate. Detailed Implementation

[0019] The technical solution of this utility model will be further described below with reference to the accompanying drawings and embodiments.

[0020] like Figures 1-3 As shown in the figure, this utility model embodiment proposes a sorting device for automated double-sided appearance inspection of thermistor chips, comprising:

[0021] Chip conveying mechanism 1, good product conveying mechanism 2, and defective product conveying mechanism 3 are installed on corresponding frames. Each chip conveying mechanism 1, good product conveying mechanism 2, and defective product conveying mechanism 3 includes two conveying rollers with a conveyor belt. The conveying rollers are driven to rotate by a motor, thereby moving the conveyor belt to convey chips. This part is existing technology, and the motor, frame, etc. are not shown in the figure.

[0022] The inspection table 4 is located between the chip conveying mechanism 1, the good product conveying mechanism 2, and the defective product conveying mechanism 3. A glass plate 5 is installed through the middle of the inspection table 4. The upper end of the glass plate 5 is flush with the upper end of the inspection table 4 to avoid interfering with the movement of the first push plate 9 and the second push plate 12.

[0023] The inspection platform 4 has two extension plates fixed on it. The good product conveying mechanism 2 and the defective product conveying mechanism 3 are located on the lower side of the extension plates, so that qualified or defective products can be pushed onto the good product conveying mechanism 2 and the defective product conveying mechanism 3.

[0024] Inspection cameras 7 are provided on both the upper and lower sides of the glass plate 5. A mounting bracket 6 is installed on the inspection table 4. The inspection camera 7 on the lower side is installed on the mounting bracket 6, and the inspection camera 7 on the upper side can be fixed by a support bracket. A first cylinder 8 and a second cylinder 11 are installed on the inspection table 4. A mounting plate 14 is installed on the inspection table 4, and the first cylinder 8 and the second cylinder 11 are installed on the mounting plate 14. A first push plate 9 opposite to the good product conveying mechanism 2 is installed at the output end of the first cylinder 8. A second push plate 12 connected to the defective product conveying mechanism 3 is installed at the output end of the second cylinder 11. The upper end of the second push plate 12 is flush with the upper end of the output end of the second cylinder 11, so as not to interfere with the reset of the guide plate 10. The bottom of the first push plate 9 and the second push plate 12 are both covered with PTFE film. The first push plate 9 and the second push plate 12 slide on the inspection table 4 to reduce the friction when the first push plate 9 and the second push plate 12 move.

[0025] The testing station 4 is equipped with a guide plate 10 that works with the chip conveying mechanism 1 to convey the chip to the glass plate 5. The testing station 4 is equipped with a bracket 13, and the guide plate 10 is rotatably mounted on the bracket 13. The chip conveying mechanism 1 is located on the upper side of the guide plate 10. The chip conveying mechanism 1 can convey the chip to the guide plate 10 and slide it onto the glass plate 5.

[0026] In use, the chip conveying mechanism 1 conveys the chip to the guide plate 10. The chip then falls onto the glass plate 5 after passing through the guide plate 10. The detection camera 7 simultaneously detects the top and bottom surfaces of the chip. If the chip passes the test, the detection camera 7 transmits a signal to the PLC. The PLC controls the first cylinder 8 to move the first push plate 9, which in turn moves the chip on the glass plate 5 to the good product conveying mechanism 2. If the chip fails the test, the PLC controls the second cylinder 11 to move, which in turn drives the second push plate 12 to move. First, the guide plate 10 rotates upward, and then the chip moves to the defective product conveying mechanism 3. The sorted chips can be conveyed through the good product conveying mechanism 2 and the defective product conveying mechanism 3.

[0027] When the output end of the second cylinder 11 is reset, the guide plate 10 is pressed against the upper end of the detection table 4 again due to gravity, and the chip conveying mechanism 1 conveys the chip again. By repeating the above work, the chip can be screened.

[0028] The control method described above is similar to an elevator overload alarm, which is existing technology.

[0029] In summary, this utility model utilizes the top and bottom distributed detection cameras 7 to simultaneously detect the top and bottom of the chip, improving detection efficiency and accuracy, thereby increasing work efficiency, reducing manpower input, and also enabling chip transportation, thus avoiding chip contamination caused by manual screening.

[0030] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A sorting device for automatic detection of the appearance of both sides of a thermistor chip, characterized in that, Include: Chip conveying mechanism (1), good product conveying mechanism (2), substandard product conveying mechanism (3); The detection table (4) is located between the chip conveying mechanism (1), the good product conveying mechanism (2), the substandard product conveying mechanism (3), the middle part of the detection table (4) is provided with a glass plate (5), the upper and lower sides of the glass plate (5) are provided with detection cameras (7), the first cylinder (8) and the second cylinder (11) are installed on the detection table (4), the output end of the first cylinder (8) is provided with a first push plate (9) opposite to the good product conveying mechanism (2), the output end of the second cylinder (11) is provided with a second push plate (12) connected with the substandard product conveying mechanism (3), and the guide plate (10) cooperating with the chip conveying mechanism (1) is installed on the detection table (4) and can convey the chip to the glass plate (5).

2. The sorting device for automatic detection of the appearance of both sides of a thermistor chip according to claim 1, characterized in that, Wherein: The chip conveying mechanism (1), the good product conveying mechanism (2) and the substandard product conveying mechanism (3) all include two conveying rollers, and the outer part of the two conveying rollers is provided with a conveying belt.

3. The sorting device for automatic detection of the appearance of both sides of a thermistor chip according to claim 1, characterized in that, Wherein: The detection table (4) is provided with a support (13), the guide plate (10) is rotatably installed on the support (13), and the chip conveying mechanism (1) is located on the upper side of the guide plate (10).

4. The sorting device for automatic detection of the appearance of both sides of a thermistor chip according to claim 1, characterized in that, Wherein: The upper end of the glass plate (5) is flush with the upper end of the detection table (4).

5. The sorting device for automatic detection of the appearance of both sides of a thermistor chip according to claim 1, characterized in that, Wherein: The detection table (4) is fixed with two extension plates, and the good product conveying mechanism (2) and the substandard product conveying mechanism (3) are located on the lower side of the extension plate.

6. The sorting device for automatic detection of the appearance of both sides of a thermistor chip according to claim 1, characterized in that, Wherein: The upper end of the second push plate (12) is flush with the upper end of the output end of the second cylinder (11), the bottom of the first push plate (9) and the second push plate (12) is wrapped with a fluorine film, and the first push plate (9) and the second push plate (12) slide on the detection table (4).