High-precision multi-beam array punching device
By combining a high-precision multi-beam array drilling device with a real-time monitoring system, the problem of processing stability of traditional laser drilling equipment on complex curved surfaces is solved, realizing efficient and precise laser array drilling, which is suitable for processing needs of complex surfaces.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2026-03-17
AI Technical Summary
Traditional laser drilling equipment struggles to maintain a constant distance between the laser beam and the material surface when dealing with complex or irregular curved surfaces, resulting in inconsistent processing quality. Furthermore, single-point laser drilling is inefficient and cannot meet the needs of large-scale production.
Employing a high-precision multi-beam array drilling device, combined with a real-time monitoring and intelligent control system, and using components such as a DOE beam splitter, 3D galvanometer, and focusing lens, the device achieves adaptive adjustment and real-time monitoring of the multi-beam array, ensuring stability and efficient processing between the laser focus and the processing surface.
It improves the accuracy and efficiency of laser array drilling, reduces human error, lowers long-term operating costs, and enables high-precision and high-efficiency laser processing on irregular surfaces.
Smart Images
Figure CN223997537U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of laser processing technology, specifically a high-precision multi-beam array drilling device. Background Technology
[0002] Laser drilling technology holds a significant position in the field of precision manufacturing due to its unique advantages. This technology utilizes a high-energy laser beam to locally heat materials, melting or evaporating them to create precise holes. Laser drilling is characterized by its non-contact nature and high precision, making it particularly suitable for processing hard or high-melting-point materials, as well as applications requiring extremely high processing accuracy.
[0003] Despite the significant achievements of laser drilling technology in industrial applications, its development still faces several challenges. For example, traditional laser drilling equipment struggles to maintain a constant distance between the laser beam and the material surface when processing complex or irregular curved surfaces, resulting in inconsistent processing quality. Furthermore, single-point laser drilling is relatively inefficient, making it difficult to meet the demands of large-scale production. Therefore, improving the adaptability, efficiency, and accuracy of laser drilling has become a research hotspot in this field. Utility Model Content
[0004] The purpose of this invention is to provide a high-precision multi-beam array drilling device that can achieve high-precision and high-efficiency laser array drilling of materials. Through real-time monitoring and adaptive adjustment mechanisms, it ensures the flexibility and efficiency of laser drilling.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-precision multi-beam array drilling device, comprising a base, a high-stability laser and a support fixed to the upper surface of the base, a right-angle prism fixed to one side of the support by bolts, a beam shaping mechanism fixed to the inner top of the support, a first electric telescopic rod fixed to the top of the support, a DOE beam splitter fixed to one end of the first electric telescopic rod, and the bottom of the DOE beam splitter connected to a beam focusing mechanism via a connecting cylinder.
[0006] The beam focusing mechanism includes a second support cylinder, which is fixed to the bottom of the connecting cylinder. A 3D galvanometer focusing lens is fixed to the inner side of the second support cylinder, and a real-time monitoring and intelligent control mechanism is fixed to the outer side of the second support cylinder and the upper surface of the base.
[0007] Preferably, the beam shaping mechanism includes a first support cylinder, which is fixed to the inner top of the bracket, and a first lens, a second lens, a beam shaper, and a wavefront modulator are fixed to the inner side of the first support cylinder.
[0008] Preferably, the real-time monitoring and intelligent control mechanism includes a terminal PC controller, and the terminal PC controller is fixed on the upper surface of the base.
[0009] Preferably, a CCD camera, a position sensor, and a second electric telescopic rod are fixed to the outside of the second support cylinder, and a beam analyzer is fixed to one end of the second electric telescopic rod.
[0010] Compared with the prior art, the beneficial effects of this utility model are:
[0011] 1. This high-precision multi-beam array drilling device can achieve fast and accurate laser array drilling, improving production efficiency. Through adaptive focusing and real-time monitoring systems, it improves drilling accuracy and consistency. The intelligent control system can automatically optimize drilling parameters, reducing human error. The modular design makes system maintenance and upgrades easier, reducing long-term operating costs.
[0012] 2. This high-precision multi-beam array drilling device, by adopting advanced diffractive optical elements and intelligent control system, realizes high-precision and high-efficiency laser array drilling of materials. While performing array drilling, it can monitor and adaptively adjust the parameters of the laser beam and the processing path in real time. When processing workpieces with irregular surfaces, it can dynamically adjust the position between the laser focus and the processing surface in real time. Attached Figure Description
[0013] Figure 1 is a schematic diagram of the left-side three-dimensional structure of this utility model;
[0014] Figure 2 is a three-dimensional structural diagram of this utility model viewed from below;
[0015] Figure 3 is a frontal cross-sectional view of the present invention.
[0016] In the diagram: 1. Base; 2. High-stability laser; 3. Support; 4. Right-angle prism; 5. Beam shaping mechanism; 501. First support cylinder; 502. First lens; 503. Second lens; 504. Beam shaper; 505. Wavefront modulator; 6. First electric telescopic rod; 7. DOE beam splitter; 8. Connecting cylinder; 9. Beam focusing mechanism; 901. Second support cylinder; 902. 3D galvanometer; 903. Focusing lens; 10. Real-time monitoring and intelligent control mechanism; 1001. Terminal PC controller; 1002. CCD camera; 1003. Position sensor; 1004. Second electric telescopic rod; 1005. Beam analyzer. Detailed Implementation
[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0018] Please refer to Figures 1-3. This utility model provides a technical solution: a high-precision multi-beam array drilling device, including a base 1. A high-stability laser 2 and a bracket 3 are fixed on the upper surface of the base 1. A right-angle prism 4 is fixed to one side of the bracket 3 by bolts. A beam shaping mechanism 5 is fixed to the inner top of the bracket 3. A first electric telescopic rod 6 is fixed to the top of the bracket 3. A DOE beam splitter 7 is fixed to one end of the first electric telescopic rod 6. The bottom of the DOE beam splitter 7 is connected to a beam focusing mechanism 9 through a connecting tube 8. The beam focusing mechanism 9 includes a second support tube 901, which is fixed to the bottom of the connecting tube 8. A 3D galvanometer 902 and a focusing lens 903 are fixed to the inner side of the second support tube 901. A real-time monitoring and intelligent control mechanism 10 is fixed to the outer side of the second support tube 901 and the upper surface of the base 1.
[0019] In this embodiment, as shown in Figures 1 and 3, the beam shaping mechanism 5 includes a first support cylinder 501, which is fixed to the inner top of the bracket 3. A first lens 502, a second lens 503, a beam shaper 504, and a wavefront modulator 505 are fixed on the inner side of the first support cylinder 501. The first lens 502 and the second lens 503 are placed coaxially. The beam shaper 504 is used to shape and transmit the laser beam to ensure the quality and stability of the beam during transmission. The wavefront modulator 505 dynamically adjusts the wavefront of the beam during this stage to compensate for any distortion and optimize the beam quality.
[0020] In this embodiment, as shown in Figure 1 and Figure 2 As shown, the real-time monitoring and intelligent control mechanism 10 includes a terminal PC controller 1001, which is fixed on the upper surface of the base 1. The real-time monitoring and intelligent control mechanism 10 monitors and optimizes the laser drilling process in real time, and the terminal PC controller 1001 can process data.
[0021] In this embodiment, as shown in Figures 2 and 3, a CCD camera 1002, a position sensor 1003, and a second electric telescopic rod 1004 are fixed to the outer side of the second support cylinder 901. A beam analyzer 1005 is fixed to one end of the second electric telescopic rod 1004. The CCD camera 1002 captures the shape and size of the laser beam spot in real time, monitoring the stability and consistency of the beam during processing. The position sensor 1003 monitors the distance between the laser focus and the processed surface in real time, accurately detecting the position of the laser focus to ensure a constant distance between the focus and the workpiece surface. The beam analyzer 1005 analyzes parameters such as the beam mode, diameter, and divergence angle to ensure good beam quality before focusing. The beam analyzer 1005 can move under the extension and retraction of the second electric telescopic rod 1004. The terminal PC controller 1001 can process data from the CCD camera 1002, the position sensor 1003, and the beam analyzer 1005. The data is used to automatically optimize the drilling path and parameters, and can predict and compensate for possible deviations during the processing.
[0022] According to another aspect of this utility model, a high-precision multi-beam array drilling method is provided, comprising the following steps:
[0023] S1. The beam shaping mechanism 5 receives the original beam from the high-stability laser 2 under the action of the right-angle prism 4. The beam passes through the first lens 502 and the second lens 503.
[0024] S2, Beam shaper 504 shapes and transmits the laser beam to ensure the quality and stability of the beam during transmission, and wavefront modulator 505 dynamically adjusts the wavefront of the beam to compensate for any distortion and optimize the beam quality.
[0025] S3. The shaped beam enters the DOE beam splitter 7. The DOE beam splitter 7 can move left and right under the extension and retraction of the first electric telescopic rod 6. The DOE beam splitter 7 splits the single beam into multiple beams. The split laser beams enter the 3D galvanometer 902. The 3D galvanometer 902 controls the movement and positioning of the beam in three-dimensional space, providing greater flexibility and faster response speed. The beam adjusted by the 3D galvanometer 902 enters the focusing lens 903, which focuses the beam onto the surface of the workpiece.
[0026] S4. During the laser array drilling process, the real-time monitoring and intelligent control mechanism 10 monitors and optimizes the laser drilling process in real time.
[0027] The working principle of this device is as follows: The high-stability laser 2 is selected based on its ability to provide a laser beam with the required power and wavelength to suit specific processing tasks. For example, a high-power fiber laser can be selected for applications requiring high-power drilling, while a wavelength-tunable laser can be selected for applications requiring a specific wavelength. The beam shaping mechanism 5 first receives the raw beam from the high-stability laser 2 with the assistance of the right-angle prism 4. The beam shaper 504 is used to shape and transmit the laser beam, ensuring the quality and stability of the beam during transmission. The wavefront modulator 505 dynamically adjusts the wavefront of the beam at this stage to compensate for any distortion and optimize the beam quality. The shaped beam enters the DOE beam splitter 7, which splits the single beam into multiple beams. These beams will be used for array drilling. The power and direction of each beam can be controlled independently. The split laser beams enter the 3D galvanometer 902, which controls the movement and positioning of the beam in three-dimensional space, providing greater flexibility and faster response speed. The control requires precise servo motors and control systems to ensure the accuracy and stability of beam positioning. After adjustment by the 3D galvanometer 902, the beam enters the focusing lens 903, which focuses the beam onto the workpiece surface. The focusing lens 903 can move up and down, adjusting according to the required focal size and working distance to achieve the best processing effect. During laser array drilling, the real-time monitoring and intelligent control mechanism 10 monitors and optimizes the laser drilling process. The CCD camera 1002 captures the shape and size of the laser beam spot in real time, monitoring the stability and consistency of the beam during processing. The position sensor 1003 monitors the distance between the laser focus and the processed surface in real time, accurately detecting the position of the laser focus and ensuring a constant distance between the focus and the workpiece surface, which is crucial for maintaining processing quality. The beam analyzer 1005 analyzes parameters such as the beam mode, diameter, and divergence angle to ensure good beam quality before focusing. The beam analyzer 1005 can be panned. The terminal PC controller 1001 can process data from the CCD camera 1002 and the position sensor 1003. The system uses data from the beam analyzer 1005 and automatically optimizes the drilling path and parameters. It can predict and compensate for possible deviations during processing, such as beam jitter, focus shift, and beam quality changes. Through real-time adjustments, the system ensures consistent processing quality, improves production efficiency, and reduces material waste. Furthermore, any content not described in detail in this specification is prior art known to those skilled in the art.
[0028] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A high-precision multi-beam array punching device comprising a base (1), characterized in that: The upper end surface of the base (1) is fixed with a high stability laser (2) and a support (3), one side of the support (3) is fixed with a right-angle prism (4) through a bolt, the inner top of the support (3) is fixed with a beam shaping mechanism (5), the top of the support (3) is fixed with a first electric telescopic rod (6), one end of the first electric telescopic rod (6) is fixed with a DOE beam splitter (7), the bottom of the DOE beam splitter (7) is connected with a beam focusing mechanism (9) through a connecting cylinder (8), the beam focusing mechanism (9) comprises a second support cylinder (901), the second support cylinder (901) is fixed at the bottom of the connecting cylinder (8), the inner side of the second support cylinder (901) is fixed with a 3D galvanometer (902) focusing lens (903), the outer side of the second support cylinder (901) and the upper end surface of the base (1) are fixed with a real-time monitoring and intelligent control mechanism (10).
2. The high-precision multi-beam array drilling device according to claim 1, characterized in that: The beam shaping mechanism (5) comprises a first support cylinder (501), and the first support cylinder (501) is fixed at the inner top of the support (3), the inner side of the first support cylinder (501) is fixed with a first lens (502), a second lens (503), a beam shaper (504) and a wavefront modulator (505).
3. The high-precision multi-beam array drilling device according to claim 1, characterized in that: The real-time monitoring and intelligent control mechanism (10) comprises a terminal PC controller (1001), and the terminal PC controller (1001) is fixed at the upper end surface of the base (1).
4. The high-precision multi-beam array drilling device according to claim 1, characterized in that: The outer side of the second support cylinder (901) is fixed with a CCD camera (1002), a bit-sensitive sensor (1003) and a second electric telescopic rod (1004), and one end of the second electric telescopic rod (1004) is fixed with a beam analyzer (1005).