Board grinding device and PCB (Printed Circuit Board) grinding machine

Abstract

The utility model provides a board grinding device and a PCB board grinding machine, and relates to the technical field of printed circuit boards. The board grinding device comprises a bearing assembly and a grinding brush assembly, the bearing assembly is movably arranged, the bearing assembly is provided with at least one rigid bearing end face, the bearing end face is used for placing and comprehensively supporting a PCB, and a plurality of detachable connecting points are defined and formed between the side face, close to the bearing end face, of the PCB and the bearing assembly; at least parts of the plurality of detachable connecting points are arranged at intervals; the polishing and brushing assembly is provided with at least one polishing and brushing part, each bearing end face is correspondingly provided with at least one polishing and brushing part, each polishing and brushing part is limited to form a polishing and brushing station, the polishing and brushing stations are located on the moving paths of the PCBs on the corresponding bearing end faces, and the polishing and brushing parts can polish and brush the PCBs located on the polishing and brushing stations. According to the invention, the probability that the PCB is curled, bent and even broken can be reduced, and the processing efficiency and the yield are improved.

Description

Technical Field

[0001] This application relates to the field of printed circuit board technology, and in particular to a grinding device and a PCB grinding machine. Background Technology

[0002] In PCB (Printed Circuit Board) manufacturing, the grinding process is an indispensable and crucial step. The principle of grinding is to achieve surface treatment through physical polishing: the PCB is fed into a grinding brush assembly via a horizontal conveyor wheel, where the high-speed rotating brushes grind the surface, and finally output by the conveyor wheel, resulting in a smooth and flat surface. However, this process has significant technical bottlenecks in practical applications, especially in the production of ultra-thin PCBs. Due to insufficient rigidity of the board material, it is prone to curling, bending, or even breakage during the grinding process, severely restricting the processing efficiency and yield of ultra-thin PCBs. Utility Model Content

[0003] In view of this, the purpose of this application is to overcome the shortcomings of the prior art and provide a PCB grinding device and PCB grinding machine that can reduce the probability of PCB boards curling, bending or even breaking, and improve processing efficiency and yield.

[0004] This application provides the following technical solution:

[0005] In a first aspect, embodiments of this application provide a grinding plate apparatus, the grinding plate apparatus comprising:

[0006] A support component is movably configured, the support component has at least one rigid support end face, the support end face is used to place and fully support a PCB board, and a plurality of detachable connection points are defined between a side of the PCB board near the support end face and the support component, and at least some of the plurality of detachable connection points are spaced apart.

[0007] A brush assembly having at least one brush portion, with at least one brush portion corresponding to each of the bearing end faces, each brush portion defining a brush station, the brush station being located on the movement path of the PCB board on the corresponding bearing end face, and the brush portion being capable of brushing the PCB board located at the brush station.

[0008] In some embodiments of the first aspect, the detachable connection point includes at least one of a peelable adhesive point, a vacuum adsorption point, or a magnetic adsorption point.

[0009] In some embodiments of the first aspect, the detachable connection point is a peelable adhesive point;

[0010] The load-bearing component further includes a carrier plate and a peelable adhesive layer, one end face of the carrier plate being the load-bearing end face, and the peelable adhesive layer covering all or part of the load-bearing end face.

[0011] In some embodiments of the first aspect, the peelable adhesive layer covers the entire area of ​​the carrier end face, such that the carrier end face and the PCB board are fully bonded to each other on the side closest to each other.

[0012] In some embodiments of the first aspect, the bearing component has bearing end faces at opposite ends, and a pair of bearing end faces are arranged in parallel.

[0013] Accordingly, there is a pair of grinding brushes, which are arranged opposite to each other and a grinding channel is defined between them. The support assembly can move along the grinding channel. When the support assembly and the PCB board are located in the grinding channel, the grinding working surface of each grinding brush can abut against the side of the PCB board opposite to the support assembly.

[0014] In some embodiments of the first aspect, the brush portion includes a brush roller and a drive element, the brush roller and the drive element being connected, the drive element being used to drive the brush roller to rotate; wherein the extension direction of the axis of the brush roller is perpendicular to the movement direction of the support assembly.

[0015] In some embodiments of the first aspect, each of the bearing end faces is provided with at least two of the brush portions, the at least two of the brush portions being spaced apart in the moving direction of the bearing assembly; wherein, in the moving direction of the bearing assembly, the rotational speed of the brush rollers of the at least two of the brush portions increases sequentially.

[0016] In some embodiments of the first aspect, the edge of the bearing end face has at least one notch.

[0017] In some embodiments of the first aspect, the notch is located upstream of the support component in the direction of movement of the support component.

[0018] Secondly, this application also provides a PCB grinding machine, which includes the grinding device as described in any of the above embodiments.

[0019] The embodiments of this application have the following advantages:

[0020] This application provides a grinding device that achieves stable grinding of ultra-thin PCB boards through the synergistic action of a support component and a grinding brush component. The PCB board is placed on the rigid support end face of the support component, which provides comprehensive support and prevents the board from sagging and deforming due to insufficient rigidity. The PCB board and the support end face are partially or completely fixed by multiple detachable connection points (such as vacuum adsorption, electrostatic adsorption, or mechanical clamps), ensuring that the PCB board does not shift during grinding and alleviating stress concentration. The spacing of the connection points balances the fixing force and the risk of board deformation. The support component moves the PCB board along a preset path, passing sequentially through the grinding stations of the grinding brush component. The high-speed rotating grinding brush physically grinds the exposed surface of the PCB board, while the rigid support end face provides a reverse support force in the grinding area, counteracting the grinding pressure and preventing the board from curling or bending. The number and distribution of detachable connection points can be dynamically adjusted according to the thickness and size of the PCB board; for example, the connection point density can be increased for ultra-thin boards to enhance local rigidity.

[0021] Therefore, the combination of a rigid bearing end face and multi-point fixing effectively disperses grinding stress, avoiding curling and breakage problems caused by uneven local stress on ultra-thin PCBs, thus improving yield. Furthermore, the fully supported structure allows for increased brush speed and feed rate, improving efficiency compared to traditional suspended grinding processes, and eliminating the need for subsequent leveling procedures. Moreover, the modular design of the bearing end face and brush section facilitates individual replacement, reducing equipment maintenance complexity.

[0022] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the structure of a grinding plate device provided in an embodiment of this application is shown from one perspective;

[0025] Figure 2 This illustration shows a schematic diagram of an assembly structure of a carrier component and a PCB board from one perspective, according to an embodiment of this application.

[0026] Figure 3 This illustration shows a schematic diagram of an assembly structure of a carrier component and a PCB board from one perspective, according to another embodiment of this application.

[0027] Explanation of key component symbols:

[0028] 100-Transmitter wheel; 200-Grinding brush assembly; 210-Grinding brush roller; 220-Grinding brush channel; 300-PCB board; 400-Carrier assembly; 410-Carrier board; 411-Carrier end face; 420-Peelable adhesive layer; 430-Notch. Detailed Implementation

[0029] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0030] It should be noted that when an element is said to be "fixed" to another element, it can be directly on the other element or there may be an intervening element. When an element is said to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is said to be "directly" on another element, there is no intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0031] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the template description is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0034] In related technologies, PCB (Printed Circuit Board) grinding is an indispensable and crucial process in PCB manufacturing. The principle of PCB grinding is to achieve surface treatment through physical grinding: the PCB is fed into a grinding brush assembly via a horizontal conveyor wheel, where the high-speed rotating brushes grind the surface, and finally output by the conveyor wheel, resulting in a smooth and flat surface. However, this process has significant technical bottlenecks in practical applications, especially in the production of ultra-thin PCBs. Due to insufficient rigidity of the board material, it is prone to curling, bending, or even breakage during the grinding process, severely restricting the processing efficiency and yield of ultra-thin PCBs.

[0035] like Figure 1 , Figure 2 and Figure 3 As shown, in order to solve the above-mentioned technical problems, this application provides a grinding device for a PCB board. The grinding device includes a support component 400 and a grinding brush component 200. The support component 400 is movably disposed and has at least one rigid support end face 411. The support end face 411 is used to place and fully support the PCB board 300. A plurality of detachable connection points are defined between the side of the PCB board 300 near the support end face 411 and the support component 400. At least some of the plurality of detachable connection points are spaced apart. The grinding brush component 200 has at least one grinding brush part. Each support end face 411 is correspondingly provided with at least one grinding brush part. Each grinding brush part is respectively defined with a grinding station. The grinding station is located on the movement path of the PCB board 300 on the corresponding support end face 411. The grinding brush part can grind the PCB board 300 located at the grinding station.

[0036] These embodiments aim to address a key problem in existing PCB (printed circuit board) grinding processes: when processing ultra-thin PCBs, their insufficient rigidity makes them prone to curling, bending, or even breakage during the grinding process. This not only affects processing efficiency but also reduces the yield of finished products.

[0037] The support assembly 400 is configured to be movable to move the PCB board 300 synchronously in preparation for subsequent brushing. The support assembly 400 has at least one rigid support end face 411 for placing and fully supporting the PCB board 300. The rigid support end face 411 is designed to provide sufficient rigidity support to reduce curling, bending, or even breakage problems caused by insufficient rigidity of the PCB board 300 material.

[0038] It should be noted that multiple detachable connection points are provided between the PCB board 300 and the support assembly 400 on the side near the support end face 411. At least some of these connection points are spaced apart. This design further enhances the support for the PCB board 300 while allowing for adjustment or replacement according to specific needs. It also distributes the stress borne by each connection point during the brushing process of the PCB board 300. Simultaneously, the multiple connection points at least partially fix the PCB board 300, reducing the probability of separation between the PCB board 300 and the support end face 411 during the brushing process.

[0039] For example, the number of connection points can be 1, 2, 3, 4, 5, 6, 7, etc. Optionally, when there are multiple connection points, the multiple connection points are arranged at least at intervals around the periphery of the PCB board 300.

[0040] The brush assembly 200 includes at least one brush section, and each bearing end face 411 is provided with at least one brush section. Each brush section forms a brushing station.

[0041] For example, in this embodiment, each bearing end face 411 is provided with one brush portion. Of course, in other embodiments, each bearing end face 411 may also be provided with 2, 3, 4, 5, 6 or 7 brush portions, etc. It should be noted that when there are multiple brush portions corresponding to each bearing end face 411, the multiple brush portions are arranged at intervals in the moving direction of the PCB board 300.

[0042] These brushing stations are located on the moving path of the PCB board 300 on the corresponding bearing end face 411, ensuring effective brushing treatment of the PCB board 300 as it passes by. This method ensures effective polishing of the PCB board 300 surface while minimizing damage caused by physical contact.

[0043] Clearly, the stable grinding of the ultra-thin PCB board 300 is achieved through the synergistic action of the support component 400 and the grinding brush component 200. The PCB board 300 is placed on the rigid support end face 411 of the support component 400, which provides comprehensive support and prevents the board from sagging and deforming due to insufficient rigidity. The PCB board 300 and the support end face 411 are partially or completely fixed through multiple detachable connection points (such as vacuum adsorption, electrostatic adsorption, or mechanical clamps), ensuring that the PCB board 300 does not shift during the grinding process and alleviating stress concentration. The spacing of the connection points balances the fixing force and the risk of board deformation. The support component 400 moves the PCB board 300 along a preset path, passing sequentially through the grinding stations of the grinding brush component 200. The high-speed rotating grinding brush physically grinds the exposed surface of the PCB board 300, while the rigid support end face 411 provides a reverse support force in the grinding area, counteracting the grinding pressure and preventing the board from curling or bending. The number and distribution of detachable connection points can be dynamically adjusted according to the PCB board thickness and size. For example, for ultra-thin boards, the connection point density can be increased to enhance local rigidity.

[0044] Therefore, the rigid bearing end face 411, combined with multi-point fixing, effectively disperses grinding stress, avoiding curling and breakage problems caused by uneven local stress on ultra-thin PCBs, thus improving yield. Furthermore, the fully supported structure allows for increased brush rotation speed and feed rate, improving efficiency compared to traditional suspended grinding processes, and eliminating the need for subsequent leveling procedures. Moreover, the modular design of the bearing end face 411 and the grinding brush facilitates individual replacement, reducing equipment maintenance complexity. It should be noted that after grinding one side of the PCB board 300, the bearing assembly 400 and the PCB board 300 are separated. The PCB board 300 is flipped so that the unprocessed side faces away from the bearing assembly 400, and then the grinding operation is repeated to achieve double-sided grinding of the PCB board 300.

[0045] In some embodiments, the detachable connection point includes at least one of a peelable adhesive point, a vacuum adsorption point, or a magnetic adsorption point.

[0046] In these embodiments, the detachable connection points employ a variety of flexible connection methods, including at least one of peelable adhesive points, vacuum adsorption points, or magnetic adsorption points. The selection of these connection methods aims to meet the different materials, thicknesses, and processing requirements of the PCB board 300, while ensuring effective fixation and stress distribution of the PCB board 300.

[0047] The peelable adhesive points temporarily fix the PCB board 300 to the bearing end face 411 using a material with appropriate adhesion (such as low-tack tape or coating). This method is suitable for scenarios requiring light fixing force and will not damage the surface of the PCB board 300 or leave any residue. The adhesive points can be quickly peeled off, facilitating the replacement of the PCB board 300 and reducing operational complexity.

[0048] For example, a low-tack adhesive layer is used to bond the PCB board 300 and the carrier end face 411. Alternatively, a peelable adhesive (such as a silicone-based adhesive or a hot-melt adhesive) can be applied to specific locations on the carrier end face 411, and the PCB board 300 can be secured with slight pressure. Alternatively, a heat-sensitive adhesive (such as a hot-melt adhesive or a phase change material) can be used to bond the PCB board 300 while it is heated, and it remains fixed after cooling; it can be easily peeled off by reheating after processing.

[0049] Vacuum adsorption points: Using vacuum adsorption technology, multiple vacuum holes are set on the bearing end face 411, and the PCB board 300 is firmly adsorbed onto the bearing end face 411 by negative pressure.

[0050] Vacuum adsorption is suitable for ultra-thin PCB boards 300 with high flatness requirements, providing uniform fixing force and avoiding localized stress concentration. The position and number of adsorption points can be dynamically adjusted according to the size and shape of the PCB board 300 to further optimize the fixing effect.

[0051] Magnetic adsorption points: Magnetic materials (such as permanent magnets or electromagnets) are embedded in the bearing end face 411, allowing the PCB board 300 to be attracted and fixed by magnetic force. This method is particularly suitable for PCB boards 300 containing metal layers (such as copper foil), enabling rapid fixing and release. The strength of the magnetic adsorption points can be controlled by adjusting the magnetic material or current to accommodate PCB boards 300 of different thicknesses and materials.

[0052] Therefore, depending on the material, thickness, and processing requirements of the PCB board 300, a single connection method or a combination of multiple connection methods can be selected. For example, for ultra-thin PCB boards 300 with poor rigidity, vacuum adsorption and peelable adhesive points can be combined to provide more stable support.

[0053] By using a spaced-out connection point design, these connection methods effectively disperse the stress generated during the brushing process, preventing curling or breakage caused by excessive localized stress. Furthermore, both vacuum adsorption and magnetic adsorption enable rapid fixation and release, reducing the time and complexity of manual intervention. Simultaneously, the modular design makes maintenance and replacement of the connection points more convenient.

[0054] It should be noted that different connection methods can be adapted to various types of PCB boards 300, including flexible PCB boards 300 without metal layers and rigid PCB boards 300 with metal layers.

[0055] For example, for ultra-thin PCBs: due to their insufficient rigidity, vacuum adsorption points or multi-point magnetic adsorption are preferred to provide uniform fixing force and full support.

[0056] Large-size PCBs: Multiple spaced connection points (such as a combination of vacuum adsorption points and peelable adhesive points) are used to ensure the stability of the entire board surface.

[0057] Flexible PCBs: Peelable adhesive joints are more suitable because flexible PCBs may not be able to withstand excessive adsorption or magnetic forces.

[0058] like Figure 2 As shown, in some embodiments, the detachable connection point is a peelable adhesive point; the carrier assembly 400 also includes a carrier plate 410 and a peelable adhesive layer 420, one end face of the carrier plate 410 is a carrier end face 411, and the peelable adhesive layer 420 covers all or part of the area of ​​the carrier end face 411.

[0059] In these embodiments, to effectively secure the PCB board 300 while ensuring easy removal without residue after processing, the detachable connection points are designed as peelable adhesive points. Specifically, this involves a further refinement of the carrier component 400, including a carrier board 410 and a peelable adhesive layer 420.

[0060] The carrier plate 410 is the core component of the support assembly 400. One end face of it is the rigid support end face 411, used to place and fully support the PCB board 300. The carrier plate 410 needs to consider rigidity and stability to provide sufficient support force to prevent the ultra-thin PCB board 300 from curling, bending, or breaking during the brushing process. For example, the carrier plate 410 can be made of aluminum alloy plate, stainless steel plate, ceramic plate, or PVC plate, etc.

[0061] The peelable adhesive layer 420 covers all or part of the bearing end face 411. The function of the peelable adhesive layer 420 is to provide the necessary adhesive fixing force without affecting the surface quality of the PCB board 300.

[0062] Depending on the actual needs, the peelable adhesive layer 420 can be selected to cover the entire bearing end face 411 or only cover some key areas, such as the edge or specific location of the PCB board 300, in order to disperse stress and reduce the risk of deformation.

[0063] The peelable adhesive layer 420 should be made of a material with appropriate adhesion to ensure the stability of the PCB board 300 during the brushing process and to allow for easy peeling without leaving any residue after processing. For example, the peelable adhesive layer 420 can be made of silicone pressure-sensitive tape, hot melt adhesive, water-soluble adhesive, electrostatic adsorption film, low-tack temporary fixative, etc.

[0064] For PCBs 300 of different sizes and shapes, the coverage and location of the peelable adhesive layer 420 may need to be adjusted. For example, for larger PCBs 300, the number and density of adhesive points can be increased; while for smaller or more complex-shaped PCBs 300, the adhesive points can be set specifically. This flexibility helps to adapt to different production needs and maximize processing efficiency and finished product yield.

[0065] For ease of understanding, the working process is as follows: In use, first place the PCB board 300 on the bearing end face 411 covered with the peelable adhesive layer 420. Use light pressure or other methods to ensure the PCB board 300 is in full contact with and fixed to the adhesive layer. After the brushing process is complete, simply peel off the PCB board 300 gently; no additional cleaning steps are required, simplifying the operation.

[0066] Clearly, the uniform fixing force provided by the peelable adhesive layer 420 effectively reduces the risk of movement and deformation of the PCB board 300 during the brushing process. This makes the installation and removal of the PCB board 300 simple and quick, improving the overall efficiency of the production line. Furthermore, the use of peelable adhesive technology avoids surface damage or residue problems that may occur with traditional fixing methods.

[0067] like Figure 2 As shown, in some embodiments, the peelable adhesive layer 420 covers the entire area of ​​the bearing end face 411, so that the bearing end face 411 and the PCB board 300 are fully bonded on the side that is close to each other.

[0068] In these embodiments, by allowing the peelable adhesive layer 420 to cover the entire bearing end face 411, the maximum contact area between the PCB board 300 and the bearing end face 411 is ensured, thereby providing a more uniform and stable fixing effect.

[0069] Full-area bonding can more effectively disperse various stresses applied to the PCB board 300 (such as mechanical forces during the brushing process), reducing the risk of deformation, curling or breakage of the PCB board 300 due to local stress concentration.

[0070] Clearly, since the PCB board 300 is well supported and fixed across the entire surface, this helps maintain its flatness, thereby improving the accuracy of subsequent processing steps.

[0071] A peelable adhesive material suitable for full-area bonding needs to be selected. These materials should have sufficient tack to ensure a secure bond, while also being easy to peel off without leaving any residue on the PCB surface. Silicone-based pressure-sensitive tape or specific types of low-tack temporary adhesives may be suitable choices.

[0072] For ultra-thin PCB boards 300 with insufficient rigidity, full-area bonding can effectively prevent any form of deformation during processing such as brushing. When there are high requirements for the processing accuracy of PCB boards 300, full-area bonding can help maintain the flatness of PCB boards 300 and reduce errors caused by board bending.

[0073] Furthermore, for PCBs with irregular shapes or intricate structures, full-area bonding can better adapt to their contours and provide all-around support.

[0074] like Figure 1 and Figure 2 As shown, in some embodiments, the support component 400 has support end faces 411 at its opposite ends, and a pair of support end faces 411 are arranged in parallel; correspondingly, there is a pair of brush parts, and the pair of brush parts are arranged opposite to each other, and a brush channel 220 is defined between the pair of brush parts, and the support component 400 can move along the brush channel 220; wherein, when the support component 400 and the PCB board 300 are located in the brush channel 220, the brush working surface of each brush part can abut against the side of the PCB board 300 opposite to the support component 400.

[0075] In these embodiments, the support assembly 400 is further optimized to improve the efficiency and effectiveness of the grinding process. Specifically, the support assembly 400 has support end faces 411 at its opposite ends, and these support end faces 411 are arranged in parallel. Correspondingly, there is also a pair of grinding brushes, which are arranged opposite each other to form a grinding channel 220.

[0076] The support component 400 has support end faces 411 at its opposite ends. These two end faces are arranged in parallel to ensure that the PCB board 300 can receive uniform support during processing. Obviously, this design allows the support component 400 to provide support in two directions simultaneously (equivalent to the PCB board 300 and the support component 400 being clamped between a pair of brush parts), which is especially suitable for wider or more complex-shaped PCB boards 300.

[0077] The brush section consists of a pair of brush sections arranged opposite to each other, forming a brush channel 220. When the support assembly 400 and the PCB board 300 are located within the brush channel 220, the brush working surface of each brush section can abut against the side of the PCB board 300 opposite to the support assembly 400.

[0078] It should be noted that the grinding channel 220 allows the carrier component 400 and the PCB board 300 on it to pass through together, so as to achieve simultaneous grinding of both sides of the PCB board 300.

[0079] During the brushing process, the PCB board 300 is first placed on the bearing end face 411 of the bearing assembly 400 and securely fixed to the bearing assembly 400 using a peelable adhesive layer 420 or other form of fixing device. Then, the bearing assembly 400, together with the fixed PCB board 300, enters the brushing channel 220 formed by a pair of brushes. As the bearing assembly 400 moves along the brushing channel 220, the brushes on each side brush the PCB board 300, ensuring that both sides of the PCB board 300 are uniformly and effectively brushed.

[0080] Clearly, this structure allows for simultaneous grinding of one side of two PCB boards 300. After grinding one side of both PCB boards 300, they are flipped and bonded together to grind the other side. This method greatly improves production efficiency.

[0081] Furthermore, since the support component 400 has support end faces 411 at both ends, it provides more uniform support, which helps to reduce the deformation of the PCB board 300 caused by unilateral pressure.

[0082] like Figure 1 As shown, in some embodiments, the brush section includes a brush roller 210 and a drive element. The brush roller 210 and the drive element are connected, and the drive element is used to drive the brush roller 210 to rotate. The extension direction of the axis of the brush roller 210 is perpendicular to the moving direction of the support assembly 400.

[0083] In these embodiments, the abrasive roller 210 is the part that directly contacts the surface of the PCB board 300. It is usually made of abrasion-resistant material and can effectively remove the oxide layer or other unwanted substances, such as surface residue or foreign matter, from the surface of the PCB board 300.

[0084] The axis of the grinding roller 210 is perpendicular to the moving direction of the support assembly 400. This allows for comprehensive and uniform grinding of the PCB board 300 surface through the rotation of the grinding roller 210 as the support assembly 400 moves along the grinding channel 220. Typically, the axial length of the grinding roller 210 is less than the width of the PCB board 300 to ensure complete coverage.

[0085] The drive element provides power to the grinding roller 210, enabling it to rotate at high speed. Common drive elements include electric motors and reducers. The drive element must have sufficient power and stability to ensure that the grinding roller 210 can maintain a constant speed and pressure during long-term operation, thereby ensuring consistent grinding results.

[0086] For example, small PCB grinders used in laboratory environments or small-scale production may only require low-power motors, typically between 50W and 200W. These types of motors are suitable for processing small or relatively simple PCBs.

[0087] For medium-sized grinding machines used in most industrial applications, motors with power between 200W and 1kW are selected. This power range can meet the surface treatment needs of most conventional PCB boards 300, providing sufficient power to drive the grinding brush roller 210 and ensure the treatment effect.

[0088] For large or ultra-thin PCBs (300mm), especially those requiring higher precision and greater force for polishing, more powerful motors are needed, potentially exceeding 1kW. This type of equipment is typically used in large-scale production lines demanding high efficiency and continuous stability.

[0089] In actual operation, as the support component 400 moves along the brush channel 220, the high-speed rotating brush roller 210 polishes the surface of the PCB board 300. Since the axial direction of the brush roller 210 is perpendicular to the moving direction of the support component 400, it can be ensured that the surface of the PCB board 300 is polished evenly. If a double-sided brush design (i.e., a pair of opposing brush sections) is adopted, both sides of the PCB board 300 can be polished simultaneously, further improving work efficiency.

[0090] like Figure 1 As shown, in some embodiments, each bearing end face 411 is provided with at least two brush portions, and the at least two brush portions are spaced apart in the moving direction of the bearing assembly 400; wherein, in the moving direction of the bearing assembly 400, the rotational speed of the brush rollers 210 of the at least two brush portions increases sequentially.

[0091] In these embodiments, each bearing end face 411 is provided with at least two grinding brush portions, which are spaced apart in the moving direction of the bearing assembly 400. Specifically, the rotational speed of the grinding rollers 210 in these grinding brush portions increases sequentially in the moving direction of the bearing assembly 400. This design helps to gradually improve the grinding effect on the surface of the PCB board 300, ensuring a high-quality surface treatment result.

[0092] Each bearing end face 411 is equipped with at least two grinding brushes, which means that the PCB board 300 will undergo multiple grinding processes as it passes through the grinding brush channel 220. The grinding brushes are spaced apart along the moving direction of the bearing assembly 400, ensuring the independence and effectiveness of each grinding process.

[0093] In the direction of movement of the support component 400, the rotational speed of the abrasive roller 210 gradually increases. For example, the first abrasive section may use a lower rotational speed to remove larger particles or initially smooth the surface; subsequent abrasive sections use higher rotational speeds for finer abrasion, ultimately achieving the desired high-precision surface quality. This method effectively reduces the risk of thermal damage or other surface defects that may result from high-speed abrasion in a single pass, while improving overall abrasion efficiency and quality.

[0094] Furthermore, since there is a speed difference between adjacent brush rollers 210, the PCB board 300 can be straightened under the action of the speed difference, so that it is in a flat state, further reducing the probability of the PCB board 300 curling, bending or even breaking, and improving processing efficiency and yield.

[0095] like Figure 3 As shown, in some embodiments, the edge of the bearing end face 411 has at least one notch 430.

[0096] In these embodiments, the notch 430 can be set in the edge region of the bearing end face 411, and the specific location and number can be adjusted according to actual needs. Obviously, by setting the notch 430, a suspended area is formed on the PCB board 300 at the notch 430, which makes it easier for workers to tear the PCB board 300 to separate it from the bearing end face 411.

[0097] For example, the number of notches 430 can be one, two, three or more, and they are usually distributed around the bearing end face 411.

[0098] Of course, the shape of the notch 430 can be rectangular, arc-shaped, V-shaped, or other geometric shapes, depending on the process requirements.

[0099] Furthermore, during the brushing process, the edge areas of the PCB board 300 are often where stress concentrates, especially in the case of ultra-thin PCB boards 300. The notch 430 design can effectively alleviate the stress concentration problem in the edge areas and reduce the risk of the PCB board 300 curling or breaking.

[0100] In some embodiments, the notch 430 is located upstream of the carrier component 400 in the direction of movement of the carrier component 400.

[0101] In these embodiments, the notch 430 is provided in the upstream region in the direction of movement of the carrier component 400, that is, the portion after the PCB board 300 enters the brush channel 220.

[0102] When the PCB board 300 enters the brushing channel 220 from the notch 430, the position of the notch 430 can reduce the deformation of the edge area of ​​the PCB board 300 due to insufficient rigidity.

[0103] In some embodiments, this application also provides a PCB grinding machine, which includes the grinding apparatus as described in any of the above embodiments.

[0104] Since the above-mentioned grinding device has the above-mentioned technical effects, the PCB grinding machine including the grinding device should have the same technical effects, which will not be elaborated here.

[0105] For example, the PCB board 300 and the carrier component 400 are fed into the brushing channel 220 by the horizontal conveyor roller 100. The surface of the PCB board 300 is polished by the brushing roller 210 and then flows out through the conveyor roller 100, so as to achieve the purpose of smooth and flat surface of the PCB board 300. Typically, the conveyor rollers 100 are arranged in pairs. In this embodiment, each pair of conveyor rollers 100 is arranged vertically at intervals. The PCB board 300 and the carrier component 400 pass between a pair of conveyor rollers 100 and form a clamping force. The rotation of the conveyor rollers 100 can drive the carrier component 400 to move in and out of the brushing channel 220.

[0106] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limitations; therefore, other examples of exemplary embodiments may have different values.

[0107] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0108] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application.

Claims

1. A grinding plate device, characterized by, The grinding plate device comprises: a bearing assembly movably arranged, the bearing assembly having at least one rigid bearing end face for placing and fully supporting a PCB board, a plurality of detachable connecting points being defined between a side face of the PCB board close to the bearing end face and the bearing assembly, at least part of the plurality of detachable connecting points being arranged at intervals; a grinding and brushing assembly having at least one grinding and brushing part, at least one grinding and brushing part being arranged corresponding to each bearing end face, each grinding and brushing part defining a grinding and brushing station on the moving path of the PCB board on the corresponding bearing end face, the grinding and brushing part being capable of grinding and brushing the PCB board located in the grinding and brushing station.

2. The sharpening apparatus of claim 1, wherein, The detachable connecting points comprise at least one of peelable adhesive points, vacuum suction points or magnetic suction points.

3. A grinding plate device according to claim 1 or 2, characterised in that The detachable connecting points are peelable adhesive points. The bearing assembly further comprises a carrier plate and a peelable adhesive layer, one end face of the carrier plate being the bearing end face, and the peelable adhesive layer covering all or part of the area of the bearing end face.

4. The sharpening apparatus of claim 3, wherein, The peelable adhesive layer covers the entire area of the bearing end face, so that the bearing end face and the side of the PCB board close to each other are fully adhered.

5. The sharpening apparatus of claim 1, wherein, The bearing assembly has bearing end faces at opposite ends, and a pair of bearing end faces are arranged in parallel. Correspondingly, the number of grinding and brushing parts is a pair, the pair of grinding and brushing parts are arranged oppositely, a grinding and brushing channel is defined between the pair of grinding and brushing parts, and the bearing assembly is capable of moving along the grinding and brushing channel; wherein, when the bearing assembly and the PCB board are located in the grinding and brushing channel, the grinding working surface of each grinding and brushing part can abut against the side of the PCB board away from the bearing assembly.

6. The sharpening apparatus of claim 1, wherein, The grinding and brushing part comprises a grinding and brushing roller and a driving element, the grinding and brushing roller and the driving element are connected, and the driving element is used to drive the grinding and brushing roller to rotate; wherein, the extension direction of the axis of the grinding and brushing roller and the moving direction of the bearing assembly are arranged perpendicularly.

7. The sharpening apparatus of claim 6, wherein, Each bearing end face is provided with at least two grinding and brushing parts corresponding to each other, the at least two grinding and brushing parts are arranged at intervals in the moving direction of the bearing assembly; wherein, in the moving direction of the bearing assembly, the rotating speeds of the grinding and brushing rollers of the at least two grinding and brushing parts increase successively.

8. The sharpening apparatus of claim 1, wherein, The edge of the bearing end face has at least one notch.

9. The sharpening apparatus of claim 8, wherein, In the moving direction of the bearing assembly, the notch is located upstream of the bearing assembly.

10. A PCB board grinder characterized by, The PCB grinding plate machine comprises the grinding plate device according to any one of claims 1 to 9.

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