Water purifier

Abstract

The utility model relates to a water purifier. The water purifier comprises a shell, a hot water tank, a cold water tank and a semiconductor refrigerator, a first baffle is arranged in the shell, the interior of the shell is divided into a first cavity and a second cavity by the first baffle, the hot water tank is arranged in the first cavity, and the cold water tank is arranged in the second cavity; the semiconductor refrigerator is arranged on the first baffle plate, the semiconductor refrigerator comprises a refrigerating surface and a heating surface, the refrigerating surface of the semiconductor is attached to the cold water tank, and the heating surface of the semiconductor is attached to the hot water tank. The water purifier can realize refrigeration or heating at the same time, and energy waste can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of water purifiers, specifically to a water purifier. Background Technology

[0002] A water purifier, also called a water filter or water purifier, is a water treatment device that performs deep filtration and purification of water according to usage requirements. Regarding drinking water cooling and heating, current semiconductor cooling systems generate a large amount of heat, and similarly, semiconductors also generate significant cooling capacity. However, current water purifiers are mostly single-function cooling or heating systems, resulting in a waste of cooling or heating capacity during semiconductor cooling processes. Utility Model Content

[0003] In view of this, the present invention provides a water purifier that can simultaneously achieve cooling or heating, and can reduce energy waste.

[0004] This utility model provides the following technical solution:

[0005] A water purifier includes: a housing, a hot water tank, a cold water tank, and a semiconductor cooler;

[0006] The housing is provided with a first baffle, which divides the interior of the housing into a first cavity and a second cavity. The hot water tank is disposed in the first cavity and the cold water tank is disposed in the second cavity.

[0007] The semiconductor cooler is disposed on the first baffle, wherein the semiconductor cooler includes a cooling surface and a heating surface, the cooling surface of the semiconductor is attached to the cold water tank, and the heating surface of the semiconductor is attached to the hot water tank.

[0008] Furthermore, it also includes: thermal conductive components;

[0009] Both the cold water tank and the hot water tank are provided with mounting holes, and the heat-conducting component extends through the mounting holes into the cold water tank and the hot water tank;

[0010] Both the cooling surface and the heating surface are provided with heat-conducting components. The heat-conducting components are connected to the hot water tank and the cold water tank. The heat-conducting components are used to transfer the cold energy from the cooling surface to the cold water tank and to transfer the heat from the heating surface to the hot water tank.

[0011] Furthermore, it also includes: limiting components;

[0012] The limiting member is disposed around the outer periphery of the mounting hole. The limiting member includes an extension and a limiting part, wherein the limiting part is disposed on the extension and there is an included angle between the extension and the limiting part.

[0013] Furthermore, the heat-conducting component includes: a heat-absorbing element and multiple heat-conducting sheets;

[0014] Multiple heat-conducting sheets are spaced apart on the heat-absorbing element along a first direction, the heat-absorbing element is attached to the cooling surface, and the heat-conducting sheets are used to release heat.

[0015] The heat-conducting plate extends through the mounting hole into the cold water tank and the hot water tank.

[0016] Furthermore, it also includes: a second baffle;

[0017] The second baffle is disposed inside the housing and is perpendicular to the first baffle. The second baffle divides the housing into a first accommodating cavity and a second accommodating cavity, with the first cavity and the second cavity located in the second accommodating cavity.

[0018] Furthermore, it also includes: filter elements and booster pumps;

[0019] The booster pump is connected to the filter element, which is connected to the hot water tank and the cold water tank. The filter element is used to provide purified water to the hot water tank and the cold water tank.

[0020] Furthermore, the water purifier also includes: a mounting base;

[0021] The housing also has an installation cavity, and the installation base is disposed in the installation cavity. The installation base has a groove, and the filter element has a guide block. When the filter element is installed on the installation base, the guide block is located in the groove.

[0022] Furthermore, a mounting component is provided inside the mounting cavity, the mounting component is disposed on two opposite side walls of the housing, and the mounting component is provided with a sliding groove;

[0023] The filter element is provided with a guide member, which cooperates with the slide groove to fix the filter element.

[0024] Furthermore, it also includes: vane pumps;

[0025] The vane pump is disposed in the second cavity and is connected to the cold water tank and / or the hot water tank. The vane pump is used to supply water to water-using equipment.

[0026] Furthermore, both the first cavity and the second cavity are provided with a heat insulation layer.

[0027] The aforementioned water purifier has a first baffle installed in its housing. The first baffle is horizontally positioned inside the housing to divide the interior of the housing into a first cavity and a second cavity. The first cavity is located above the second cavity and contains a hot water pipe. The second cavity contains a cold water tank. A semiconductor cooler is installed on the first baffle, with the cooling surface of the semiconductor cooler facing the cold water tank and the heating surface facing the hot water pipe. This allows the semiconductor cooler to heat both the cold water tank and the hot water pipe simultaneously, achieving both cooling and heating, while also reducing energy waste in the water purifier. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0029] Figure 1 One of the structural schematic diagrams of the water purifier provided in the embodiments of this utility model;

[0030] Figure 2 This is the second structural schematic diagram of the water purifier provided in the embodiment of the present utility model;

[0031] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0032] Figure 4 This is a schematic diagram of the structure of the heat-conducting component provided in an embodiment of the present utility model;

[0033] Figure 5 A schematic diagram of the shell structure provided for an embodiment of this utility model;

[0034] Figure 6 The third schematic diagram of the structure of the water purifier provided in the embodiment of this utility model;

[0035] Figure 7 for Figure 6 Enlarged view of point B in the middle;

[0036] Figure 8 for Figure 6 Enlarged view of point C in the middle;

[0037] Figure 9 The fourth schematic diagram of the water purifier provided in this embodiment of the utility model.

[0038] Explanation of reference numerals in the attached figures:

[0039] 100-Water purifier; 10-Shell; 11-Hot water tank; 12-Cold water tank; 13-First baffle; 14-First cavity; 15-Second cavity; 16-Mounting hole; 17-Second baffle; 18-First accommodating cavity; 19-Second accommodating cavity; 20-Semiconductor cooler; 21-Cooling surface; 22-Heating surface; 30-Heat-conducting component; 31-Heat-absorbing component; 32-Multiple heat-conducting sheets; 40-Limiting component; 41-Extension; 42-Limiting component; 50-Filter element; 51-Booster pump; 52-Mounting cavity; 53-Guide block; 54-Mounting component; 541-Slide groove; 55-Guide component; 60-Mounting base; 61-Groove; 70-Vessel pump; 80-Insulation layer. Detailed Implementation

[0040] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0041] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0042] In this document, references to "embodiment" or "implementation" mean that a particular feature, structure, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0043] A water purifier, also called a water filter or water purifier, is a water treatment device that performs deep filtration and purification of water according to usage requirements. Regarding drinking water cooling and heating, current semiconductor cooling systems generate a large amount of heat, and similarly, semiconductors also generate significant cooling capacity. However, current water purifiers are mostly single-function cooling or heating systems, resulting in a waste of cooling or heating capacity during semiconductor cooling processes.

[0044] Therefore, this embodiment provides a water purifier 100. The water purifier 100 can simultaneously cool or heat, and can reduce energy waste.

[0045] Please see Figure 1 and Figure 2 A water purifier 100 includes: a housing 10, a hot water tank 11, a cold water tank 12, and a semiconductor cooler 20;

[0046] The housing 10 is provided with a first baffle 13, which divides the interior of the housing 10 into a first cavity 14 and a second cavity 15. The hot water tank 11 is disposed in the first cavity 14 and the cold water tank 12 is disposed in the second cavity 15.

[0047] The semiconductor cooler 20 is disposed on the first baffle 13, wherein the semiconductor cooler 20 includes a cooling surface 21 and a heating surface 22, the cooling surface 21 of the semiconductor is attached to the cold water tank 12, and the heating surface 22 of the semiconductor is attached to the hot water tank 11.

[0048] The water purifier 100 described above has a first baffle 13 installed in the housing 10. The first baffle 13 is horizontally installed inside the housing 10 to divide the interior of the housing 10 into a first cavity 14 and a second cavity 15. The first cavity 14 is located above the second cavity 15 and a hot water pipe is installed in the first cavity 14. A cold water tank 12 is installed in the second cavity 15. A semiconductor cooler 20 is installed on the first baffle 13. The cooling surface 21 of the semiconductor cooler 20 faces the cold water tank 12 and the heating surface 22 faces the hot water pipe. In this way, the semiconductor cooler 20 can heat both the cold water tank 12 and the hot water pipe at the same time, achieving both cooling and heating, and also reducing the energy waste of the water purifier 100.

[0049] Understandably, a first baffle 13 is provided inside the housing 10. The first baffle 13 is horizontally arranged inside the housing 10, thus dividing the interior of the housing 10 into upper and lower cavities. The first cavity 14 is located in the upper part, and the second cavity 15 is located in the lower part. A hot water tank 11 is provided in the first cavity 14, and a cold water tank 12 is provided in the second cavity 15. A semiconductor cooler 20 is provided on the first baffle 13. The heating surface 22 of the semiconductor cooler 20 is in contact with the cold water tank 12, and the heating surface 22 of the semiconductor cooler 20 is in contact with the hot water tank 11. In this way, the hot water tank 11 can be heated by the heat generated by the semiconductor cooler 20 during cooling, while the cold energy generated by the semiconductor cooler 20 can be used by the cold water tank 12. This fully utilizes the cold or heat generated by the semiconductor cooler 20, reduces the waste of the cold or heat generated by the semiconductor cooler 20, and enables the water purifier 100 to produce both cold and hot water simultaneously.

[0050] Please see Figure 2 In some embodiments, it also includes: a heat-conducting component 30;

[0051] Both the cold water tank 12 and the hot water tank 11 are provided with mounting holes 16, and the heat-conducting component 30 extends through the mounting holes 16 into the cold water tank 12 and the hot water tank 11;

[0052] Both the cooling surface 21 and the heating surface 22 are provided with heat-conducting components 30. The heat-conducting components 30 are connected to the hot water tank 11 and the cold water tank 12. The heat-conducting components 30 are used to transfer the cold energy of the cooling surface 21 to the cold water tank 12 and to transfer the heat of the heating surface 22 to the hot water tank 11.

[0053] Understandably, mounting holes 16 are provided on the side walls of both the hot water tank 11 and the cold water tank 12, and heat-conducting components 30 are installed in the mounting holes 16. One end of the heat-conducting component 30 installed on the hot water tank 11 contacts the heating surface 22 of the semiconductor cooler 20, and the other end passes through the through hole in the hot water tank 11 and extends into the hot water tank 11. One end of the heat-conducting component 30 installed on the cold water tank 12 contacts the cooling surface 21 of the semiconductor cooler 20, and the other end passes through the through hole in the cold water tank 12 and extends into the cold water tank 12. In this way, the heat-conducting component 30 can directly exchange heat with the water flow in the cold water tank 12 and the water flow in the hot water tank 11. This allows for more efficient transfer of the cold energy generated by the cooling surface 21 to the cold water tank 12 or the heat generated by the heating surface 22 to the hot water tank 11, thereby improving the heat exchange efficiency of the water purifier 100 and reducing the energy loss of the water purifier 100.

[0054] Please see Figure 2 and Figure 3 In some embodiments, it also includes: a limiting member 40;

[0055] The limiting member 40 is disposed around the outer periphery of the mounting hole 16. The limiting member 40 includes an extension 41 and a limiting part 42, wherein the limiting part 42 is disposed on the extension 41 and there is an included angle between the extension 41 and the limiting part 42.

[0056] Understandably, a limiting member 40 is provided on the outer periphery of the mounting hole 16. The limiting member 40 is used to cooperate with the heat-conducting component 30 to limit the relative position of the heat-conducting component 30 relative to the cold water tank 12 or the hot water tank 11. The limiting member 40 includes an extension 41 and a limiting part 42. The extension 41 extends away from the mounting hole 16 (i.e., extends to the outside of the hot water tank 11 and the cold water tank 12). The limiting part 42 is disposed on the extension 41. The limiting part 42 can be disposed perpendicularly on the extension 41 or form an angle with the limiting part 42. This allows the limiting part 42 to limit the installation position of the heat-conducting component 30, making the installation of the heat-conducting component 30 more convenient.

[0057] Understandably, after the heat-conducting component 30 is installed on the limiting part 42, a seal can be provided between the limiting part 42 and the heat-conducting component 30 to prevent water leakage from the mounting hole 16. The heat-conducting component 30 can be directly fixed on the limiting part 42. Specifically, the limiting part 42 can be connected by providing the mounting hole 16 on the limiting part 42 and by connecting the heat-conducting component 30 to the mounting hole 16.

[0058] Please see Figure 4 In some embodiments, the heat-conducting component 30 includes: a heat-absorbing element 31 and a plurality of heat-conducting sheets 32;

[0059] Multiple heat-conducting sheets are spaced apart on the heat-absorbing element 31 along a first direction. The heat-absorbing element 31 is attached to the cooling surface 21. The heat-conducting sheets are used to release heat.

[0060] The heat-conducting sheet extends through the mounting hole 16 into the cold water tank 12 and the hot water tank 11.

[0061] Understandably, the heat-conducting component 30 includes a heat-absorbing element 31 and heat-conducting plates. The heat-absorbing element 31 is connected to the heat exchanger and is used to collect the heat generated by the heat exchanger. Multiple heat-conducting plates 32 are spaced apart on the heat-absorbing element 31 and are arranged perpendicular to the heat-absorbing element 31. The heat-conducting plates extend into the water storage tank, so that the cold energy on the heat-absorbing element 31 can be transferred to the water storage tank through the heat-conducting component 30. In this way, the cold energy generated by the semiconductor cooler 20 can be transferred to the water storage tank through the heat-absorbing element 31 and the heat-conducting plates. The multiple heat-conducting plates 32 can accelerate the efficiency of energy transfer, so that energy can enter the water storage tank faster and more evenly, realize heat exchange, and thus enable the heat-conducting component 30 to conduct heat.

[0062] Please see Figure 5 In some embodiments, it also includes: a second baffle 17;

[0063] The second baffle 17 is disposed inside the housing 10 and is perpendicular to the first baffle 13. The second baffle 17 divides the housing 10 into a first accommodating cavity 18 and a second accommodating cavity 19. The first cavity 14 and the second cavity 15 are located in the second accommodating cavity 19.

[0064] Understandably, the second baffle 17 is disposed inside the housing 10 and is perpendicular to the first baffle 13. The second baffle 17 divides the housing 10 into a first accommodating cavity 18 and a second accommodating cavity 19, wherein the first cavity 14 and the second cavity 15 are located in the second accommodating cavity 19. In this way, the first accommodating cavity 18 and the first cavity 14 and the second cavity 15 disposed in the second accommodating cavity 19 can be formed by the first baffle 13 and the second baffle 17. Furthermore, an installation cavity 52 is also provided on the housing 10.

[0065] Please see Figure 6 and Figure 9 In some embodiments, it also includes: filter element 50 and booster pump 51;

[0066] The booster pump 51 is connected to the filter element 50, and the filter element 50 is connected to the hot water tank 11 and the cold water tank 12. The filter element 50 is used to provide purified water to the hot water tank 11 and the cold water tank 12.

[0067] Understandably, the filter element 50 is installed in the mounting cavity 52, and the booster pump 51 is installed in the first accommodating cavity 18. The booster pump 51 is connected to the filter element 50, and the municipal water supply is connected to the booster pump 51. After being pressurized by the booster pump 51, the municipal water supply enters the filter element 50. The purified water filtered by the filter element 50 flows into the hot water tank 11 and / or the cold water tank 12. Then, the semiconductor cooler 20 generates cooling energy to cool the purified water in the cold water tank 12, and the heat generated by the semiconductor cooler 20 during cooling heats the purified water in the hot water tank 11. In this way, cooling and heating can be achieved simultaneously. When the user needs to use hot water, it can be delivered to the water-using equipment through the outlet of the heat storage tank.

[0068] Understandably, the booster pump 51 is used to pressurize the unpurified water because the filter element 50 is equipped with an RO filter element 50 (Reverse Osmosis membrane). The water pressure of the municipal water supply is insufficient to allow the water to pass through the RO filter element 50 during water purification. In order to allow the water to pass through the filter element 50 smoothly, the booster pump 51 is set up to ensure that the water can flow into the filter element 50 and at the same time ensure the purification efficiency of the filter element 50.

[0069] Please see Figure 6 and Figure 7 In some embodiments, the water purifier 100 further includes: a mounting base 60;

[0070] The housing 10 also has a mounting cavity 52, and the mounting base 60 is disposed in the mounting cavity 52. ​​The mounting base 60 is provided with a groove 61, and the filter element 50 is provided with a guide block 53. When the filter element 50 is installed on the mounting base 60, the guide block 53 is located in the groove 61.

[0071] Understandably, the mounting cavity 52 has a semi-enclosed structure, which is used to install the filter element 50. The semi-enclosed structure facilitates the installation and removal of the filter element 50. The first cavity 14 and the second cavity 15 are both inside the housing 10. The first cavity 14 is used to install the booster pump 51, and the second cavity 15 is used to install the water storage tank. The booster pump 51 is used to pressurize the filter element 50. By pressurizing the water flow through the booster pump 51, the water flow can be filtered through the filter element 50. The filtered water flows into the cold water tank 12 and / or the hot water tank 11 for storage and heating or cooling.

[0072] Understandably, the housing 10 is provided with an installation cavity 52, and an installation base 60 is provided in the installation cavity 52. ​​The installation base 60 is used to install the filter element 50. The installation base 60 and the filter element 50 are detachably connected. The installation base 60 is provided with a water channel structure that is compatible with the filter element 50. When the filter element 50 is installed on the installation base 60, the filter element 50 can be used normally.

[0073] Understandably, to facilitate the installation of the filter element 50 onto the mounting base 60, a groove 61 is provided on the mounting base 60, extending through the top of the mounting base 60. A guide block 53 is provided on the side of the filter element 50 away from the handle, and the guide block 53 is adapted to the size of the groove 61. The guide block 53 is used to cooperate with the groove 61. When the filter element 50 is installed on the base, the guide block 53 can be inserted into the groove 61 to position the filter element 50. At the same time, the cooperation between the filter element 50 and the guide block 53 can also restrict the rotation of the filter element 50 along its circumference. This can improve the stability of the filter element 50 after installation, ensuring that the filter element 50 will not move during normal use, thereby improving the stability of the water purifier 100.

[0074] Please see Figure 6 and Figure 8 In some embodiments, a mounting member 54 is provided in the mounting cavity 52, the mounting member 54 is provided on two opposite side walls of the housing 10, and a sliding groove 541 is provided on the mounting member 54;

[0075] The filter element 50 is provided with a guide 55, which cooperates with the slide groove 541 to fix the filter element 50.

[0076] Understandably, a mounting component 54 is provided within the mounting cavity 52, and the mounting component 54 is positioned as follows: Figure 8 The upper part of the mounting cavity 52 is shown, and it is set on the side walls on both sides of the mounting cavity 52; the mounting member 54 is provided with a sliding groove 541, and the guide member 55 is provided on the two opposite side walls of the filter element 50. The guide member 55 on the filter element 50 is adapted to the sliding groove 541. Therefore, when the filter element 50 is installed into the mounting cavity 52, the guide member 55 can be inserted into the sliding groove 541 and cooperate with the mounting cavity 52. ​​In this way, the horizontal displacement of the filter element 50 in the mounting cavity 52 can be restricted by the mounting member 54, and it will not move in the vertical direction of the filter element 50 due to gravity. This can improve the stability of the filter element 50 after installation, ensure that the filter element 50 will not move during normal use, and thus improve the stability of the water purifier 100.

[0077] Please see Figure 9 In some embodiments, it also includes: a vane pump 70;

[0078] The vane pump 70 is disposed in the first accommodating cavity 18, and the vane pump 70 is connected to the cold water tank 12 and / or the hot water tank 11. The vane pump 70 is used to supply water to water-using equipment.

[0079] Understandably, the vane pump 70 can be installed at any location within the housing 10, such as in the first accommodating cavity 18 or the second accommodating cavity 19, and the vane pump 70 is connected to the water storage tank. In this way, the vane pump 70 can pressurize the purified water in the hot water tank 11 or the cold water tank 12, and deliver the pressurized water from the hot water tank 11 or the cold water tank 12 to the user end to realize the water supply of the water purification equipment. Specifically, the hot water (cold water) in the hot water tank 11 (cold water tank 12) flows out through the outlet of the hot water tank 11 (outlet of the cold water tank 12) and flows to the vane pump 70. After pressurizing the hot water (cold water), the vane pump 70 delivers it to the user end for user use. The vane pump 70 can ensure that the installation position of the hot water tank 11 (cold water tank 12) is not affected by water pressure, and can smoothly deliver the hot water in the hot water tank 11 (cold water tank 12) to the water-using equipment to improve the user experience.

[0080] Please see Figure 9 In some embodiments, both the first cavity 14 and the second cavity 15 are provided with a heat insulation layer 80.

[0081] Understandably, a heat insulation layer 80 is provided on the outer wall of the housing 10. The heat insulation layer 80 can isolate the first cavity 14 or the second cavity 15 from the external temperature. When there is a temperature difference between the inside and outside of the housing 10, the heat insulation layer 80 can prevent the energy inside the housing 10 from leaking out, reduce the loss of cold energy in the housing 10, reduce energy waste, and also improve the heating (cooling) effect of the water purifier 100.

[0082] In this utility model, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The appearance of these phrases in various places in the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this utility model can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this utility model can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this utility model, provided there is no contradiction between them.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solution of this utility model should not depart from the spirit and scope of the technical solution of this utility model.

Claims

1. A water purifier, characterized in that, The water purifier comprises a shell, a hot water tank, a cold water tank and a semiconductor refrigerator. A first baffle is arranged in the shell, which divides the shell into a first cavity and a second cavity, the hot water tank is arranged in the first cavity, and the cold water tank is arranged in the second cavity. The semiconductor refrigerator is arranged on the first baffle, wherein the semiconductor refrigerator comprises a refrigeration surface and a heating surface, the refrigeration surface of the semiconductor is attached to the cold water tank, and the heating surface of the semiconductor is attached to the hot water tank. Further comprising:

2. The water purifier according to claim 1, wherein A heat conduction assembly; The cold water tank and the hot water tank are both provided with mounting holes, and the heat conduction assembly extends into the cold water tank and the hot water tank through the mounting holes; The refrigeration surface and the heating surface are both provided with the heat conduction assembly, the heat conduction assembly is connected with the hot water tank and the cold water tank, and the heat conduction assembly is used for guiding the cold energy of the refrigeration surface into the cold water tank and guiding the heat of the heating surface to the hot water tank. Further comprising:

3. The water purifier according to claim 2, wherein A limiting piece; The limiting piece is arranged around the outer periphery of the mounting hole, the limiting piece comprises an extension and a limiting portion, wherein the limiting portion is arranged on the extension, and the extension and the limiting portion have an included angle therebetween. The heat conduction assembly comprises a heat absorption piece and a plurality of heat conduction sheets; 4. The water purifier according to claim 3, wherein A plurality of heat conduction sheets are arranged on the heat absorption piece in a first direction, the heat absorption piece is attached to the refrigeration surface, and the heat conduction sheets are used for releasing heat; The heat conduction sheets extend into the cold water tank and the hot water tank through the mounting holes. Further comprising:

5. The water purifier according to claim 1, wherein A second baffle; The second baffle is arranged in the shell and is arranged perpendicularly to the first baffle, the second baffle divides the shell into a first accommodating cavity and a second accommodating cavity, and the first cavity and the second cavity are located in the second accommodating cavity. Further comprising:

6. The water purifier according to claim 5, wherein A filter core and a booster pump; The booster pump is connected with the filter core, the filter core is connected with the hot water tank and the cold water tank, and the filter core is used for providing pure water to the hot water tank and the cold water tank. The water purifier further comprises a mounting base; 7. The water purifier according to claim 6, wherein The shell further has a mounting cavity, the mounting base is arranged in the mounting cavity, the mounting base is provided with a groove, the filter core is provided with a guide block, and when the filter core is mounted to the mounting base, the guide block is located in the groove. The mounting cavity is provided with a mounting piece, the mounting piece is arranged on opposite two side walls of the shell, and the mounting piece is provided with a sliding groove; 8. The water purifier according to claim 7, wherein The filter core is provided with a guide piece, and the guide piece cooperates with the sliding groove to fix the filter core. Further comprising:

9. The water purifier according to claim 8, characterized in that A vane pump; The vane pump is arranged in the first accommodating cavity, the vane pump is connected with the cold water tank and / or the hot water tank, and the vane pump is used for supplying water to a water-using device. The first cavity and the second cavity are both provided with a heat insulation layer.

10. The water purifier according to claim 1, wherein ​

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