Separated testing device

Abstract

The utility model provides a separated testing device, which relates to the technical field of semiconductor testing equipment, and is characterized in that an upper testing base and a lower testing base are mutually connected into a whole, and a testing guide frame is an independent part and can independently lift and move, so that a chip main body is driven to lift and move relative to the upper testing base and the lower testing base; according to the chip testing device and the chip testing method, the technical problems that in the prior art, a lower testing base, an upper testing base and a carrier frame used for fixing a to-be-tested chip are connected together, so that the needed space is large and the chip testing device is not divided in the OLGA field are solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing equipment technology, and in particular to a discrete testing device. Background Technology

[0002] With the development of semiconductor technology, OLGA (Organic Land Grid Array) chips are widely used in various optoelectronic devices due to their unique packaging. These chips are characterized by the integration of photodiodes or other photosensitive devices on their front surface, which presents unique challenges during automated mass production testing. To ensure the performance consistency of the final product, in addition to routine electrical characteristic testing, the functionality of these photosensitive elements must be rigorously evaluated.

[0003] Testing photosensitive devices requires stringent conditions, especially regarding lighting. An ideal testing environment should provide a controllable and stable light source, ensuring the photosensitive area is fully exposed to this light without any physical obstructions. To achieve this, the industry commonly uses specially designed test sockets. These sockets typically consist of three parts: a lower test base, an upper test base, and a frame for securing the chip under test. These three components are tightly connected by screws and locating pins, forming a closed yet easy-to-operate integrated structure.

[0004] However, this seemingly robust design has revealed some problems in practical applications. Especially in scenarios involving large-scale production, when multiple test samples need to be processed continuously using a rotary disc sorter, the large and indivisible size of the test sockets significantly increases the space required for each station. As a result, while the testing accuracy of individual chips is guaranteed, the throughput of the entire system is limited, thus affecting overall production efficiency. Utility Model Content

[0005] The purpose of this invention is to provide a separate testing device to alleviate the technical problem in the prior art where the test base, test upper base, and the frame for fixing the chip under test are connected together, resulting in a large space requirement and difficulty in improving testing efficiency.

[0006] The detachable testing device provided by this utility model includes: an upper testing base, a lower testing base, and a testing guide frame;

[0007] The upper test base is disposed on the lower test base, the lower test base is used to connect the test circuit board, and the upper test base and the lower test base are connected to each other. The upper test base and the lower test base are provided with probes for making the chip body and the test circuit board conductive.

[0008] The test guide frame is used to support the chip body, and the test guide frame is configured to move up and down to move the chip body up and down relative to the upper test base and the lower test base.

[0009] Furthermore,

[0010] The separate testing device also includes a first connecting component;

[0011] The first connecting member passes through the upper test base and the lower test base, and the first connecting member is used to connect the upper test base and the lower test base.

[0012] Furthermore,

[0013] The top surface of the test guide frame has a recessed groove for placing the chip body so that the top surface of the chip body is flush with the top surface of the test guide frame.

[0014] Furthermore,

[0015] The separate testing device also includes connecting structural components;

[0016] The connecting structure has connecting protrusions on both sides, and a placement groove is formed between the connecting protrusions. The test base is placed in the placement groove.

[0017] Furthermore,

[0018] The separate testing device also includes a second connecting component;

[0019] The test base is provided with a first connecting hole, the connecting structure is provided with a second connecting hole, and the test circuit board is provided with a third connecting hole. The first connecting hole, the second connecting hole, and the third connecting hole are provided correspondingly. The second connecting member passes through the first connecting hole, the second connecting hole, and the third connecting hole so that the second connecting member can connect the test base, the connecting structure, and the test circuit board.

[0020] Furthermore,

[0021] The connecting structure has a lower positioning slot at the bottom of the placement groove, and the bottom surface of the test base has a lower positioning protrusion. The lower positioning slot is used for the lower positioning protrusion to extend into.

[0022] Furthermore,

[0023] The connecting protrusion is connected to a positioning member, and the test circuit board is provided with a positioning hole for the positioning member to extend into.

[0024] Furthermore,

[0025] The separate testing device also includes a fixed mounting base;

[0026] The mounting base is located below the test circuit board, and the mounting base is used for the second connecting member and the positioning member to extend into.

[0027] Furthermore,

[0028] The connecting protrusion is provided with a guide post, and the test guide frame is provided with a guide hole for the guide post to extend into.

[0029] Furthermore,

[0030] The test guide frame is provided with an upper positioning slot, and the top surface of the test base is raised to form an upper positioning protrusion. The upper positioning slot is used for the upper positioning protrusion to extend into.

[0031] The detachable testing device provided by this utility model connects the upper test base and the lower test base into one unit, while the test guide frame is an independent component. The test guide frame can move independently up and down in automated equipment, thereby driving the chip body to move up and down relative to the upper and lower test bases. This controls the probes to conduct through the test circuit board and the chip body for testing. This alleviates the technical problem in the prior art where the lower test base, the upper test base, and the frame used to fix the chip under test are connected together, resulting in a large space requirement and difficulty in improving testing efficiency. Attached Figure Description

[0032] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0033] Figure 1 A schematic diagram of the overall structure of the detachable testing device provided in this embodiment of the utility model;

[0034] Figure 2 A schematic diagram of the structure of the detachable testing device provided in an embodiment of this utility model from a frontal view.

[0035] Figure 3 for Figure 2 Exploded view of the structure from the right perspective;

[0036] Figure 4A schematic diagram of the test upper base, test lower base, connecting structural components and test circuit board in the separate test device provided in this embodiment of the utility model;

[0037] Figure 5 This is a schematic diagram of the structure of the test base in the detachable test device provided in this embodiment of the utility model;

[0038] Figure 6 This is a schematic diagram of the connecting structure in the detachable testing device provided in this embodiment of the utility model;

[0039] Figure 7 This is a schematic diagram of the structure of the test circuit board in the separate test device provided in this embodiment of the utility model;

[0040] Figure 8 This is a schematic diagram of the structure of the test guide frame in the split test device provided in the embodiment of this utility model.

[0041] Icons: 10-Chip body; 20-Test circuit board; 21-Third connection hole; 22-Positioning hole; 30-Probe; 100-Upper test base; 110-Upper positioning protrusion; 200-Lower test base; 210-First connection hole; 220-Lower positioning protrusion; 300-Test guide frame; 310-Accommodation slot; 320-Guide hole; 330-Upper positioning slot hole; 400-First connecting component; 500-Connecting structure; 510-Connecting protrusion; 520-Placement slot; 530-Second connection hole; 540-Positioning component; 550-Guide post; 560-Lower positioning slot hole; 600-Fixed mounting base; Detailed Implementation

[0042] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0043] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0044] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0045] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.

[0046] like Figure 1 , Figure 2 and Figure 3 As shown, the detachable testing device provided in this embodiment includes: an upper test base 100, a lower test base 200, and a test guide frame 300; the upper test base 100 is disposed on the lower test base 200, the lower test base 200 is used to connect the test circuit board 20, the test circuit board 20 is located below the lower test base 200, and the upper test base 100 and the lower test base 200 are connected to each other; both the upper test base 100 and the lower test base 200 have through holes for the probe 30 to pass through.

[0047] The test guide frame 300 is used to support the chip body 10, and the test guide frame 300 is configured to move up and down to move the chip body 10 relative to the test upper base 100 and the test lower base 200.

[0048] Specifically, the test guide frame 300 is installed on the existing disk structure. The driving component on the disk structure drives the test guide frame 300 to move up and down, thereby realizing the independent lifting and lowering of the test guide frame 300. When testing is required, the test guide frame 300 moves down to the position where the probe 30 contacts the chip body 10, and the chip body 10, probe 30 and test circuit board 20 form a path for testing. After the test is completed, the test guide frame 300 moves up to disconnect the probe 30 from the chip body 10.

[0049] In an optional embodiment, the detachable testing device further includes a first connecting member 400; the first connecting member 400 may be configured as a screw, the upper test base 100 is provided with an upper connecting hole, the lower test base 200 is provided with a lower connecting hole, and the first connecting member 400 passes through the upper connecting hole and the lower connecting hole, thereby connecting the upper test base 100 and the lower test base 200 using the first connecting member 400.

[0050] The first connecting member 400 can also be configured as an expansion bolt or an embedded part, and the type of the first connecting member 400 can be selected according to the actual situation.

[0051] The separate testing device provided in this embodiment connects the upper test base 100 and the lower test base 200 into one unit, while the test guide frame 300 is an independent component. The test guide frame 300 can move up and down independently, thereby driving the chip body 10 to move up and down relative to the upper test base 100 and the lower test base 200. This controls the probe 30 to conduct through the test circuit board 20 and the chip body 10 for testing. This alleviates the technical problem in the prior art where the lower test base 200, the upper test base 100, and the frame used to fix the chip under test are connected together, resulting in a large space requirement and indivisibility.

[0052] Based on the above embodiments, such as Figure 8 As shown, in an optional embodiment, the top surface of the test guide frame 300 in the separate test device provided in this embodiment is recessed to form a receiving groove 310. The receiving groove 310 is used to place the chip body 10. After the chip body 10 is placed in the receiving groove 310, the top surface of the chip body 10 is flush with the top surface of the test guide frame 300, so that the chip body 10 can be fully exposed at the photosensitive position.

[0053] In addition, the test guide frame 300 is equipped with screw mounting positions, which can be used in conjunction with the light tube device for testing photosensitive devices.

[0054] In alternative implementations, such as Figure 4 As shown, the separate testing device also includes a connecting structure 500; connecting protrusions 510 are respectively provided on both sides of the connecting structure 500, and the recessed area between the two connecting protrusions 510 forms a placement groove 520. The test base 200 is placed in the placement groove 520, which can stably embed the test base 200 therein. This embedded design reduces loosening or displacement caused by external forces during the test.

[0055] In an optional embodiment, the detachable testing device further includes a second connecting member, which is configured as a screw. The lower test base 200 is provided with a first connecting hole 210, and the connecting structure 500 is provided with a second connecting hole 530. Figure 7As shown, the test circuit board 20 is provided with a third connection hole 21. The first connection hole 210, the second connection hole 530 and the third connection hole 21 are provided correspondingly. The second connecting member passes through the first connection hole 210, the second connection hole 530 and the third connection hole 21 so that the second connecting member can connect the test base 200, the connecting structure 500 and the test circuit board 20. The test base 200, the connecting structure 500 and the test circuit board 20 are connected in series to form an integral structure, which ensures that the relative positions of the three are fixed and avoids loosening or misalignment caused by external force or vibration during use, thereby improving the overall stability of the device.

[0056] In alternative implementations, such as Figure 6 As shown, the connecting structure 500 has a lower positioning slot 560 at the bottom of the placement slot 520, as... Figure 5 As shown, the bottom surface of the test base 200 has a lower positioning protrusion 220. The shape of the lower positioning protrusion 220 is adapted to the lower positioning slot 560, so that the positioning protrusion can extend into the lower positioning slot 560. This ensures that the test base 200 is accurately positioned in the placement slot 520, avoiding positional deviation caused by manual assembly or external vibration. It also simplifies the assembly process. The initial positioning can be completed simply by aligning the lower positioning protrusion 220 with the lower positioning slot 560 and inserting it, without the need for additional calibration tools or steps.

[0057] In an optional embodiment, the connecting protrusion 510 is connected to a positioning member 540, which is specifically configured as a positioning pin. The test circuit board 20 is provided with a positioning hole 22, and the positioning member 540 can extend into the positioning hole 22, making the installation process of the test circuit board 20 more intuitive and efficient. The initial positioning can be completed simply by aligning the positioning member 540 with the positioning hole 22 and inserting it, without the need for additional calibration tools or steps.

[0058] In an optional embodiment, the split test device further includes a mounting base 600; the mounting base 600 is disposed below the test circuit board 20, and the mounting base 600 allows the second connecting member and the positioning member 540 to extend in, forming a multi-point support structure, which significantly improves the structural stability of the entire split test device.

[0059] In an optional embodiment, the connecting protrusion 510 is provided with a guide post 550, and the test guide frame 300 is provided with a guide hole 320. The guide hole 320 is used for the guide post 550 to extend into. By cooperating with the guide post 550 on the connecting protrusion 510 and the guide hole 320 on the test guide frame 300, it can be ensured that the test guide frame 300 moves in a predetermined direction during installation or movement, avoiding assembly errors caused by offset or tilt. In addition, the top end of the guide post 550 is a conical surface structure, and the bottom end of the guide hole 320 has a slope, so that after the guide post 550 is inserted into the guide hole 320, a mechanical guiding structure is formed, which restricts the degree of freedom of the test guide frame 300 in non-predetermined directions and improves the stability of the movement of the test guide frame 300.

[0060] In an optional embodiment, the test guide frame 300 is provided with an upper positioning slot 330, and the top surface of the test upper base 100 is raised to form an upper positioning protrusion 110. The upper positioning slot 330 is used for the upper positioning protrusion 110 to extend into. After the upper positioning protrusion 110 is inserted into the upper positioning slot 330, it ensures that the test upper base 100 and the test guide frame 300 reach a precise relative position during installation.

[0061] Additionally, it should be noted that since the test guide frame 300 moves independently, there may be manufacturing and motion tolerances and chip thickness tolerances in the vertical direction during the movement. These all need to be within the compression stroke of the test probe 30. Therefore, it is necessary to consider setting a longer probe 30 stroke to cover the greater errors brought about by the design of the discrete socket.

[0062] In summary, the separate testing device provided by this utility model has the following advantages:

[0063] 1. Modular design with high space utilization: The upper test base 100 and the lower test base 200 are connected by the first connecting member 400 to form a modular structure, while the test guide frame 300 is an independent component that can be raised, lowered, and moved independently. This design reduces the overall space occupied by the testing device while providing high flexibility.

[0064] 2. Precise chip positioning and improved test quality: The top surface of the test guide frame 300 is provided with a receiving groove 310 for placing the chip body 10, ensuring that the photosensitive position of the chip body 10 is fully exposed, which helps to improve the accuracy of chip testing, especially for the testing of photosensitive devices, providing good matching conditions.

[0065] 3. Strong connection stability, reducing the risk of loosening and displacement: The connecting structure 500 securely embeds the test base 200 through the placement slot 520. With the second connecting component passing through the first connecting hole 210, the second connecting hole 530 and the third connecting hole 21, the test base 200, the connecting structure 500 and the test circuit board 20 are firmly connected, ensuring that they will not loosen or misalign due to external force or vibration during the test.

[0066] 4. Precise assembly, reduced manual intervention: The matching design of the lower positioning protrusion 220 and the lower positioning slot 560, as well as the alignment of the positioning component 540 and the positioning hole 22, make the assembly process more intuitive and efficient, reduce the deviation that may be caused by manual operation, and simplify the assembly process.

[0067] 5. Multi-point support and guiding mechanism to improve motion accuracy: The fixed mounting base 600 provides a multi-point support structure, which enhances the stability of the overall device. In addition, the matching design of the guide column 550 and the guide hole 320 not only ensures that the test guide frame 300 moves in the predetermined direction during installation or movement, but also realizes mechanical guidance through the combination of conical surface and inclined surface, which further improves the stability and accuracy of the movement of the test guide frame 300.

[0068] 6. Upper positioning mechanism to enhance assembly reliability: The matching design of the upper positioning protrusion 110 and the upper positioning slot 330 ensures that the test base 100 and the test guide frame 300 reach a precise relative position during installation, avoiding test failure due to assembly errors.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A split test device, characterized in that, The utility model relates to a kind of separated test device, including: Test upper base (100), test lower base (200) and test guide frame (300); The test upper base (100) is arranged on the test lower base (200), the test lower base (200) is used to connect test circuit board (20), and the test upper base (100) and the test lower base (200) are connected with each other, the test upper base (100) and the test lower base (200) are provided with probe (30) for making chip main body (10) and the test circuit board (20) conductive; The test guide frame (300) is used to contain the chip main body (10), and the test guide frame (300) is configured to be able to make lifting movement, to drive the chip main body (10) relative to the test upper base (100) and the test lower base (200) lifting movement.

2. The separated test device according to claim 1, wherein The separated test device further comprises a first connecting member (400); The first connecting member (400) passes through the test upper base (100) and the test lower base (200), and the first connecting member (400) is used to connect the test upper base (100) and the test lower base (200).

3. The separated test device according to claim 1, wherein The top surface of the test guide frame (300) is recessed to form a receiving groove (310), and the receiving groove (310) is used to place the chip main body (10) so that the top surface of the chip main body (10) is flush with the top surface of the test guide frame (300).

4. The separated test device according to claim 1, wherein The separated test device further comprises a connecting structure (500); The connecting structure (500) is provided with connecting protrusions (510) on both sides, and a placing groove (520) is formed between the connecting protrusions (510), and the test lower base (200) is arranged in the placing groove (520).

5. The separated test device according to claim 4, wherein The separated test device further comprises a second connecting member; The test lower base (200) is provided with a first connecting hole (210), the connecting structure (500) is provided with a second connecting hole (530), and the test circuit board (20) is provided with a third connecting hole (21), the first connecting hole (210), the second connecting hole (530) and the third connecting hole (21) are correspondingly arranged, and the second connecting member passes through the first connecting hole (210), the second connecting hole (530) and the third connecting hole (21) so that the second connecting member can connect the test lower base (200), the connecting structure (500) and the test circuit board (20).

6. The separated test device according to claim 5, wherein The connecting structure (500) is provided with a lower positioning slot hole (560) at the bottom of the placing slot (520), the bottom surface of the test lower base (200) is provided with a lower positioning protrusion (220), and the lower positioning slot hole (560) is used for inserting the lower positioning protrusion (220).

7. The separated test device according to claim 5, wherein, The connecting protrusion (510) is connected with a positioning member (540), the test circuit board (20) is provided with a positioning hole (22), and the positioning hole (22) is used for inserting the positioning member (540).

8. The separated test device according to claim 7, wherein, The separated test device further comprises a fixed mounting base (600); The fixed mounting base (600) is arranged below the test circuit board (20), and the fixed mounting base (600) is used for inserting the second connecting member and the positioning member (540).

9. The separated test device according to claim 4, wherein, The connecting protrusion (510) is provided with a guide column (550), the test guide frame (300) is provided with a guide hole (320), and the guide hole (320) is used for inserting the guide column (550).

10. The separated test device according to claim 1, wherein, The test guide frame (300) is provided with an upper positioning slot hole (330), the top surface of the test upper base (100) is provided with an upper positioning protrusion (110), and the upper positioning slot hole (330) is used for inserting the upper positioning protrusion (110).

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