Data acquisition optical module and optical transceiver assembly

Abstract

The utility model provides a data acquisition optical module and an optical transceiver assembly. The data acquisition optical module comprises a circuit board; the light emitting component is electrically connected with the circuit board, and the light emitting component is used for generating a light emitting signal; the light emitting component comprises a tube base provided with a first high-frequency tube pin and a second high-frequency tube pin, the first high-frequency tube pin and the second high-frequency tube pin penetrate through the tube base, and the top of the first high-frequency tube pin and the top of the second high-frequency tube pin protrude out of the top face of the tube base; the first high-frequency pin and the second high-frequency pin are electrically connected with the circuit board; the bottom of the first mounting seat is connected with the top surface of the tube seat, and the first mounting seat is positioned on the top side edges of the first high-frequency tube pin and the second high-frequency tube pin; the bottom surface of the laser chip is connected with the top surface of the first mounting seat, and the top surface emits a light emission signal; the laser chip is electrically connected with the first high-frequency pin and the second high-frequency pin; the second lens is positioned above the laser chip; the second lens collimates a light emission signal generated by the laser chip; the bottom of the pipe cap is connected with the top of the pipe seat. And vehicle-mounted communication can be realized conveniently.

Description

[0001] This application claims priority to Chinese Patent Application No. CN2025201429075, filed on January 21, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of vehicle-mounted optical communication technology, and in particular to a data acquisition optical module and an optical transceiver assembly. Background Technology

[0003] With the development of autonomous driving and intelligent driving assistance technologies, vehicles are increasingly demanding the collection and processing of camera data. While traditional electrical transmission methods can meet basic requirements, they have limitations in terms of high bandwidth, low latency, and interference resistance. Utility Model Content

[0004] Some embodiments provide a data acquisition optical module and an optical transceiver assembly to facilitate optical cable communication in vehicle communication systems.

[0005] Some embodiments provide a data acquisition optical module, including: a circuit board;

[0006] A light emitting component is electrically connected to the circuit board, and the light emitting component is used to output a light emission signal;

[0007] The light emitting component includes:

[0008] A tube socket is provided with a high-frequency pin, which passes through the tube socket and has its top protruding from the top surface of the tube socket; the high-frequency pin is electrically connected to the circuit board.

[0009] The first mounting base is connected to the top surface of the tube seat at its bottom and is located on the side of the high-frequency tube pin;

[0010] The VCSEL laser chip has its bottom surface connected to the top surface of the first mounting base, and the top surface emits light signals; the VCSEL laser chip is electrically connected to the high-frequency pin.

[0011] The second lens is located above the VCSEL laser chip; the second lens collimates the light emission signal emitted by the VCSEL laser chip.

[0012] The tube cap is connected to the tube base at the bottom and covers the VCSEL laser chip and the second lens.

[0013] One of the above technical solutions has the following advantages or beneficial effects: The optical emitting component includes a socket with a high-frequency pin. The high-frequency pin passes through the socket and protrudes from the top surface of the socket. A laser chip is mounted on a first mounting base, with its bottom surface connected to the top surface of the first mounting base. The top surface of the laser chip emits an optical emission signal. The optical emission signal emitted from the top surface of the laser chip is transmitted to a second lens, collimated by the second lens, and then passes through a cap before being output from the cap. This facilitates ensuring the efficiency of the optical emitting component's output optical emission signal. The bottom surface of the first mounting base is connected to the top surface of the socket, and the first mounting base is located next to the high-frequency pin. The laser chip is electrically connected to the high-frequency pin. The first mounting base and the high-frequency pin facilitate the electrical connection between the laser chip and the circuit board. VCSEL laser chips have a larger focal spot diameter, a wider divergence angle, and a lower focal power density. Since the communication distance of automotive optical communication is typically no more than 20m, the combination of the VCSEL laser chip, the socket, and the cap makes the VCSEL laser chip suitable for automotive optical communication. Furthermore, the use of multimode fiber and the high power and large spot size of the VCSEL laser chip in vehicle-mounted optical communication make the optical path more stable and significantly reduce the problem of optical signal power drop, thus facilitating the fulfillment of vehicle-grade reliability requirements. Therefore, the data acquisition optical module provided in this embodiment can easily realize optical cable communication in vehicle-mounted communication systems.

[0014] In some embodiments, a data acquisition optical module is provided, wherein the socket is further provided with an output pin, and the optical emitting component further includes:

[0015] The second mounting base is connected to the top surface of the tube seat at its bottom, and the second mounting base is located between the first mounting base and the output pin;

[0016] A backlight detector is disposed on the top surface of the second mounting base; the backlight detector is electrically connected to the tube socket and the output pin;

[0017] An inclined light window is formed on the top of the cap, and the light window is inclinedly positioned above the VCSEL laser chip and the backlight detector; the light reflected by the light window is transmitted to the backlight detector.

[0018] Another technical solution described above has the following advantages or beneficial effects: The light emitting component further includes a second mounting base and a backlight detector, with output pins provided on the mounting base. The second mounting base is located to the side of the output pins, and its bottom is connected to the top surface of the mounting base. The backlight detector is located on the top surface of the second mounting base, facilitating its placement on the mounting base and thus enabling the detection of the emitted light power of the laser chip. The cap includes an optical window, which is tilted above the VCSEL laser chip and the backlight detector. The light emission signal generated by the VCSEL laser chip is transmitted to the optical window, which transmits most of the light emission signal and reflects a small portion. The small portion of the light emission signal reflected by the optical window is transmitted to the backlight detector. This tilted optical window facilitates the detection of the emitted light power of the VCSEL laser chip by the backlight detector.

[0019] In some embodiments, a data acquisition optical module is provided, wherein the cap includes:

[0020] The cap body has a bottom surface connected to the top surface of the tube seat, and a support platform formed on the top surface; an inclined surface is formed on the support platform, and the inclined surface is inclinedly positioned above the VCSEL laser chip;

[0021] The bottom surface of the light window is connected to the inclined surface, so that the light window is tilted above the VCSEL laser chip and the backlight detector.

[0022] Another technical solution described above has the following advantages or beneficial effects: the cap includes a cap body and an optical window. The top of the cap body is connected to the top surface of the tube base, and a support platform is provided on the top of the cap body. An inclined surface is formed on the support platform, and the inclined surface is suspended obliquely above the laser chip. The bottom surface of the optical window is connected to the inclined surface, so that the optical window is obliquely set above the laser chip and the backlight detector, thus facilitating the oblique setting of the optical window.

[0023] In some embodiments, a data acquisition optical module is provided, wherein a first high-frequency pin and a second high-frequency pin are provided on the socket; a first pad and a second pad are formed on the top surface of the first mounting base, wherein the first pad is wire-connected to the first high-frequency pin and the second pad is wire-connected to the second high-frequency pin;

[0024] The VCSEL laser chip is located on the side of the first pad and the second pad, and the VCSEL laser chip is wire-connected to the first pad and the second pad.

[0025] Another technical solution described above has the following advantages or beneficial effects: a first pad and a second pad are formed on the top surface of the first mounting base, and the laser chip is located on the sides of the first pad and the second pad. A first high-frequency pin is wire-connected to the first pad, a second high-frequency pin is wire-connected to the second pad, and the laser chip is wire-connected to both the second pad and the second pad. This facilitates the electrical connection between the laser chip and the circuit board, thereby facilitating the laser chip to generate a light emission signal based on a high-frequency drive signal.

[0026] In some embodiments, a data acquisition optical module is provided, wherein a metal layer is formed on the top surface of the second mounting base, the backlight detector is mounted on the metal layer, and the metal layer is wire-connected to the output pin;

[0027] The backlight detector is wired to the top surface of the tube socket.

[0028] Another technical solution described above has the following advantages or beneficial effects: A metal layer is formed on the top surface of the second mounting base, and the backlight detector is mounted on the metal layer, so that the cathode of the backlight detector is electrically connected to the metal layer. The metal layer is wire-connected to the output pin, and the backlight detector is wire-connected to the top surface of the mounting base, which facilitates the provision of reverse bias voltage to the backlight detector, so as to output a detection current through the backlight detector, thereby detecting the emitted light power of the laser chip through the backlight detector.

[0029] In some embodiments, a data acquisition optical module is provided, wherein the optical emitting component further includes a mounting post located on the side of the first mounting base; the bottom of the mounting post is connected to the top surface of the tube base, and the side of the mounting post is connected to the second lens.

[0030] Another technical solution described above has the following advantages or beneficial effects: the light emitting component further includes a mounting post located on the side of the first mounting base. The bottom of the mounting post is connected to the top surface of the tube base, and the side of the mounting post is connected to the second lens. This allows the second lens to be conveniently positioned above the laser chip via the mounting post, and the mounting post also facilitates adjustment of the second lens's position.

[0031] Some embodiments provide a data acquisition optical module, including:

[0032] An optical fiber adapter is located at the optical port of the data acquisition optical module; the optical fiber adapter includes an optical fiber ferrule, and the fiber core in the optical fiber ferrule is a multimode fiber core.

[0033] The second connecting sleeve is fitted onto the pipe cap, and its end is connected to the pipe seat;

[0034] A round-square tube body is provided with a first lens and a first filter inside; one end of the round-square tube body is connected to the optical fiber adapter, and the other end of the round-square tube body is connected to the second connecting sleeve; the first lens is located on the side of the optical fiber adapter, and the first filter is located on the side of the first lens away from the optical fiber adapter.

[0035] Another technical solution in the above-mentioned technical solution has the following advantages or beneficial effects: A second connecting sleeve is fitted onto the tube cap, one end of the second connecting sleeve is connected to the round / square tube body, and the other end of the second connecting sleeve is connected to the tube seat, facilitating the connection of the optical emitting component to the round / square tube body. An optical fiber adapter is installed on the round / square tube body, and a first lens and a first filter are installed inside the round / square tube body. The first lens is close to the optical fiber adapter. The optical emission signal is input to the round / square tube body, passes through the first filter and is transmitted to the first lens, then converged and transmitted to the optical fiber adapter, and finally optically coupled to the optical fiber via the optical fiber adapter. The optical fiber adapter includes an optical fiber ferrule, in which the fiber core is a multimode fiber core. This facilitates making the diameter of the light spot coupled into the multimode fiber core comparable to the diameter of the multimode fiber core, thereby making the optical energy distribution of the optical emission signal and other signals more uniform in the multimode fiber core, which is more beneficial for downstream beam splitting applications.

[0036] Some embodiments provide an optical transceiver component, including:

[0037] Fiber optic adapter;

[0038] A round-square tube body with a first lens installed inside; one end of the round-square tube body is connected to the optical fiber adapter, and the first lens is located on the side of the optical fiber adapter.

[0039] A light-emitting component is connected to the other end of the circular-square tube.

[0040] The light emitting component includes:

[0041] The tube socket is provided with a first high-frequency pin and a second high-frequency pin, the first high-frequency pin and the second high-frequency pin passing through the tube socket, and the top of the first high-frequency pin and the second high-frequency pin protruding from the top surface of the tube socket;

[0042] The VCSEL laser chip has its bottom surface connected to the socket and its top surface emitting light signals; the VCSEL laser chip is electrically connected to the first high-frequency pin and the second high-frequency pin.

[0043] The second lens is located above the VCSEL laser chip; the second lens collimates the light emission signal emitted by the VCSEL laser chip.

[0044] The tube cap is connected to the tube base at the bottom and covers the VCSEL laser chip and the second lens.

[0045] Another technical solution in the above-mentioned technical solution has the following advantages or beneficial effects: The optical emitting component includes a tube socket, on which a first high-frequency pin and a second high-frequency pin are provided. The first high-frequency pin and the second high-frequency pin pass through the tube socket and protrude from the top surface of the tube socket. A VCSEL laser chip is disposed on the tube socket, and the top surface of the VCSEL laser chip emits an optical emission signal. The optical emission signal emitted from the top surface of the VCSEL laser chip is transmitted to a second lens, collimated by the second lens, and then passes through a tube cap, output from the tube cap, and transmitted to the round-square tube body. This facilitates ensuring the efficiency of the optical emitting component outputting the optical emission signal to the round-square tube body. The first high-frequency pin and the second high-frequency pin facilitate the electrical connection between the VCSEL laser chip and the circuit board. An optical fiber adapter is disposed on the round-square tube body, and a first lens is disposed inside the round-square tube body. The first lens is close to the optical fiber adapter. The optical emission signal is input to the round-square tube body, passes through a first filter, and is transmitted to the first lens. The first lens converges the signal and transmits it to the optical fiber adapter, so as to facilitate optical coupling to the optical fiber via the optical fiber adapter.

[0046] VCSEL laser chips have a larger focal spot diameter, wider divergence angle, and lower focal power density. The communication distance of automotive optical communication is usually no more than 20m. By combining the VCSEL laser chip with the socket and cap, and with the first and second lenses, the VCSEL laser chip can be used in automotive optical communication. In addition, automotive optical communication uses multimode fiber. The high power and large spot size of the VCSEL laser chip make the optical path of automotive optical communication more stable, greatly reducing the problem of optical signal power drop, and making it easier to meet the reliability requirements of automotive applications.

[0047] In some embodiments, an optical transceiver assembly is provided, wherein the optical emitting component further includes a first mounting base, the bottom of which is connected to the top surface of the tube socket, and the top of which supports and connects to the bottom surface of the VCSEL laser chip; a first pad and a second pad are formed on the top surface of the first mounting base, the first pad is wire-connected to the first high-frequency pin, and the second pad is wire-connected to the second high-frequency pin;

[0048] The VCSEL laser chip is located on the side of the first pad and the second pad, and the VCSEL laser chip is wire-connected to the first pad and the second pad.

[0049] Another technical solution described above has the following advantages or beneficial effects: the bottom surface of the first mounting base is connected to the top surface of the tube socket, and the first mounting base is located on the side of the first high-frequency pin and the second high-frequency pin. The laser chip is electrically connected to the first high-frequency pin and the second high-frequency pin. The first mounting base, the first high-frequency pin, and the second high-frequency pin facilitate the electrical connection between the laser chip and the circuit board. A first pad and a second pad are formed on the top surface of the first mounting base, and the laser chip is located on the side of the first pad and the second pad. The first high-frequency pin is wire-connected to the first pad, the second high-frequency pin is wire-connected to the second pad, and the laser chip is wire-connected to the second pad and the second pad. This facilitates the electrical connection between the laser chip and the circuit board, thereby facilitating the laser chip to generate a light emission signal based on a high-frequency drive signal.

[0050] In some embodiments, an optical transceiver assembly is provided, wherein the socket is further provided with an output pin; the optical emitting component further includes:

[0051] The second mounting base is connected to the top surface of the tube seat at its bottom, and the second mounting base is located between the first mounting base and the output pin;

[0052] A backlight detector is disposed on the top surface of the second mounting base; the backlight detector is electrically connected to the tube socket and the output pin;

[0053] The cap includes:

[0054] The cap body has a bottom surface connected to the top surface of the tube seat, and a support platform formed on the top surface; an inclined surface is formed on the support platform, and the inclined surface is inclinedly positioned above the VCSEL laser chip;

[0055] The light window has its bottom surface connected to the inclined surface, so that the light window is tilted above the VCSEL laser chip and the backlight detector; the light signal reflected by the light window is transmitted to the backlight detector.

[0056] Another technical solution described above has the following advantages or beneficial effects: The light emitting component further includes a second mounting base and a backlight detector, with output pins provided on the mounting base. The second mounting base is located on the side of the output pins, and its bottom is connected to the top surface of the mounting base. The backlight detector is located on the top surface of the second mounting base, facilitating its placement on the mounting base. The cap includes a cap body and an optical window. The top of the cap body is connected to the top surface of the mounting base, and a support platform is provided on the top of the cap body. An inclined surface is formed on the support platform, and the inclined surface is tilted and suspended above the laser chip. The bottom surface of the optical window is connected to the inclined surface, allowing the optical window to be tilted above the laser chip and the backlight detector. The light emission signal generated by the laser chip is transmitted to the optical window; part of the light emission signal is refracted through the optical window, and part of the light emission signal is reflected by the optical window. The light signal reflected by the optical window is transmitted to the backlight detector, enabling the backlight detector to receive the light emission signal and thus detect the emitted light power of the laser chip. Attached Figure Description

[0057] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are merely drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. Furthermore, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0058] Figure 1 This is a diagram of an in-vehicle optical communication system architecture according to some embodiments;

[0059] Figure 2A This is a partial structural diagram of a vehicle-mounted optical communication system according to some embodiments;

[0060] Figure 2B This is a partial breakdown structure of a vehicle-mounted optical communication system according to some embodiments. Figure 1 ;

[0061] Figure 2C Figure 2 shows a partial exploded view of a vehicle-mounted optical communication system according to some embodiments;

[0062] Figure 3A This is a structural diagram of a data acquisition optical module according to some embodiments;

[0063] Figure 3B An exploded view of a data acquisition optical module according to some embodiments;

[0064] Figure 4A This is a schematic diagram of a sensor and circuit board assembly according to some embodiments;

[0065] Figure 4B This is an exploded view of a sensor and circuit board assembly according to some embodiments;

[0066] Figure 4C This is a schematic diagram of the electrical connection between a sensor and a circuit board according to some embodiments;

[0067] Figure 4D This is an exploded view of the electrical connection between a sensor and a circuit board according to some embodiments;

[0068] Figure 5A This is a structural diagram of a sensor according to some embodiments;

[0069] Figure 5B This is a cross-sectional structural diagram of a sensor according to some embodiments;

[0070] Figure 5C This is a partial cross-sectional view of a sensor according to some embodiments;

[0071] Figure 6A This is a structural diagram of an optical transceiver component according to some embodiments;

[0072] Figure 6B An exploded view of an optical transceiver assembly according to some embodiments;

[0073] Figure 6C This is a structural diagram of the internal structure of an optical transceiver assembly according to some embodiments;

[0074] Figure 7A This is a structural diagram of another optical transceiver assembly according to some embodiments;

[0075] Figure 7B An exploded view of another optical transceiver assembly according to some embodiments;

[0076] Figure 7C This is a cross-sectional view of another optical transceiver assembly according to some embodiments;

[0077] Figure 8A A structure of a round-square tube according to some embodiments Figure 1 ;

[0078] Figure 8B This is a structural diagram of a round-square tube according to some embodiments;

[0079] Figure 8C This is a cross-sectional view of a round-square tube according to some embodiments;

[0080] Figure 8D This is a diagram illustrating the usage state of a round-square tube according to some embodiments;

[0081] Figure 9A This is a structural diagram of a light emitting component according to some embodiments;

[0082] Figure 9B Disassembly of a light emitting component according to some embodiments Figure 1 ;

[0083] Figure 9C An exploded view of a light emitting component according to some embodiments is shown in Figure 2.

[0084] Figure 9D Exploded view 3 shows a light emitting component according to some embodiments;

[0085] Figure 9E This is a partial view of a light emitting component according to some embodiments;

[0086] Figure 9F This is a cross-sectional view of a light emitting component according to some embodiments;

[0087] Figure 9G This is a schematic diagram of the assembly of a light emitting component and a second connecting sleeve according to some embodiments;

[0088] Figure 10A This is a cross-sectional view of the layout of an in-vehicle optical communication system according to some embodiments;

[0089] Figure 10B This is a cross-sectional structural diagram of a data acquisition optical module according to some embodiments;

[0090] Figure 10C This is a partial cross-sectional view of a data acquisition optical module according to some embodiments;

[0091] Figure 11A This is an exploded view of an optoelectronic composite interface assembly structure according to some embodiments;

[0092] Figure 11B This is a cross-sectional structural diagram of an optoelectronic composite interface assembly according to some embodiments;

[0093] Figure 11C This is an exploded cross-sectional view of an optoelectronic composite interface assembly according to some embodiments;

[0094] Figure 12A This is a cross-sectional view of a first fiber optic adapter and optoelectronic composite interface assembly according to some embodiments;

[0095] Figure 12B An exploded view of a first fiber optic adapter and optoelectronic composite interface assembly according to some embodiments;

[0096] Figure 12CThis is an exploded top sectional view of an optoelectronic composite interface according to some embodiments;

[0097] Figure 13A This is a structural diagram of an optoelectronic composite interface according to some embodiments;

[0098] Figure 13B This is an exploded view of an optoelectronic composite interface according to some embodiments;

[0099] Figure 14 This is a schematic diagram of an assembly of an optoelectronic connector assembly and an optoelectronic composite interface according to some embodiments;

[0100] Figure 15A This is a structural diagram of an optoelectronic connector assembly according to some embodiments;

[0101] Figure 15B An exploded view of an optoelectronic connector assembly according to some embodiments;

[0102] Figure 15C A housing structure according to some embodiments Figure 1 ;

[0103] Figure 15D Figure 2 shows a shell structure according to some embodiments;

[0104] Figure 16 This is a structural diagram of an optocoupler assembly according to some embodiments from another perspective;

[0105] Figure 17 This is an exploded view from another perspective of an optocoupler assembly according to some embodiments;

[0106] Figure 18 This is a cross-sectional structural diagram of an optoelectronic connector assembly according to some embodiments;

[0107] Figure 19 This is a schematic diagram of an optical connection for an in-vehicle optical communication system according to some embodiments;

[0108] Figure 20 This is a schematic diagram of the power supply connection of an in-vehicle optical communication system according to some embodiments;

[0109] Figure 21 This is a cross-sectional structural diagram of an optoelectronic connector assembly and optoelectronic composite interface according to some embodiments;

[0110] Figure 22 This is a top cross-sectional view of an optoelectronic connector assembly and optoelectronic composite interface assembly according to some embodiments;

[0111] Figure 23 This is a partially enlarged top cross-sectional view of an optoelectronic connector assembly and optoelectronic composite interface assembly according to some embodiments;

[0112] Figure 24 This is an exploded top sectional view of an optoelectronic connector assembly and optoelectronic composite interface assembly according to some embodiments;

[0113] Figure 25 This is an exploded top sectional view of an optoelectronic connector assembly and optoelectronic composite interface assembly according to some embodiments;

[0114] Figure 26 This is an assembly structure diagram of a snap-fit ​​connector and photoelectric connector assembly according to some embodiments;

[0115] Figure 27 This is a partially enlarged structural view of an assembly of a snap-fit ​​connector and an optoelectronic connector according to some embodiments;

[0116] Figure 28 This is an exploded view of a snap-fit ​​connector and photoelectric connector assembly according to some embodiments. Detailed Implementation

[0117] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0118] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0119] Electricity has replaced gasoline and chemical energy as the driving force for automobiles, not only promoting the development of new energy vehicles but also providing ample power for vehicle functions such as road condition imaging detection and advanced driver assistance systems. The high-power electricity requirements of in-vehicle communication and display devices such as lidar, multi-camera systems surrounding the vehicle, high-performance advanced driver assistance chips, and large in-vehicle screens can be met by the vehicle's battery pack.

[0120] Currently, the average number of in-vehicle cameras exceeds 10, with each camera boasting over 8 million pixels. Autonomous driving chips also possess computing power exceeding 500 TOPS. This indicates that in-vehicle signal communication has entered the realm of high-frequency signal transmission. This field demands high standards for signal transmission quality, transmission speed, and anti-interference capabilities, which traditional cables can no longer meet. Signal transmission in in-vehicle communication and display devices is gradually evolving towards replacing traditional cables with optical fibers, extending optical communication technology into automotive products.

[0121] The electrical signals output by the vehicle-mounted cameras are converted by the MAC chip and transmitted to the laser driver chip. The laser driver chip then loads the electrical signals into light for transmission. In a vehicle scenario, multiple vehicle-mounted cameras are distributed around the vehicle body, transmitting multiple video signals from different directions to the vehicle-mounted processing chip (including the driver assistance chip and the vehicle infotainment chip) to form multi-view driving images or detection images for driver assistance. The vehicle-mounted cameras are distributed around the vehicle body and are numerous; the vehicle-mounted processing chips are located inside the vehicle and are fewer in number. A majority-to-minority communication network topology is formed between the vehicle-mounted cameras and the vehicle-mounted processing chips, with the unit communication architecture consisting of multiple vehicle-mounted cameras corresponding to one vehicle-mounted processing chip.

[0122] The applicant discovered that this communication architecture shares some similarities with the ONU and OLT communication architecture in access network optical communication, but also exhibits the following significant differences. While the ONU and OLT also follow a multiple-to-one communication architecture, it lacks image detection and processing capabilities. Furthermore, the ONU and OLT act as the host computer for the optical modules, with the host computer supplying power to the optical modules and establishing signal interaction and transmission between them. Additionally, the external structural form of the ONU, OLT, and optical modules is unsuitable for automotive installation environments. These similarities offer some design inspiration for automotive optical communication, but the aforementioned differences also present significant technical obstacles to the implementation of automotive optical communication design solutions.

[0123] Figure 1 This is a diagram illustrating an architecture of an in-vehicle optical communication system according to some embodiments. Figure 1As shown, in some embodiments, the vehicle-mounted optical communication system 1000 is electrically connected to the vehicle-mounted main processing device 2000. The vehicle-mounted optical communication system 1000 includes multiple sensors for acquiring image or video data of the vehicle's surroundings. The vehicle-mounted main processing device 2000 can identify the channel addresses of the sensors and analyze and process the sensor-acquired data to achieve real-time perception of the vehicle's surrounding environment.

[0124] In some embodiments, the vehicle-mounted optical communication system 1000 may include a data acquisition optical module 100. The data acquisition optical module 100 includes a circuit board 110, a sensor 120, and an optical transceiver assembly 130. The sensor 120 transmits the acquired electrical signals via the circuit board 110 to the optical transceiver assembly 130, which converts the electrical signals into optical signals. Thus, the electrical signal data acquired by the sensor 120 is transmitted in the form of optical signals. Optical signal transmission has a high transmission rate and strong anti-interference capability, improving the data security of the vehicle-mounted system, and is particularly suitable for scenarios with high data security requirements, such as autonomous driving.

[0125] In some embodiments, the vehicle-mounted optical communication system 1000 may include an optical signal data processing device 200. The optical signal data processing device 200 performs photoelectric conversion. The optical signal data processing device 200 is located between the data acquisition optical module 100 and the vehicle-mounted main processing device 2000. Optical signal transmission occurs between the optical signal data processing device 200 and the data acquisition optical module 100.

[0126] In some embodiments, the optical signal data processing device 200 receives optical signals from the data acquisition optical module 100 and converts the optical signals into electrical signals suitable for processing by the vehicle-mounted main processing device 2000. During the signal conversion process, the optical signal data processing device 200 can process and optimize the optical signals to improve signal quality. Simultaneously, the optical signal data processing device 200 can manage the channel addresses of multiple sensors 120, ensuring that the vehicle-mounted main processing device 2000 can accurately identify and process data from different sensors 120.

[0127] In some embodiments, under certain application scenarios, the vehicle-mounted main processing device 2000 sends control signals to the sensor 120 via the optical signal data processing device 200 and the data acquisition optical module 100 to adjust the parameters of the sensor 120, such as exposure time and focal length, and to monitor the working status of the sensor 120 in real time. Specifically, the control signals or control commands issued by the vehicle-mounted main processing device 200 are transmitted to the optical signal data processing device 200, which converts the electrical signals into optical signals. These optical signals are then transmitted to the data acquisition optical module 100, which in turn converts the optical signals back into electrical signals. The converted electrical signals are then transmitted to the sensor 120 via the circuit board 110 to control the operation of the sensor 120.

[0128] In some embodiments, the vehicle-mounted optical communication system 1000 may include a fiber optic composite cable 500. The fiber optic composite cable 500 integrates optical fiber and electrical cable to simultaneously transmit optical signals and power signals. The fiber optic composite cable 500 is optically connected to the data acquisition optical module 100. The fiber optic composite cable 500 is located between the data acquisition optical module 100 and the optical signal data processing device 200 to establish optical signal transmission between the data acquisition optical module 100 and the optical signal data processing device 200, while simultaneously providing a power signal to the data acquisition optical module 100.

[0129] In some embodiments, the optical signal output by the data acquisition optical module 100 is transmitted to the optical signal data processing device 200 via the optoelectronic composite cable 500, or the optical signal output by the optical signal data processing device 200 is transmitted to the data acquisition optical module 100 via the optoelectronic composite cable 500. Simultaneously, a power signal is transmitted to the data acquisition optical module 100 via the optoelectronic composite cable 500, thereby supplying power to the data acquisition optical module 100.

[0130] In some embodiments, the vehicle-mounted optical communication system 1000 may include an optocoupler assembly 400. The optocoupler assembly 400 is disposed between the data acquisition optical module 100 and the optocoupler composite cable 500. The optocoupler assembly 400 serves as an interface for connecting the data acquisition optical module 100 and the optocoupler composite cable 500, thereby establishing an optocoupler connection between them. On one hand, the optocoupler assembly 400 optically connects the data acquisition optical module 100 and the optocoupler composite cable 500, establishing an optical connection between them. On the other hand, the optocoupler assembly 400 electrically connects the data acquisition optical module 100 and the optocoupler composite cable 500, providing the power signal transmitted in the optocoupler composite cable 500 to the data acquisition optical module 100.

[0131] In some embodiments, the vehicle-mounted optical communication system 1000 may include a composite connector 600. One end of the composite connector 600 is connected to an optical-electric composite cable 500, and the other end is connected to a wire 610 and an optical fiber 620. The optical fiber 620 is used to transmit optical signals, and the wire 610 is used to transmit power signals.

[0132] In some embodiments, one end of the optical fiber 620 is optically connected to the optical-electric composite cable 500 via a composite connector 600, so the optical signal transmitted by the optical-electric composite cable 500 is transmitted externally via the optical fiber 620. One end of the wire 610 receives a power signal, and the other end is electrically connected to the optical-electric composite cable 500 via the composite connector 600, so the power signal is transmitted to the optical-electric composite cable 500 via the wire 610, and then supplies power externally via the optical-electric composite cable 500.

[0133] In some embodiments, the optical fiber 620 is used to connect the optoelectronic composite cable 500 and the optical signal data processing device 200. The optical signal transmitted in the optoelectronic composite cable 500 is then transmitted to the optical signal data processing device 200 via the optical fiber 620. The wire 610 is electrically connected to the vehicle-mounted power supply device. The power signal is then transmitted to the optoelectronic composite cable 500 via the wire 610. The optoelectronic composite cable 500 transmits the power signal to the data acquisition optical module 100, supplying power to the data acquisition optical module 100.

[0134] In some embodiments, multiple sensors 120 are respectively installed at the front of the vehicle, parking space, and both sides of the vehicle body. One of the sensors 120 can be integrated into a corresponding data acquisition optical module 100. When setting up multi-channel sensors 120, a beam splitter 300 is provided at the transmission end of the multi-channel optical fiber 620. One end of the beam splitter 300 is connected to the optical fiber 620, and the other end is connected to the optical signal data processing device 200, so that multiple vehicle-mounted sensors 120 correspond to one optical signal data processing device 200.

[0135] Figure 2A This is a partial structural diagram of a vehicle-mounted optical communication system according to some embodiments. Figure 2A As shown, in some embodiments, the data acquisition optical module 100 includes an optoelectronic composite interface 140. The optoelectronic composite interface 140 is used to achieve external coupling connection of the data acquisition optical module 100 to transmit the optical signal generated by the data acquisition optical module 100 externally. The optoelectronic composite interface 140 is fixed to the surface of the circuit board 110, and one end of the optical transceiver assembly 130 extends into the optoelectronic composite interface 140 to guide the optical signal generated by the optical transceiver assembly 130 into the optoelectronic composite interface 140.

[0136] In some embodiments, the optoelectronic composite interface 140 is fixed to the end of the circuit board 110. The optoelectronic connector assembly 400 is connected to the optoelectronic composite cable 500, and the optoelectronic connector assembly 400 is inserted into the optoelectronic composite interface 140 to establish an optoelectronic connection between the data acquisition optical module 100 and the optoelectronic composite cable 500.

[0137] In some embodiments, the optocoupler assembly 400 integrates an optical fiber adapter for connecting the optical fiber in the optocoupler composite cable 500. The optical fiber adapter in the data acquisition optical module 100 is connected to the optical fiber adapter in the optocoupler assembly 400, thereby achieving an optical connection between the optical fiber inside the data acquisition optical module 100 and the optical fiber in the optocoupler composite cable 500 to transmit optical signals.

[0138] In some embodiments, the optoelectronic connector assembly 400 integrates a cable connection terminal for electrically connecting the cable in the optoelectronic composite cable 500. Simultaneously, the cable connection terminal is electrically connected to the data acquisition optical module 100, establishing an electrical connection between the optoelectronic composite cable 500 and the data acquisition optical module 100, thereby providing the power signal transmitted in the optoelectronic composite cable 500 to the data acquisition optical module 100.

[0139] Figure 2B This is a partial breakdown structure of a vehicle-mounted optical communication system according to some embodiments. Figure 1 , Figure 2C This is a partial exploded view of a vehicle-mounted optical communication system according to some embodiments, as shown in Figure 2. Figure 2B and Figure 2C As shown, in some embodiments, the data acquisition optical module 100 includes a first fiber optic adapter 134. The optocoupler assembly 400 includes a second fiber optic adapter. The first fiber optic adapter 134 connects to the internal optical fiber of the data acquisition optical module 100, and the second fiber optic adapter connects to the optical cable in the optocoupler composite cable 500.

[0140] In some embodiments, the optoelectronic composite interface 140 has a first opening 141 at one end and a second opening 142 at the other end. The first fiber optic adapter 134 is embedded in the optoelectronic composite interface 140 along the first opening 141 to introduce the optical signal output by the optical transceiver component 130 into the optoelectronic composite interface 140.

[0141] In some embodiments, the optocoupler assembly 400 is embedded in the optocoupler composite interface 140 along the second opening 142. The second fiber optic adapter in the optocoupler assembly 400 is optically coupled to the first fiber optic adapter 134 to realize the optical connection between the optocoupler composite cable 500 and the data acquisition optical module 100.

[0142] Figure 3A This is a structural diagram of a data acquisition optical module according to some embodiments. Figure 3B This is an exploded view of a data acquisition optical module according to some embodiments. For example... Figure 3A and Figure 3B As shown, in some embodiments, the data acquisition optical module 100 is mainly used to acquire electrical signals for analysis and processing by the on-board main processing device 2000, so as to realize real-time perception of the vehicle's surrounding environment.

[0143] In some embodiments, the data acquisition optical module 100 includes a circuit board 110. The circuit board 110 includes circuit traces, electronic components, and chips, etc., and the electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), media access controllers (MAC) chips, physical layer chips (PHY) chips, etc.

[0144] In some embodiments, the data acquisition optical module 100 may include a sensor 120. The sensor 120 is fixed to the surface of the circuit board 110. The sensor 120 can identify the environment surrounding the vehicle and obtain information such as road conditions, vehicle position, and obstacles, converting this information into electrical signals, which can be image data or video data. The sensor 120 is electrically connected to the circuit board 110 to transmit the acquired electrical signal data to the circuit board 110. Exemplarily, the sensor 120 may include a camera to acquire image data or video data.

[0145] In some embodiments, the data acquisition optical module 100 may include an optical transceiver component 130. The optical transceiver component 130 is physically separated from the circuit board 110, and then electrically connected to the circuit board 110 via a flexible circuit board 130a. The optical transceiver component 130 is configured to transmit and receive optical signals. The optical transceiver component 130 converts electrical signals acquired by the sensor 120 into optical signals for signal transmission; or converts received optical signals into electrical signals to receive control signals.

[0146] In some embodiments, the data acquisition optical module 100 may include a flexible circuit board 130a. One end of the flexible circuit board 130a is connected to the circuit board 110, and the other end is connected to the optical transceiver assembly 130, thereby establishing an electrical connection between the circuit board 110 and the optical transceiver assembly 130. The electrical signals transmitted on the circuit board 110 are transmitted to the optical transceiver assembly 130 via the flexible circuit board 130a. The optical transceiver assembly 130 receives the electrical signals from the flexible circuit board 130a and converts them into optical signals.

[0147] In some embodiments, the data acquisition optical module 100 may include an optoelectronic composite interface 140. The optoelectronic composite interface 140 is fixed to the surface of the circuit board 110. The optoelectronic composite interface 140 is adapted to and connected to the optoelectronic connector assembly 400. Exemplarily, the two are connected by a plug-in method. Within the optoelectronic composite interface 140, the second fiber optic adapter in the optoelectronic connector assembly 400 is optically coupled to the first fiber optic adapter 134, and the optical signal output from the optical transceiver assembly 130 is connected to the optical cable in the optoelectronic composite cable 500. Within the optoelectronic composite interface 140, the cable connection terminal integrated inside the optoelectronic connector assembly 400 is electrically connected to the circuit board 110, and the power signal transmitted in the optoelectronic composite cable 500 is powered through traces on the surface of the circuit board 110.

[0148] In some embodiments, the sensor 120 is disposed on the second surface of the circuit board 110. The flexible circuit board 130a, the optical transceiver assembly 130, and the optoelectronic composite interface 140 are disposed on the first surface of the circuit board 110, thus fully utilizing the space of the circuit board 110, avoiding spatial conflicts between components, optimizing spatial layout, and facilitating miniaturization. Furthermore, since the flexible circuit board 130a and the optical transceiver assembly 130 generate electromagnetic noise, disposing of the sensor 120 on a different surface reduces interference from electromagnetic noise on the first surface, improving the data acquisition accuracy of the sensor 120. Since the optical transceiver assembly 130 generates significant heat during operation, disposing of the sensor 120 on a different surface reduces the impact of heat on the sensor 120, improving the data acquisition accuracy of the sensor 120.

[0149] In some embodiments, the data acquisition optical module 100 may include a MAC chip 150. The MAC chip 150 is disposed on the surface of the circuit board 110. The MAC chip 150 is electrically connected to the circuit board 110.

[0150] In some embodiments, the data acquisition optical module 100 may include a driver chip 160. The driver chip 160 is disposed on the surface of the circuit board 110. The driver chip 160 is electrically connected to the circuit board 110. The electrical signal output by the sensor 120 is converted by the MAC chip 150 and then transmitted to the driver chip 160.

[0151] In some embodiments, the electrical signal collected by the sensor 120 is transmitted to the circuit board 110, and then processed by the MAC chip 150 and the driver chip 160 on the surface of the circuit board 110. The processed electrical signal is then transmitted to the optical transceiver assembly 130 via the flexible circuit board 130a. The optical transceiver assembly 130 converts the received electrical signal into an optical signal and transmits the data collected by the sensor 120 in the form of light.

[0152] In some embodiments, the MAC chip 150 receives electrical signal data collected by multiple sensors 120 and encapsulates the raw electrical signals collected by each sensor 120, including adding frame header information such as source address and destination address to the raw electrical signals to ensure that the data is transmitted correctly in the network. At the same time, the MAC chip 150 can allocate bandwidth to different sensors 120 to avoid frame loss during congestion.

[0153] In some embodiments, the driver chip 160 provides a drive current to the optical transceiver component 130 to drive the optical transceiver component 130 to convert electrical signals into optical signals. Simultaneously, since the electrical signals acquired by the sensor 120 are relatively weak, the driver chip 160 can amplify the amplitude of the electrical signals, facilitating the optical transceiver component 130 to effectively convert them into optical signals. Furthermore, the driver chip 160 can provide a synchronization clock for the multiple sensors 120, preventing sampling timing errors in the sensors 120.

[0154] Figure 4A This is a schematic diagram of a sensor and circuit board assembly according to some embodiments. Figure 4B This is an exploded view of a sensor and circuit board assembly according to some embodiments. Figure 4A and Figure 4B As shown, in some embodiments, the sensor 120 and the optoelectronic composite interface 140 are located on different surfaces of the circuit board 110. The optoelectronic composite interface 140 is located on the first surface of the circuit board 110, and the sensor 120 is located on the second surface of the circuit board 110.

[0155] In some embodiments, the sensor 120 is electrically connected to the circuit board 110 to transmit the electrical signal output by the sensor 120 to the circuit board 110, and then to the optical transceiver assembly 130 via the circuit board 110. The optical transceiver assembly 130 converts the electrical signal into an optical signal for transmission via light.

[0156] In some embodiments, a first electrical connector 121 is formed on the end face of the sensor 120 facing the circuit board 110. A second electrical connector 112 is formed on the surface of the circuit board 110. The first electrical connector 121 is electrically connected to the second electrical connector 112, and the second electrical connector 112 is electrically connected to the circuit board 110, thereby electrically connecting the sensor 120 to the circuit board 110. Exemplarily, the first electrical connector 121 and the second electrical connector 112 are electrically mated together to achieve electrical connection between them.

[0157] Figure 4C This is a schematic diagram of the electrical connection between a sensor and a circuit board according to some embodiments. Figure 4D This is an exploded schematic diagram of the electrical connection between a sensor and a circuit board according to some embodiments. Figure 4C and Figure 4DAs shown, in some embodiments, the first electrical connector 121 and the second electrical connector 112 are electrically connected to achieve an electrical connection between the sensor 120 and the circuit board 110. The first electrical connector 121 serves as an output interface, and the second electrical connector 112 serves as an input interface; electrical contact between the two is ensured through a mating method.

[0158] In some embodiments, the first electrical connector 121 includes two rows of electrical connection terminals 122. The second electrical connector 112 includes an electrical connection groove 1121 and pins 1122 located on the outer walls of both sides of the electrical connection groove. One end of the pin 1122 is electrically connected to the wall of the electrical connection groove 1121, and the other end is electrically connected to the surface of the circuit board 110.

[0159] In some embodiments, when the first electrical connector 121 and the second electrical connector 112 are electrically connected, the electrical connection terminal 122 is inserted into the electrical connection groove 1121 and electrically connected to the electrical connection groove 1121, thereby realizing the electrical connection between the electrical connection terminal 122 and the pin 1122, and thus realizing the electrical connection between the first electrical connector 121 and the second electrical connector 112.

[0160] In some embodiments, the first electrical connector 121 is larger than the second electrical connector 112. The first electrical connector 121 serves as a socket, and the second electrical connector 112 serves as a plug; the two are plugged together to achieve an electrical connection.

[0161] In some embodiments, the width between the two sidewalls of the first electrical connector 121 is greater than the width between the two sidewalls of the second electrical connector 112, and the first electrical connector 121 can wrap around the second electrical connector 112, thereby inserting the electrical connection terminal 122 into the electrical connection groove 1121.

[0162] Figure 5A This is a structural diagram of a sensor according to some embodiments. Figure 5B This is a cross-sectional structural diagram of a sensor according to some embodiments. Figure 5C This is a partial cross-sectional structural diagram of a sensor according to some embodiments. For example... Figures 5A-5C As shown, in some embodiments, a first electrical connector 121 is formed on the end face of the sensor 120 facing the circuit board 110. The first electrical connector 121 has a socket for the second electrical connector 112 to be inserted, thereby achieving electrical connection between the two.

[0163] In some embodiments, the first electrical connector 121 includes two rows of electrical connection terminals 122. The electrical connection terminals 122 are inclined toward the sidewall of the first electrical connector 121 so that the ends of the electrical connection terminals 122 can contact the inner wall of the electrical connection groove 1121, thereby realizing the electrical connection between the electrical connection terminals 122 and the second electrical connector 112.

[0164] Figure 6AThis is a structural diagram of an optical transceiver component according to some embodiments. Figure 6B This is an exploded view of an optical transceiver assembly according to some embodiments. Figure 6A and Figure 6B As shown, in some embodiments, the optical transceiver component 130 may be in a TO package.

[0165] In some embodiments, the optical transceiver assembly 130 may include a round-square tube 131. Each sidewall of the round-square tube 131 has an opening.

[0166] In some embodiments, the optical transceiver assembly 130 may include an optical emitting component 132. The optical emitting component 132 is embedded in the opening of the round-square tube 131.

[0167] In some embodiments, the optical transceiver assembly 130 may include an optical receiving component 133. The optical receiving component 133 is embedded within the opening of the round-square tube 131. The optical receiving component 133 and the optical emitting component 132 are located on adjacent sidewalls of the round-square tube 131.

[0168] In some embodiments, the optical transceiver assembly 130 may include a first fiber optic adapter 134. The first fiber optic adapter 134 is embedded in the opening of the round-square tube 131. The first fiber optic adapter 134 and the transmitting component 132 are located on opposite sidewalls of the round-square tube 131.

[0169] In some embodiments, the light emitting component 132 is electrically connected to the circuit board 110. Electrical signal data acquired by the sensor 120 is transmitted via the circuit board 110 to the light emitting component 132, which converts the electrical signal into an optical signal. The optical signal is output along the first fiber optic adapter 134 and transmitted to the optical signal data processing device 200. The optical signal data processing device 200 receives the optical signal from the data acquisition optical module 100 and converts it into an electrical signal suitable for processing by the vehicle-mounted main processing device 2000.

[0170] In some embodiments, the optical receiving component 133 is electrically connected to the circuit board 110. The optical receiving component 133 converts the optical signal transmitted along the first fiber optic adapter 134 into an electrical signal, and the converted electrical signal is transmitted along the circuit board 110. Exemplarily, control signals or control commands issued by the vehicle main processing device 2000 are transmitted in the form of optical signals to the first fiber optic adapter 134 and then to the optical receiving component 133. The optical receiving component 133 converts the received optical signal into an electrical signal, and the electrical signal is transmitted to the sensor 120 via the circuit board 110.

[0171] In some embodiments, the light emitting component 132 and the light receiving component 133 can be electrically connected to the surface of the circuit board 110 via flexible circuit boards. One flexible circuit board has one end electrically connected to the light emitting component 132 and the other end electrically connected to the surface of the circuit board 110. Another flexible circuit board has one end electrically connected to the light receiving component 133 and the other end electrically connected to the surface of the circuit board 110.

[0172] Figure 6C This is a structural diagram of the internal structure of an optical transceiver assembly according to some embodiments. Figure 6C As shown, in some embodiments, the light emitting component 132 and the light receiving component 133 are respectively fixed to the side wall of the round-square tube 131.

[0173] In some embodiments, an optical component, including a filter 135, is disposed within the inner cavity of the round-square tube 131. The filter 135 is located at the intersection of the emission optical path of the light emitting component 132 and the reception optical path of the light receiving component 133. The filter 135 is tilted and gradually tilts towards the first fiber optic adapter 134 along the light emission direction of the light emitting component 132. The filter 135 is configured to transmit the optical signal generated by the light emitting component 132 and reflect the optical signal input to the light receiving component 133 via the first fiber optic adapter 134.

[0174] In some embodiments, after the light signal emitted by the light emitting component 132 enters the round-square tube 131, the light signal directly passes through the filter 135 and enters the first optical fiber adapter 134 to realize the transmission of the light signal.

[0175] In some embodiments, the optical signal output along the first optical fiber adapter 134 is incident on the surface of the filter 135 and reflected by the filter 135 into the light receiving component 133.

[0176] In some embodiments, to prevent reflected light from returning to the optical emitting component 132 at the fiber end face, the optical components within the circular-square tube 131 further include an optical isolator 136, located between the optical emitting component 132 and the filter 135. The optical signal generated by the optical emitting component 132 can directly pass through the optical isolator 136 and the filter 135, thereby entering the first fiber optic adapter 134. The optical signal reflected back from the fiber end face can pass through the filter 135 but cannot pass through the optical isolator 136, thus preventing it from entering the optical emitting component 132 and ensuring the light emission quality of the optical emitting component 132.

[0177] In some embodiments, since the filter 135 is a semi-transparent and semi-reflective film, when the light signal generated by the light emitting component 132 passes through the filter 135, part of the light signal is reflected at the filter 135, and the reflected light signal is diffusely reflected in the round-square tube 131, forming crosstalk light.

[0178] In some embodiments, to avoid signal crosstalk caused by crosstalk light, the optical components within the round-square tube 131 further include a light-absorbing sheet 137, which is disposed on the reflected light path of the light signal emitted by the light emitting component 132 after being reflected by the filter 135. The light-absorbing sheet 137 can absorb the light signal reflected at the filter 135, thereby reducing the formation of crosstalk light.

[0179] In some embodiments, the light-absorbing sheet 137 is fixed to the surface of the mounting base 138. The mounting base 138 is configured to support the light-absorbing sheet 137. The mounting base 138 is embedded in the opening of the round-square tube 131.

[0180] In some embodiments, another form of optical transceiver component is also provided, namely, the data acquisition optical module 100 may include an optical transceiver component 180.

[0181] In some embodiments, the optical transceiver assembly 180 may include an optical receiving component 183 and an optical emitting component 182, which are physically separated from the circuit board 110 and then electrically connected to the circuit board 110 via corresponding flexible circuit boards or electrical connectors. The optical receiving component 183 is used to receive optical signals, and the optical emitting component 182 is used to generate optical signals.

[0182] In some embodiments, at least one of the light receiving component 183 and the light emitting component 182 is located on the side of the circuit board 110 away from the gold finger 301.

[0183] In some embodiments, at least one of the light receiving component 183 and the light emitting component 182 may be directly disposed on the circuit board 110. For example, at least one of the light emitting component 182 or the light receiving component 183 may be disposed on the surface of the circuit board 110 or on the side of the circuit board 110.

[0184] In some embodiments, the optical transceiver assembly 180 may include a first fiber optic adapter 184 located within the optical port.

[0185] In some embodiments, the optical transceiver assembly 180 further includes a rectangular tube 181, which can connect to the optical receiving component 183, the optical transmitting component 182, and the first fiber optic adapter 184. Optical devices, such as lenses or filters, may be disposed within the rectangular tube 181. These optical devices are used to change the transmission direction of the received and transmitted optical signals.

[0186] Figure 7A This is a structural diagram of another optical transceiver assembly according to some embodiments. Figure 7B This is an exploded view of another optical transceiver assembly according to some embodiments. Figure 7A and Figure 7BAs shown, in some embodiments, the optical transceiver assembly 180 may include a first connecting sleeve 188. The first connecting sleeve 188 is used to connect the first fiber optic adapter 184 and the round-square tube 181 to facilitate the connection of the first fiber optic adapter 184 and the round-square tube 181 and to facilitate the adjustment of the relative positions of the first fiber optic adapter 184 and the round-square tube 181. Exemplarily, one end of the first connecting sleeve 188 is embedded and connected to the first fiber optic adapter 184, and the other end of the first connecting sleeve 188 is connected to the end face of one end of the round-square tube 181.

[0187] In some embodiments, the optical transceiver assembly 180 may include a second connecting sleeve 189. The second connecting sleeve 189 is used to connect the round-square tube 181 and the optical emitting component 182, facilitating the connection between the optical emitting component 182 and the round-square tube 181, and facilitating the adjustment of the relative position of the first fiber optic adapter 184 and the round-square tube 181, thereby facilitating the adjustment of the coupling efficiency of the optical emitting component 182 generating the optical emission signal to the round-square tube 181. Exemplarily, one end of the second connecting sleeve 189 is connected to the end face of the other end of the round-square tube 181, and the other end of the second connecting sleeve 189 is sleeved on the top of the optical emitting component 182.

[0188] Figure 7C This is a cross-sectional view of another optical transceiver assembly according to some embodiments. Figure 7C As shown, in some embodiments, the optical transceiver assembly 180 may include a first lens 185 located within the circular-square tube 181. Exemplarily, the first lens 185 is located near the first fiber optic adapter 184. The first lens 185 can collimate received light signals and focus emitted light signals.

[0189] In some embodiments, the optical transceiver assembly 180 may include a first filter 186 located within the circular-square tube 181. The first filter 186 may be located on the side of the first lens 185. The first filter 186 can transmit the light emission signal generated by the light emitting component 182, and the first filter 186 can reflect the light receiving signal to the light receiving component 183.

[0190] In some embodiments, the optical transceiver assembly 180 may include a second filter 187 located between the optical receiving component 183 and the first filter 186 and in the reflected light path of the second filter 187. The second filter 187 is used to filter the light signal reflected by the first filter 186, so as to improve the quality of the light signal received by the optical receiving component 183.

[0191] In some embodiments, the first fiber optic adapter 184 includes an adapter body 1841 and a fiber optic ferrule 1842. One end of the fiber optic ferrule 1842 is embedded in and connected to the adapter body 1841, and the other end of the fiber optic ferrule 1842 is located within a first connecting sleeve 188. The fiber optic ferrule 1842 is used to transmit optical transmission signals and optical reception signals, facilitating the coupling of optical transmission signals into the optical fiber and the transmission of optical reception signals output through the optical fiber to the round-square tube body 181.

[0192] In some embodiments, the fiber core in the fiber ferrule 1842 can be a multimode fiber core, ensuring that the diameter of the light spot coupled into the multimode fiber core is comparable to the diameter of the multimode fiber core, thereby ensuring that the light energy distribution of the light emission signal and other signals in the multimode fiber core is more uniform, which is more conducive to back-end beam splitting applications.

[0193] Figure 8A A structure of a round-square tube according to some embodiments Figure 1 , Figure 8B This is a structural diagram of a round-square tube according to some embodiments. Figure 8C This is a cross-sectional view of a round-square tube according to some embodiments. Figure 8D This is a diagram illustrating the usage of a round-square tube according to some embodiments. Figures 8A-8D As shown, in some embodiments, a receiving cavity 1811 is formed inside the round-square tube 181, and a first filter 186 and a second filter 187 are disposed inside the receiving cavity 1811.

[0194] In some embodiments, a first mounting surface 1812 is formed on the edge of the receiving cavity 1811, and the first mounting surface 1812 supports and connects the first filter 186. The first mounting surface 1812 is inclined, which facilitates the placement of the first filter 186 within the receiving cavity 1811.

[0195] In some embodiments, a second mounting surface 1813 is formed on the edge of the receiving cavity 1811, and the second mounting surface 1813 supports and connects the second filter 187. The second mounting surface 1813 facilitates fixing the second filter 187.

[0196] In some embodiments, the round-square tube 181 has a first mounting hole 1814 that extends through one end of the round-square tube 181 and connects to the receiving cavity 1811. The first lens 185 is embedded in the first mounting hole 1814.

[0197] In some embodiments, a second mounting hole 1815 is formed on the round-square tube 181, the second mounting hole 1815 penetrates the side of the round-square tube 181, and the second mounting hole 1815 communicates with the receiving cavity 1811. The second mounting hole 1815 is used to embed and connect the optical receiving component 183.

[0198] In some embodiments, a mounting boss 1816 is formed at the other end of the round-square tube 181, protruding from the other end of the round-square tube 181. A first through hole 1817 is formed on the mounting boss 1816, which communicates with the receiving cavity 1811. The end face of the mounting boss 1816 is connected to one end of the second connecting sleeve 189, so as to connect the second connecting sleeve 189 through the mounting boss 1816, so as to realize the adjustment of the light emitting component 182 in the width and height directions of the round-square tube 181.

[0199] Figure 9A This is a structural diagram of a light emitting component according to some embodiments. Figure 9B Disassembly of a light emitting component according to some embodiments Figure 1 , Figure 9C This is an exploded view of a light emitting component according to some embodiments. Figure 9D 3 is an exploded view of a light emitting component according to some embodiments. Figure 9E This is a partial view of a light emitting component according to some embodiments. Figure 9F This is a cross-sectional view of a light-emitting component according to some embodiments. Figures 9A-9F As shown, in some embodiments, the light emitting component 182 includes a socket 1821 and a cap 1822. The cap 1822 covers the top of the socket 1821 and is fixedly connected to the socket 1821. The socket 1821 and the cap 1822 can form a relatively enclosed space, within which a laser chip or other device can be disposed. Pins 1823 are formed on the socket 1821, and the pins 1823 are used for electrical connection to the first flexible circuit board 310 or the circuit board of a host computer. Multiple pins 1823 are formed on the socket 1821, with some pins 1823 penetrating the socket 1821, causing the top of the pin 1823 to protrude from the top of the socket 1821. The laser chip or other device can be wire-connected to the pins 1823. Exemplarily, the pins 1823 include high-frequency pins used for transmitting high-frequency signals.

[0200] In some embodiments, the light emitting component 182 may include a laser chip 1824. A socket 1821 supports and connects to the laser chip 1824, and the laser chip 1824 can be wire-connected to pins 1823. The laser chip 1824 is a Vertical Cavity Surface Emitting Laser (VCSEL) laser chip, with its emitting surface located on its top surface. The bottom surface of the laser chip 1824 is connected to the socket 1821, and its emitting surface is located above the bottom surface of the laser chip 1824. VCSEL laser chips have a larger focal spot diameter, a wider divergence angle, and a lower focal power density. VCSEL laser chips are typically only used in COB-packaged optical modules, which are mostly used in relatively stable environments, such as data centers.

[0201] In some conventional optical emitting components 182, the laser chip mainly uses distributed feedback (DFB) laser chips. DFB laser chips have concentrated energy distribution, smaller focal spot diameter, narrow divergence angle, and higher focal power density, making them suitable for single-mode fiber transmission. However, they have high requirements for optical coupling accuracy and are costly to manufacture.

[0202] In some embodiments, the VCSEL laser chip is combined with a socket 1821 and a cap 1822 to encapsulate the VCSEL laser chip within the socket 1821 and cap 1822, thereby improving the VCSEL laser chip's environmental adaptability. Furthermore, the communication distance of automotive optical communication is typically no greater than 20m, making the VCSEL laser chip suitable for automotive optical communication applications. Additionally, automotive optical communication uses multimode fiber, and the high power and large spot size of the VCSEL laser chip make the optical path of automotive optical communication more stable, significantly reducing the problem of optical power drop and facilitating the meeting of automotive-grade reliability requirements. Therefore, since the optical transceiver component 180 is suitable for automotive optical communication, the optical module containing the optical transceiver component 180 is the data acquisition optical module 110.

[0203] In some embodiments, the light emitting component 182 may include a first mounting base 1825 disposed on the tube socket 1821. The bottom of the first mounting base 1825 is connected to the tube socket 1821, and the top of the first mounting base 1825 supports and connects to the laser chip 1824. The first mounting base 1825 can raise the laser chip 1824 to facilitate electrical connection between the laser chip 1824 and the corresponding pin 1823.

[0204] In some embodiments, the first mounting base 1825 is a ceramic substrate, and pads are formed on the top surface of the first mounting base 1825. A laser chip 1824 is mounted on the top surface of the first mounting base 1825, and the laser chip 1824 is wire-connected to corresponding pads on the top surface of the first mounting base 1825. The pads on the top surface of the first mounting base 1825 are wire-connected to corresponding pins 1823. The first mounting base 1825 can isolate the laser chip 1824 from the ground plane on the socket 1821.

[0205] In some embodiments, a first high-frequency pin 18231 and a second high-frequency pin 18232 are formed on the socket 1821. The first high-frequency pin 18231 and the second high-frequency pin 18232 are used to electrically connect to the laser chip 1824 to input a high-frequency driving signal to the laser chip 1824, so that the laser chip 1824 generates a light emission signal based on the high-frequency driving signal.

[0206] In some embodiments, the first mounting base 1825 is located between the first high-frequency pin 18231 and the second high-frequency pin 18232. A first pad 18251 and a second pad 18252 are formed on the top surface of the first mounting base 1825. The first pad 18251 is wire-connected to the first high-frequency pin 18231, and the second pad 18252 is wire-connected to the second high-frequency pin 18232. Exemplarily, the first pad 18251 and the second pad 18252 are located at one edge of the top surface of the first mounting base 1825, and the laser chip 1824 is mounted on the other side of the top surface of the first mounting base 1825.

[0207] In some embodiments, the light emitting component 182 may include a second lens 1826 located above the laser chip 1824. The second lens 1826 is used to collimate the light emission signal to converge the light emission signal into parallel light.

[0208] In some embodiments, the second lens 1826 combined with the first lens 185 can effectively improve the coupling efficiency of the optical signal in the optical transceiver assembly 180, making it easier to adapt to automotive applications, making the optical path more stable, reducing the drop in optical power of the optical signal, and meeting automotive reliability requirements.

[0209] In some embodiments, the light emitting component 182 may include a mounting post 1827 located on the side of the laser chip 1824. The mounting post 1827 supports and connects to a second lens 1826, facilitating the placement of the second lens 1826 above the laser chip 1824. Exemplarily, the side of the mounting post 1827 is connected to the second lens 1826. The mounting post 1827 may be a ceramic post, with its bottom connected to the top surface of the tube base 1821 and its side connected to the side of the second lens 1826. The ceramic post can insulate heat, reducing the heat load on the second lens 1826. Of course, in some embodiments, the mounting post 1827 may be integrally formed with the tube base 1821.

[0210] In some embodiments, the light emitting component 182 may include a backlight detector 1828. A socket 1821 may support and connect the backlight detector 1828, which can be used to detect the emitted light power of the laser chip 1824. Exemplarily, the backlight detector 1828 receives the backlight or partially reflected light emission signal from the laser chip 1824 to detect the emitted light power of the laser chip 1824. The backlight detector 1828 may be electrically connected to the socket 1821.

[0211] In some embodiments, the light emitting component 182 may include a second mounting base 1829 disposed on the tube socket 1821. The top of the second mounting base 1829 is connected to the tube socket 1821, and the top of the second mounting base 1829 supports and connects to the backlight detector 1828. The second mounting base 1829 facilitates electrical connection between the backlight detector 1828 and the tube socket 1821. The second mounting base 1829 may be a ceramic substrate.

[0212] In some embodiments, an output pin 18233 is formed on the socket 1821, and the output pin 18233 is located on the side of the second mounting base 1829. A metal layer 18291 is disposed on the top surface of the second mounting base 1829, and a backlight detector 1828 is mounted on the metal layer 18291. The cathode of the backlight detector 1828 is electrically connected to the metal layer 18291. The metal layer 18291 is wired to the output pin 18233, and the anode of the backlight detector 1828 is electrically connected to the top surface of the socket 1821, which facilitates the provision of a reverse bias voltage to the backlight detector 1828, thereby facilitating the output of a detection current by the backlight detector 1828.

[0213] In some embodiments, the cap 1822 includes a cap body 18221 and a light window 18222. The cap body 18221 has a base 1821, and the top of the cap body 18221 is connected to the light window 18222. Exemplarily, the top of the cap body 18221 is tilted to facilitate the tilted placement of the light window 18222 on top of the cap body 18221. The light emission signal generated by the laser chip 1824 is transmitted to the light window 18222; part of the light emission signal is refracted through the light window 18222, and part of the light emission signal is reflected by the light window 18222. The light signal reflected by the light window 18222 is transmitted to the backlight detector 1828 so that the backlight detector 1828 can receive the light emission signal.

[0214] In some embodiments, a support platform 18223 is formed on the cap body 18221, and the top of the cap body 18221 is recessed to form the support platform 18223, which supports the connecting light window 18222. Exemplarily, an inclined surface 18224 is formed on the top of the support platform 18223, which supports the connecting light window 18222, facilitating the inclined setting of the light window 18222.

[0215] In some embodiments, the light emission signal generated by the laser chip 1824 is transmitted to the second lens 1826, collimated by the second lens 1826, and then transmitted to the optical window 18222. Part of the light emission signal is transmitted into the circular tube 181 through the optical window 18222, and part of the light emission signal is reflected by the optical window 18222 towards the backlight detector 1828.

[0216] Figure 9G This is a schematic diagram illustrating the assembly of a light-emitting component and a second connecting sleeve according to some embodiments. Figure 9G As shown, in some embodiments, the bottom dimension of the cap body 18221 is smaller than the dimension of the seat 1821, and the other end of the second connecting sleeve 189 is connected to the seat 1821, with the second connecting sleeve 189 covering the outside of the cap 1822. Exemplarily, the other end of the second connecting sleeve 189 is connected to the top surface of the seat 1821.

[0217] In some embodiments, a connecting plate 1891 is formed at one end of the second connecting sleeve 189, and the connecting plate 1891 is located at the light-emitting end of the cap 1822. The connecting plate 1891 facilitates the connection between the second connecting sleeve 189 and the round-square tube 181 and facilitates the adjustment of the positions of the second connecting sleeve 189 and the round-square tube 181, thereby ensuring the coupling efficiency of the light emission signal to the round-square tube 181 and ensuring that the light power intensity of the light emission signal transmitted to the round-square tube 181 meets the preset requirements. A second through hole 1892 is formed on the connecting plate 1891, which is used to transmit the light emission signal. The second through hole 1892 can communicate with the first through hole 1817 to facilitate the transmission of the light emission signal to the round-square tube 181.

[0218] The following embodiments use the example of a data acquisition optical module 100 that may include an optical transceiver component 130 for illustrative purposes.

[0219] Figure 10A This is a cross-sectional structural diagram of a vehicle-mounted optical communication system layout according to some embodiments. For example... Figure 10A As shown, in some embodiments, the inner cavity of the optoelectronic composite interface 140 is hollow, and the first fiber optic adapter 134 and the optoelectronic connector assembly 400 are respectively inserted from both ends of the optoelectronic composite interface 140, and the two are connected in the inner cavity of the optoelectronic composite interface 140.

[0220] In some embodiments, the first fiber optic adapter 134 and the second fiber optic adapter in the opto-connector assembly 400 are connected in the cavity of the opto-composite interface 140. Then, the optical signal input or output of the first fiber optic adapter 134 establishes an optical connection with the opto-connector assembly 400, thereby establishing an optical connection between the first fiber optic adapter 134 and the opto-composite cable 500 for optical signal transmission.

[0221] Figure 10B This is a cross-sectional structural diagram of a data acquisition optical module according to some embodiments. Figure 10C This is a partial cross-sectional view of a data acquisition optical module according to some embodiments. Figure 10B and Figure 10C As shown, in some embodiments, the optoelectronic composite interface 140 is fixed to the surface of the circuit board 110, and the circuit board 110 supports the optoelectronic composite interface 140. The optoelectronic composite interface 140 is located at one end of the circuit board 110.

[0222] In some embodiments, a through hole 111 is formed on the surface of the circuit board 110. A locking portion 143 is formed at the bottom of the optoelectronic composite interface 140. The locking portion 143 extends toward the circuit board 110 and is inserted into the through hole 111, thereby fixing the optoelectronic composite interface 140 to the surface of the circuit board 110.

[0223] In some embodiments, the engaging portion 143 includes two latches 1431 disposed opposite to each other. The latches 1431 have a certain elasticity and have protrusions 1432. By pinching the two latches 1431, they undergo elastic deformation, causing the latches 1431 to slide into the through hole 111 and extend upward to the surface of the circuit board 110. The protrusions 1432 are engaged on the surface of the circuit board 110, thereby inserting the optoelectronic composite interface 140 into the through hole 111, preventing the optoelectronic composite interface 140 from falling off, and achieving a fixed connection between the optoelectronic composite interface 140 and the circuit board 110.

[0224] In some embodiments, the optical transceiver assembly 130 and the optoelectronic composite interface 140 are located on a first surface of the circuit board 110. The sensor 120 is located on a second surface of the circuit board 110.

[0225] In some embodiments, the data acquisition optical module 100 may include a positive electrode contact 191 and a negative electrode contact 192, which are arranged adjacent to each other.

[0226] In some embodiments, the positive electrode contact 191 is disposed on the inner surface of the optoelectronic composite interface 140, and one end is exposed relative to the optoelectronic composite interface 140 so that the end is electrically connected to the circuit board. Similarly, the negative electrode contact 192 is disposed inside the optoelectronic composite interface 140, and one end is exposed relative to the optoelectronic composite interface 140 so that the end is electrically connected to the circuit board.

[0227] In some embodiments, one end of the positive electrode contact 191 is electrically connected to the circuit board 110, and the other end is electrically connected to the optoelectronic composite cable 500, transmitting the positive power signal transmitted through the optoelectronic composite cable 500 to the circuit board 110. One end of the negative electrode contact 192 is electrically connected to the circuit board 110, and the other end is electrically connected to the optoelectronic composite cable 500, transmitting the negative power signal transmitted through the optoelectronic composite cable 500 to the circuit board 110, thereby providing power to the data acquisition optical module 100. The positive electrode contact 191 and the negative electrode contact 192 can be made of a metal material with good conductivity to ensure high efficiency of power transmission.

[0228] In some embodiments, the positive electrode contact 191 includes a first connecting segment 1911 and a second connecting segment 1912. The second connecting segment 1912 is connected to the first connecting segment 1911. The first connecting segment 1911 extends parallel to the long axis of the inner cavity of the optoelectronic composite interface 140 for external electrical connection. The second connecting segment 1912 extends perpendicular to the long axis of the inner cavity of the optoelectronic composite interface 140 for electrical connection to the circuit board 110. The negative electrode contact 192 is designed similarly.

[0229] In some embodiments, the first connecting segment 1911 is located on the inner surface of the optoelectronic composite interface 140 to electrically connect to the optoelectronic composite cable 500 and receive the positive power signal transmitted by the optoelectronic composite cable 500. The second connecting segment 1912 passes through the optoelectronic composite interface 140 and the circuit board 110, and extends a certain distance beyond the surface of the circuit board 110, thereby electrically connecting to the circuit board 110. Exemplarily, the end of the second connecting segment 1912 extends beyond the surface of the circuit board 110 and is soldered to the circuit board 110 to ensure a strong connection. For example, there is a height difference between the end of the second connecting segment 1912 and the surface of the circuit board 110, and the end of the second connecting segment 1912 is soldered to the surface of the circuit board 110 to achieve electrical connection.

[0230] In some embodiments, the second connecting segment 1912 extends perpendicularly to the surface of the circuit board 110 and is perpendicularly connected to the circuit board 110, thereby reducing the space occupied.

[0231] In some embodiments, the optoelectronic composite interface 140 includes a base plate 144, which is in contact with a circuit board 110. The base plate 144 has a first through hole 1441, and the circuit board 110 has a second through hole 113. The first through hole 1441 and the second through hole 113 are connected. A positive electrode contact 191 passes through the first through hole 1441 and the second through hole 113 in sequence and extends out of the surface of the circuit board 110 to be electrically connected to the circuit board 110.

[0232] Figure 11A This is an exploded view of an optoelectronic composite interface assembly structure according to some embodiments. Figure 11B This is a cross-sectional structural diagram of an optoelectronic composite interface assembly according to some embodiments. Figure 11C This is an exploded cross-sectional view of an optoelectronic composite interface assembly according to some embodiments. Figure 11A-11C As shown, in some embodiments, the optoelectronic composite interface 140 has openings at both ends and a hollow interior. An optoelectronic connection is established between the data acquisition optical module 100 and the optoelectronic composite cable 500 within the interior of the optoelectronic composite interface 140. The first fiber optic adapter 134 and the optoelectronic connector assembly 400 are inserted from the openings at both ends of the optoelectronic composite interface 140, and are connected inside the optoelectronic composite interface 140.

[0233] In some embodiments, the optoelectronic composite interface 140 has a first opening 141 at one end and a second opening 142 at the other end. A first fiber optic adapter 134 is inserted into the inner cavity of the optoelectronic composite interface 140 along the first opening 141, and an optoelectronic connector assembly 400 is inserted into the inner cavity of the optoelectronic composite interface 140 along the second opening 142. The first opening 141 matches the first fiber optic adapter 134, ensuring that the first fiber optic adapter 134 can be smoothly inserted and fixed in the inner cavity. The second opening 142 matches the optoelectronic connector assembly 400, ensuring that the optoelectronic connector assembly 400 can be smoothly inserted and fixed in the inner cavity.

[0234] In some embodiments, the optoelectronic composite interface 140 includes a snap-fit ​​member 170. The snap-fit ​​member 170 is used for assembly and connection with the optoelectronic connector assembly 400, fixing the optoelectronic connector assembly 400 within the optoelectronic composite interface 140. Exemplarily, the snap-fit ​​member 170 is engaged with the optoelectronic connector assembly 400.

[0235] In some embodiments, the snap-fit ​​170 is located at one end near the first opening 141 to snap-fit ​​the photoelectric connector assembly 400 inserted along the second opening 142.

[0236] In some embodiments, the latching member 170 includes a first latch 171 and a second latch 172 disposed opposite to each other to latch the photoelectric connector assembly 400. The first latch 171 and the second latch 172 extend in a direction parallel to the insertion direction of the photoelectric connector assembly 400 to engage the photoelectric connector assembly 400 in the insertion direction. The first latch 171 and the second latch 172 deform under external force and return to their original shape after the force is released, thereby achieving engagement.

[0237] In some embodiments, the snap-fit ​​connector 170 includes a limiting portion 174. The limiting portion 174 is located at one end facing the first fiber optic adapter 134, and is used to fix and limit the first fiber optic adapter 134.

[0238] In some embodiments, a clearance through-hole 173 is formed at one end of the limiting portion 174 facing the first fiber optic adapter 134, and the clearance through-hole 173 is formed between the first claw 171 and the second claw 172. The clearance through-hole 173 is used to avoid the first fiber optic adapter 134. The first fiber optic adapter 134 enters into the first opening 141 along the clearance through-hole 173.

[0239] In some embodiments, the positive electrode contact 191 and the negative electrode contact 192 are disposed at one end of the optoelectronic composite interface 140 facing the optoelectronic connector assembly 400. Exemplarily, they are disposed at one end of the base plate 144 near the second opening 142.

[0240] In some embodiments, the positive electrode contact 191 and the negative electrode contact 192 are configured as elastic contacts, and their electrical connection with the photoelectric connector assembly 400 is an elastic contact connection. The elastic design allows the positive electrode contact 191 and the negative electrode contact 192 to adapt to minor unevenness or displacement of the contact surface, ensuring a stable electrical connection, reducing the possibility of poor contact or disconnection, and ensuring the reliability of the electrical connection.

[0241] In some embodiments, in the positive electrode contact 191, a first connecting segment 1911 extends toward the outside of the second opening 142 to make contact with the photoelectric connector assembly 400. A second connecting segment 1912 extends toward the circuit board 110 to make contact with the circuit board 110. Exemplarily, the first connecting segment 1911 extends in a direction parallel to the insertion direction of the photoelectric connector assembly 400, and the second connecting segment 1912 extends in a direction perpendicular to the circuit board 110.

[0242] In some embodiments, the first connecting segment 1911 is located on the inner surface of the optoelectronic composite interface 140 for electrical connection with the optocoupler assembly 400. The second connecting segment 1912 passes through the optoelectronic composite interface 140 and the circuit board 110, and extends a certain distance beyond the surface of the circuit board 110 for electrical connection with the circuit board 110. That is, there is a height difference between the end of the second connecting segment 1912 and the surface of the circuit board 110. The negative electrode contact 192 is designed in the same way.

[0243] In some embodiments, the end of the positive electrode contact 191 that is electrically connected to the photoelectric connector assembly 400 is bent downward to form a first arc-shaped contact surface 1913 to avoid interference when it is connected to the photoelectric connector assembly 400. The end of the negative electrode contact 192 also forms a second arc-shaped contact surface 1923.

[0244] In some embodiments, a first mounting groove 1442 and a second mounting groove 1443 are formed at one end of the base plate 144 near the second opening 142. The first mounting groove 1442 is used to embed the positive electrode contact 191, and the second mounting groove 1443 is used to embed the negative electrode contact 192.

[0245] In some embodiments, the end of the first mounting groove 1442 is formed with a first step 1444 to avoid and guide the positive electrode contact 191 to bend downward to form a first arc-shaped contact surface 1913. The end of the second mounting groove 1443 is formed with a second step 1445 to avoid and guide the second contact 182 to bend downward to form a second arc-shaped contact surface 1923.

[0246] In some embodiments, the first through hole 1441 is connected to the first mounting groove 1442 to guide the positive electrode contact 191 through the first through hole 1441 through the optoelectronic composite interface 140 and the circuit board 110, and to electrically connect with the circuit board 110.

[0247] Figure 12A This is a cross-sectional view of a first fiber optic adapter and optoelectronic composite interface assembly according to some embodiments. Figure 12B This is an exploded view of a first fiber optic adapter and optoelectronic composite interface assembly according to some embodiments. Figure 12A and Figure 12B As shown, in some embodiments, the first fiber optic adapter 134 is assembled and connected to the optoelectronic composite interface 140.

[0248] In some embodiments, the end of the optoelectronic composite interface 140 facing the first fiber optic adapter 134 has a first opening 141, and the snap-fit ​​member 170 has a clearance through hole 173. The first fiber optic adapter 134 passes through the first opening 141 and the clearance through hole 173 in sequence and enters the inner cavity of the optoelectronic composite interface 140, thereby assembling the first fiber optic adapter 134 in the optoelectronic composite interface 140.

[0249] In some embodiments, the first fiber optic adapter 134 includes a flange 1341 disposed along the outer wall of the first fiber optic adapter 134.

[0250] In some embodiments, the first fiber optic adapter 134 passes through the first opening 141 and the clearance through hole 173 in sequence. The flange 1341 is connected to one side of the limiting part 174. The limiting part 174 limits the flange 1341 so as to limit the first fiber optic adapter 134 through the limiting part 174, thereby ensuring that the first fiber optic adapter 134 is coupled to the target position.

[0251] In some embodiments, the first fiber optic adapter 134 includes a protrusion 1342. A gap exists between the protrusion 1342 and the optoelectronic composite interface 140, providing adjustment space for the coupling of the first fiber optic adapter 134, thereby ensuring the coupling accuracy of the first fiber optic adapter 134.

[0252] Figure 12C This is an exploded top cross-sectional view of an optoelectronic composite interface according to some embodiments. Figure 12C As shown, in some embodiments, the inner surface of the photoelectric composite interface 140 facing the photoelectric connector assembly 400 is respectively formed with a first assembly groove 1442 and a second assembly groove to embed the positive electrode contact 191 and the negative electrode contact 192 respectively.

[0253] In some embodiments, a guide groove 1446 is provided between the first assembly groove 1442 and the second assembly groove 1443. The positive electrode contact 191 is located on one side of the guide groove 1446, and the negative electrode contact 192 is located on the other side of the guide groove 1446.

[0254] In some embodiments, the guide groove 1446 is configured as a recess with a receiving cavity. The guide groove 1446 guides the insertion direction of the optoelectronic connector assembly 400, guiding the optoelectronic connector assembly 400 to be inserted into the optoelectronic composite interface 140 in the correct insertion direction, reducing repeated insertion and incorrect insertion caused by incorrect insertion direction.

[0255] Figure 13A This is a diagram of an optoelectronic composite interface structure according to some embodiments. Figure 13B This is an exploded structural diagram of an optoelectronic composite interface according to some embodiments. For example... Figure 13A and Figure 13B As shown, in some embodiments, the optoelectronic composite interface 140 is designed to be detachable to facilitate the assembly of the connector 170.

[0256] In some embodiments, the optoelectronic composite interface 140 includes a first splicing component 145 and a second splicing component 146, which are assembled together to form the optoelectronic composite interface 140. Designing the optoelectronic composite interface 140 as a splicing type facilitates the assembly of its internal structure.

[0257] In some embodiments, the first splicing member 145 has a plug groove 1451, and the second splicing member 146 has a protrusion 1461. The protrusion 1461 is plugged into the plug groove 1451 and tightly fitted to form a photoelectric composite interface 140.

[0258] In some embodiments, the second splicing member 146 includes a locking arm 1462 disposed opposite to the first splicing member 145, the end of which has a hook 1463. The first splicing member 145 has a slot 1452. The locking arm 1462 is an elastic arm, and the hook 1463 is inserted into the slot 1452 by the elastic deformation of the locking arm 1462, thus achieving a stable connection between the first splicing member 145 and the second splicing member 146 and preventing the second splicing member 146 from falling off.

[0259] Figure 14 This is a schematic diagram illustrating the assembly of a photoelectric connector assembly and a photoelectric composite interface according to some embodiments. Figure 14 As shown, in some embodiments, the optoelectronic connector assembly 400 is plugged into the optoelectronic composite interface 140 to achieve assembly. The data acquisition optical module 100 is optoelectronically connected to the optoelectronic composite cable 500 through the optoelectronic connector assembly.

[0260] In some embodiments, the optoelectronic composite interface 140 has openings at both ends. Exemplarily, the optoelectronic composite interface 140 has a first opening 141 and a second opening 142 at its two ends. The first opening 141 faces the first fiber optic adapter 134, and the second opening 142 faces the optoelectronic connector assembly 400. The first fiber optic adapter 134 enters the optoelectronic composite interface 140 through the first opening 141, and the optoelectronic connector assembly 400 enters the optoelectronic composite interface 140 through the second opening 142. Thus, the optoelectronic composite cable 500 connected to the first fiber optic adapter 134 and the optoelectronic connector assembly 400 is optically connected within the optoelectronic composite interface 140, thereby achieving optical signal coupling. Simultaneously, the circuit board 110 and the optoelectronic composite cable 500 connected to the optoelectronic connector assembly 400 are electrically connected within the optoelectronic composite interface 140.

[0261] Figure 15A This is a structural diagram of an optoelectronic connector assembly according to some embodiments. Figure 15B This is an exploded view of an optocoupler assembly according to some embodiments. Figure 15A and Figure 15B The view shown is the forward insertion direction when the photoelectric connector assembly 400 is inserted into the second opening 142, along... Figure 15A The view shown is inserted into the second opening 142. (As shown) Figure 15A and Figure 15B As shown, in some embodiments, one end of the optocoupler assembly 400 is inserted into the optocoupler composite interface 140, and the other end is connected to the optocoupler composite cable 500 to realize the optical connection between the optocoupler composite cable 500 and the first fiber optic adapter 134.

[0262] In some embodiments, the optocoupler assembly 400 may include a housing 410. The housing 410 serves as the outer structure of the optocoupler assembly 400 and is in contact with the optocoupler composite interface 140.

[0263] In some embodiments, the optoelectronic connector assembly 400 may include a mating member 420. The mating member 420 is located within the housing 410. The mating member 420 engages with a snap-fit ​​member 170 inside the optoelectronic composite interface 140 to connect the optoelectronic connector assembly 400 to the optoelectronic composite interface 140, thereby snapping the optoelectronic connector assembly 400 into the optoelectronic composite interface 140.

[0264] In some embodiments, the mating member 420 is mated and connected to the snap-fit ​​member 170. The mating member 420 has a first limiting protrusion 421 and a second limiting protrusion 422 formed on its two sidewalls. For example... Figure 11AAs shown, the latching member 170 includes a first latch 171 and a second latch 172 disposed opposite to each other. A first limiting protrusion 421 engages with the first latch 171, and a second limiting protrusion 422 engages with the second latch 172, thereby achieving a mating connection between the mating member 420 and the latching member 170. The bidirectional engagement ensures a stable connection and reduces loosening caused by vehicle vibration or impact.

[0265] In some embodiments, the first claw 171 and the second claw 172 are elastic claws. Through the elastic deformation of the first claw 171, the first limiting protrusion 421 engages with the first claw 171. Through the elastic deformation of the second claw 172, the second limiting protrusion 422 engages with the second claw 172. Exemplarily, the first claw 171 and the second claw 172 undergo elastic deformation during the insertion of the photoelectric connector assembly 400 and return to their original shape after insertion, thus achieving an engaging connection.

[0266] In some embodiments, the first limiting protrusion 421 and the second limiting protrusion 422 have guide slopes to facilitate alignment and engagement during insertion.

[0267] In some embodiments, the optocoupler assembly 400 may include a second fiber optic adapter 430. The second fiber optic adapter 430 is located within the housing 410. The second fiber optic adapter 430 is assembled with a mating member 420. The mating member 420 has a hollow interior, and the second fiber optic adapter 430 passes through the interior of the mating member 420.

[0268] In some embodiments, the optoelectronic composite cable 500 includes optical fibers. A second optical fiber adapter 430 has an internal optical fiber channel for accommodating and securing the optical fiber in the optoelectronic composite cable 500. For example... Figure 10A As shown, in some embodiments, the second fiber optic adapter 430 is docked with the first fiber optic adapter 134 to establish an optical connection between the fiber optic cable fixed in the second fiber optic adapter 430 and the fiber optic cable fixed in the fiber optic adapter 431, thereby establishing an optical connection between the optoelectronic composite cable 500 and the data acquisition optical module 100 to realize optical signal transmission.

[0269] In some embodiments, the end of the second fiber optic adapter 430 is exposed relative to the housing 410, allowing it to directly interface with the first fiber optic adapter 134, reducing obstacles during connection. Simultaneously, the exposed end of the second fiber optic adapter 430 allows the optical signal to directly enter the first fiber optic adapter 134, avoiding optical signal attenuation caused by obstruction by the housing 410.

[0270] In some embodiments, the optoelectronic composite cable 500 includes a positive cable and a negative cable, which may be respectively disposed on both sides of the optical cable. The optoelectronic connector assembly 400 may include a positive cable connection terminal 440 and a negative cable connection terminal 450. The positive cable connection terminal 440 is used to electrically connect the positive cable in the optoelectronic composite cable 500 to the circuit board 110, and the negative cable connection terminal 450 is used to electrically connect the negative cable in the optoelectronic composite cable 500 to the circuit board 110. The positive cable connection terminal 440 and the negative cable connection terminal 450 are used to realize the electrical connection between the devices on both sides of the optoelectronic connector assembly 400.

[0271] In some embodiments, one end of the positive cable connection terminal 440 is electrically connected to the positive cable in the optoelectronic composite cable 500, and the other end is electrically connected to the positive contact 191. The positive contact 191 electrically connects the optoelectronic connector assembly 400 and the circuit board 110, and further electrically connects the optoelectronic composite cable 500 and the circuit board 110. The positive power signal transmitted in the optoelectronic composite cable 500 is transmitted to the circuit board 110.

[0272] In some embodiments, the positive electrode contact 191 is electrically connected to the circuit board 110, thereby establishing an electrical connection between the positive electrode cable in the optoelectronic composite cable 500 and the circuit board 110. The positive electrode power signal transmitted by the optoelectronic composite cable 500 is transmitted to the surface of the circuit board 110, and then powered through the traces on the surface of the circuit board 110.

[0273] In some embodiments, one end of the negative cable connection terminal 450 is electrically connected to the negative cable in the optoelectronic composite cable 500, and the other end is electrically connected to the negative contact 192. The negative contact 192 electrically connects the optoelectronic connector assembly 400 to the circuit board, and further electrically connects the optoelectronic composite cable 500 to the circuit board 110. The negative power signal transmitted in the optoelectronic composite cable 500 is transmitted to the circuit board 110.

[0274] In some embodiments, the negative electrode contact 192 is electrically connected to the circuit board 110, thereby establishing an electrical connection between the negative electrode cable in the optoelectronic composite cable 500 and the circuit board 110. The negative electrode power signal transmitted by the optoelectronic composite cable 500 is transmitted to the surface of the circuit board 110, and then powered through the traces on the surface of the circuit board 110.

[0275] In some embodiments, the optoelectronic connector assembly 400 may include an optical cable sheath 460. The optical cable sheath 460 is used to fix the optoelectronic composite cable 500, providing mechanical protection for the optoelectronic composite cable 500 and preventing damage to the optoelectronic composite cable 500.

[0276] Figure 15C A housing structure according to some embodiments Figure 1 , Figure 15D Figure 2 shows a shell structure according to some embodiments. Figure 15C and Figure 15D As shown, in some embodiments, a guide protrusion 411 is formed on the bottom surface of the housing 410 to indicate the insertion direction of the photoelectric connector assembly 400. The guide protrusion 411 engages with the guide groove 1446.

[0277] In some embodiments, a first through-hole 412 is formed on one side of the guide protrusion 411, and the first through-hole 412 is used to provide a positive cable connection terminal 440. A second through-hole 413 is formed on the other side of the guide protrusion 411, and the second through-hole 413 is used to provide a negative cable connection terminal 450.

[0278] In some embodiments, the two sidewalls of the housing 410 are respectively provided with a first notch 414 and a second notch 415. The first notch 414 is used to avoid one sidewall of the mating member 420, exposing the first limiting protrusion 421 formed on that sidewall, so that the first limiting protrusion 421 can engage with the first claw 171 to achieve a limiting connection. The second notch 415 is used to avoid the other sidewall of the mating member 420, exposing the second limiting protrusion 422 formed on that sidewall, so that the second limiting protrusion 422 can engage with the second claw 172 to achieve a limiting connection.

[0279] In some embodiments, the upper and lower ends of the first notch 414 are respectively formed with first clearance recesses 416 to avoid interference at the first notch 414 during the limiting connection. The upper and lower ends of the second notch 415 are respectively formed with second clearance recesses 417 to avoid interference at the second notch 415 during the limiting connection.

[0280] In some embodiments, the upper and lower ends of the first notch 414 are respectively formed with first clearance recesses 416 to avoid the top and bottom ends of the first claw 171 and prevent the first claw 171 from interfering with the first notch 414. Similarly, the upper and lower ends of the second notch 415 are respectively formed with second clearance recesses 417 to prevent the second claw 172 from interfering with the second notch 415.

[0281] Figure 16 This is a structural diagram of an optocoupler assembly according to some embodiments from another perspective. Figure 17 This is an exploded view from another perspective of an optocoupler assembly according to some embodiments. Figure 16 and Figure 17 The view shown is the reverse insertion direction when the photoelectric connector assembly 400 is inserted into the second opening 142. Figure 16 The top surface shown is the bottom surface during insertion. For example... Figure 16 and Figure 17 As shown, in some embodiments, one end of the optical cable sheath 460 is inserted into the housing 410.

[0282] In some embodiments, the positive cable connection terminal 440 and the negative cable connection terminal 450 are located on the bottom surface of the housing 410. When the optocoupler assembly 400 is inserted into the optocoupler composite interface 140, the bottom end of the optocoupler assembly 400 is defined as the bottom surface of the housing 410.

[0283] In some embodiments, a first through-hole 412 and a second through-hole 413 are formed on the bottom surface of the housing 410. The first through-hole 412 is used to house a positive cable connection terminal 440, and the second through-hole 413 is used to house a negative cable connection terminal 450. The first through-hole 412 and the second through-hole 413 are configured as a through-hole structure to ensure that the positive cable connection terminal 440 is electrically connected to the positive contact 191, and the negative cable connection terminal 450 is electrically connected to the negative contact 192.

[0284] In some embodiments, a guide protrusion 411 is formed on the bottom surface of the housing 410. The guide protrusion 411 protrudes relative to the bottom surface of the housing 410. The guide protrusion 411 is located between the first through-hole 412 and the second through-hole 413. The positive cable connection terminal 440 is located on one side of the guide protrusion 411, and the negative cable connection terminal 450 is located on the other side of the guide protrusion 411.

[0285] In some embodiments, the guide protrusion 411 can indicate the insertion direction, allowing the optocoupler assembly 400 to be quickly and accurately inserted into the optocoupler composite interface 140, reducing repeated and incorrect insertions caused by incorrect insertion direction. During insertion, the guide protrusion 411 is located at the bottom end of the optocoupler assembly 400; therefore, insertion can be performed along the direction in which the guide protrusion 411 is located at the bottom end of the optocoupler assembly 400.

[0286] In some embodiments, when the optoelectronic connector assembly 400 is inserted, the guide protrusion 411 engages with the guide groove 1446 of the optoelectronic composite interface 140, providing guidance for the insertion direction of the optoelectronic connector assembly 400 and ensuring that the optoelectronic connector assembly 400 can be smoothly inserted into the optoelectronic composite interface 140. Exemplarily, the guide groove 1446 is formed on the inner surface of the bottom end of the optoelectronic composite interface 140, and the guide protrusion 411 is formed on the outer surface of the bottom end of the optoelectronic connector assembly 400, with the two engaging in a concave-convex fit.

[0287] Figure 18 This is a cross-sectional structural diagram of a photoelectric connector assembly according to some embodiments. Figure 18 As shown, in some embodiments, the end of the second fiber optic adapter 430 is exposed relative to the end of the housing 410, and can then be directly connected to the first fiber optic adapter 134.

[0288] In some embodiments, the housing 410 encloses the mating member 420, and the mating member 420 encloses the second fiber optic adapter 430. The fiber optic cable sheath 460 is inserted into the housing 410 and is located between the housing 410 and the second fiber optic adapter 430.

[0289] In some embodiments, the optical cable sheath 460 is inserted into the housing 410 and wraps around the second optical fiber adapter 430. An optical fiber channel is formed inside the second optical fiber adapter 430, and the optical cable in the optoelectronic composite cable 500 is fixed inside the second optical fiber adapter 430.

[0290] Figure 19 This is a schematic diagram of an optical connection in a vehicle-mounted optical communication system according to some embodiments. Figure 19 As shown, in some embodiments, the optoelectronic composite cable 500 is optically connected to the data acquisition optical module 100 to transmit optical signals. One end of the optoelectronic composite interface 140 has a first opening 141, and the other end has a second opening 142.

[0291] In some embodiments, the first fiber optic adapter 134 is inserted into the inner cavity of the optoelectronic composite interface 140 along the first opening 141, and the second fiber optic adapter 430 is inserted into the inner cavity of the optoelectronic composite interface 140 along the second opening 142.

[0292] In some embodiments, the second fiber optic adapter 430 carrying the optical fiber of the optoelectronic composite cable 500 is plugged into the first fiber optic adapter 134, and the optical cable of the optoelectronic composite cable 500 is connected to the optical fiber in the first fiber optic adapter 134, establishing an optical connection between the optoelectronic composite cable 500 and the data acquisition optical module 100, thereby transmitting optical signals.

[0293] In some embodiments, the optoelectronic composite cable 500 includes an optical cable 520. One end of the optical cable 520 is optically connected to the optical fiber 620, and the other end is connected to the first optical fiber adapter 134. Thus, the optical cable 520 is connected to the optical fiber in the first optical fiber adapter 134, thereby establishing an optical connection between the optical fiber 620 and the data acquisition optical module 100.

[0294] Figure 20 This is a schematic diagram of the power supply connection for a vehicle-mounted optical communication system according to some embodiments. Figure 20 As shown, in some embodiments, the optoelectronic composite cable 500 is electrically connected to the data acquisition optical module 100 to transmit power signals and supply power to the data acquisition optical module 100.

[0295] In some embodiments, the positive cable in the optoelectronic composite cable 500 is electrically connected to the circuit board 110 via the positive cable connection terminal 440 and the positive contact 191. The positive power signal transmitted by the positive cable is powered by traces on the surface of the circuit board 110.

[0296] In some embodiments, the negative cable in the optoelectronic composite cable 500 is electrically connected to the circuit board 110 via the negative cable connection terminal 450 and the negative electrical contact 192. The negative power signal transmitted by the negative cable is powered by traces on the surface of the circuit board 110.

[0297] In some embodiments, one end of the positive cable connection terminal 440 is electrically connected to the positive cable in the optoelectronic composite cable 500, and the other end is electrically connected to one end of the positive contact 191. The other end of the positive contact 191 is electrically connected to the circuit board 110. Thus, the positive cable in the optoelectronic composite cable 500 is electrically connected to the circuit board 110. The positive power signal transmitted by the positive cable in the optoelectronic composite cable 500 is routed through the surface of the circuit board 110 to supply power to the sensor 120, the optical transceiver assembly 130, and the like.

[0298] In some embodiments, one end of the negative cable connection terminal 450 is electrically connected to the negative cable in the optoelectronic composite cable 500, and the other end is electrically connected to one end of the negative contact 192. The other end of the negative contact 192 is electrically connected to the circuit board 110. Thus, the negative cable in the optoelectronic composite cable 500 is electrically connected to the circuit board 110. The negative power signal transmitted by the negative cable in the optoelectronic composite cable 500 passes through the surface of the circuit board 110 and supplies power to the sensor 120, the optical transceiver assembly 130, etc.

[0299] In some embodiments, the positive electrode contact 191 includes a first connecting segment 1911 and a second connecting segment 1912. The first connecting segment 1911 is electrically connected to the positive cable connection terminal 440. The second connecting segment 1912 passes through the optoelectronic composite interface 140 and the circuit board 110, and extends out of the surface of the circuit board 110, so that the positive electrode contact 191 is electrically connected to the circuit board 110. Exemplarily, the end of the positive electrode contact 191 is electrically connected to the circuit board 110 by soldering with gold solder. The negative electrode contact 192 can be connected in the same way.

[0300] In some embodiments, the positive cable connection terminal 440 and the positive electrical contact 191 are in a flexible contact connection, and the negative cable connection terminal 450 and the negative electrical contact 192 are in a flexible contact connection, so as to adapt to the slight unevenness or displacement of the contact surface, ensure a stable electrical connection, reduce the possibility of poor contact or disconnection, and ensure the reliability of the electrical connection.

[0301] In some embodiments, the optoelectronic composite cable 500 includes a positive cable 510. One end of the positive cable 510 is electrically connected to the wire 610, and the other end is electrically connected to the positive cable connection terminal 440, thereby transmitting the power signal transmitted in the wire 610 to the positive cable connection terminal 440 via the positive cable 510, and then to the surface of the circuit board 110.

[0302] In some embodiments, the wire 610 includes a positive wire and a negative wire. One end of the positive wire receives a positive power signal, and the other end is electrically connected to the positive cable 510 via a composite connector 600. The positive cable 510 is electrically connected to the positive cable connection terminal 440, thereby transmitting the positive power signal transmitted in the positive wire to the positive cable connection terminal 440 via the positive cable 510, and then to the surface of the circuit board 110.

[0303] In some embodiments, one end of the negative wire receives a negative power signal, and the other end is electrically connected to the negative cable via a composite connector 600. The negative cable is electrically connected to the negative cable connection terminal 450, thereby transmitting the negative power signal transmitted in the negative wire to the negative cable connection terminal 450 via the negative cable, and then to the surface of the circuit board 110.

[0304] Figure 21 This is a cross-sectional structural diagram of an optoelectronic connector assembly and optoelectronic composite interface according to some embodiments. Figure 21 As shown, the optoelectronic composite interface 140 is fixed to the surface of the circuit board 110, and the optoelectronic composite interface 140 is assembled and connected with the optoelectronic connector assembly 400.

[0305] In some embodiments, the outer wall of the bottom surface of the housing 410 protrudes downward to form a guide protrusion 411. A positive cable connection terminal 440 is provided on one side of the guide protrusion 411, and a negative cable connection terminal 450 is provided on the other side.

[0306] In some embodiments, the inner wall of the bottom surface of the optoelectronic composite interface 140 is recessed downward to form a guide groove 1446. A positive electrode contact 191 is provided on one side of the guide groove 1446, and a negative electrode contact 192 is provided on the other side. The guide groove 1446 is recessed towards the circuit board.

[0307] In some embodiments, the guide protrusion 411 and the guide groove 1446 are connected in a cooperative manner, which can provide guidance for the insertion of the optoelectronic connector assembly 400 and ensure that the optoelectronic connector assembly 400 can be smoothly inserted into the optoelectronic composite interface 140. For example, the guide groove 1446 is formed on the inner surface of the bottom end of the optoelectronic composite interface 140, and the guide protrusion 411 is formed on the outer surface of the bottom end of the optoelectronic connector assembly 400, and the two are in a concave-convex fit.

[0308] In some embodiments, on the side where the guide protrusion 411 mates with the guide groove 1446, the positive cable connection terminal 440 is electrically connected to the positive contact 191. On the other side where the guide protrusion 411 mates with the guide groove 1446, the negative cable connection terminal 450 is electrically connected to the negative contact 192.

[0309] Figure 22This is a top cross-sectional view of an optoelectronic connector assembly and optoelectronic composite interface assembly according to some embodiments. Figure 23 This is a partially enlarged top cross-sectional view of an optoelectronic connector assembly and optoelectronic composite interface assembly according to some embodiments. Figure 22 and Figure 23 As shown, in some embodiments, the optocoupler assembly 400 enters the inner cavity of the optocoupler composite interface 140 through the second opening 142 and is optically connected to the first fiber optic adapter 134.

[0310] In some embodiments, the optoelectronic composite interface 140 is provided with a snap-fit ​​connector 170. The snap-fit ​​connector 170 is formed with a clearance through hole 173, through which the first fiber optic adapter 134 enters the inner cavity of the optoelectronic composite interface 140.

[0311] In some embodiments, the optocoupler assembly 400 includes a mating member 420. The mating member 420 is mated and connected with the snap-fit ​​member 170, so that the optocoupler assembly 400 is snapped into the optocoupler composite interface 140.

[0312] In some embodiments, the latching member 170 includes a first latch 171 and a second latch 172 disposed opposite to each other. The first latch 171 and the second latch 172 are symmetrically arranged. The extending directions of the first latch 171 and the second latch 172 are respectively aligned with the insertion direction of the optocoupler assembly 400. The ends of the first latch 171 and the second latch 172 are respectively bent to form hooks.

[0313] In some embodiments, the mating member 420 has protrusions on both side walls, forming a first limiting protrusion 421 and a second limiting protrusion 422. The first limiting protrusion 421 and the second limiting protrusion 422 are symmetrically arranged. The first limiting protrusion 421 engages with the first claw 171, and the second limiting protrusion 422 engages with the second claw 172, thereby engaging the mating member 420 with the snap-fit ​​member 170, and thus snapping the photoelectric connector assembly 400 into the photoelectric composite interface 140.

[0314] In some embodiments, the first claw 171 and the second claw 172 are elastic and can undergo elastic deformation when subjected to force. When assembling the photoelectric connector assembly 400, under the action of external force, the first claw 171 and the second claw 172 are pushed outward and undergo brief deformation. After the first claw 171 engages with the first limiting protrusion 421 and the second claw 172 engages with the first limiting protrusion 421, the first claw 171 and the second claw 172 quickly return to their original shape, completing the engagement of the first claw 171 with the first limiting protrusion 421 and the second claw 172 with the second limiting protrusion 422.

[0315] In some embodiments, the end of the first claw 171 is bent to form a hook, and the first limiting protrusion 421 slides into the hook to limit the first claw 171 and prevent the first claw 171 from loosening.

[0316] In some embodiments, under the action of an external force opposite to the insertion direction, the first claw 171 and the second claw 172 deform, the first claw 171 disengages from the first limiting protrusion 421, and the second claw 172 disengages from the second limiting protrusion 422, thereby allowing the photoelectric connector assembly 400 to be disassembled from the photoelectric composite interface 140 and unlocked.

[0317] In some embodiments, the inner wall of the first jaw 171 is formed with a first clearance arc 1711, and the inner wall of the second jaw 172 is formed with a second clearance arc 1721. The first clearance arc 1711 allows the first jaw 171 to align and engage more smoothly with the first limiting protrusion 421, and the second clearance arc 1721 allows the second jaw 172 to align and engage more smoothly with the second limiting protrusion 422. This also reduces the force required for assembly and lowers the assembly difficulty.

[0318] Figure 24 This is an exploded top sectional view of an optoelectronic connector assembly and optoelectronic composite interface assembly according to some embodiments. Figure 25 This is an exploded top sectional view of an optoelectronic connector assembly and optoelectronic composite interface assembly according to some embodiments. Figure 24 and Figure 25 As shown, in some embodiments, the optocoupler assembly 400 enters the inner cavity of the optocoupler composite interface 140 through the second opening 142 and is optically connected to the first fiber optic adapter 134.

[0319] In some embodiments, under the action of external force, the optocoupler assembly 400 enters the optocoupler composite interface 140 along the correct insertion direction. The first limiting protrusion 421 engages with the first claw 171, and the second limiting protrusion 422 engages with the second claw 172, engaging the mating part 420 with the snap-fit ​​part 170, thereby snapping the optocoupler assembly 400 into the optocoupler composite interface 140. Simultaneously, the second fiber optic adapter 430 enters the opening of the first fiber optic adapter 134, realizing the optical connection between the optocoupler composite cable 500 and the fiber optic adapter 135, thereby transmitting optical signals. At the same time, the optocoupler composite cable 500 is electrically connected to the circuit board 110, and the power signal transmitted within the optocoupler composite cable 500 is powered through the traces on the surface of the circuit board 110.

[0320] In some embodiments, the first claw 171 engages with the first limiting protrusion 421 along one side of the housing 410, and the second claw 172 engages with the second limiting protrusion 422 along the other side of the housing 410, forming a bidirectional synchronous locking, which effectively restricts the displacement of the mating part 420 and avoids loosening caused by uneven force on one side of the engagement.

[0321] Figure 26 This is an assembly structure diagram of a snap-fit ​​connector and photoelectric connector assembly according to some embodiments. Figure 27 This is a partially enlarged structural view of an assembly of a snap-fit ​​connector and an optoelectronic connector according to some embodiments. Figure 28 This is an exploded view of an assembly of a snap-fit ​​connector and a photoelectric connector according to some embodiments. Figure 26-28 As shown, the first claw 171 engages with the first limiting protrusion 421 along one side of the housing 410, and the second claw 172 engages with the second limiting protrusion 422 along the other side of the housing 410.

[0322] In some embodiments, a first notch 414 and a second notch 415 are formed on the two side walls of the housing 410, respectively. The first notch 414 exposes the first limiting protrusion 421 formed on the side wall, facilitating the engagement of the first limiting protrusion 421 with the first claw 171. The second notch 415 exposes the second limiting protrusion 422 formed on the side wall, facilitating the engagement of the second limiting protrusion 422 with the second claw 172.

[0323] In some embodiments, a first clearance recess 416 is formed at the upper and lower ends of the first notch 414, and the first clearance recess 416 is recessed inward. At the opposite end, a second clearance recess 417 is formed at the upper and lower ends of the second notch 415.

[0324] In some embodiments, the first clearance recess 416 can provide space for the top and bottom ends of the first claw 171, allowing the first claw 171 to engage more smoothly with the first limiting protrusion 421 during engagement, reducing assembly resistance and making engagement smoother. Simultaneously, the first clearance recess 416 ensures precise matching between the first claw 171 and the first limiting protrusion 421, enhancing the stability and reliability of the connection.

[0325] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A data collection optical module, characterized by, The application relates to a light-emitting component, which comprises the following parts: a circuit board; a light-emitting part electrically connected to the circuit board, the light-emitting part being used for outputting a light-emitting signal; wherein the light-emitting part comprises: a tube base provided with a high-frequency pin, the high-frequency pin penetrating through the tube base, the top of the high-frequency pin being protruded from the top surface of the tube base, the high-frequency pin being electrically connected to the circuit board; a first mounting base connected to the top surface of the tube base and located at the side of the high-frequency pin; a VCSEL laser chip with the bottom surface connected to the top surface of the first mounting base and the top surface emitting the light-emitting signal, the VCSEL laser chip being electrically connected to the high-frequency pin; a second lens located above the VCSEL laser chip, the second lens collimating the light-emitting signal emitted by the VCSEL laser chip; a tube cap with the bottom connected to the tube base, the tube cap covering the VCSEL laser chip and the second lens.

2. The data collection optical module of claim 1, wherein, The tube base is further provided with an output pin, and the light-emitting part further comprises: a second mounting base connected to the top surface of the tube base, the second mounting base being located between the first mounting base and the output pin; a back light detector arranged on the top surface of the second mounting base, the back light detector being electrically connected to the tube base and the output pin; the top of the tube cap is formed with an inclined light window, the light window being arranged above the VCSEL laser chip and the back light detector in an inclined manner, and the light-emitting signal reflected by the light window is transmitted to the back light detector.

3. The data collection optical module of claim 2, wherein, The tube cap comprises: a tube cap body with the bottom connected to the top surface of the tube base and the top formed with a support table, the support table being formed with an inclined surface arranged above the VCSEL laser chip in an inclined manner; the bottom surface of the light window is connected to the inclined surface, so that the light window is arranged above the VCSEL laser chip and the back light detector in an inclined manner.

4. The data collection optical module of claim 1, wherein, The tube base is provided with a first high-frequency pin and a second high-frequency pin, the top surface of the first mounting base is formed with a first solder pad and a second solder pad, the first solder pad is wire-connected to the first high-frequency pin, and the second solder pad is wire-connected to the second high-frequency pin; the VCSEL laser chip is located at the side of the first solder pad and the second solder pad, and the VCSEL laser chip is wire-connected to the first solder pad and the second solder pad.

5. The data collection optical module of claim 2, wherein, The top surface of the second mounting base is formed with a metal layer, the back light detector is attached to the metal layer, and the metal layer is wire-connected to the output pin; the back light detector is wire-connected to the top surface of the tube base.

6. The data collection optical module of claim 1, wherein, The light-emitting part further comprises a mounting column located at the side of the first mounting base, the bottom of the mounting column is connected to the top surface of the tube base, and the side of the mounting column is connected to the second lens.

7. The data collection optical module of claim 1, wherein, The application further relates to a data acquisition optical module, which comprises the following parts: an optical fiber adapter located at the optical port of the data acquisition optical module; the optical fiber adapter comprises an optical fiber ferrule, the fiber core in the optical fiber ferrule being a multi-mode fiber core; a second connecting sleeve sleeved on the tube cap and connected to the tube base at the end. The round square pipe body is internally provided with a first lens and a first filter; one end of the round square pipe body is connected to the fiber optic adapter, and the other end of the round square pipe body is connected to the second connecting sleeve; the first lens is located at the side of the fiber optic adapter, and the first filter is located at the side of the first lens away from the fiber optic adapter.

8. An optical transceiver subassembly, comprising: Comprise: a fiber optic adapter; a round square pipe body internally provided with a first lens; one end of the round square pipe body is connected to the fiber optic adapter, and the first lens is located at the side of the fiber optic adapter; a light emitting component connected to the other end of the round square pipe body; wherein the light emitting component comprises: a tube seat provided with a high-frequency pin, the high-frequency pin penetrating through the tube seat, and the top of the high-frequency pin protruding from the top surface of the tube seat; a VCSEL laser chip with a bottom surface connected to the tube seat and a top surface emitting a light emitting signal; the VCSEL laser chip is electrically connected to the high-frequency pin; a second lens located above the VCSEL laser chip; the second lens collimates the light emitting signal emitted by the VCSEL laser chip; a cap connected to the bottom of the tube seat, covering the VCSEL laser chip and the second lens.

9. The optical transceiver module of claim 8, wherein the optical subassembly is configured to be mounted on a printed circuit board (PCB) of the optical transceiver module. The tube seat is also provided with an output pin; the light emitting component further comprises: a second mounting seat connected to the top surface of the tube seat, located at the side of the output pin; a back light detector arranged on the top surface of the second mounting seat; the back light detector is electrically connected to the tube seat and the output pin; The cap comprises: a cap body connected to the top surface of the tube seat, and a support table formed at the top of the cap body; an inclined surface is formed on the support table, which is inclinedly arranged above the VCSEL laser chip; a light window connected to the inclined surface, so that the light window is inclinedly arranged above the VCSEL laser chip and the back light detector; the light signal reflected by the light window is transmitted to the back light detector.

10. The optical transceiver module of claim 8, wherein the optical subassembly is configured to be mounted on a printed circuit board (PCB) of the optical transceiver module. The tube seat is provided with a first high-frequency pin and a second high-frequency pin; the light emitting component further comprises a first mounting seat connected to the top surface of the tube seat and supporting the bottom surface of the VCSEL laser chip; a first solder pad and a second solder pad are formed on the top surface of the first mounting seat, the first solder pad is wire-bonded to the first high-frequency pin, and the second solder pad is wire-bonded to the second high-frequency pin; The VCSEL laser chip is located at the side of the first solder pad and the second solder pad, and the VCSEL laser chip is wire-bonded to the first solder pad and the second solder pad.

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