Main control board heat dissipation structure

Abstract

The utility model relates to a heat dissipation structure of a main control board. The heat dissipation structure comprises a metal flow guide cover and a flow guide frame, the metal flow guide cover comprises a cover body arranged above the main control board, a cooling fan is arranged on the upper surface of the cover body, and the cooling fan is communicated with the cover body through ventilation holes. According to the utility model, through the arrangement of the metal flow guide cover, the heat dissipation fan, the flow guide frame and other parts, and through the matching relationship between the heat dissipation fan and the metal flow guide cover, the air flow is limited in the metal flow guide cover, so that the air flow can only flow along the space between the metal flow guide cover and the main control board; at the moment, an airflow flowing path is limited on the upper surface of the main control board, so that the upper surface of the main control board is subjected to precise heat dissipation; through the arrangement of the metal flow guide cover and the flow guide frame, the effect of increasing the heat dissipation area is achieved, the heat dissipation effect is more excellent, and through the arrangement of the flow guide frame, airflow exhausted by the heat dissipation fan flows directionally.

Description

Technical Field

[0001] This utility model relates to the field of motherboard heat dissipation technology, specifically to a heat dissipation structure for a main control board. Background Technology

[0002] The main control board, also known as the motherboard or host board, is the main part responsible for directing and controlling the operation of various components. It is also a major component of complex electronic systems. The most important component on the motherboard is the chipset.

[0003] The main control board generates a lot of heat when it is working. In order to avoid the heat from negatively affecting the main control board, the main control board is usually used in conjunction with a cooling fan. The cooling fan generates airflow to expel the hot air, thereby achieving the effect of heat dissipation.

[0004] While this method can achieve heat dissipation, when the main control board is located in a chassis with a large internal space, the airflow generated by the cooling fan moves the hot air above the motherboard to control the temperature around the main control board within a certain range. However, due to the large number of electronic components on the surface of the main control board, it is difficult for the airflow to flow along the surface of the main control board, resulting in the surface temperature of the main control board remaining high. Therefore, a new heat dissipation structure for the main control board is proposed to solve the above-mentioned problems. Utility Model Content

[0005] Based on the above description, this utility model provides a heat dissipation structure for a main control board to solve the problem that existing heat dissipation structures have poor heat dissipation effect on the surface of the main control board.

[0006] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: a heat dissipation structure for a main control board, comprising: a metal air guide shroud and an air guide frame;

[0007] The metal air guide includes a cover body disposed above the main control board, and a cooling fan is disposed on the upper surface of the cover body. The cooling fan is connected to the cover body through ventilation holes.

[0008] Based on the above technical solution, the present invention can be further improved as follows.

[0009] Furthermore, the cover is an air guide cover with an opening facing outwards. Multiple hollow columns are provided on the top wall inside the cover. The multiple hollow columns are connected to the upper surface of the main control board by screws and nuts. The electronic components on the upper surface of the main control board are located directly below the cover.

[0010] Furthermore, the top wall inside the cover is provided with multiple heat exchange columns, which are located inside the cover.

[0011] Furthermore, the upper surface of the cover is provided with ventilation holes and multiple heat exchange fins, and the multiple heat exchange fins form a mounting groove that communicates with the ventilation holes.

[0012] Furthermore, a cooling fan is installed inside the mounting slot, and the cooling fan is connected to the ventilation hole. The metal air guide cover is made of metal.

[0013] Furthermore, a flow guide is provided on the top of the cooling fan by screws, and the flow guide is located inside the mounting slot.

[0014] Furthermore, the air guide frame includes an air guide plate, and multiple columns are provided at the bottom of the air guide plate. The columns and the cooling fan are connected to the cover by screws, and the air guide plate is made of metal.

[0015] Compared with the prior art, the technical solution of this application has the following beneficial technical effects:

[0016] 1. This utility model sets up components such as a metal air guide, a cooling fan, and an air guide frame. Through the cooperation between the cooling fan and the metal air guide, the airflow is confined to the inside of the metal air guide, so that the airflow can only flow along the space between the metal air guide and the main control board. At this time, the airflow path is limited to the upper surface of the main control board, thereby accurately dissipating heat on the upper surface of the main control board.

[0017] 2. By setting up the metal air guide and air guide frame, the heat dissipation area is increased, resulting in better heat dissipation. Furthermore, the air guide frame allows the airflow exhausted by the cooling fan to flow in a directional manner, that is, to move laterally along the direction of the air guide plate, thereby driving the airflow after heat exchange between the heat exchange fins, thus increasing the heat dissipation effect. Attached Figure Description

[0018] Figure 1 A schematic diagram of a heat dissipation structure for a main control board provided in an embodiment of this utility model;

[0019] Figure 2 for Figure 1 Structural sectional view;

[0020] Figure 3 for Figure 2 Another structural diagram from a different perspective;

[0021] Figure 4 This is a schematic diagram of the structure of the metal flow guide in the embodiment of this utility model;

[0022] Figure 5 for Figure 4 Another structural diagram from a different perspective;

[0023] Figure 6 This is a schematic diagram of the flow guide frame in an embodiment of the present utility model;

[0024] Figure 7 for Figure 6 Another structural diagram from a different perspective;

[0025] The attached diagram lists the components represented by each number as follows:

[0026] 1. Main control board; 2. Metal air guide shroud; 21. Cover body; 22. Heat exchange fins; 23. Mounting slot; 24. Ventilation hole; 25. Hollow column; 26. Heat exchange column; 3. Cooling fan; 4. Air guide frame; 41. Air guide plate; 42. Column. Detailed Implementation

[0027] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0029] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0030] Please see Figures 1-5 A heat dissipation structure for a main control board includes: a metal air guide shroud 2 and an air guide frame 4;

[0031] The metal air guide shroud 2 includes a cover 21 disposed above the main control board 1. A cooling fan 3 is disposed on the upper surface of the cover 21. The cooling fan 3 is connected to the cover 21 through ventilation holes 24.

[0032] The cover 21 is an air guide cover with an opening facing the direction. Multiple hollow columns 25 are provided on the top wall inside the cover 21. The multiple hollow columns 25 are connected to the upper surface of the main control board 1 by screws and nuts. The electronic components on the upper surface of the main control board 1 are located directly below the cover 21. Multiple heat exchange columns 26 are provided on the top wall inside the cover 21. The multiple heat exchange columns 26 are located inside the cover 21.

[0033] The upper surface of the cover 21 is provided with ventilation holes 24 and multiple heat exchange fins 22. The multiple heat exchange fins 22 form a mounting groove 23 that communicates with the ventilation holes 24. A cooling fan 3 is provided inside the mounting groove 23. The cooling fan 3 communicates with the ventilation holes 24. The metal guide cover 2 is made of metal.

[0034] Based on the above, the metal air guide shroud 2 increases the heat dissipation area on the one hand, and restricts the direction of airflow on the other hand. When the cooling fan 3 is powered on, the airflow is restricted between the shroud 21 and the main control board 1, so that the airflow flows along the upper surface of the main control board 1 as much as possible, thereby accurately cooling the surface of the main control board 1 where electronic components are located, thus achieving the effect of precise heat dissipation on its surface.

[0035] During the above process, the heat exchange column 26, the cover 21 and the heat exchange fins 22 all come into contact with the air to exchange heat.

[0036] like Figures 1-3 , Figure 6 and Figure 7 As shown, the top of the cooling fan 3 is provided with a guide frame 4 by screws. The guide frame 4 is located inside the mounting slot 23. The guide frame 4 includes a guide plate 41. The bottom of the guide plate 41 is provided with multiple columns 42. The columns 42 and the cooling fan 3 are connected to the cover 21 by screws. The guide plate 41 is made of metal.

[0037] Based on the above, the air guide 4 is designed to guide the airflow, so that the exhaust airflow flows along the direction of the air guide 41 after being blocked by the air guide 41. At this time, the airflow direction is transverse, and the transversely flowing airflow comes into contact with the heat exchange fins 22, so that the hot air at the heat exchange fins 22 can flow, and the heat exchange fins 22 can dissipate heat fully.

[0038] In summary, this heat dissipation structure restricts the airflow direction, allowing the airflow to flow along the surface of the main control board 1 where electronic components are located, thereby specifically dissipating heat from that surface and preventing the main control board 1 from remaining at a high temperature.

[0039] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A main control board heat dissipation structure, characterized in that, Include: Metallic fairing (2) and fairing frame (4); The metallic fairing (2) includes a cover body (21) arranged above the main control panel (1), and the upper surface of the cover body (21) is provided with a cooling fan (3), and the cooling fan (3) and the cover body (21) are communicated through the ventilation hole (24).

2. The master control board heat dissipation structure according to claim 1, wherein, The cover body (21) is a open-topped fairing, a plurality of hollow columns (25) are arranged on the top wall inside the cover body (21), the plurality of hollow columns (25) are connected with the upper surface of the main control panel (1) through screws and nuts, and the electronic components on the upper surface of the main control panel (1) are located directly below the cover body (21).

3. The master control board heat dissipation structure of claim 1, wherein, The top wall inside the cover body (21) is provided with a plurality of heat exchange columns (26), and the plurality of heat exchange columns (26) are located inside the cover body (21).

4. The master control board heat dissipation structure of claim 1, wherein, The upper surface of the cover body (21) is provided with a ventilation hole (24) and a plurality of heat exchange fins (22), and a plurality of heat exchange fins (22) form an installation groove (23) communicated with the ventilation hole (24).

5. The master control board heat dissipation structure according to claim 4, wherein, The inside of the installation groove (23) is provided with a cooling fan (3), the cooling fan (3) and the ventilation hole (24) are communicated, and the metallic fairing (2) is made of metal material.

6. The master control board heat dissipation structure of claim 4, wherein, The top of the cooling fan (3) is provided with a fairing frame (4) through a screw, and the fairing frame (4) is located inside the installation groove (23).

7. The master control board heat dissipation structure of claim 1, wherein, The fairing frame (4) includes a guide plate (41), the bottom of the guide plate (41) is provided with a plurality of stand columns (42), the stand columns (42) and the cooling fan (3) are connected with the cover body (21) through screws, and the guide plate (41) is made of metal material.

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