Heat dissipation module with mainboard convenient to mount and dismount quickly

Abstract

The utility model relates to the technical field of mainboard heat dissipation modules, and discloses a heat dissipation module with a mainboard convenient to quickly mount and dismount, which comprises a mainboard body, fixing pipes are fixedly connected to the front and rear sides of the left end of the mainboard body, and pressing blocks are slidably connected to the inner walls of the top ends of the fixing pipes. Sliding groove shells are fixedly connected to the opposite ends of the inner walls of the fixing pipes, clamping blocks are connected to the bottom ends of the pressing blocks through dismounting sets, fixing frames are fixedly connected to the opposite ends of the inner walls of the fixing pipes, the outer walls of the fixing pipes are sleeved with butt joint plates, and heat dissipation shells are fixedly connected to the top ends of the butt joint plates; the inner wall of the heat dissipation shell is connected with a semiconductor cooler through a heat dissipation set. According to the utility model, the disassembly and assembly efficiency is obviously improved through a mechanical linkage structure, the risks of tool dependence and part damage caused by traditional screw fixation are avoided, the heat dissipation efficiency is improved, the temperature stability of the mainboard body under high load is ensured, the service life is prolonged, and the noise is reduced.

Description

Technical Field

[0001] This utility model relates to the field of motherboard heat dissipation module technology, and in particular to a heat dissipation module for motherboards that is easy to install and remove quickly. Background Technology

[0002] The motherboard cooling module is a core component of computer hardware, focusing on managing and reducing the temperature of the motherboard and its critical components such as the CPU, chipset, and VRM, ensuring stable system operation and extending hardware lifespan. CPU coolers dissipate heat rapidly using air or liquid cooling technology, while chipset heatsinks maintain low temperatures through passive cooling design. VRM cooling modules, combining heatsinks and heat pipes, provide efficient cooling for voltage regulation modules, ensuring overclocking stability. M.2 SSD heatsinks use thermal pads and metal heatsinks to prevent overheating during high-speed read / write operations. Furthermore, chassis fan and airflow design optimize airflow, heat pipe technology efficiently transfers heat, and thermally conductive materials (such as thermal paste and thermal pads) fill contact gaps to improve heat dissipation efficiency. High-end motherboards also feature full-coverage heatsinks and RGB-lit heatsinks, balancing performance and aesthetics. Regularly cleaning dust, checking fans, and replacing thermally conductive materials are crucial steps in maintaining the cooling module.

[0003] In modern computer hardware, the motherboard cooling module is crucial for stable system operation. However, existing designs suffer from the drawback of inconvenient disassembly. A cooling module typically includes components such as a CPU cooler, chipset heatsink, VRM cooling module, and M.2 SSD heatsink, which are mostly secured with screws or adhesives. When cleaning dust, replacing thermal materials, or upgrading, users must disassemble the entire module. Due to the large number of screws, their hidden locations, or complex clips, the disassembly process is not only time-consuming and laborious but also prone to damaging the motherboard or other delicate components, causing significant inconvenience for maintenance.

[0004] In response to this technical problem, this application proposes a heat dissipation module for motherboards that facilitates quick installation and removal. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a heat dissipation module for motherboards that facilitates quick installation and removal. Through a mechanical linkage structure, it significantly improves installation and removal efficiency, avoids tool dependence and component damage risks caused by traditional screw fixing, and enhances heat dissipation efficiency. This ensures stable temperature of the motherboard under high load, extends its service life, and reduces noise.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A heat dissipation module for easy and quick installation and removal of a motherboard includes a motherboard body. Fixed tubes are fixedly connected to both the front and rear sides of the left end of the motherboard body. Pressing blocks are slidably connected to the inner walls of the top of each fixed tube. Sliding shells are fixedly connected to opposite ends of the inner walls of each fixed tube. A locking block is connected to the bottom of each pressing block via a disassembly assembly. A fixing bracket is fixedly connected to opposite ends of the inner walls of each fixed tube. A docking plate is fitted onto the outer wall of the fixed tube. A heat dissipation shell is fixedly connected to the top of the docking plate. A semiconductor cooler is connected to the inner wall of the heat dissipation shell via a heat dissipation assembly.

[0008] Furthermore, the disassembly assembly includes a pressing block fixedly connected to the bottom end of the pressing block, and a locking block is provided at both the front and rear ends of the pressing block, with the bottom ends of the locking blocks slidably connected to the front and rear ends of the fixing frame, respectively.

[0009] Furthermore, each of the card blocks has a spring two fixedly connected to its opposite end, and the opposite ends of the spring two are respectively fixedly connected to the front and rear ends of the fixing frame.

[0010] Furthermore, a locking rod is rotatably connected to the bottom end of the pressing block, and a deflection block is fixedly connected to the opposite end of the locking rod.

[0011] Furthermore, each of the deflection blocks is fixedly connected to a spring at one of its opposite ends, and the bottom end of the spring is fixedly connected to the bottom end of the inner wall of the slide box.

[0012] Furthermore, a second clamping plate is fixedly connected to the top side of one opposite end of the sliding groove shell, and a first clamping plate is fixedly connected to the bottom side of one opposite end of the sliding groove shell.

[0013] Furthermore, the heat dissipation assembly includes filter screens fixedly connected to both the left and right ends of the heat dissipation shell, a fixing plate fixedly connected to the top of the inner wall of the heat dissipation shell, and a cooling fan fixedly connected to the inner wall of the fixing plate.

[0014] Furthermore, a liquid tank is fixedly connected to the bottom of the inner wall of the heat sink shell, the outer wall of the semiconductor cooler is installed on the inner wall of the liquid tank, a water pump is fixedly connected to the inner wall of the liquid tank, a cooling copper pipe is fixedly connected to the driving end of the water pump, and the other end of the cooling copper pipe is fixedly connected to the top of the liquid tank and passes through it.

[0015] This utility model has the following beneficial effects:

[0016] 1. In this utility model, during the installation of the motherboard heat dissipation module, after the mating plate is inserted into the fixing tube, pressing the pressing block drives the squeezing block to expand and lock the locking block outward, and the locking rod slides into the locking plate to complete the fixation; when pressed again, the spring causes the locking rod to disengage and the locking block to retract, realizing one-click disassembly. This design significantly improves the disassembly and assembly efficiency through a mechanical linkage structure, avoiding the tool dependence and component damage risks caused by traditional screw fixing.

[0017] 2. In this invention, when the motherboard heat dissipation module is running, the cooling fan starts, and at the same time, the semiconductor cooler cools the cooling oil in the liquid tank, and the water pump pumps it into the cooling copper pipe to form a circulation loop. The low-temperature surface of the cooling copper pipe works in conjunction with the fan airflow to achieve dual heat dissipation of "air cooling + liquid cooling", which significantly improves heat dissipation efficiency, ensures that the motherboard body temperature is stable under high load, extends service life and reduces noise. Attached Figure Description

[0018] Figure 1 A perspective view of a heat dissipation module for a motherboard that facilitates quick installation and disassembly according to this utility model;

[0019] Figure 2 A half-sectional view of the heat sink shell of a heat dissipation module for a motherboard that is easy to install and remove quickly, as proposed in this utility model.

[0020] Figure 3 A half-sectional view of the liquid tank of a heat dissipation module for a motherboard that facilitates quick installation and disassembly, as proposed in this utility model.

[0021] Figure 4 A half-sectional view of the fixing tube of a heat dissipation module for easy and quick installation and disassembly of a motherboard, as proposed in this utility model.

[0022] Figure 5 This is a schematic diagram of a mounting bracket structure for a heat dissipation module on a motherboard that facilitates quick installation and removal, as proposed in this utility model.

[0023] Figure 6 This is a half-sectional view of the sliding shell of a heat dissipation module for a motherboard that facilitates quick installation and disassembly, as proposed in this utility model.

[0024] Legend:

[0025] 1. Mainboard body; 2. Connecting plate; 3. Fixing tube; 4. Heat sink shell; 5. Fixing plate; 6. Cooling fan; 7. Cooling copper pipe; 8. Filter screen; 9. Semiconductor cooler; 10. Pressing block; 11. Liquid tank; 12. Water pump; 13. Locking block; 14. Locking rod; 15. Deflection block; 16. Spring 1; 17. Pressing block; 18. Fixing frame; 19. Spring 2; 20. Slide shell; 21. Locking plate 1; 22. Locking plate 2. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Reference Figures 4-6 This utility model provides an embodiment of a heat dissipation module for easy and quick installation and disassembly of a motherboard, comprising a motherboard body 1. Fixing tubes 3 are fixedly connected to both the front and rear sides of the left end of the motherboard body 1. Pressing blocks 10 are slidably connected to the inner walls of the top ends of the fixing tubes 3. Sliding groove shells 20 are fixedly connected to opposite ends of the inner walls of the fixing tubes 3. A locking block 13 is connected to the bottom end of the pressing block 10 via a disassembly assembly. The disassembly assembly includes a pressing block 17 fixedly connected to the bottom end of the pressing block 10. Locking blocks 13 are provided at both the front and rear ends of the pressing block 17, and the bottom ends of the locking blocks 13 are slidably connected to... At both ends of the fixed frame 18, spring 19 is fixedly connected to the opposite end of the locking block 13. The opposite ends of spring 19 are fixedly connected to the front and rear ends of the fixed frame 18. A locking rod 14 is rotatably connected to the bottom end of the pressing block 10. A deflecting block 15 is fixedly connected to the opposite end of the locking rod 14. A spring 16 is fixedly connected to the opposite end of the deflecting block 15. The bottom end of spring 16 is fixedly connected to the bottom end of the inner wall of the slide shell 20. A locking plate 22 is fixedly connected to the top side of the opposite end of the slide shell 20. A locking plate 21 is fixedly connected to the bottom side of the opposite end of the slide shell 20.

[0028] Specifically, during the installation and removal of the motherboard heat dissipation module, the fixing mechanism of the mating plate 2 and the fixing tube 3 is designed as follows: After the mating plate 2 is fitted into the preset position of the fixing tube 3, the user presses the pressing block 10, driving the internal squeezing block 17 to move downward, forcing the symmetrically distributed locking blocks 13 to unfold laterally to both sides, so that the outer extension of the locking blocks 13 is inserted into the gap between the mating plate 2 and the fixing tube 3, thereby achieving a stable installation of the mating plate 2 on the motherboard body 1. At the same time, the downward pressing action of the squeezing block 17 drives the locking rod 14 at the fixing tube 3 to slide along the upper surface of the second locking plate 22 until the locking rod 14 is embedded in the locking groove between the first locking plate 21 and the second locking plate 22, forming a mechanical self-locking state. When disassembly is required, the pressing block 10 is pressed again. At this time, the spring 16 applies a reverse elastic force to the deflection block 15, forcing the locking rod 14 to tilt and disengage from the locking groove, and slide out along the side edge of the second locking plate 22, so that the squeezing block 17 returns to the initial position under the spring reset action. Simultaneously, under the elastic restoring force of spring 19, the locking block 13 retracts inward, releasing the locking constraint of the docking plate 2, ultimately achieving rapid and non-destructive disassembly of the heat dissipation module. This design, through the modular locking and spring linkage mechanism, significantly improves the installation efficiency and maintenance convenience of the motherboard heat dissipation module.

[0029] Reference Figures 1-3A fixing bracket 18 is fixedly connected to one end of the inner wall of the fixing pipe 3. A docking plate 2 is sleeved on the outer wall of the fixing pipe 3. A heat sink 4 is fixedly connected to the top of the docking plate 2. A semiconductor cooler 9 is connected to the inner wall of the heat sink 4 through a heat dissipation assembly. The heat dissipation assembly includes a filter screen 8 fixedly connected to both ends of the heat sink 4. A fixing plate 5 is fixedly connected to the top of the inner wall of the heat sink 4. A cooling fan 6 is fixedly connected to the inner wall of the fixing plate 5. A liquid tank 11 is fixedly connected to the bottom of the inner wall of the heat sink 4. The outer wall of the semiconductor cooler 9 is installed on the inner wall of the liquid tank 11. A water pump 12 is fixedly connected to the inner wall of the liquid tank 11. A cooling copper pipe 7 is fixedly connected to the drive end of the water pump 12. The other end of the cooling copper pipe 7 is fixedly connected to the top of the liquid tank 11 and passes through it.

[0030] Specifically, in the active cooling system of the motherboard heat dissipation module, when the cooling fan 6 starts running, the semiconductor cooler 9 integrated in the liquid reservoir 11 is simultaneously powered on, rapidly reducing the temperature of the high thermal conductivity cooling oil encapsulated in the liquid reservoir 11 through the Peltier effect. The cooled cooling oil is then pumped by the micro water pump 12 into the cooling copper pipes 7 surrounding key heat-generating areas of the motherboard body 1, such as the CPU power supply module and chipset, forming a closed-loop circulation loop. The low temperature on the surface of the cooling copper pipes 7 absorbs heat from the motherboard through heat conduction, forming a "air cooling + liquid cooling" dual-mode collaborative heat dissipation with the forced airflow generated by the cooling fan 6: the metal surface of the copper pipes 7 reduces the ambient temperature through radiative heat exchange, while the fan 6 accelerates the airflow to remove convective heat from the copper pipes 7 and the motherboard surface. This hybrid cooling mechanism monitors the temperature of the motherboard body 1 in real time through the temperature sensor 8, and the temperature control chip 5 dynamically adjusts the power of the semiconductor cooler 9 and the speed of the water pump 12 to ensure that the cooling oil is always maintained within the efficient operating temperature range of -5℃ to 10℃. This design not only keeps the temperature rise of the motherboard under high load conditions below 15°C, but its modular liquid cooling unit also achieves zero noise and no risk of condensation during the heat dissipation process by utilizing the high specific heat capacity of the cooling oil, significantly improving the environmental adaptability and maintenance convenience of the motherboard heat dissipation module.

[0031] Working principle: After the docking plate 2 is installed on the fixing tube 3, pressing the pressing block 10 causes the squeezing block 17 to squeeze the locking block 13 to move to both sides, causing the locking block 13 to unfold outwards, so that the pressing block 10 is locked between the docking plate 2 and the fixing tube 3, allowing the docking plate 2 to be installed on the main body 1. When the squeezing block 17 is pressed down, the locking rod 14 at the fixing tube 3 slides along the upper side of the second locking plate 22 to between the second locking plate 22 and the first locking plate 21. When the pressing block 10 is pressed again, due to the squeezing of the deflection block 15 by the spring 16, the locking rod 14 remains tilted, allowing... It slides out from the side of the second card plate 22 again, allowing the pressing block 17 to reset. Under the elastic force of the second spring 19, the card block 13 retracts, allowing the docking plate 2 to be disassembled. When the cooling fan 6 starts to dissipate heat, the temperature of the preset cooling oil in the liquid tank 11 is reduced by the cooling of the semiconductor cooler 9. Then, the water pump 12 pumps it into the cooling copper pipe 7 and forms a circuit. The low temperature emitted from the surface of the cooling copper pipe 7 works in conjunction with the cooling fan 6 to enhance the heat dissipation effect of the cooling fan 6 and improve the protection of the motherboard body 1.

[0032] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation module for motherboards that facilitates quick installation and removal, comprising a motherboard body (1), characterized in that: The left end of the main plate body (1) is fixedly connected with a fixed tube (3) on the front and back sides, the inner wall of the top end of the fixed tube (3) is slidably connected with a pressing block (10), the inner wall of the fixed tube (3) is fixedly connected with a sliding groove shell (20) at opposite ends, the bottom end of the pressing block (10) is connected with a clamping block (13) through a disassembling group, the inner wall of the opposite end of the fixed tube (3) is fixedly connected with a fixed frame (18), the outer wall of the fixed tube (3) is sleeved with a butt joint plate (2), the top end of the butt joint plate (2) is fixedly connected with a heat dissipation shell (4), and the inner wall of the heat dissipation shell (4) is connected with a semiconductor refrigerator (9) through a heat dissipation group.

2. The heat dissipation module of claim 1, wherein: The disassembling group includes an extrusion block (17) fixedly connected to the bottom end of the pressing block (10), and clamping blocks (13) are arranged at the front and back ends of the extrusion block (17).

3. The heat dissipation module of claim 1, wherein: The opposite ends of the clamping block (13) are fixedly connected with spring two (19), and the opposite ends of the spring two (19) are fixedly connected to the front and back ends of the fixed frame (18).

4. The heat dissipation module of claim 1, wherein: The bottom end of the pressing block (10) is rotatably connected with a clamping rod (14), and the opposite ends of the clamping rod (14) are fixedly connected with deflection blocks (15).

5. The heat dissipation module of claim 4, wherein: The opposite ends of the deflection block (15) are fixedly connected with spring one (16), and the bottom end of the spring one (16) is fixedly connected to the inner wall of the bottom end of the sliding groove shell (20).

6. The heat dissipation module of claim 1, wherein: The top sides of the opposite ends of the sliding groove shell (20) are fixedly connected with clamping plates two (22), and the bottom sides of the opposite ends of the sliding groove shell (20) are fixedly connected with clamping plates one (21).

7. The heat dissipation module of claim 1, wherein the heat dissipation module is mounted on the mainboard by means of the fastening structure. The heat dissipation group includes filter screens (8) fixedly connected to the left and right ends of the heat dissipation shell (4), a fixed plate (5) fixedly connected to the inner wall of the top end of the heat dissipation shell (4), and a heat dissipation fan (6) fixedly connected to the inner wall of the fixed plate (5).

8. The heat dissipation module of claim 1, wherein: The inner wall of the bottom end of the heat dissipation shell (4) is fixedly connected with a liquid bin (11), the outer wall of the semiconductor refrigerator (9) is mounted on the inner wall of the liquid bin (11), the inner wall of the liquid bin (11) is fixedly connected with a water pump (12), the driving end of the water pump (12) is fixedly connected with a cooling copper pipe (7), and the other end of the cooling copper pipe (7) is fixedly connected to the top end of the liquid bin (11) and penetrates.

Images