Heating plate and cooking utensil

Abstract

The utility model provides a heating plate and a cooking utensil, the heating plate comprises a heat conducting plate, the heat conducting plate comprises a heat conducting surface, and the heat conducting surface is used for contacting a pot; the heating element is arranged on the heat conducting plate; the heat-insulating layer is arranged on one side, deviating from the heat-conducting surface, of the heat Wherein the porosity of the heat conducting plate is smaller than that of the heat insulating layer. The heat insulation layer is arranged on the side, away from the cookware, of the heat conduction plate, heat generated by the heating piece is prevented from being conducted to the side away from the cookware, heat is gathered to the side where the cookware is located, and therefore the heating efficiency of the heating disc can be improved, and the cooking time can be shortened. The risk that the electronic elements in the cooking utensil are damaged due to the fact that heat is transmitted to the side away from the cookware at the high temperature is reduced, the electronic elements in the cooking utensil are effectively protected, and heat waste is avoided.

Description

Technical Field

[0001] This utility model relates to the field of household appliance technology, and more specifically, to a heating plate and a cooking appliance. Background Technology

[0002] An electric heating plate is an electric heater that converts electrical energy into heat energy. It is widely used in everyday kitchen appliances, such as rice cookers and electric steamers. Currently, electric heating plates in related technologies generally consist of two main components: a cast aluminum plate and a heating element. The heating element generates heat through high power, which is quickly conducted to the cast aluminum plate, and then from the cast aluminum plate to the cookware.

[0003] Among them, electric heating tubes generally heat from both sides, and the heat generated at the bottom of the electric heating tube (i.e. the side away from the cast aluminum plate) does ineffective work, resulting in heat waste. Moreover, cooking utensils generally place electronic components at the bottom of the electric heating tube, which can easily cause the electronic components to overheat when the electric heating plate is working, increasing the risk of damage to the electronic components. Utility Model Content

[0004] The embodiments of this utility model are intended to solve at least one of the technical problems existing in the prior art.

[0005] Therefore, a first aspect of the embodiments of this utility model provides a heating plate.

[0006] A second aspect of the embodiments of this utility model provides a cooking utensil.

[0007] In view of the above, according to a first aspect of the present invention, a heating plate is provided, the heating plate comprising: a heat-conducting plate, the heat-conducting plate including a heat-conducting surface for contacting a cookware; a heating element disposed on the heat-conducting plate; and a heat insulation layer disposed on the side of the heat-conducting plate away from the heat-conducting surface; wherein the porosity of the heat-conducting plate is less than the porosity of the heat insulation layer.

[0008] The heating plate provided in this embodiment of the utility model includes a heat-conducting plate, a heating element, and a heat insulation layer. Specifically, the heat-conducting plate includes a heat-conducting surface for contacting the cookware. That is, the heat generated by the heating element can be transferred to the cookware via the heat-conducting plate to heat and cook the food inside the cookware. Optionally, the cookware includes a metal pot, a ceramic pot, or the inner pot of a cooking utensil.

[0009] The heat insulation layer is located on the side of the heat-conducting plate away from the heat-conducting surface. This means that by placing the heat insulation layer on the side of the heat-conducting plate away from the cookware, heat generated by the heating element is prevented from being conducted to the side away from the cookware. This allows heat to concentrate on the side where the cookware is located, thereby improving the heating efficiency of the heating plate, shortening cooking time, and reducing the risk of damage to the internal electronic components of the cooking appliance caused by heat transfer to the side away from the cookware at high temperatures. This effectively protects the internal electronic components of the cooking appliance, reducing the probability of malfunction and extending its lifespan and reliability. Furthermore, it solves the problem of heat generated on one side of the heat-conducting plate doing ineffective work when both sides are heating, avoiding heat waste and improving the energy efficiency of the cooking appliance.

[0010] Because the porosity of the heat-conducting plate is less than that of the insulation layer, meaning the heat-conducting plate is a denser material compared to the insulation layer, the heat generated by the heating element can be quickly transferred to the cookware through the heat-conducting plate. This improves heat transfer efficiency, thereby increasing the cooking efficiency of the appliance and shortening cooking time. In contrast, the insulation layer has a porous structure, ensuring its heat insulation effect and reducing downward (away from the cookware) heating of the heating element during operation. This protects the internal electronic components of the appliance and further improves its energy efficiency.

[0011] In some technical solutions, optionally, the porosity of the heat-conducting plate is less than or equal to 0.1%; and / or the porosity of the insulation layer is less than or equal to 10%.

[0012] In this technical solution, since the porosity of the heat-conducting plate is less than or equal to 0.1%, that is, the heat-conducting plate is a dense material compared to the heat insulation layer. This allows the heat generated by the heating element to be quickly transferred to the cookware through the heat-conducting plate, which is beneficial to improving the heat transfer efficiency and thus improving the cooking efficiency of the cooking appliance and shortening the cooking time.

[0013] The porosity of the insulation layer is less than or equal to 10%. This is understandable, as excessive porosity would lead to insufficient strength, causing cracking and even detachment from the heat-conducting plate. This would prevent effective heat insulation of the side of the heat-conducting plate away from the cookware, resulting in heat waste. By ensuring the porosity of the insulation layer is less than or equal to 10%, a porous structure is achieved, guaranteeing both insulation effectiveness and structural strength, thus enabling effective heat concentration towards the cookware.

[0014] In some technical solutions, the interior of the insulation layer may optionally include pores with a pore diameter greater than or equal to 1 mm and less than or equal to 3 mm.

[0015] In this technical solution, the interior of the heat insulation layer is defined to include pores. Optionally, during the preparation of the heating plate, a foaming agent can be added to the heat insulation layer, and multiple pores will be formed inside the heat insulation layer after molding.

[0016] Because the insulation layer contains pores, it helps to improve the insulation effect of the insulation layer, further hindering the conduction of heat to the side away from the pot, and better realizing the accumulation of heat on the side where the pot is located. This reduces the temperature interference of high temperature on the side and bottom electronic components of the cooking appliance, and improves the reliability of the cooking appliance.

[0017] Understandably, if the pores are too small, the insulation effect of the heat insulation layer will be reduced, causing more heat to escape from the side of the heat-conducting plate away from the cookware. This can lead to excessively high temperatures in the electronic components near the heating plate inside the cookware, affecting its lifespan. If the pores are too large, the insulation layer will lack strength, making it prone to cracking or even detaching from the heat-conducting plate. This would prevent effective heat insulation of the side of the heat-conducting plate away from the cookware, resulting in heat waste.

[0018] By limiting the pore size to between 1mm and 3mm, the insulation layer's ability to block heat from the side away from the cookware can be improved while ensuring its strength. This allows heat to be effectively concentrated on the side where the cookware is located, thus improving cooking efficiency.

[0019] In some technical solutions, the heat-conducting plate, the heating element, and the insulation layer can optionally be integrated into a single structure.

[0020] In this technical solution, the heat-conducting plate, heating element, and insulation layer are integrated into a single structure, meaning they are integrally formed. Optionally, the heat-conducting plate, heating element, and insulation layer can be integrally formed using integrated sintering technology. Specifically, the heating element is embedded inside the heat-conducting plate, and then the heat-conducting plate and insulation layer are pressed together and sintered in a kiln to achieve integral forming. This ensures the overall structural strength of the heating plate while reducing manufacturing difficulty and thus lowering the production cost of the heating plate.

[0021] In some technical solutions, the heating element optionally includes a metal wire located inside the heat-conducting plate.

[0022] In this technical solution, the heating element is defined as a metal wire. Specifically, the metal wire is located inside the heat-conducting plate, that is, the metal wire is embedded in the middle of the heat-conducting plate. This helps to shorten the distance between the metal wire and the pot, improve the efficiency of heat transfer, and thus improve the heating efficiency of the heating plate.

[0023] In some technical solutions, optionally, the heat-conducting plate includes a heat-resistant plate; and / or the heat-conducting plate includes an insulating plate; and / or the heat insulation layer includes an insulating layer.

[0024] In this technical solution, the heat-conducting plate is defined as including a heat-resistant plate, meaning that the heat-conducting plate has excellent high-temperature resistance. Therefore, compared to heating plates composed of cast aluminum plates and heating tubes in related technologies, this effectively avoids the risk of melting at high temperatures, thus improving the reliability of the heating plate. Optionally, the heat-conducting plate includes a high-temperature resistant inorganic material with a melting point greater than or equal to 1000℃, which can effectively avoid the risk of melting. Optionally, the insulation layer has a melting point greater than or equal to 1000℃ to prevent melting at high temperatures.

[0025] The heat-conducting plate is an insulating plate, meaning it has excellent insulation properties. Since the cookware that comes into contact with the heat-conducting surface is generally a metal pot, setting the heat-conducting plate as an insulating plate helps to further improve the reliability of the cooking utensils.

[0026] The heat insulation layer is an insulating layer. Since the wiring terminals that are electrically connected to the heating element are led out from the heat insulation layer, setting the heat insulation layer as an insulating layer helps to further improve the reliability of the heating plate.

[0027] In some technical solutions, the heat-conducting plate may optionally include a silicon carbide plate, a silicon nitride plate, an alumina plate, a glass plate, or a ceramic plate; the heat-conducting plate may include a silicon carbide plate, and the insulation layer may include a silicon carbide layer; the heat-conducting plate may include a silicon nitride plate, and the insulation layer may include a silicon nitride layer; the heat-conducting plate may include an alumina plate, and the insulation layer may include an alumina layer; the heat-conducting plate may include a glass plate, and the insulation layer may include a glass layer; or the heat-conducting plate may include a ceramic plate, and the insulation layer may include a ceramic layer.

[0028] In this technical solution, the heat-conducting plate is specified to include silicon carbide plate, silicon nitride plate, alumina plate, glass plate or ceramic plate, that is, the heat-conducting plate is made of high temperature resistant inorganic material, which has good heat transfer performance and good insulation performance.

[0029] The heat-conducting plate includes a silicon carbide plate, and the heat insulation layer includes a silicon carbide layer; the heat-conducting plate includes a silicon nitride plate, and the heat insulation layer includes a silicon nitride layer; the heat-conducting plate includes an alumina plate, and the heat insulation layer includes an alumina layer; the heat-conducting plate includes a glass plate, and the heat insulation layer includes a glass layer; the heat-conducting plate includes a ceramic plate, and the heat insulation layer includes a ceramic layer. In other words, the heat-conducting plate and the heat insulation layer are made of the same material. Therefore, after the heat-conducting plate and the heat insulation layer are integrally sintered, cracking at the interface between the heat-conducting plate and the heat insulation layer can be reduced, the bonding strength between the heat-conducting plate and the heat insulation layer can be improved, and the heat insulation effect of the heat insulation layer can be ensured.

[0030] In some technical solutions, optionally, at least a portion of the heat-conducting surface is configured as an arc-shaped surface, with the arc-shaped surface recessed toward the side where the insulation layer is located.

[0031] In this technical solution, at least a portion of the heat-conducting surface is curved, and the curved surface is concave towards the side where the insulation layer is located, i.e., the curved surface is concave towards the side away from the cookware. When the cookware is placed on the heat-conducting surface, the heat-conducting area between the heat-conducting surface and the cookware is increased. This allows heat to be transferred to the interior of the cookware not only through the bottom but also through at least a portion of the sides. This improves the uniformity of heating of the food inside the cookware, thereby achieving uniform heating of the cooking appliance and ensuring optimal cooking results.

[0032] In some technical solutions, optionally, the line connecting the outer edge of the heat-conducting surface and the center of the bottom of the heating plate is used as a reference line, and the angle α between the reference line and the horizontal plane satisfies 0°<α≤60°.

[0033] In this technical solution, since the line connecting the outer edge of the heat-conducting surface and the center O of the bottom of the heating plate is the reference line, and the angle between the reference line and the horizontal plane is between 0° and 60°, the heating plate is a large-arc heating plate, that is, the heat-conducting surface is made into a large arc size. When the pot is placed on the heat-conducting surface, the heat-conducting area between the heat-conducting surface and the pot can be increased, so that in addition to the heat being transferred to the inside of the pot through the bottom of the pot, the heat can also be transferred to the inside of the pot through at least part of the side of the pot. This is beneficial to improve the uniformity of heating of the food inside the pot, thereby achieving uniform heating of the cooking utensils and ensuring the cooking effect.

[0034] In some technical solutions, the heating plate may optionally include wiring terminals that are electrically connected to the heating element and exposed outside the insulation layer.

[0035] In this technical solution, the heating plate is further defined as including wiring terminals. Specifically, the wiring terminals are electrically connected to the heating element, thereby enabling the heating element to be energized. It is understood that the heating element generates heat when energized, and this heat is transferred to the cookware via the heat-conducting plate to heat and cook the food inside.

[0036] Since the wiring terminals are exposed on the insulation layer, meaning the terminals are led out from below (the side away from the cookware), it facilitates assembly.

[0037] According to a second aspect of the present invention, a cooking appliance is provided, including a heating plate as provided by any of the above-described technical solutions, and thus possesses all the beneficial technical effects of the heating plate, which will not be repeated here.

[0038] Additional aspects and advantages of the present invention will be set forth in the description which follows, in part will be obvious from the description, or may be learned by practice of the present invention. Attached Figure Description

[0039] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0040] Figure 1 One of the structural schematic diagrams of a heating plate according to an embodiment of the present invention is shown;

[0041] Figure 2 A second schematic diagram of the structure of a heating plate according to an embodiment of the present invention is shown;

[0042] Figure 3 A third schematic diagram of the structure of a heating plate according to an embodiment of the present invention is shown;

[0043] Figure 4 A fourth schematic diagram of the structure of a heating plate according to an embodiment of the present invention is shown;

[0044] Figure 5 Fifth schematic diagram of the structure of a heating plate according to an embodiment of the present invention is shown;

[0045] Figure 6 Sixth schematic diagram of the structure of a heating plate according to an embodiment of the present invention is shown.

[0046] in, Figures 1 to 6 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0047] 100 Heating plate, 110 Heat-conducting plate, 111 Heat-conducting surface, 112 Outer edge, 120 Heating element, 121 Metal wire, 130 Insulation layer, 131 Air vent, 140 Reference line, 150 Terminal block. Detailed Implementation

[0048] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0049] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0050] The following reference Figures 1 to 6 This invention describes a heating plate 100 and a cooking appliance provided according to some embodiments of the present invention.

[0051] In one embodiment according to this application, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, a heating plate 100 is proposed, which includes: a heat-conducting plate 110, the heat-conducting plate 110 including a heat-conducting surface 111 for contacting the cookware; a heating element 120 disposed on the heat-conducting plate 110; and a heat insulation layer 130 disposed on the side of the heat-conducting plate 110 away from the heat-conducting surface 111; wherein the porosity of the heat-conducting plate 110 is less than the porosity of the heat insulation layer 130.

[0052] The heating plate 100 provided in this embodiment of the utility model includes a heat-conducting plate 110, a heating element 120, and a heat insulation layer 130. Specifically, the heat-conducting plate 110 includes a heat-conducting surface 111, which is used to contact the cookware. That is, the heat generated by the heating element 120 can be transferred to the cookware through the heat-conducting plate 110 to heat and cook the food inside the cookware. Optionally, the cookware includes a metal pot, a ceramic pot, or the inner pot of a cooking utensil.

[0053] The heat insulation layer 130 is disposed on the side of the heat-conducting plate 110 away from the heat-conducting surface 111. That is, the heat insulation layer 130 is disposed on the side of the heat-conducting plate 110 away from the cookware, which prevents the heat generated by the heating element 120 from being conducted to the side away from the cookware. This allows the heat to be concentrated on the side where the cookware is located, thereby improving the heating efficiency of the heating plate 100 and shortening the cooking time. At the same time, it reduces the risk of damage to the internal electronic components of the cooking appliance caused by the transfer of heat to the side away from the cookware at high temperatures. This effectively protects the internal electronic components of the cooking appliance, thereby reducing the probability of malfunction of the cooking appliance, which is conducive to extending the service life of the cooking appliance and improving its reliability.

[0054] Moreover, it also solves the problem of heat generated on one side of the heat-conducting plate 110 doing ineffective work when both sides are heated, thus avoiding heat waste and improving the energy efficiency of cooking appliances.

[0055] Because the porosity of the heat-conducting plate 110 is less than that of the insulation layer 130, meaning that the heat-conducting plate 110 is a denser material compared to the insulation layer 130, the heat generated by the heating element 120 can be quickly transferred to the cookware through the heat-conducting plate 110. This improves heat transfer efficiency, thereby increasing the cooking efficiency of the cooking appliance and shortening cooking time. In contrast, the insulation layer 130 has a porous structure compared to the heat-conducting plate 110, ensuring its insulation effect and reducing downward (towards the side away from the cookware) heating of the heating element 120 during operation. This protects the electronic components inside the cooking appliance and further improves its energy efficiency.

[0056] Optionally, the thermal conductivity of the heat-conducting plate 110 is greater than or equal to 5 W / (mK).

[0057] Optionally, the thermal conductivity of the insulation layer 130 is less than or equal to 2 W / (mK).

[0058] In some embodiments, optionally, the porosity of the heat-conducting plate 110 is less than or equal to 0.1%; and / or the porosity of the insulation layer 130 is less than or equal to 10%.

[0059] In this embodiment, since the porosity of the heat-conducting plate 110 is less than or equal to 0.1%, that is, the heat-conducting plate 110 is a dense material compared to the heat insulation layer 130, the heat generated by the heating element 120 can be quickly transferred to the cookware through the heat-conducting plate 110, which is beneficial to improve the heat transfer efficiency, thereby improving the cooking efficiency of the cooking appliance and shortening the cooking time.

[0060] The porosity of the insulation layer 130 is less than or equal to 10%. It's understandable that if the porosity of the insulation layer 130 were too high, its strength would be insufficient, making it prone to cracking or even detaching from the heat-conducting plate 110. This would prevent effective heat insulation of the side of the heat-conducting plate 110 away from the cookware, resulting in heat waste. By ensuring the porosity of the insulation layer 130 is less than or equal to 10%, it achieves a porous structure, guaranteeing both insulation effectiveness and structural strength, thereby enabling effective heat concentration towards the side where the cookware is located.

[0061] like Figure 2 As shown, in some embodiments, optionally, the interior of the heat insulation layer 130 includes pores 131, the pore diameter of which is greater than or equal to 1 mm and less than or equal to 3 mm.

[0062] In this embodiment, the interior of the heat insulation layer 130 is defined to include pores 131. Optionally, during the preparation of the heating plate 100, a foaming agent can be added to the heat insulation layer 130, and after molding, multiple pores 131 will be formed inside the heat insulation layer 130.

[0063] Since the heat insulation layer 130 includes pores 131 inside, it helps to improve the heat insulation effect of the heat insulation layer 130, further hindering the conduction of heat to the side away from the pot, better realizing the accumulation of heat to the side where the pot is located, reducing the temperature interference of high temperature on the side and bottom electronic components of the cooking appliance, and improving the reliability of the cooking appliance.

[0064] Understandably, if the aperture of the pore 131 is too small, the heat insulation effect of the insulation layer 130 will be reduced, causing more heat to escape from the side of the heat-conducting plate 110 away from the cookware. This can easily lead to excessively high temperatures of the electronic components near the heating plate 100 inside the cooking appliance, affecting its lifespan. If the aperture of the pore 131 is too large, the insulation layer 130 will lack sufficient strength, easily causing cracking or even detachment from the heat-conducting plate 110. This would prevent the heat-conducting plate 110 from effectively isolating the heat away from the cookware, resulting in heat waste.

[0065] By limiting the aperture of the pores 131 to between 1mm and 3mm, the insulation effect of the insulation layer 130 on the side away from the cookware can be improved while ensuring the strength of the insulation layer 130. This allows for the effective concentration of heat towards the side where the cookware is located, which is beneficial for improving cooking efficiency.

[0066] Optionally, there are multiple pores 131, which are evenly distributed within the insulation layer 130.

[0067] In some embodiments, the heat-conducting plate 110, the heating element 120, and the heat insulation layer 130 may be an integral structure.

[0068] In this embodiment, the heat-conducting plate 110, the heating element 120, and the heat insulation layer 130 are an integral structure, meaning they are integrally formed. Optionally, the heat-conducting plate 110, the heating element 120, and the heat insulation layer 130 can be integrally formed using integrated sintering technology. Specifically, the heating element 120 is embedded inside the heat-conducting plate 110, and then the heat-conducting plate 110 and the heat insulation layer 130 are pressed together and then sintered in a kiln to achieve integral forming. This ensures the overall structural strength of the heating plate 100 while reducing manufacturing difficulty and thus lowering the production cost of the heating plate 100.

[0069] like Figure 1 and Figure 2 As shown, in some embodiments, the heating element 120 optionally includes a metal wire 121 located inside the heat-conducting plate 110.

[0070] In this embodiment, the heating element 120 is defined to include a metal wire 121. Specifically, the metal wire 121 is located inside the heat-conducting plate 110. That is, the metal wire 121 is embedded in the middle of the heat-conducting plate 110, which helps to shorten the distance between the metal wire 121 and the pot, improve the efficiency of heat transfer, and thus improve the heating efficiency of the heating plate 100.

[0071] Optionally, the metal wire 121 includes a nickel-chromium metal wire.

[0072] Optionally, the metal wires 121 are evenly embedded inside the heat-conducting plate 110, which is beneficial to achieve uniform heating of the heating plate 100.

[0073] In some embodiments, the heat-conducting plate 110 may optionally include a heat-resistant plate; and / or the heat-conducting plate 110 may include an insulating plate; and / or the heat insulation layer 130 may include an insulating layer.

[0074] In this embodiment, the heat-conducting plate 110 is defined as including a heat-resistant plate, meaning that the heat-conducting plate 110 has good high-temperature resistance. Therefore, compared to the heating plate composed of a cast aluminum plate and heating tube in related technologies, this effectively avoids the risk of melting at high temperatures, thus improving the reliability of the heating plate 100. Optionally, the heat-conducting plate 110 includes a high-temperature resistant inorganic material with a melting point greater than or equal to 1000°C, which can effectively avoid the risk of melting. Optionally, the insulation layer 130 has a melting point greater than or equal to 1000°C, preventing melting at high temperatures.

[0075] The heat-conducting plate 110 is an insulating plate, meaning that the heat-conducting plate 110 has good insulation properties. Since the cookware that comes into contact with the heat-conducting surface 111 is generally a metal pot, setting the heat-conducting plate 110 as an insulating plate helps to further improve the reliability of the cooking utensils.

[0076] The heat insulation layer 130 is an insulating layer. Since the wiring terminal 150, which is electrically connected to the heating element 120, is led out from the heat insulation layer 130, setting the heat insulation layer 130 as an insulating layer is beneficial to further improve the reliability of the heating plate 100.

[0077] Optionally, the heat-conducting plate 110 may include a silicon carbide plate, a silicon nitride plate, an alumina plate, a glass plate, a ceramic plate, or an inorganic composite plate.

[0078] In some embodiments, the heat-conducting plate 110 may optionally include a silicon carbide plate, a silicon nitride plate, an alumina plate, a glass plate, or a ceramic plate; the heat-conducting plate 110 may include a silicon carbide plate and the heat insulation layer 130 may include a silicon carbide layer; the heat-conducting plate 110 may include a silicon nitride plate and the heat insulation layer 130 may include a silicon nitride layer; the heat-conducting plate 110 may include an alumina plate and the heat insulation layer 130 may include an alumina layer; the heat-conducting plate 110 may include a glass plate and the heat insulation layer 130 may include a glass layer; or the heat-conducting plate 110 may include a ceramic plate and the heat insulation layer 130 may include a ceramic layer.

[0079] In this embodiment, the heat-conducting plate 110 is defined as including a silicon carbide plate, a silicon nitride plate, an alumina plate, a glass plate, or a ceramic plate. That is, the heat-conducting plate 110 is made of high-temperature resistant inorganic material, which has good heat transfer performance and good insulation performance.

[0080] The heat-conducting plate 110 includes a silicon carbide plate, and the heat insulation layer 130 includes a silicon carbide layer; the heat-conducting plate 110 includes a silicon nitride plate, and the heat insulation layer 130 includes a silicon nitride layer; the heat-conducting plate 110 includes an alumina plate, and the heat insulation layer 130 includes an alumina layer; the heat-conducting plate 110 includes a glass plate, and the heat insulation layer 130 includes a glass layer; the heat-conducting plate 110 includes a ceramic plate, and the heat insulation layer 130 includes a ceramic layer. That is to say, the heat-conducting plate 110 and the heat insulation layer 130 are made of the same material. Therefore, after the heat-conducting plate 110 and the heat insulation layer 130 are integrally sintered, cracking at the interface between the heat-conducting plate 110 and the heat insulation layer 130 can be reduced, the bonding strength between the heat-conducting plate 110 and the heat insulation layer 130 can be improved, and the heat insulation effect of the heat insulation layer 130 can be ensured.

[0081] In some embodiments, optionally, at least a portion of the thermally conductive surface 111 is configured as an arcuate surface, with the arcuate surface recessed toward the side where the insulation layer 130 is located.

[0082] In this embodiment, at least a portion of the heat-conducting surface 111 is an arc-shaped surface, and the arc-shaped surface is concave towards the side where the heat insulation layer 130 is located, i.e., the arc-shaped surface is concave away from the cookware. When the cookware is placed on the heat-conducting surface 111, the heat-conducting area between the heat-conducting surface 111 and the cookware can be increased. This allows heat to be transferred to the interior of the cookware not only through the bottom of the cookware but also through at least a portion of the sides of the cookware. This helps to improve the uniformity of heating of the food inside the cookware, thereby achieving uniform heating of the cooking appliance and ensuring the cooking effect.

[0083] like Figure 5 As shown, in some embodiments, optionally, the line connecting the outer edge 112 of the heat-conducting surface 111 and the center of the bottom of the heating plate 100 is a reference line 140, and the angle α between the reference line 140 and the horizontal plane satisfies 0°<α≤60°.

[0084] In this embodiment, since the line connecting the outer edge 112 of the heat-conducting surface 111 and the center O of the bottom of the heating plate 100 is the reference line 140, and the angle between the reference line 140 and the horizontal plane is between 0° and 60°, that is, the heating plate 100 is a large-arc heating plate, that is, the heat-conducting surface 111 is made into a large-arc size. When the pot is placed on the heat-conducting surface 111, the heat-conducting area between the heat-conducting surface 111 and the pot can be increased, so that in addition to the heat being transferred to the inside of the pot through the bottom of the pot, the heat can also be transferred to the inside of the pot through at least part of the side of the pot. This is beneficial to improve the uniformity of the heating of the food inside the pot, thereby achieving uniform heating of the cooking utensils and ensuring the cooking effect.

[0085] Optionally, the angle between the reference line 140 and the horizontal plane is 20°, 30°, 40°, 50° or 60°.

[0086] like Figure 1, Figure 2 , Figure 4 , Figure 5 and Figure 6 As shown, in some embodiments, the heating plate 100 may optionally include a wiring terminal 150, which is electrically connected to the heating element 120 and exposed in the heat insulation layer 130.

[0087] In this embodiment, the heating plate 100 further includes a wiring terminal 150. Specifically, the wiring terminal 150 is electrically connected to the heating element 120, thereby enabling the heating element 120 to be energized. It is understood that the heating element 120 can generate heat when energized, and the heat is transferred to the cookware via the heat-conducting plate 110 to heat and cook the food inside the cookware.

[0088] Since the wiring terminal 150 is exposed on the heat insulation layer 130, that is, the wiring terminal 150 is led out from below (the side away from the pot), it is easy to assemble.

[0089] In a specific embodiment, such as Figure 2 As shown, an integrated electric heating plate (heating plate 100) has a large arc-shaped heating surface (heat-conducting surface 111). The heating plate 100 is divided into upper and lower parts. The upper part is an integrated arc-shaped heating plate (heat-conducting plate 110), and the lower part is a porous heat insulation layer (heat insulation layer 130) and exposed wiring terminals 150 at the bottom. The two are integrally formed and sintered. When heated, it will heat the whole (cookware).

[0090] The upper integrated arc-shaped heating plate (heat-conducting plate 110) has an embedded heating wire (metal wire 121). When energized, it rapidly transfers heat to the cooking appliance (pot) through the insulating encapsulation layer (heat-conducting plate 110), achieving uniform heating. The lower porous insulation layer (heat insulation layer 130) is a lightweight, insulating inorganic insulation layer. Through heat insulation, it reduces the temperature interference of high temperatures on the side walls and bottom electronic components. The wiring terminal 150 passes through the lower insulation layer (heat insulation layer 130), and the wires are led out from below for easy assembly.

[0091] Working principle: Through integrated molding and sintering technology, the electric heating wire (metal wire 121) and the inorganic insulating plate (heat-conducting plate 110) are integrally molded and sintered, so that the resistance wire is embedded inside the inorganic insulating plate (heat-conducting plate 110).

[0092] A heat insulation layer (heat insulation layer 130) is installed below the integrated heating plate (heating plate 100) to concentrate heat upwards and prevent the risk of damage to electronic components caused by downward heat conduction at high temperatures. During use, the dense upper part (heat conducting plate 110) can quickly transfer heat to the cooking appliance (pot). The bottom is a porous heat insulation layer (heat insulation layer 130) to reduce downward heat generation during operation. In other words, the heat insulation layer insulates the bottom, protecting the circuit components (electronic components) and improving energy efficiency.

[0093] like Figure 5 As shown, the angle between the highest point of the disc (outer edge 112 of the heat-conducting surface 111) and the bottom (center O of the bottom of the heating plate 100) can reach 0°-60°, thereby achieving large-arc heating of the heating plate.

[0094] According to a second aspect of the present invention, a cooking appliance is provided, including a heating plate 100 as provided in any of the above embodiments, and thus possessing all the beneficial technical effects of the heating plate 100, which will not be repeated here.

[0095] Alternatively, the cooking appliance may include a rice cooker or an electric steamer.

[0096] In the description of this specification, the terms "connection," "installation," and "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0097] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0098] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A heating tray, characterized by The application relates to a heating disc. The application relates to a heating disc. The application relates to a heating disc. The application relates to a heating disc. The application relates to a heating disc.

2. The heating tray of claim 1, wherein, The application relates to a heating disc.

3. The heating tray of claim 1, wherein, The application relates to a heating disc.

4. The heating tray according to any one of claims 1 to 3, characterized in that, The application relates to a heating disc.

5. The heating tray according to any one of claims 1 to 3, characterized in that, The application relates to a heating disc.

6. The heating tray according to any one of claims 1 to 3, characterized in that, The application relates to a heating disc.

7. The heating tray according to any one of claims 1 to 3, characterized in that, The application relates to a heating disc. The application relates to a heating disc.

8. The heating tray according to any one of claims 1 to 3, characterized in that, The application relates to a heating disc.

9. The heating tray of claim 8, wherein, The application relates to a heating disc.

10. The heating tray according to any one of claims 1 to 3, characterized in that, The application relates to a heating disc. The application relates to a heating disc.

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