Lamp bead structure for improving air tightness and yin-yang screen
By adopting a three-pad isolation design in LED devices, the problems of airtightness and uneven screen brightness are solved, achieving high chip consistency and preventing water vapor intrusion, thus improving the airtightness and light emission uniformity of the devices.
Patent Information
- Application Number
- CN202423092562.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2026-03-17
- Estimated Expiration
- 2034-12-16
AI Technical Summary
Existing small-pitch LED devices suffer from poor airtightness and uneven screen brightness, allowing moisture to easily enter and cause failure. The red light chip significantly affects the emission angle of the blue and green light chips, resulting in a noticeable brightness contrast.
A three-pad design is adopted, with the pads spaced apart on the substrate. At least one pad has a lower relative height than the other two pads, which makes the relative heights of the blue, green and red light chips consistent. The die bonding functional area is isolated to prevent moisture intrusion.
This improves the airtightness of LED devices, avoids the phenomenon of uneven screen brightness, ensures the consistency of chip light emission angle, and enhances the overall performance of the devices.
Smart Images
Figure CN224007039U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor, concretely is a lamp pearl structure for improving air tightness and yin and yang screen. BACKGROUND
[0002] The existing small-pitch LED device adopts a flat plate type BT substrate as a support, the substrate is a single-layer plate divided into front-side circuitry and back-side circuitry, the front-side circuitry is used for binding light-emitting chips and realizing electrical interconnection, the back-side circuitry is used for welding with an LED display screen module PCB, and the front side and the back-side circuitry are connected and conducted through a through hole. The front-side circuitry of the substrate is divided into die-bonding functional areas, wire-bonding functional areas and insulation isolation areas, a red light chip is fixed on a red light die-bonding functional area by silver glue, and a blue light chip and a green light chip are fixed on corresponding blue light die-bonding functional areas and green light die-bonding functional areas by insulation glue or silver glue.
[0003] The existing die-bonding functional areas have a whole structure, so that some water vapor easily enters the inside of the lamp pearl during use of the small-pitch LED device, leading to easy failure and dead light of the small-pitch LED device; and the red, green and blue chips arranged on the die-bonding functional areas are arranged in a linear type, and the height of the general red light chip is 1.5 times the height of the blue light chip and the green light chip, so that the light-emitting angle of the blue light chip and the green light chip is blocked by the red light chip, leading to the formation of yin and yang screen during use of the small-pitch LED device, that is, obvious brightness contrast is presented on the left and right sides of the LED screen, as shown in the accompanying drawings. Figures 5-6
[0004] Therefore, the existing LED device has poor air tightness and forms yin and yang screen. INVENTION CONTENTS
[0005] Based on this, the utility model aims at providing a lamp pearl structure for improving air tightness and yin and yang screen to solve the technical problem of poor air tightness and formation of yin and yang screen of the existing LED device in the background art.
[0006] The utility model provides a lamp pearl structure for improving air tightness and yin and yang screen, the lamp pearl structure is applied to an LED device, the LED device includes a substrate, a blue light chip, a green light chip and a red light chip with a relative height higher than the blue light chip and the green light chip;
[0007] The lamp bead structure includes three pads spaced apart on the substrate. The three pads are respectively corresponding to the blue light chip, the green light chip, and the red light chip. At least one of the three pads has a lower relative height than the other two pads, so that when the blue light chip, the green light chip, and the red light chip are fixed on the corresponding pads, the relative heights of the blue light chip, the green light chip, and the red light chip are the same.
[0008] Furthermore, the three pads include a blue pad, a green pad, and a red pad disposed on the substrate.
[0009] Furthermore, the blue light pad, the green light pad, and the red light pad are all located on the center line of the substrate.
[0010] Furthermore, the blue light pad, the green light pad, and the red light pad are spaced apart along the length of the substrate.
[0011] Furthermore, the green light pad is disposed between the blue light pad and the red light pad.
[0012] Furthermore, the relative height of the blue light pad and the relative height of the green light pad are both lower than the relative height of the red light pad.
[0013] Furthermore, the blue light pad, the green light pad, and the red light pad are all provided with die-attach adhesive for fixing the blue light chip, the green light chip, and the red light chip.
[0014] Furthermore, the blue light pad, the green light pad, and the red light pad are each provided with a die-bonding identification point corresponding to the blue light chip, the green light chip, and the red light chip, respectively.
[0015] Furthermore, each of the die bonding identification points is respectively located in the central region of the blue light pad, the central region of the green light pad, and the central region of the red light pad.
[0016] Furthermore, the blue light pad is configured to correspond to the blue light chip, the green light pad is configured to correspond to the green light chip, and the red light pad is configured to correspond to the red light chip.
[0017] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0018] In the LED chip structure for improving airtightness and uneven brightness provided by this utility model, by arranging three pads spaced apart on the substrate, the die-bonding functional area is changed from an integral structure in the prior art to an isolated design. Simultaneously, by ensuring that at least one pad is lower in relative height than the other two, the blue, green, and red LED chips are fixed to their respective pads at the same relative height. This compensates for the red LED chip being higher than the blue and green LED chips, thus avoiding the red LED chip affecting the light emission angle of the blue and green LED chips, improving uneven brightness. Furthermore, raising one pad helps prevent moisture intrusion, thereby improving the overall airtightness of the LED device. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the structure of the lamp bead used to improve airtightness and the yin-yang screen in one embodiment of the present invention;
[0020] Figure 2 This is a side sectional view of the lamp bead structure used to improve airtightness and the yin-yang screen in one embodiment of the present invention;
[0021] Figure 3 This is a rear cross-sectional view of the lamp bead structure used to improve airtightness and the yin-yang screen in one embodiment of the present invention;
[0022] Figure 4 This is a top view of a substrate having die bond adhesive and die bond identification points in one embodiment of the present invention;
[0023] Figure 5 This is a schematic diagram of the structure of an LED device in the prior art;
[0024] Figure 6 This is a side cross-sectional view of an LED device in the prior art.
[0025] In the diagram: 100, substrate; 110, die bonding functional area; 200, blue LED chip; 300, green LED chip; 400, red LED chip; 500, blue LED pad; 600, green LED pad; 700, red LED pad; 800, die bond adhesive; 900, die bond identification point. Detailed Implementation
[0026] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.
[0027] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.
[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0029] Please see Figures 1-4 The image shows a lamp bead structure for improving airtightness and the use of a screen with varying brightness in one embodiment of this utility model. The lamp bead structure is applied in an LED device, which includes a substrate 100, a blue light chip 200, a green light chip 300, and a red light chip 400 with a relative height higher than the blue light chip 200 and the green light chip 300. It should be noted that the LED device is not limited to the substrate 100, blue light chip 200, green light chip 300, and red light chip 400 shown in this embodiment. It may also include pins, bonding wires, insulating areas, through holes, common electrode, G negative electrode, B negative electrode, R negative electrode, etc. Since some other components are conventional prior art in this field, they will not be specifically described here.
[0030] Please see Figures 5-6 As shown, this is a small-pitch LED device in the prior art. The die-bonding functional area 110 in this LED device is an integral structure, which makes it easy for moisture to enter the inside of the LED chip during use, causing the small-pitch LED device to fail and die. In addition, the height of the red light chip 400 is 1.5 times the height of the blue light chip 200 and the green light chip 300, which causes the light emission angle of the blue light chip 200 and the green light chip 300 to be blocked by the red light chip 400, resulting in the formation of a screen with uneven brightness when the small-pitch LED device is in use.
[0031] In this embodiment, the lamp bead structure includes three pads spaced apart on the substrate 100. The three pads are respectively corresponding to the blue light chip 200, the green light chip 300, and the red light chip 400. At least one of the three pads has a lower relative height than the other two pads, so that when the blue light chip 200, the green light chip 300, and the red light chip 400 are fixed on the corresponding pads, the relative heights of the blue light chip 200, the green light chip 300, and the red light chip 400 are the same.
[0032] It should be noted that the three pads are the die-bonding functional area in the prior art. By arranging the three pads spaced apart on the substrate 100, the die-bonding functional area 110 is changed from a monolithic structure in the prior art to an isolated design. At the same time, with at least one pad having a lower relative height than the other two, when the blue light chip 200, green light chip 300, and red light chip 400 are fixed on their respective pads, their relative heights are consistent. This compensates for the fact that the red light chip 400 is higher than the blue light chip 200 and green light chip 300, thus avoiding the influence of the red light chip 400 on the light emission angle of the blue light chip 200 and green light chip 300, improving the unevenness of the screen. In addition, raising one pad helps prevent moisture intrusion, thereby improving the overall airtightness of the LED device.
[0033] Specifically, for ease of understanding, in this embodiment, the three pads include a blue light pad 500, a green light pad 600, and a red light pad 700 disposed on the substrate 100. The blue light pad 500, green light pad 600, and red light pad 700 are all disposed on the center line of the substrate 100, and the blue light pad 500, green light pad 600, and red light pad 700 are spaced apart along the length of the substrate 100. Specifically, the blue light pad 500 is correspondingly disposed with the blue light chip 200, the green light pad 600 is correspondingly disposed with the green light chip 300, and the red light pad 700 is correspondingly disposed with the red light chip 400.
[0034] In some other preferred embodiments, the green pad 600 is located between the blue pad 500 and the red pad 700, and the relative height of the blue pad 500 and the relative height of the green pad 600 are both lower than the relative height of the red pad 700.
[0035] To further improve the consistency of the positions of the blue light chip 200, green light chip 300, and red light chip 400 on the pads, in some optional embodiments, the blue light pad 500, green light pad 600, and red light pad 700 are all provided with die bond adhesive 800 for fixing the blue light chip 200, green light chip 300, and red light chip 400, and the blue light pad 500, green light pad 600, and red light pad 700 are all provided with die bond identification points 900 corresponding to the blue light chip 200, green light chip 300, and red light chip 400, respectively.
[0036] Specifically, each die bonding identification point 900 is respectively located in the central area of the blue light pad 500, the central area of the green light pad 600, and the central area of the red light pad 700.
[0037] In summary, the LED chip structure for improving airtightness and yin-yang shielding shown in this embodiment has at least the following beneficial effects compared with the LED chip structures for improving airtightness and yin-yang shielding in the prior art:
[0038] In the LED chip structure for improving airtightness and uneven screen brightness provided by this utility model, by arranging three pads spaced apart on the substrate 100, the die-bonding functional area 110 is changed from an integral structure in the prior art to an isolated design. Simultaneously, by ensuring that at least one pad is lower in relative height than the other two, when the blue LED chip 200, green LED chip 300, and red LED chip 400 are fixed to their respective pads, their relative heights are consistent. This compensates for the fact that the red LED chip 400 is higher than the blue LED chip 200 and green LED chip 300, thus avoiding the influence of the red LED chip 400 on the light emission angle of the blue LED chip 200 and green LED chip 300, improving the uneven screen brightness. Furthermore, raising one pad helps prevent moisture intrusion, thereby improving the overall airtightness of the LED device.
[0039] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0040] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A lamp bead structure for improving air tightness and a positive and negative screen, characterized by, The lamp bead structure is applied to an LED device, the LED device comprising a substrate, a blue light chip, a green light chip and a red light chip with a relative height higher than the blue light chip and the green light chip; The lamp bead structure comprises three pads spaced on the substrate, the three pads are respectively arranged corresponding to the blue light chip, the green light chip and the red light chip, and the relative height of at least one of the three pads is lower than that of the other two pads, so that the relative heights of the blue light chip, the green light chip and the red light chip are consistent when the blue light chip, the green light chip and the red light chip are fixed on the corresponding pads.
2. The lamp bead structure for improving air tightness and yin-yang shield according to claim 1, characterized in that, The three pads comprise a blue light pad, a green light pad and a red light pad arranged on the substrate.
3. The lamp bead structure for improving air tightness and yin-yang shield according to claim 2, characterized in that, The blue light pad, the green light pad and the red light pad are arranged on the center line of the substrate.
4. The lamp bead structure for improving air tightness and yin-yang shield according to claim 2, characterized in that, The blue light pad, the green light pad and the red light pad are spaced along the length direction of the substrate.
5. The lamp bead structure for improving air tightness and yin-yang shield according to claim 2, characterized in that, The green light pad is arranged between the blue light pad and the red light pad.
6. The lamp bead structure for improving air tightness and yin-yang shield according to claim 2, characterized in that, The relative height of the blue light pad and the relative height of the green light pad are lower than the relative height of the red light pad.
7. The lamp bead structure for improving air tightness and yin-yang shield according to claim 2, characterized in that, The blue light pad, the green light pad and the red light pad are provided with die bonding glue for fixing the blue light chip, the green light chip and the red light chip.
8. The lamp bead structure for improving air tightness and yin-yang shield according to claim 2, characterized in that, The blue light pad, the green light pad and the red light pad are respectively provided with die bonding identification point parts corresponding to the blue light chip, the green light chip and the red light chip.
9. The lamp bead structure for improving air tightness and yin-yang shield according to claim 8, characterized in that, Each of the die bonding identification point parts is arranged in the center area of the blue light pad, the center area of the green light pad and the center area of the red light pad, respectively.
10. The lamp bead structure for improving air tightness and yin-yang shield according to claim 2, characterized in that, The blue light pad is arranged corresponding to the blue light chip, the green light pad is arranged corresponding to the green light chip and the red light pad is arranged corresponding to the red light chip.