High-weather-resistance PC board with built-in heat dissipation channel

Abstract

The utility model relates to the technical field of PC boards, in particular to a high-weather-resistance PC board with a built-in heat dissipation channel. Comprising a bottom plate, a top plate is arranged on the upper side of the bottom plate, a heat dissipation coating is arranged on the side, deviating from the top plate, of the bottom plate, a heat dissipation device is arranged between the bottom plate and the top plate, the heat dissipation device is used for conducting heat dissipation on the interior of the PC board, and the heat dissipation device comprises a supporting column fixedly connected to the center position of the bottom plate and the center position of the top plate; according to the utility model, heat is quickly conducted to the ventilating duct through the ventilating duct and then efficiently transferred to the fins, and the fins are radially and uniformly arranged, so that the contact area with air is expanded, the heat is uniformly distributed, the heat dissipation performance is ensured to be stable, meanwhile, the regularly arranged fins enhance the overall structural strength, and the service life of the radiator is prolonged. Air heat convection caused by the fins and orderly diffusion of hot air in the ventilating duct along the cambered surfaces of the fins reduce turbulent flow and air resistance, and the convection heat dissipation effect is enhanced.

Description

TECHNICAL FIELD

[0001] The utility model relates to PC board technical field, concretely relates to a high weatherability PC board of built -in heat dissipation channel. BACKGROUND

[0002] PC board full name polycarbonate board is with polycarbonate polymer as main raw material, extrusion processing through special process a kind of high-performance plastic plate, it has very high light transmittance, outstanding resistance to impact strength, light sound insulation, strong weather resistance, good flame resistance and multiple advantages such as ultraviolet resistance, be widely used in building facade, traffic facilities, sunshade, greenhouse, outdoor billboard etc. field, with the development of various industries, the performance requirement of PC board is higher and higher, not only require it to have good weather resistance, also need to have better heat dissipation performance, to meet the demand under different environment and use condition.

[0003] The existing PC board generates heat when in use, and the traditional heat dissipation method is natural heat dissipation method and setting heat dissipation channels in the PC board. In the natural heat dissipation method, due to the limited thermal conductivity of the PC board, the heat is difficult to conduct to the outside quickly, and the heat dissipation efficiency is very low. Although the method of setting heat dissipation channels in the PC board improves the heat dissipation condition to some extent, the design of the heat dissipation channel is too simple at present, most of the heat dissipation channels are only some straight hollows in the PC board, and the air flow in them lacks effective guidance. The heat exchange efficiency between the heat dissipation channel and the heat generating area of the PC board is not high, and the simple heat dissipation channel is difficult to cope with the complex heat source distribution situation, and cannot efficiently dissipate heat in the heat concentration area, affecting the performance and service life of the PC board. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a high weatherability PC board with built-in heat dissipation channels to solve the problem of low heat dissipation efficiency of the traditional heat dissipation method, which is natural heat dissipation method and setting heat dissipation channels in the PC board.

[0005] To achieve the above-mentioned purpose, the utility model provides a high weatherability PC board with built-in heat dissipation channels, which comprises a bottom plate, a top plate is arranged on the upper side of the bottom plate, a heat dissipation coating is arranged on the side away from each other of the bottom plate and the top plate, a heat dissipation device is arranged between the bottom plate and the top plate, the heat dissipation device is used for dissipating heat in the PC board, the heat dissipation device comprises a support fixedly connected at the center position of the bottom plate and the top plate, the support is arranged in the shape of a truncated cone, a plurality of fins are arranged on the outer periphery of the support, the upper and lower ends of the plurality of fins are respectively attached to the two sides adjacent to the top plate and the bottom plate, and the fins are arranged in the shape of an arc, and the side away from the support of the plurality of fins is flush with the side wall of the top plate.

[0006] The radial and uniform arrangement design of the fins not only expands the air contact area, uniformly distributes heat, prevents local overheating, ensures stable heat dissipation performance, and enhances the overall structural strength of the regular arranged fins, so that the PC board can better resist external force and vibration.

[0007] As a further improvement of the technical solution, the outer circumferential array of the support column has a plurality of connecting plates corresponding in number to the fins.

[0008] As a further improvement of the technical solution, the two sides of the connecting plate are fixedly connected with the two adjacent fins, and the plurality of fins and connecting plates away from the side of the support column are flush with the periphery of the top plate.

[0009] As a further improvement of the technical solution, the fins and connecting plates between every two adjacent fins form an air duct, the air duct is internally provided with heat-conducting silica gel, and the heat-conducting silica gel is arranged obliquely from the support column to the side wall of the top plate.

[0010] The air thermal convection caused by the fins and the orderly diffusion of hot air in the air duct along the fin arc surface both reduce turbulence and air resistance, enhance the convective heat dissipation effect, and the heat-conducting silica gel arranged in the air duct fills the gap by using its flexibility and heat conductivity, further improving the heat dissipation speed of the fins.

[0011] As a further improvement of the technical solution, a plurality of support rods are fixedly connected between the bottom plate and the top plate, the plurality of support rods are arranged at the corners of the bottom plate and the top plate, and the plurality of support rods penetrate the fins.

[0012] Compared with the prior art, the utility model has the beneficial effects that: the heat is quickly conducted to the air duct through the air duct, and then efficiently transmitted to the fins, the radial and uniform arrangement design of the fins not only expands the air contact area, uniformly distributes heat, prevents local overheating, ensures stable heat dissipation performance, and enhances the overall structural strength of the regular arranged fins, so that the PC board can better resist external force and vibration, the air thermal convection caused by the fins and the orderly diffusion of hot air in the air duct along the fin arc surface both reduce turbulence and air resistance, enhance the convective heat dissipation effect, and the heat-conducting silica gel arranged in the air duct fills the gap by using its flexibility and heat conductivity, further improving the heat dissipation speed of the fins. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a whole structure schematic view of the utility model;

[0014] Figure 2 It is a structure schematic view of the utility model support rod;

[0015] Figure 3 It is a structure schematic view of the utility model heat-conducting silica gel;

[0016] Figure 4 Structure diagram of the connecting plate of the utility model;

[0017] Figure 5 Structure diagram of the fin of the utility model.

[0018] The meanings of various reference numerals in the drawings are as follows:

[0019] 1, bottom plate; 11, top plate; 12, support rod; 13, heat dissipation coating;

[0020] 2, heat dissipation device; 21, support column; 22, fin; 23, connecting plate; 24, heat-conducting silica gel; 25, air duct. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be apparently and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0022] In the description of the utility model, it should be understood that the orientations or position relationships indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like are the orientations or position relationships shown based on the drawings, and are only for the convenience of describing the utility model and simplifying the description, and are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0023] Embodiment 1

[0024] Please refer to Figure 1 The embodiment provides a high-weather-resistance PC plate with built-in heat dissipation channels, which comprises a bottom plate 1, the upper side of the bottom plate 1 is provided with a top plate 11, and the side, away from the top plate 11, of the bottom plate 1 and the top plate 11 is provided with a heat dissipation coating 13. The heat dissipation coating 13 has good weather resistance, wear resistance and corrosion resistance, can effectively isolate the contact between the PC plate and the external environment, and prevents the erosion of ultraviolet rays, rainwater, dust and the like on the PC plate.

[0025] Please refer to Figures 2-5As shown, the bottom plate 1 and the top plate 11 are provided with a heat dissipation device 2 for dissipating heat inside the PC board, the heat dissipation device 2 includes a support 21 fixedly connected at the center of the bottom plate 1 and the top plate 11, the support 21 is provided in the form of a truncated cone, the outer periphery of the support 21 is provided with a plurality of fins 22, the upper and lower ends of the plurality of fins 22 are respectively fitted with the two adjacent sides of the top plate 11 and the bottom plate 1, and the fins 22 are provided in the form of an arc, the side of the plurality of fins 22 away from the support 21 is flush with the side wall of the top plate 11, the arc surface of the fin 22 guides the orderly flow of air, reduces turbulence and air resistance, so that the air can smoothly pass through to take away heat, enhances the convective heat dissipation effect, and the regularly arranged fins 22 enhance the overall structural strength.

[0026] As shown in Figure 4 As shown, the PC board generates heat during operation, the heat is conducted from the heat source through the PC board material to the inside of the PC board, the outer periphery of the support 21 is provided with a plurality of connecting plates 23, the number of connecting plates 23 corresponds to the number of fins 22, the two sides of the connecting plate 23 are fixedly connected with the two adjacent fins 22, the fins 22 between each other and the connecting plate 23 form an air duct 25, the side of the plurality of fins 22 and the connecting plate 23 away from the support 21 is flush with the periphery of the top plate 11, the heat is first quickly transferred into the air duct 25, then the heat is transferred to the fins 22, the radial fin structure of the fin 22 greatly expands the contact area with the air, the uniformly arranged fins 22 can evenly distribute heat to each fin 22, avoid local overheating, ensure balanced heat dissipation performance, the fins 22 make the surrounding air rise and the density becomes smaller, the surrounding cooler air will be supplemented, the hot air continuously rises and is replaced by the surrounding cold air, thereby dissipating heat to the environment, and the hot air inside the air duct 25 diffuses outward along the arc surface of the fin 22, the arc surface of the fin 22 guides the orderly flow of air, reduces turbulence and air resistance, so that the air can smoothly pass through to take away heat, enhances the convective heat dissipation effect; at the same time, the regularly arranged fins 22 enhance the overall structural strength, so that it can better resist external force and vibration during operation and is not easy to be damaged.

[0027] As shown in Figure 3 The inside of the air duct 25 is provided with heat-conducting silica gel 24, the heat-conducting silica gel 24 is inclinedly arranged from the support 21 to the side wall of the top plate 11, since there is an interval inside the air duct 25, and air is a poor conductor of heat, which will increase the thermal resistance, by providing heat-conducting silica gel 24 inside the air duct 25, the heat-conducting silica gel 24 has good flexibility and heat conductivity, can fill the gap inside the air duct 25, tightly contact the surface, so that the heat is more quickly transferred into the air duct 25, and the heat dissipation speed of the fin 22 is accelerated.

[0028] As shown in Figure 1 And Figure 2As shown, the plurality of support rods 12 are fixedly connected between the bottom plate 1 and the top plate 11, the plurality of support rods 12 are arranged at the corners of the bottom plate 1 and the top plate 11, and the plurality of support rods 12 penetrate the fins 22. By fixedly connecting the support rods 12 between the bottom plate 1 and the top plate 11, the strength of the PC board is strengthened, so that the PC board is more stable during use.

[0029] In specific use, the high-weather-resistance PC board with built-in heat dissipation channels of the embodiment first conducts heat from the heat source to the ventilation channel 25 through the PC board material, then transfers the heat to the fins 22, the fins 22 greatly expand the air contact area by virtue of the radial fin structure, and the uniformly arranged fins 22 promote uniform heat distribution, prevent local overheating, and ensure stable heat dissipation performance.

[0030] In terms of convection heat dissipation, the fins 22 make the surrounding air rise and become less dense, cold air is supplemented, and hot air is continuously replaced to dissipate heat to the environment, and the hot air in the ventilation channel 25 diffuses outward along the arc surface of the fins 22, the arc surface of the fins 22 guides the orderly flow of air, reduces turbulence and air resistance, and enhances the convection heat dissipation effect.

[0031] In addition, the inside of the ventilation channel 25 is intermittent, and air is a poor conductor of heat, which increases thermal resistance. By arranging the heat-conducting silica gel 24 in the inside of the ventilation channel 25, the heat-conducting silica gel 24 fills the gap in the inside of the ventilation channel 25 due to good flexibility and heat conductivity, tightly contacts the contact surface, accelerates heat conduction to the inside of the ventilation channel 25, improves the heat dissipation speed of the fins 22, and at the same time, the regularly arranged fins 22 also enhance the overall structural strength, so that they can better resist external force and vibration.

[0032] The basic principles, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only preferred examples of the present application and do not limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A high weather-resistant PC board with built-in heat dissipation channels, comprising a base plate (1), characterized in that: A top plate (11) is provided on the upper side of the base plate (1). A heat dissipation coating (13) is provided on the side of the base plate (1) and the top plate (11) that is opposite to each other. A heat dissipation device (2) is provided between the base plate (1) and the top plate (11). The heat dissipation device (2) is used to dissipate heat inside the PC board. The heat dissipation device (2) includes a support column (21) fixedly connected to the center of the base plate (1) and the top plate (11). The support column (21) is set in the shape of a frustum. A number of fins (22) are arranged in a circular array on the outer circumference of the support column (21). The upper and lower ends of the number of fins (22) are respectively attached to the adjacent sides of the top plate (11) and the base plate (1). The fins (22) are set in an arc shape. The side of the number of fins (22) away from the support column (21) is flush with the side wall of the top plate (11).

2. The high weather-resistant PC board with built-in heat dissipation channel according to claim 1, characterized in that: The outer circumferential array of the support column (21) has a number of connecting plates (23), and the number of connecting plates (23) corresponds to the number of fins (22).

3. The high weather-resistant PC board with built-in heat dissipation channel according to claim 2, characterized in that: The two sides of the connecting plate (23) are fixedly connected to the adjacent two side fins (22), and the side of several fins (22) and the connecting plate (23) away from the support column (21) is flush with the perimeter of the top plate (11).

4. The high weather-resistant PC board with built-in heat dissipation channel according to claim 2, characterized in that: The fins (22) adjacent to each other and the connecting plate (23) form a ventilation channel (25). The ventilation channel (25) is provided with thermally conductive silicone (24), which is inclined from the support (21) toward the side wall of the top plate (11).

5. The high weather-resistant PC board with built-in heat dissipation channel according to claim 1, characterized in that: A plurality of support rods (12) are fixedly connected between the bottom plate (1) and the top plate (11). The plurality of support rods (12) are located at the corners of the bottom plate (1) and the top plate (11), and the plurality of support rods (12) penetrate the fins (22).

Images