Novel pushing mechanism of semiconductor pressure control valve

Abstract

The utility model provides a pushing mechanism of a novel semiconductor pressure control valve, which comprises an upper shell, a lower shell, a pushing rod, a pushing rod, a pushing rod and a pushing rod, wherein the bottom of the upper shell is provided with a lower shell; the swing ejection assembly is installed in the upper shell, and the swing ejection assembly is used for adjusting the opening degree of the valve plate; the air inlet pipe is installed in the lower shell, and an air outlet pipe installed on the bottom side of the lower shell is arranged on one side of the air inlet pipe; and the valve plate is mounted at the top of the swing ejection assembly. The bottom of the pneumatic sliding block is jacked up by air pressure from a high-pressure air channel of the air flowing cavity, a swing ejection assembly is arranged, a driven gear can conveniently drive a transmission shaft to circularly swing and rotate in an arc shape, the axial position of a valve plate needs to be adjusted during rotation, free movement of the valve plate in the horizontal direction is achieved, the opening degree of the valve plate is adjusted, and the pressure of an equipment cavity is controlled. The chip processing technology requirements are met, production and assembly are convenient, movement is more stable, the product structure is simpler, production is convenient, and cost is low.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor equipment vacuum control pressure valve technical field, it is a kind of new type semiconductor control pressure valve's push mechanism. BACKGROUND

[0002] Semiconductor control pressure valve is the valve of the semiconductor device with auxiliary equipment, for controlling the direction, pressure and flow of gas in control pressure system.

[0003] In semiconductor, solar energy dry etching and deposition equipment, need to use pendulum clock type control pressure valve, valve needs to adjust valve plate axial position when rotating, realizes valve plate horizontal direction free motion, adjusts the opening of valve plate, reaches the pressure of control equipment cavity, satisfies chip processing process requirement. The opening of valve is the area of gas flow through effective passage area / valve plate completely open area.

[0004] The existing control pressure pendulum valve structure is controlled by driving shaft to swing valve plate, sealed by vacuum cover, and then the opening of valve is controlled. The transmission shaft of valve plate is axially pushed to valve plate free motion interval by spring during rotation. The axial pressure of spring is large during assembly, which is not convenient for assembly. The force of needle bearing is uneven during movement, which affects transmission stability. UTILITY MODEL CONTENTS

[0005] The utility model provides a new type semiconductor control pressure valve's push mechanism to solve the technical problem that the existing control pressure pendulum valve structure is controlled by driving shaft to swing valve plate, sealed by vacuum cover, and then the opening of valve is controlled. The transmission shaft of valve plate is axially pushed to valve plate free motion interval by spring during rotation. The axial pressure of spring is large during assembly, which is not convenient for assembly. The force of needle bearing is uneven during movement, which affects transmission stability.

[0006] The utility model solves the above-mentioned technical problem by the following technical scheme:

[0007] The utility model provides a new type semiconductor control pressure valve's push mechanism, the new type semiconductor control pressure valve's push mechanism includes:

[0008] Upper shell, lower shell is installed in the bottom of upper shell;

[0009] Swing ejection assembly, swing ejection assembly is installed in upper shell, and swing ejection assembly is used for the opening adjustment of valve plate;

[0010] Air inlet pipe, air inlet pipe is installed in lower shell, and air inlet pipe side is provided with air outlet pipe installed in the bottom side of lower shell;

[0011] Valve plate, valve plate is installed in the top of swing ejection assembly.

[0012] Further, the bottom end of the upper shell is provided with a lower shell, and the upper shell and the lower shell are fixedly connected through bolts.

[0013] Further, the swing ejection assembly comprises a driving motor, a driving gear shaft, a driven gear and a transmission shaft, the driving motor is fixedly installed at the bottom side of the lower shell, the driving motor output end is connected with the driving gear shaft, the side surface of the driving gear shaft is engagedly connected with the driven gear, the transmission shaft is installed in the driven gear, the top end of the transmission shaft penetrates the upper shell and is connected with the valve plate, and the bottom end of the transmission shaft is provided with a pneumatic sliding block.

[0014] Further, the driven gear is composed of a circular disc and an arc-shaped toothed plate, the circular disc and the arc-shaped toothed plate are integrally formed, the arc-shaped toothed plate is in a circular arc structure in the top view, and the arc-shaped toothed plate is engagedly connected with the driving gear shaft.

[0015] Further, the top end and the bottom end of the driving gear shaft are respectively provided with bearings, and the bearings are respectively installed in the upper shell and the lower shell.

[0016] Further, the lower shell is provided with a gas flow cavity for high-pressure gas.

[0017] Further, the inner cavity of the pneumatic sliding block is installed with a guide shaft, and the top end of the guide shaft extends into the inner cavity of the guide groove at the bottom end of the transmission shaft.

[0018] Further, the surface of the guide shaft is sleeved with a needle bearing, and the needle bearing is arranged between the transmission shaft and the pneumatic sliding block.

[0019] Further, the sealing groove in the lower shell is installed with a sealing ring, and the inner wall of the sealing ring is slidably attached to the outer side surface of the pneumatic sliding block.

[0020] Further, the bottom end of the pneumatic sliding block is arranged in the gas flow cavity, and the bottom of the pneumatic sliding block is subjected to the gas pressure from the high-pressure gas passage of the gas flow cavity.

[0021] On the basis of conforming to the common sense in the art, the above-mentioned preferred conditions can be combined arbitrarily, that is, the preferred examples of the utility model are obtained.

[0022] The positive progress effect of the utility model is that:

[0023] The pushing mechanism of the new type semiconductor pressure control valve is provided with a gas flow cavity, a gas inlet pipe, a gas outlet pipe, a gas dynamic sliding block, a driving motor, a driving gear shaft, a driven gear, a transmission shaft and a valve plate. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description only represent some embodiments of the present application.

[0025] Figure 1 It is a perspective structural schematic view of the pushing mechanism.

[0026] Figure 2 It is a bottom view of the pushing mechanism.

[0027] Figure 3 It is a sectional view of the driving gear shaft and the driven gear.

[0028] Figure 4 It is a sectional view of the valve plate in a non-movement state.

[0029] Figure 5 It is a sectional view of the valve plate in a movement state.

[0030] BRIEF DESCRIPTION OF DRAWINGS

[0031] 1, upper shell; 2, lower shell; 3, driving gear shaft; 4, driven gear; 5, gas dynamic sliding block; 6, sealing ring; 7, needle bearing; 8, transmission shaft; 9, driving motor; 10, valve plate; 11, gas flow cavity; 12, gas inlet pipe; 13, gas outlet pipe. DETAILED DESCRIPTION

[0032] In order to make the personnel in the technical field better understand the scheme of the present application, the technical scheme in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor should fall within the scope of protection of the present application.

[0033] It should be noted that the terms "first", "second", and the like in the description and claims of the present application and the above drawings are used to distinguish similar objects, and do not necessarily have to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0034] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0035] Also, in addition to indicating the orientation or positional relationship, the above-mentioned part of the terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meaning of these terms in the present application can be understood according to the specific circumstances.

[0036] In addition, the terms "mount", "set", "provided with", "connected", "connected", "sleeved" should be broadly understood. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0037] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0038] As Figures 1-5 shown, the new type of semiconductor pressure control valve push mechanism includes:

[0039] The upper shell 1 is provided with the lower shell 2 at the bottom.

[0040] The swing ejection assembly is installed in the upper shell 1 and is used for adjusting the opening of the valve plate 10.

[0041] The intake pipe 12 is installed in the lower shell 2, and the intake pipe 12 is provided with the exhaust pipe 13 installed at the bottom side of the lower shell 2.

[0042] The valve plate 10 is installed at the top of the swing ejection assembly.

[0043] Through the action of the swing ejection assembly, the axial position of the valve plate 10 needs to be adjusted during rotation, the valve plate 10 is freely moved in the horizontal direction, the opening of the valve plate 10 is adjusted, the pressure of the device cavity is controlled, the requirements of the chip processing technology are met, the production assembly is facilitated, the movement is more stable, the product structure is simpler, the production is facilitated, and the cost is low.

[0044] The lower shell 2 is arranged at the bottom end of the upper shell 1, and the lower shell 2 is fixedly connected with the upper shell 1 through bolts.

[0045] The swing ejection assembly includes a driving motor 9, a driving gear shaft 3, a driven gear 4, and a transmission shaft 8. The driving motor 9 is fixedly installed at the bottom side of the lower shell 2. The driving motor 9 is connected with the driving gear shaft 3 at the output end. The driving gear shaft 3 is meshingly connected with the driven gear 4 at the side surface. The driven gear 4 is installed with the transmission shaft 8 inside. The transmission shaft 8 penetrates the upper shell 1 at the top end and is connected with the valve plate 10. The transmission shaft 8 is provided with the pneumatic slide block 5 at the bottom end.

[0046] In use, the bottom of the slide block is lifted by the gas pressure from the high-pressure gas passage of the gas flow cavity 11, the pneumatic slide block 5 is lifted, the pneumatic slide block 5 pushes the driven gear 4 on the top side to move upwards, then the driving motor 9 is started, the driving motor 9 drives the driving gear shaft 3 to rotate, the driving gear shaft 3 drives the driven gear 4 meshingly connected on one side to rotate, and then drives the transmission shaft 8 to rotate in a circular arc swing. The axial position of the valve plate 10 needs to be adjusted during rotation, the valve plate 10 is freely moved in the horizontal direction, the opening of the valve plate 10 is adjusted, the pressure of the device cavity is controlled, the requirements of the chip processing technology are met, the production assembly is facilitated, the movement is more stable, the product structure is simpler, the production is facilitated, and the cost is low.

[0047] The driven gear 4 is composed of a circular disc and an arc-shaped tooth plate, the circular disc is integrally formed with the arc-shaped tooth plate, the arc-shaped tooth plate is in a circular arc structure in a top view, and the arc-shaped tooth plate is in meshing connection with the driving gear shaft 3.

[0048] The driving gear shaft 3 is provided with bearings at the top end and the bottom end respectively, and the bearings are arranged in the upper shell 1 and the lower shell 2 respectively.

[0049] The lower shell 2 is provided with a gas flow cavity 11 for high-pressure gas.

[0050] The pneumatic slider 5 is provided with a guide shaft in the inner cavity, and the top end of the guide shaft extends into the inner cavity of the guide groove arranged at the bottom end of the transmission shaft 8.

[0051] The guide shaft is sleeved with a needle bearing 7, and the needle bearing 7 is arranged between the transmission shaft 8 and the pneumatic slider 5.

[0052] The needle bearing 7 is arranged, so that the rotation is facilitated.

[0053] The lower shell 2 is provided with a sealing groove, and the sealing groove is provided with a sealing ring 6, and the inner wall of the sealing ring 6 is in sliding fit with the outer side surface of the pneumatic slider 5.

[0054] The bottom end of the pneumatic slider 5 is arranged in the gas flow cavity 11, and the bottom of the pneumatic slider 5 is subjected to the gas pressure from the high-pressure gas passage of the gas flow cavity 11.

[0055] The circuit and electronic components and modules are all prior art, and those skilled in the art can realize them without further description, and the content protected by the application does not involve improvement of software and methods.

[0056] The utility model is not limited to the above-mentioned embodiment, and any change in shape or structure falls within the protection scope of the utility model. The protection scope of the utility model is defined by the appended claims, and those skilled in the art can make various changes or modifications to the embodiments without departing from the principles and essence of the utility model, but the changes and modifications fall within the protection scope of the utility model.

Claims

1. A novel pusher mechanism for a semiconductor pressure-controlled valve, characterized in that, The pushing mechanism of the novel semiconductor pressure-controlled valve includes: Upper housing (1), with a lower housing (2) installed at the bottom of the upper housing (1); A swing ejection assembly is installed in the upper housing (1) and is used for adjusting the opening of the valve plate (10); An air intake pipe (12) is installed inside the lower housing (2), and an air outlet pipe (13) installed on the bottom side of the lower housing (2) is provided on one side of the air intake pipe (12). Valve plate (10) is mounted on top of the swing ejection assembly.

2. The pushing mechanism of the novel semiconductor pressure-controlled valve as described in claim 1, characterized in that: The lower shell (2) is provided at the bottom of the upper shell (1), and the lower shell (2) and the upper shell (1) are fixedly connected by bolts.

3. The pushing mechanism of the novel semiconductor pressure-controlled valve as described in claim 1, characterized in that: The swing ejection assembly includes a drive motor (9), a drive gear shaft (3), a driven gear (4), and a transmission shaft (8). The drive motor (9) is fixedly installed on the bottom side of the lower housing (2). The output end of the drive motor (9) is connected to the drive gear shaft (3). The driven gear (4) is meshed with the side surface of the drive gear shaft (3). The transmission shaft (8) is installed inside the driven gear (4). The top end of the transmission shaft (8) passes through the upper housing (1) and is connected to the valve plate (10). A pneumatic slider (5) is provided at the bottom end of the transmission shaft (8).

4. The pushing mechanism of the novel semiconductor pressure-controlled valve as described in claim 3, characterized in that: The driven gear (4) is composed of a circular disk and an arc-shaped toothed plate. The circular disk and the arc-shaped toothed plate are integrally formed. The arc-shaped toothed plate has a circular arc-shaped cross-section when viewed from above. The arc-shaped toothed plate is meshed with the drive gear shaft (3).

5. The pushing mechanism of the novel semiconductor pressure-controlled valve as described in claim 3, characterized in that: The top and bottom ends of the drive gear shaft (3) are respectively equipped with bearings, and the bearings are respectively installed in the upper housing (1) and the lower housing (2).

6. The pushing mechanism of the novel semiconductor pressure-controlled valve as described in claim 1, characterized in that: The lower housing (2) is provided with a high-pressure gas flow chamber (11).

7. The pushing mechanism of the novel semiconductor pressure-controlled valve as described in claim 3, characterized in that: The pneumatic slider (5) has a guide shaft installed in its inner cavity, and the top end of the guide shaft extends to the inner cavity of the guide groove opened at the bottom end of the transmission shaft (8).

8. The pushing mechanism of the novel semiconductor pressure-controlled valve as described in claim 7, characterized in that: A needle roller bearing (7) is sleeved on the surface of the guide shaft, and the needle roller bearing (7) is disposed between the transmission shaft (8) and the pneumatic slider (5).

9. The pushing mechanism of the novel semiconductor pressure-controlled valve as described in claim 1, characterized in that: A sealing ring (6) is installed in the sealing groove inside the lower housing (2), and the inner wall of the sealing ring (6) slides against the outer surface of the pneumatic slider (5).

10. The pushing mechanism of the novel semiconductor pressure-controlled valve as described in claim 3, characterized in that: The bottom end of the pneumatic slider (5) is located inside the gas flow chamber (11), and the bottom of the pneumatic slider (5) is subjected to air pressure from the high-pressure gas channel of the gas flow chamber (11).

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