Condenser for resin production

Abstract

The utility model discloses a condenser for resin production, which relates to the technical field of resin production and comprises a body, a mounting plate is mounted on the outer side of the body, a base is mounted at the bottom of the body, and a cooling component for cooling the body is arranged in the base. A dustproof assembly used for preventing dust is arranged on one side of the body. The cooling device has the advantages that cold air in the shell is blown to the heat conducting fins through the cooling fan, heat adsorbed by the heat conducting fins is blown out of the base, the cooling effect of the heat conducting fins on the body is improved, the cold air is blown to the interior of the base through the cooling fan, the temperature in the base is lowered, and the cooling effect on the body is improved; and the effect of filtering dust entering the body during condensation is achieved through the dustproof net, the problem that the dust blocks a pipeline or scratches fins is avoided, dust attachment is reduced, and the heat exchange efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to resin production technical field, especially a condenser for resin production. BACKGROUND

[0002] Resin production is a chemical process involving the conversion of monomers into high molecular materials such as plastics, coatings or adhesives through polymerization reactions. Condensers are used in resin production to cool the reaction mixture or solvent vapors, controlling reaction temperature, recovering solvents or removing impurities. Efficient operation of condensers is crucial for improving production efficiency and product quality.

[0003] The existing condenser in use, the condenser usually through air as cooling medium, the heat of refrigerant vapor is taken away, however, in long time high load operation, the temperature inside the condenser can be significantly increased, resulting in condensing efficiency, even cause equipment failure, and the internal temperature is too high, can cause condensing pressure to rise, reduce refrigeration efficiency, and the air-cooled condenser is cooled by air, in the environment with more dust, dust will adhere to the fin and pipe surface of condenser, hinder the air flow, reduce the heat dissipation efficiency. SUMMARY

[0004] This section aims to outline some aspects of the embodiments of the present utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the utility model name to avoid obscuring the purpose of this section, the abstract of the specification and the utility model name. Such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] To solve the above technical problems, the utility model provides the following technical scheme:

[0006] A condenser for resin production, comprising a body, the outer side of the body is provided with a mounting plate, the bottom of the body is provided with a base, the inside of the base is provided with a cooling assembly for cooling the body, one side of the body is provided with a dustproof assembly for dust prevention;

[0007] The cooling assembly comprises heat-conducting fins mounted in the base for absorbing the heat generated by the body, the inner wall of the base is fixed with a shell, the inner wall of the shell is mounted with a semiconductor refrigerator, and the inner wall of the shell is mounted with a cooling fan for cooling the heat-conducting fins.

[0008] The dustproof assembly comprises a partition plate fixed to one side of the body, two groups of supporting blocks are fixed to one side of the partition plate, a limiting rod is fixed to the top of the supporting blocks, and a dustproof net for dust prevention of the body is arranged on the outer side of the limiting rod.

[0009] As a preferred scheme of the condenser for resin production, the inner wall of the base is fixed with a flow guide frame for guiding the cooling air, and the top of the flow guide frame is fixed with a flow guide cover.

[0010] As a preferred scheme of the condenser for resin production, the outer side of the dustproof net is fixed with a plurality of sliding sleeves, and the top of the limiting rod is threadedly connected with a nut for limiting the dustproof net.

[0011] As a preferred scheme of the condenser for resin production, one side of the partition plate is fixed with a fixing frame, one side of the fixing frame is clamped with a mounting frame, and the inner wall of the mounting frame is threadedly connected with a fixing bolt for fixing the fixing frame.

[0012] As a preferred scheme of the condenser for resin production, one side of the mounting frame is fixed with a supporting rod, and one end of the supporting rod is fixed with a mounting disc for mounting the body.

[0013] As a preferred scheme of the condenser for resin production, the top of the body is fixed with a supporting frame, the inner wall of the supporting frame is slidably connected with a sliding block, one side of the sliding block is fixed with a supporting plate, and the bottom of the supporting plate is mounted with a sound-absorbing plate for noise reduction of the body.

[0014] As a preferred scheme of the condenser for resin production, the top of the supporting plate is fixed with a supporting disc, and the top of the supporting disc is fixed with a protective cover.

[0015] The condenser for resin production has the following beneficial effects: the cooling fan blows the cold air in the shell to the heat-conducting fins to blow out the heat absorbed by the heat-conducting fins, improves the cooling effect of the heat-conducting fins on the body, and blows the cold air in the base by the cooling fan to reduce the temperature in the base and improve the cooling effect on the body; the dustproof net filters the dust entering the body during condensation, avoids the problem of dust blocking the pipeline or scratching the fins, reduces dust adhesion, improves heat exchange efficiency, the sound-absorbing plate absorbs the noise generated by the body, and achieves the effect of noise reduction during use of the body. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor. Among them:

[0017] Fig. 1 It is an overall structural diagram of a condenser for resin production.

[0018] Fig. 2 It is a structural diagram of a base in a condenser for resin production.

[0019] Fig. 3 It is a structural diagram of a dustproof assembly in a condenser for resin production.

[0020] Fig. 4 It is a structural diagram of a support plate in a condenser for resin production.

[0021] In the figure, 1 is a body, 2 is a mounting plate, 3 is a base, 4 is a cooling assembly, 41 is a heat-conducting fin, 42 is a shell, 43 is a semiconductor refrigerator, 44 is a cooling fan, 5 is a dustproof assembly, 51 is a partition plate, 52 is a support block, 53 is a limiting rod, 54 is a dustproof net, 6 is a flow guide frame, 7 is a flow guide cover, 8 is a sliding sleeve, 9 is a nut, 10 is a fixing frame, 11 is a mounting frame, 12 is a support rod, 13 is a mounting disc, 14 is a fixing bolt, 15 is a support frame, 16 is a sliding block, 17 is a support plate, 18 is a sound-absorbing plate, 19 is a support disc, and 20 is a protective cover. DETAILED DESCRIPTION

[0022] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0023] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application, but the present application can also be practiced in other ways different from those described herein, and those skilled in the art can make similar generalizations without departing from the connotation of the present application, therefore the present application is not limited by the specific embodiments disclosed below.

[0024] Secondly, the "one embodiment" or "embodiment" referred to herein means that the specific features, structures or characteristics can be included in at least one implementation of the present application. In this specification, "in one embodiment" does not mean the same embodiment, nor is it an independent or alternative embodiment that excludes other embodiments.

[0025] Embodiment one:

[0026] Reference Figs. 1-4For the first embodiment of the utility model, this embodiment provides a condenser for resin production, including body 1, the outside of body 1 is equipped with mounting plate 2, the bottom of body 1 is equipped with base 3, the inside of base 3 is provided with cooling assembly 4 for cooling body 1, one side of body 1 is provided with dustproof assembly 5 for dust prevention.

[0027] Body 1 is the air-cooled condenser in prior art, body 1 and base 3 are all fixed with mounting plate 2 by bolt, base 3 is installed at the bottom of body 1 by mounting plate 2, the effect of cooling and heat dissipation to body 1 is achieved by cooling assembly 4, improves the condensing efficiency of body 1, the effect of dust prevention to the air inlet of body 1 is achieved by setting dustproof assembly 5, avoids the problem that dust adheres to the surface of fin and pipeline.

[0028] Cooling assembly 4 includes heat-conducting fin 41 installed in the inside of base 3 for adsorbing the heat generated by body 1, the inner wall of base 3 is fixed with shell 42, the inner wall of shell 42 is installed with semiconductor refrigerator 43, the inner wall of shell 42 is installed with cooling fan 44 for cooling heat-conducting fin 41.

[0029] Heat-conducting fin 41 is prior art, which is a kind of metal component for enhancing heat exchange efficiency, usually made of high-thermal-conductivity material, with large surface area, the purpose is to expand the contact area with cooling medium, improve heat transfer efficiency, not described here, the effect of adsorbing the heat generated by body 1 is achieved by heat-conducting fin 41, reduce the temperature of body 1 when working, semiconductor refrigerator 43 is a thermoelectric device based on Peltier effect, driven by direct current two different semiconductor materials, energy transfer is realized at its junction, one end absorbs heat and refrigerates, the other end releases heat, changing the direction of current can switch refrigeration and heating function, which is prior art and not described here, the cold end of semiconductor refrigerator 43 is arranged in the inside of shell 42, semiconductor refrigerator 43 is started to refrigerate, so that the inside of shell 42 is full of cold air, cooling fan 44 is started to blow the cold air in the inside of shell 42 to heat-conducting fin 41, the heat adsorbed by heat-conducting fin 41 is blown out of base 3, improve the cooling effect of heat-conducting fin 41 to body 1, and cooling fan 44 blows the cold air to the inside of base 3, so that the temperature in the inside of base 3 is reduced, improve the cooling effect to body 1.

[0030] Dustproof assembly 5 includes partition 51 fixed on one side of body 1, two groups of support blocks 52 are fixed on one side of partition 51, limit rod 53 is fixed on the top of support block 52, dust screen 54 for dust prevention of body 1 is arranged on the outside of limit rod 53.

[0031] The dustproof net 54 is located between the two groups of limiting rods 53, and the dustproof net 54 can filter dust entering the inside of the body 1 during condensation, so that the problem of pipe blockage or fin scratching caused by dust is avoided, dust adhesion is reduced, and heat exchange efficiency is improved.

[0032] Embodiment two:

[0033] For the second embodiment of the utility model, the embodiment is based on the previous embodiment.

[0034] Specifically, the inner wall of the base 3 is fixed with a flow guide frame 6 for guiding the cooling wind, and the top of the flow guide frame 6 is fixed with a flow guide cover 7.

[0035] The cooling fan 44 blows out the cold wind to the heat conduction fin 41 through the flow guide frame 6, improves the cooling effect of the heat conduction fin 41, and the flow guide cover 7 is used to spread the cold wind blown out by the cooling fan 44 in the base 3, so that the temperature in the base 3 is reduced, and the cooling effect of the body 1 is improved.

[0036] Specifically, the outer side of the dustproof net 54 is fixed with a plurality of sliding sleeves 8, and the top of the limiting rod 53 is threadedly connected with a nut 9 for limiting the dustproof net 54.

[0037] The inner wall of the sliding sleeve 8 is slidably connected with the outer side of the limiting rod 53, the sliding sleeve 8 is clamped on the outer side of the limiting rod 53, the dustproof net 54 is installed, the nut 9 is installed on the top of the limiting rod 53, and the dustproof net 54 is limited.

[0038] Specifically, the side of the partition plate 51 is fixed with a fixing frame 10, the side of the fixing frame 10 is clamped with a mounting frame 11, and the inner wall of the mounting frame 11 is threadedly connected with a fixing bolt 14 for fixing the fixing frame 10.

[0039] The inner wall of the fixing frame 10 is clamped with the outer side of the mounting frame 11, the mounting frame 11 is fixed on the outer side of the fixing frame 10 through the fixing bolt 14, and the fixing frame 10 and the mounting frame 11 are both provided with two groups.

[0040] Specifically, the side of the mounting frame 11 is fixed with a supporting rod 12, and one end of the supporting rod 12 is fixed with a mounting disc 13 for mounting the body 1.

[0041] The body 1 can be mounted through the mounting disc 13, the stability of the body 1 during use is improved, the body 1 and the fixing frame 10 can be installed in the inside of the mounting frame 11 through the fixing bolt 14, and the body 1 is convenient for subsequent disassembly and maintenance.

[0042] Embodiment three:

[0043] For the third embodiment of the utility model, the embodiment is based on the previous two embodiments.

[0044] Specifically, a support frame 15 is fixed to the top of the main body 1, a slider 16 is slidably connected to the inner wall of the support frame 15, a support plate 17 is fixed to one side of the slider 16, and a sound-absorbing plate 18 for noise reduction of the main body 1 is installed at the bottom of the support plate 17.

[0045] The sound-absorbing panel 18 is made of glass wool, and its internal fiber structure can efficiently absorb sound wave energy. This is existing technology and will not be described in detail here. The sound-absorbing panel 18 can absorb the noise generated by the main body 1, thereby reducing noise when the main body 1 is in use. The slider 16 slides inside the support frame 15, which facilitates the subsequent disassembly of the support plate 17 and the sound-absorbing panel 18.

[0046] Specifically, a support plate 19 is fixed to the top of the support plate 17, and a protective cover 20 is fixed to the top of the support plate 19.

[0047] The protective cover 20 is made of silicone. The protective cover 20 protects the top of the main body 1 and prevents the main body 1 from being damaged by collisions or falling objects.

[0048] During use, the heat-conducting fins 41 absorb the heat generated by the main body 1, reducing the operating temperature of the main body 1. The semiconductor cooler 43 is activated to cool the interior of the housing 42, filling it with cool air. The cooling fan 44 blows the cool air from the housing 42 onto the heat-conducting fins 41, expelling the heat absorbed by the fins 41 from the base 3, thus improving the cooling effect of the heat-conducting fins 41 on the main body 1. The cooling fan 44 also blows the cool air into the base 3, lowering the internal temperature and further improving the cooling effect on the main body 1. The air guide 6 directs the cool air from the cooling fan 44 to the heat-conducting fins 41, enhancing the cooling effect. The air guide 7 distributes the cool air from the cooling fan 44 throughout the base 3. The sliding sleeve 8 is secured to the outside of the limiting rod 53. The dustproof net 54 is installed on the top of the limiting rod 53 by the nut 9, which limits the position of the dustproof net 54 and facilitates its subsequent disassembly and replacement. The dustproof net 54 filters the dust that enters the body 1 during condensation, preventing dust from clogging the pipes or scratching the fins, reducing dust adhesion, and improving heat exchange efficiency. The fixing bolts 14 can be used to install the body 1 and the fixing frame 10 inside the mounting frame 11, which facilitates the subsequent disassembly and maintenance of the body 1. The sound-absorbing plate 18 absorbs the noise generated by the body 1, achieving noise reduction when the body 1 is in use. The slider 16 slides inside the support frame 15, which facilitates the subsequent disassembly of the support plate 17 and the sound-absorbing plate 18.

[0049] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present application, and they should be covered in the scope of the claims of the present application.

Claims

1. A condenser for resin production, comprising a body (1), characterized in that: An mounting plate (2) is installed on the outside of the main body (1), a base (3) is installed on the bottom of the main body (1), a cooling component (4) for cooling the main body (1) is provided inside the base (3), and a dustproof component (5) for dust prevention is provided on one side of the main body (1). The cooling assembly (4) includes heat-conducting fins (41) installed inside the base (3) for adsorbing the heat generated by the body (1). A shell (42) is fixed to the inner wall of the base (3). A semiconductor cooler (43) is installed on the inner wall of the shell (42). A cooling fan (44) for cooling the heat-conducting fins (41) is installed on the inner wall of the shell (42). The dustproof component (5) includes a partition (51) fixed to one side of the body (1), two sets of support blocks (52) are fixed to one side of the partition (51), a limit rod (53) is fixed to the top of the support block (52), and a dustproof net (54) for dustproofing the body (1) is provided on the outside of the limit rod (53).

2. The condenser for resin production as described in claim 1, characterized in that: The inner wall of the base (3) is fixed with a flow guide frame (6) for guiding the cooling air, and the top of the flow guide frame (6) is fixed with a flow guide cover (7).

3. The condenser for resin production as described in claim 1, characterized in that: Multiple sets of sliding sleeves (8) are fixed on the outside of the dustproof net (54), and a nut (9) for limiting the dustproof net (54) is threadedly connected to the top of the limiting rod (53).

4. The condenser for resin production as described in claim 1, characterized in that: A fixing bracket (10) is fixed on one side of the partition (51), and a mounting bracket (11) is snapped onto one side of the fixing bracket (10). The inner wall of the mounting bracket (11) is threaded with fixing bolts (14) for fixing the fixing bracket (10).

5. The condenser for resin production as described in claim 4, characterized in that: A support rod (12) is fixed to one side of the mounting bracket (11), and a mounting plate (13) for mounting the main body (1) is fixed to one end of the support rod (12).

6. The condenser for resin production as described in claim 1, characterized in that: The top of the body (1) is fixed with a support frame (15), and a slider (16) is slidably connected to the inner wall of the support frame (15). A support plate (17) is fixed to one side of the slider (16), and a sound-absorbing plate (18) for noise reduction of the body (1) is installed at the bottom of the support plate (17).

7. The condenser for resin production as described in claim 6, characterized in that: The top of the support plate (17) is fixed with a support plate (19), and the top of the support plate (19) is fixed with a protective cover (20).

Images