RA8D1-based minimum system board

Abstract

The utility model relates to the technical field of automation, in particular to an RA8D1-based minimum system board, which comprises a core board, an RA8D1 single chip microcomputer is fixedly arranged at the center of the front surface of the core board, a camera interface is fixedly arranged at the center of the left side of the front surface of the core board, and a debugging interface and a USB interface are respectively arranged at the right side of the front surface of the core board. According to the utility model, the problems that a development suite taking RA8D1 as a main chip, especially a minimum system board, is lacked in the market, the current RA8D1 chip is not easy to use, and the high performance cannot be exerted are solved, a BGA pin of a single chip microcomputer is led out through BTB, the use of a user is facilitated, necessary power supplies and peripheral devices are integrated, necessary resistance-capacitance elements are integrated, the trouble in use is reduced, and the cost is reduced. The RA8D1 chip has the advantages that the heat conduction plate 121 is utilized to conduct out heat on the surface of the core plate 1, and the working durability and smoothness of the chip are greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of automation technology, specifically a minimum system board based on RA8D1. Background Technology

[0002] The newly invented Cortex-M85 core offers scalar computation performance 30% higher than the Cortex-M7. It utilizes Helium technology, an M-type vector extension of the Arm Cortex-M processor family, which delivers significant performance improvements for machine learning and digital signal processing applications. It boasts higher machine learning performance than traditional ARM core microcontrollers.

[0003] The RA8D1 series, the first microcontroller based on the Arm® Cortex®-M85 (CM85) core, boasts an industry-leading CoreMark / MHz score of 6.39, offering superior performance, efficiency, security, and a wide range of peripherals, thus narrowing the performance gap between MCUs and MPUs.

[0004] There is a lack of development kits on the market that use RA8D1 as the main chip, especially minimum system boards. The current RA8D1 chip is not easy to use and its high performance cannot be fully utilized. In order to solve the above technical problems, we have designed a minimum system board based on RA8D1. Utility Model Content

[0005] The purpose of this invention is to provide a minimum system board based on RA8D1, which has the advantages of high performance and ease of use. It solves the problem that there is a lack of development kits based on RA8D1 as the main chip on the market, especially minimum system boards. Currently, the RA8D1 chip is not easy to use and its high performance cannot be fully utilized.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a minimum system board based on RA8D1, comprising a core board, wherein an RA8D1 microcontroller is fixedly mounted at the center of the front surface of the core board, a camera interface is fixedly mounted at the center of the left side of the front surface of the core board, a debug interface and a USB interface are respectively mounted on the right side of the front surface of the core board, a QSPI Flash memory chip, an SDRAM memory chip and a BOOT button are respectively fixedly mounted on the front surface of the core board, a TF card interface is fixedly mounted on the right side of the back surface of the core board, BTB interfaces are fixedly mounted at the top and bottom of the back surface of the core board, and heat dissipation components are fixedly mounted at the top and bottom of the front surface of the core board. The heat dissipation components include a heat-conducting plate, a heat-conducting aluminum sheet is fixedly mounted on the front surface of the heat-conducting plate, and a fan is fixedly connected to the surface of the heat-conducting aluminum sheet.

[0007] Preferably, a P704 indicator light and a power light are fixedly installed on the top and bottom of the left side of the core board, respectively, and an RST button is fixedly installed on the upper right corner of the core board.

[0008] Preferably, mounting plates are fixedly installed on both the left and right sides of the heat-conducting plate, and screws are provided through the surface of the mounting plates, with the rear ends of the screws threadedly connected to the surface of the core plate.

[0009] Preferably, a water tank is installed at one end of the heat-conducting plate, and a semiconductor cooling chip is fixedly connected to one end of the heat-conducting plate through the interior of the water tank. A heat dissipation plate is fixedly connected to the heat-generating end of the semiconductor cooling chip.

[0010] Preferably, positioning posts are provided through both ends of the surface of the water tank, a water injection valve is provided on the surface of the water tank, and the heat-conducting plate is fixedly connected to the cooling end of the semiconductor cooling chip.

[0011] Preferably, the back of the heat-conducting plate is filled with thermal grease between the surface of the core plate and the back of the heat-conducting plate, and the fan blows air towards the heat-conducting plate.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] This utility model brings out the microcontroller's BGA pins through BTB, making it convenient for users. It integrates necessary power supplies and peripheral devices, as well as necessary resistors and capacitors, reducing the hassle of use and achieving the effect of easy use. It greatly enhances the high performance of the RA8D1 chip. At the same time, it uses the heat dissipation plate 121 to conduct heat off the surface of the core board 1, enabling efficient heat dissipation during chip use and greatly improving the chip's durability and smoothness of operation. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the rear view structure of this utility model;

[0016] Figure 3 This is a partial structural diagram of the heat dissipation component of this utility model.

[0017] Figure 4 This is a schematic diagram of the workflow of this utility model;

[0018] Figure 5 The circuit of this utility model Figure 1 ;

[0019] Figure 6 The circuit of this utility model Figure 2 ;

[0020] Figure 7The circuit of this utility model Figure 3 ;

[0021] Figure 8 The circuit of this utility model Figure 4 ;

[0022] Figure 9 The circuit of this utility model Figure 5 ;

[0023] Figure 10 The circuit of this utility model Figure 6 ;

[0024] Figure 11 The circuit of this utility model Figure 7 ;

[0025] Figure 12 The circuit of this utility model Figure 8 ;

[0026] Figure 13 The circuit of this utility model Figure 9 ;

[0027] Figure 14 The circuit of this utility model Figure 10 ;

[0028] Figure 15 The circuit of this utility model Figure 10 one;

[0029] Figure 16 The circuit of this utility model Figure 10 two;

[0030] Figure 17 The circuit of this utility model Figure 10 three;

[0031] Figure 18 The circuit of this utility model Figure 10 Four;

[0032] Figure 19 The circuit of this utility model Figure 10 five.

[0033] In the diagram: 1. Core board; 2. RA8D1 microcontroller; 3. SDRAM memory chip; 4. QSPI Flash memory chip; 5. USB interface; 6. Debug interface; 7. Camera interface; 8. BOOT button; 9. RST button; 10. P704 indicator light; 11. Power indicator light; 12. Heat dissipation component; 121. Heat conduction plate; 122. Fan; 123. Thermal conductive aluminum sheet; 124. Mounting plate; 125. Positioning post; 126. Semiconductor cooling chip; 127. Heat sink; 128. Water tank; 13. TF card interface; 14. BTB interface. Detailed Implementation

[0034] Please see Figures 1-19 A minimum system board based on RA8D1 includes a core board 1. An RA8D1 microcontroller 2 (model R7FA8D1AHECBD) is fixedly mounted at the center of the front surface of the core board 1. A camera interface 7 (for connecting a camera) is fixedly mounted at the center of the left side of the front surface of the core board 1. A debugging interface 6 and a USB interface 5 are mounted on the right side of the front surface of the core board 1. The USB interface 5 is used to expand the microcontroller's USB functionality, and the debugging interface 6 is used for downloading programs to debug the microcontroller. A QSPI Flash memory chip 4, an SDRAM memory chip 3, and a BOOT button 8 are fixedly mounted on the front surface of the core board 1. The SDRAM memory chip 3 (model H57V2562GFR-60C) and the QSPI... The Flash memory chip 4 is model W25Q64JVSSIQ. The BOOT button 8 is used to switch the boot mode. A TF card interface 13 is fixedly installed on the right side of the back surface of the core board 1. The TF card interface 13 is used to expand the SDIO function of the microcontroller. BTB interfaces 14 are fixedly installed on the top and bottom of the back surface of the core board 1. BTB interfaces 14 are used to bring out the GPIO of the microcontroller for user use. Heat dissipation components 12 are fixedly installed on the top and bottom of the front surface of the core board 1. The heat dissipation components 12 include a heat conduction plate 121. A heat conduction aluminum sheet 123 is fixedly installed on the front surface of the heat conduction plate 121. A fan 122 is fixedly connected to the surface of the heat conduction aluminum sheet 123.

[0035] Please see Figure 1 On the top and bottom left side of the core board 1, P704 indicator light 10 and power light 11 are fixedly installed respectively. P704 indicator light 10 is a user-controllable indicator light, and power light 11 is used to indicate whether the power supply is normal. RST button 9 is fixedly installed in the upper right corner of the core board 1. RST button 9 is used to reset the microcontroller.

[0036] Please see Figures 1-3 Mounting plates 124 are fixedly installed on both the left and right sides of the heat-conducting plate 121. Screws are provided through the surface of the mounting plate 124, and the rear end of the screws is threaded to the surface of the core plate 1. By setting screws, the mounting plate 124 can be easily fixed to the surface of the core plate 1.

[0037] Please see Figure 3 A water tank 128 is installed at one end of the heat-conducting plate 121. One end of the heat-conducting plate 121 extends into the interior of the water tank 128 and is fixedly connected to a semiconductor cooling chip 126. The heat-generating end of the semiconductor cooling chip 126 is fixedly connected to a heat sink 127. By setting the heat sink 127, the heat on the surface of the semiconductor cooling chip 126 can be easily dissipated.

[0038] Please see Figure 3 Positioning posts 125 are provided through both ends of the surface of the water tank 128, and a water injection valve is provided on the surface of the water tank 128. The heat conduction plate 121 is fixedly connected to the cooling end of the semiconductor cooling chip 126.

[0039] Please see Figure 3 Thermal grease is filled between the back of the heat-conducting plate 121 and the surface of the core board 1. The airflow of the fan 122 is directed towards the heat-conducting plate 121. With the help of multiple heat dissipation and heat conduction structures, the chip can maintain an operating temperature of ≤65℃ under full load.

[0040] In use, a 5V power supply is input via USB interface 5 or BTB interface 14, and the voltage is regulated by the RY9121E voltage regulator chip to output 3.3V. This output is supplied to other peripherals on the core board 1 and the RA8D1 microcontroller 2. The RA8D1 microcontroller 2 has a set of step-down chips inside, which can be stepped down by adding some external resistors and capacitors to output a core voltage of 1.2V for the chip to use. The RA8D1 microcontroller 2 communicates with the QSPI Flash memory chip 4 via SPI, with the SDRAM memory chip 3 via a parallel bus, with the TF card interface 13 (for external TF card insertion) via SDIO, with the camera interface 7 (for external camera connection) via DVP, and with the debug interface 6 via the SW debug interface.

[0041] In summary, this RA8D1-based minimum system board, through its core board 1, RA8D1 microcontroller 2, SDRAM memory chip 3, QSPI Flash memory chip 4, USB interface 5, debug interface 6, camera interface 7, BOOT button 8, RST button 9, P704 indicator light 10, power light 11, heat dissipation component 12, TF card interface 13, and BTB interface 14, solves the problem of the lack of development kits based on the RA8D1 as the main chip in the market, especially the minimum system board, and the current RA8D1 chip being difficult to use and unable to achieve its high performance.

Claims

1. A minimum system board based on RA8D1, comprising a core board (1), characterized in that: A RA8D1 microcontroller (2) is fixedly installed at the center of the front surface of the core board (1). A camera interface (7) is fixedly installed at the center of the left side of the front surface of the core board (1). A debugging interface (6) and a USB interface (5) are respectively installed on the right side of the front surface of the core board (1). A QSPI Flash memory chip (4), an SDRAM memory chip (3) and a BOOT button (8) are respectively fixedly installed on the front surface of the core board (1). A TF card interface (13) is fixedly installed on the right side of the back surface of the core board (1). A BTB interface (14) is fixedly installed on the top and bottom of the back surface of the core board (1). A heat dissipation assembly (12) is fixedly installed on the top and bottom of the front surface of the core board (1). The heat dissipation assembly (12) includes a heat-conducting plate (121). A heat-conducting aluminum sheet (123) is fixedly installed on the front surface of the heat-conducting plate (121). A fan (122) is fixedly connected to the surface of the heat-conducting aluminum sheet (123).

2. The minimum system board based on RA8D1 according to claim 1, characterized in that: The top and bottom left sides of the core board (1) are respectively fixedly installed with a P704 indicator light (10) and a power light (11), and the upper right corner of the core board (1) is fixedly installed with an RST button (9).

3. A minimum system board based on RA8D1 according to claim 1, characterized in that: Mounting plates (124) are fixedly installed on both the left and right sides of the heat-conducting plate (121). Screws are provided through the surface of the mounting plate (124), and the rear end of the screws is threaded to the surface of the core plate (1).

4. A minimum system board based on RA8D1 according to claim 3, characterized in that: A water tank (128) is installed at one end of the heat-conducting plate (121). One end of the heat-conducting plate (121) extends into the interior of the water tank (128) and is fixedly connected to a semiconductor cooling chip (126). The heat-generating end of the semiconductor cooling chip (126) is fixedly connected to a heat sink plate (127).

5. A minimum system board based on RA8D1 according to claim 4, characterized in that: Positioning posts (125) are provided through both ends of the surface of the water tank (128), and a water injection valve is provided on the surface of the water tank (128). The heat-conducting plate (121) is fixedly connected to the cooling end of the semiconductor cooling chip (126).

6. A minimum system board based on RA8D1 according to claim 3, characterized in that: The back of the heat-conducting plate (121) is filled with thermal grease between the contact surface of the core plate (1) and the fan (122) is directed toward the heat-conducting plate (121).

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