Memory liquid cooling heat dissipation structure

Abstract

The utility model relates to a memory liquid cooling heat dissipation structure, which belongs to the technical field of memory heat dissipation and comprises a mainboard, a processor is fixed on the mainboard, a processor cold plate is fixed at the top of the processor, and a plurality of memory banks positioned on one side of the processor cold plate are fixed on the mainboard. A plurality of memory radiator cold plates which are symmetrically distributed on the two sides of the memory banks are fixed to the main board, and a heat conduction assembly used for conducting heat on the memory banks is arranged between every two corresponding memory radiator cold plates on the left side and the right side. According to the memory liquid cooling heat dissipation structure, the memory bank generates heat, transmission and output of the heat of the memory bank are achieved through the arrangement of the heat conduction assembly, heat dissipation of the memory bank is achieved through the memory radiator cold plate, secondary heat dissipation of the structure is achieved through the arrangement of the heat dissipation assembly, and the heat dissipation efficiency is improved through sliding connection of the heat conduction block and the memory radiator cold plate. And in cooperation with locking of the limiting rods, overall flexible adjustment is achieved, overall use is convenient and stable, and the use effect is good.

Description

TECHNICAL FIELD

[0001] The utility model relates to memory heat dissipation technical field, concretely is a memory liquid cooling heat dissipation structure. BACKGROUND

[0002] Central processing unit and memory are the most important components in server products, about 80% of total power consumption, with the rapid improvement of server product performance, the heat dissipation requirement of central processing unit and memory is also higher and higher, the original air cooling has not been able to meet the demand, liquid cooling is more and more important, especially for the liquid cooling heat dissipation challenge of server memory, because the spacing of memory on the mainboard is smaller and smaller, the space for designing liquid cooling scheme is also smaller and smaller.

[0003] The existing memory liquid cooling scheme in the industry can be applied to a single memory or a small amount of memory, but there are assembly problems caused by design and assembly tolerance in the use environment of multiple memories, which seriously affects the product reliability of the server, and therefore a memory liquid cooling heat dissipation structure is provided to solve the above problems. UTILITY MODEL CONTENT

[0004] In view of the defects of the prior art, the utility model provides a memory liquid cooling heat dissipation structure, which has the advantages of good use effect, and solves the problem of poor use effect of liquid cooling heat dissipation.

[0005] To achieve the above purpose, the utility model provides the following technical scheme: a memory liquid cooling heat dissipation structure, comprising a mainboard, the mainboard is fixed with a central processing unit, the top of the central processing unit is fixed with a processor cold plate, the mainboard is also fixed with a plurality of memory sticks located on one side of the processor cold plate, the mainboard is fixed with a plurality of memory radiator cold plates which are symmetrically distributed on both sides of the plurality of memory sticks, and a heat conduction component for conducting heat to the memory stick is arranged between the left and right corresponding two memory radiator cold plates.

[0006] The memory radiator cold plate is also provided with a heat dissipation component for dissipating the heat conducted by the heat conduction component and communicating with the processor cold plate, and the memory stick and the heat conduction component are provided with a protection component.

[0007] Further, the heat conduction component comprises a heat sink, the heat sink is fixed with a heat pipe, the left and right sides of the heat pipe are fixed with heat conduction blocks, the outer side of the heat conduction block is fixed with heat conduction silicone grease, and the heat conduction block is movably connected with the heat dissipation component.

[0008] Further, the heat dissipation component comprises a memory radiator interface structure fixed to the inner side of the memory radiator cold plate, the inner side of the memory radiator interface structure is fixed with a liquid pipeline, and the memory radiator cold plate is inserted with a limiting rod inserted with the heat conduction block.

[0009] Further, the protection assembly comprises a memory interface structure fixed outside the memory bank, the memory interface structure is fixed with a memory protection sheet outside, and the memory protection sheet is fixed with a memory clamp outside.

[0010] Further, a plurality of plug-in holes are formed in the top of the memory radiator cold plate, and a connecting hole matched with the plug-in hole is formed in the memory radiator interface structure.

[0011] Further, a bearing hole matched with the plug-in hole is formed in the top of the heat conduction block, and the limiting rod is sequentially plugged with the memory radiator cold plate, the memory radiator interface structure and the heat conduction block through the plug-in hole, the connecting hole and the bearing hole.

[0012] Further, a sliding channel is formed in the side of the memory radiator cold plate close to the heat conduction block, and the heat conduction block is slidingly connected with the memory radiator cold plate through the sliding channel.

[0013] Further, the output pipe of the liquid pipeline is fixedly communicated with a connecting pipe, and the processor cold plate is communicated with the heat dissipation assembly through the connecting pipe.

[0014] Compared with the prior art, the technical scheme of the present application has the following beneficial effects:

[0015] The memory liquid cooling heat dissipation structure generates heat through the memory bank, realizes the transmission and output of the heat of the memory bank through the arrangement of the heat conduction assembly, realizes the preliminary heat dissipation of the memory bank through the memory radiator cold plate, realizes the carrying of the heat of the heat conduction block and the memory radiator cold plate through the liquid pipeline through the arrangement of the heat dissipation assembly, thereby realizing the secondary heat dissipation of the structure, and the further improvement of the heat dissipation effect is beneficial, the flexible adjustment of the whole is realized through the sliding connection effect of the heat conduction block and the memory radiator cold plate and the locking of the heat conduction block and the memory radiator cold plate by the limiting rod, the whole structure is simple, convenient and stable to use, and the use effect is good. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 It is an exploded view of the structure of the utility model;

[0017] Fig. 2 It is an exploded view of the structure of the heat conduction assembly and the protection assembly of the utility model;

[0018] Fig. 3 It is a three-dimensional structure schematic view of the heat conduction assembly of the utility model;

[0019] Fig. 4 It is an exploded view of the heat dissipation assembly structure of the utility model;

[0020] Fig. 5 It is a three-dimensional structure schematic view of the protection assembly of the utility model.

[0021] In the figure: 1 mainboard, 2 central processing unit, 3 memory strip, 4 memory radiator cold plate, 5 heat conduction assembly, 501 heat pipe, 502 heat dissipation fin, 503 heat conduction block, 504 heat conduction silicone grease, 6 heat dissipation assembly, 601 memory radiator interface structure, 602 liquid pipeline, 603 limiting rod, 7 protection assembly, 701 memory interface structure, 702 memory protection sheet, 703 memory clamp, 8 processor cold plate. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0023] Please refer to Figs. 1-2 In the embodiment, the memory liquid cooling heat dissipation structure comprises a mainboard 1, the central processing unit 2 is fixed on the mainboard 1, the processor cold plate 8 is fixed on the top of the central processing unit 2, a plurality of memory strips 3 are fixed on the mainboard 1 and located on one side of the processor cold plate 8, a plurality of memory radiator cold plates 4 are fixed on the mainboard 1 and symmetrically distributed on both sides of the plurality of memory strips 3, and the heat conduction assembly 5 for conducting heat to the memory strip 3 is arranged between the left and right corresponding two memory radiator cold plates 4.

[0024] It can be understood that, through the arrangement of the memory radiator cold plate 4, the heat transferred by the memory radiator can be preliminarily dissipated, the structure heat dissipation effect can be realized, and thus the heat dissipation effect can be improved.

[0025] The heat dissipation assembly 6 for dissipating the heat conducted by the heat conduction assembly 5 and communicating with the processor cold plate 8 is further arranged on the memory radiator cold plate 4, and the protection assembly 7 is arranged on the memory strip 3 and the heat conduction assembly 5.

[0026] In the embodiment, through the arrangement of the heat dissipation assembly 6, the heat on the memory radiator cold plate 4 and the heat conduction block 503 can be quickly carried under the flow of the cooling liquid in the liquid pipeline 602, the secondary heat dissipation of the structure is realized, the overall heat dissipation effect can be further improved, and thus the use effect can be improved.

[0027] Please refer to Fig. 3 In order to improve the use effect, the heat conduction assembly 5 in the embodiment comprises the heat dissipation fin 502, the heat pipe 501 is fixed on the heat dissipation fin 502, the heat conduction block 503 is fixed on the left and right sides of the heat pipe 501, the sliding channel is formed in the side of the memory radiator cold plate 4 close to the heat conduction block 503, and the heat conduction block 503 is slidably connected with the memory radiator cold plate 4 through the sliding channel.

[0028] It can also be understood that, by the sliding channel arrangement, the sliding displacement of the heat-conducting block 503 is facilitated, thereby facilitating the adjustment of the relative position between the memory heat spreader and the memory, thereby facilitating the improvement of the convenience of the overall structure, and further improving the use effect of the overall structure.

[0029] The top of the heat-conducting block 503 is provided with a receiving hole matched with the plug-in hole, the limiting rod 603 is plugged into the memory heat spreader cold plate 4, the memory heat spreader interface structure 601 and the heat-conducting block 503 through the plug-in hole, the connecting hole and the receiving hole in sequence, the outer side of the heat-conducting block 503 is fixed with the heat-conducting silicone grease 504, and the heat-conducting block 503 is movably connected with the heat dissipation assembly 6.

[0030] In this embodiment, the heat-conducting silicone grease 504, the L-shaped memory heat spreader interface structure 601 and the U-shaped memory heat spreader cold plate 4 are arranged, heat is transferred to the memory heat spreader cold plate 4 in three directions, thereby facilitating the rapid transfer of heat of the structure and improving the use effect.

[0031] Please refer to Fig. 4 In order to improve the use reliability, the heat dissipation assembly 6 in this embodiment comprises the memory heat spreader interface structure 601 fixed to the inner side of the memory heat spreader cold plate 4, the top of the memory heat spreader cold plate 4 is provided with a plurality of plug-in holes, and the connecting hole matched with the plug-in hole is arranged on the memory heat spreader interface structure 601.

[0032] It can be found that, by the arrangement of the plug-in hole and the connecting hole, the stable connection of the limiting rod 603 is facilitated, thereby improving the use stability of the overall structure, facilitating the up and down movement of the heat-conducting block 503 in the length direction of the hole, overcoming the memory assembly and contact problems caused by the tolerance changes of design, production and assembly, and improving the overall reliability and stability.

[0033] The inner side of the memory heat spreader interface structure 601 is fixed with the liquid pipeline 602, the output pipe of the liquid pipeline 602 is fixedly connected with a connecting pipe, the processor cold plate 8 is communicated with the heat dissipation assembly 6 through the connecting pipe, and the limiting rod 603 plugged with the heat-conducting block 503 is plugged into the memory heat spreader cold plate 4.

[0034] In this embodiment, by the arrangement of the memory heat spreader interface structure 601, the good heat transfer between the memory heat spreader cold plate 4 and the liquid pipeline 602 and the heat-conducting block 503 is facilitated, thereby improving the heat dissipation effect of the overall structure.

[0035] Please refer to Fig. 5In order to improve the stability, the protection assembly 7 in the embodiment comprises a memory interface structure 701 fixed outside the memory bank 3, the memory interface structure 701 is fixed with a memory protection sheet 702 outside, and the memory protection sheet 702 is fixed with a memory clamp 703 outside.

[0036] In the embodiment, the memory clamp 703 is not damaged when being installed downwardly by the setting of the memory protection sheet 702, and has a certain gap filling effect, which assists heat conduction to the memory clamp 703, is beneficial to heat transfer, improves the heat dissipation effect, and improves the stability of the structure.

[0037] In the embodiment, the electrical elements are electrically connected with the controller and the power supply, the control mode of the utility model is controlled by the controller, the control circuit of the controller can be realized by simple programming of the person skilled in the art, the power supply is also known in the art, and the utility model is mainly used for protecting the mechanical device, so the control mode and the circuit connection of the utility model are not explained in detail.

[0038] The working principle of the above embodiment is as follows:

[0039] The heat generated by the memory bank 3 is dissipated outside the memory bank 3, the heat generated by the memory bank 3 is transferred through the heat pipe 501 and the heat sink 502, the heat is transmitted through the fixed setting of the heat conduction block 503 and the heat pipe 501, the heat is preliminarily dissipated through the memory radiator cold plate 4, the heat on the memory radiator cold plate 4 and the heat conduction block 503 is quickly carried through the flow of the cooling liquid in the liquid pipeline 602, so that the secondary heat dissipation of the memory bank 3 is realized, the heat dissipation effect of the overall structure is improved, the sliding connection effect of the heat conduction block 503 and the memory radiator cold plate 4 is beneficial to realize the sliding adjustment of the overall memory radiator, the locking of the heat conduction block 503 and the memory radiator cold plate 4 is realized through the setting of the limiting rod 603, so that the stable use of the overall structure is facilitated, the quick disassembly and assembly of the structure is realized, the overall use convenience is improved, the overall structure is convenient to use, and the use effect is good.

[0040] It is to be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the presence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0041] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the application.

Claims

1. A liquid cooling structure for memory, comprising a motherboard (1), characterized in that: A central processing unit (2) is fixed on the motherboard (1), and a processor cold plate (8) is fixed on the top of the central processing unit (2). A plurality of memory modules (3) located on one side of the processor cold plate (8) are also fixed on the motherboard (1). A plurality of memory heat sinks (4) are fixed on the motherboard (1) and symmetrically distributed on both sides of the plurality of memory modules (3). A heat-conducting component (5) for conducting heat to the memory modules (3) is provided between two corresponding memory heat sinks (4). The memory heat sink cold plate (4) is also provided with a heat dissipation component (6) for dissipating the heat conducted by the heat conduction component (5) and communicating with the processor cold plate (8). The memory module (3) and the heat conduction component (5) are provided with protective components (7).

2. The memory liquid cooling structure according to claim 1, characterized in that: The heat-conducting component (5) includes a heat sink (502), a heat pipe (501) is fixed on the heat sink (502), and heat-conducting blocks (503) are fixed on both the left and right sides of the heat pipe (501). Thermal grease (504) is fixed on the outside of the heat-conducting blocks (503), and the heat-conducting blocks (503) are movably connected to the heat dissipation component (6).

3. The memory liquid cooling structure according to claim 2, characterized in that: The heat dissipation assembly (6) includes a memory heat sink interface structure (601) fixed to the inside of the memory heat sink cold plate (4), a liquid pipe (602) fixed to the inside of the memory heat sink interface structure (601), and a limiting rod (603) inserted into the memory heat sink cold plate (4) and inserted into the heat conduction block (503).

4. The memory liquid cooling structure according to claim 1, characterized in that: The protective component (7) includes a memory interface structure (701) fixed to the outside of the memory module (3), a memory protection plate (702) fixed to the outside of the memory interface structure (701), and a memory clip (703) fixed to the outside of the memory protection plate (702).

5. The memory liquid cooling structure according to claim 3, characterized in that: The top of the memory heat sink cold plate (4) is provided with multiple plug holes, and the memory heat sink interface structure (601) is provided with connection holes that are compatible with the plug holes.

6. The memory liquid cooling structure according to claim 5, characterized in that: The top of the heat-conducting block (503) is provided with a receiving hole that matches the plug-in hole. The limiting rod (603) is plugged into the memory heat sink cold plate (4), the memory heat sink interface structure (601) and the heat-conducting block (503) in sequence through the plug-in hole, the connecting hole and the receiving hole.

7. The memory liquid cooling structure according to claim 2, characterized in that: The memory heat sink cold plate (4) has a sliding channel on the side near the heat conduction block (503), and the heat conduction block (503) is slidably connected to the memory heat sink cold plate (4) through the sliding channel.

8. The memory liquid cooling structure according to claim 3, characterized in that: The liquid pipe (602) has a fixed connection to the output port of the liquid pipe (602), and the processor cold plate (8) is connected to the heat dissipation component (6) through the connection pipe.

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