Auxiliary heat dissipation device for rack-mounted server

Abstract

The utility model discloses a rack-mounted server auxiliary heat dissipation device in the technical field of server heat dissipation devices, which comprises a case body, a heat conducting plate is fixedly embedded in the center of the case body, fixing blocks are fixedly connected to four corners of the back of the case body, and limiting fixing holes are fixedly formed in the inner sides of the fixing blocks. A limiting fixing hole is formed in the case body, one end of the interior of the limiting fixing hole is fixedly connected with an abutting spring, one end of the abutting spring is fixedly connected with an abutting sliding block, the abutting sliding block is slidably connected with the interior of the limiting fixing hole in a sleeved mode, a heat dissipation device is arranged on the back face of the case body, and the four corners of the heat dissipation device are fixedly connected with fixing insertion columns. And the fixing insertion column is sleeved in the limiting fixing hole. According to the arrangement, a split installation heat dissipation mode is adopted, the heat dissipation device can be independently taken down to be cleaned, dust is effectively prevented from falling into the interior to influence element operation, and meanwhile, an elastic sleeving mode is adopted, so that installation and disassembly are very convenient.

Description

Technical Field

[0001] This utility model belongs to the technical field of server heat dissipation devices, specifically relating to an auxiliary heat dissipation device for rack-mounted servers. Background Technology

[0002] A server, also known as a computing server, is a device that provides computing services. Because servers need to respond to and process service requests, they generally need to have the capability to handle and guarantee service delivery. A server's components include a processor, hard drive, memory, system bus, etc., similar to a general computer architecture. Servers can be categorized by their form factor into rack servers, tower servers, and blade servers, with rack servers being the most common. Servers generate a significant amount of heat during operation, requiring cooling.

[0003] Existing heat dissipation methods typically use air cooling, but during prolonged use, a lot of dust tends to accumulate on the fan surface. The fan surface is inconvenient to clean, and the dust on the fan surface can easily fall onto the battery or power board, which can easily lead to malfunctions, thus having certain limitations. Utility Model Content

[0004] The purpose of this utility model is to provide an auxiliary heat dissipation device for rack-mounted servers, in order to solve the problem mentioned in the background art that, during long-term use, the surface of the fan is prone to accumulating a lot of dust, the surface of the fan is inconvenient to clean, and the dust on the fan surface is easy to fall on the battery or power board, which can easily lead to failure and has certain limitations.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an auxiliary heat dissipation device for a rack-mount server, comprising a chassis body, a heat-conducting plate fixedly embedded in the center of the chassis body, fixing blocks fixedly connected to the four corners of the back of the chassis body, a limiting fixing hole fixedly formed on the inner side of the fixing block, a stop spring fixedly connected to one end of the limiting fixing hole, a stop slider fixedly connected to one end of the stop spring, the stop slider slidably sleeved inside the limiting fixing hole, a heat dissipation device provided on the back of the chassis body, fixing pins fixedly connected to the four corners of the heat dissipation device, the fixing pins sleeved inside the limiting fixing hole.

[0006] Preferably, a connection hole is fixedly opened on one side of the chassis body, a fixing hole is fixedly opened inside the chassis body, and a fixing support plate is fixedly connected to the other side of the chassis body.

[0007] Preferably, the heat dissipation device includes a fan box, a cooling plate, a heat dissipation motor, a cooling fan, and a battery, and ventilation openings are fixedly provided on both sides of the fan box.

[0008] Preferably, the bottom of the fan box is fixedly embedded with refrigeration fins, both sides of the inside of the fan box are fixedly connected with heat dissipation motors, the heat dissipation motors are fixedly connected with heat dissipation fans through shafts, the inside of the fan box is fixedly connected with a storage battery, and the heat dissipation motors are electrically connected with the storage battery through wires.

[0009] Compared with the prior art, the utility model has the advantages that:

[0010] 1、The utility model discloses a heat dissipation mode of split mounting can be taken down alone and cleaned, effectively avoids dust from falling into the inside and affecting the operation of elements, and simultaneously adopts elastic sleeve connection, so that installation and dismounting are very convenient.

[0011] 2、The utility model discloses a semiconductor refrigeration mode for cooling, high -efficient cooling to the heat conduction plate can cool the inside of the case quickly, and the cooling effect is better, and the semiconductor refrigeration module is a single individual, convenient to detach, so that the inside of the case can not be exposed to the outside, and the protection effect is better. DRAWINGS

[0012] Figure 1 It is the structure schematic diagram of the utility model;

[0013] Figure 2 It is the back structure schematic diagram of the utility model case body;

[0014] Figure 3 It is the inside structure schematic diagram of the utility model fixed block;

[0015] Figure 4 It is the back structure schematic diagram of the utility model;

[0016] Figure 5 It is the inside structure schematic diagram of the utility model heat dissipation device.

[0017] In the drawing: 1, case body;2, heat conduction plate;3, fixed block;4, limit fixed hole;5, abutment spring;6, abututment sliding block;7, heat dissipation device;8, fixed column;9, connecting hole;10, fixed hole;11, fixed support plate;12, fan box;13, vent;14, refrigeration fin;15, heat dissipation motor;16, heat dissipation fan;17, storage battery. PREFERRED EMBODIMENT

[0018] The technical scheme in the embodiments of the utility model will be described clearly and completely below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model and not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0019] Please refer to Figures 1-5 The utility model provides a technical scheme: a rack type server auxiliary heat abstractor, including the case body 1, the center of case body 1 is fixed and inlaid with the heat conduction plate 2, the back four corners of case body 1 are fixedly connected with fixed block 3, the inside of fixed block 3 is fixed and is equipped with the limiting fixed hole 4, one end inside limiting fixed hole 4 is fixedly connected with the abutment spring 5, one end of abutment spring 5 is fixedly connected with the abutment sliding block 6, the abutment sliding block 6 is slidably sleeved in the inside of limiting fixed hole 4, the back of case body 1 is provided with heat abstractor 7, the four corners of heat abstractor 7 are fixedly connected with fixed insertion column 8, fixed insertion column 8 is sleeved in the inside of limiting fixed hole 4.

[0020] In the embodiment, by fixing the processor, hard disk, memory and other system assemblies in the inside of case body 1, in the heat dissipation process, heat is conducted to the outside of case body 1 through the heat conduction plate 2, and then air cooling heat dissipation is carried out through the heat abstractor 7, so that the heat dissipation effect of the server is realized, when it is needed to clean dust, the heat abstractor 7 can be pushed upward or downward, so that the fixed insertion column 8 abuts against the abutment sliding block 6 and elastically displaces, so that the other end of heat abstractor 7 can slide out, which facilitates installation and dismounting and cleaning, the heat dissipation mode of the separation type installation is adopted, the heat abstractor can be individually taken down and cleaned, dust falling into the inside and affecting the operation of elements is effectively avoided, and the elastic sleeving mode is adopted, so that installation and dismounting are very convenient.

[0021] Specifically, one side of the case body 1 is fixedly provided with a connecting hole 9, the inside of the case body 1 is fixedly provided with a fixed hole 10, and the other side of the case body 1 is fixedly connected with a fixed support plate 11.

[0022] In the embodiment, the connecting hole 9 is arranged to facilitate the connection of equipment, the fixed hole 10 is arranged to fix the processor, hard disk, memory and other system assemblies, and the fixed support plate 11 is arranged to support the whole.

[0023] Specifically, the heat abstractor 7 includes a fan box 12, a refrigeration fin 14, a heat dissipation motor 15, a heat dissipation fan 16 and a storage battery 17, and ventilation openings 13 are formed in the two sides of the fan box 12.

[0024] In the embodiment, the heat abstractor 7 can effectively cool the heat conduction plate 2, so that the heat dissipation efficiency of the heat conduction plate 2 is higher.

[0025] Specific, the bottom of the fan box 12 fixed inlayed with refrigeration fin 14, the inside both sides of the fan box 12 is fixedly connected with heat dissipation motor 15, the heat dissipation motor 15 is fixedly connected with heat dissipation fan 16 through the shaft, the inside center of the fan box 12 is fixedly connected with battery 17, the heat dissipation motor 15 is electrically connected with battery 17 through wire.

[0026] In the embodiment, the heat dissipation motor 15 can drive the heat dissipation fan 16 to rotate after the power is turned on, so that the cooling surface of the refrigeration fin 14 can be air-cooled, and the cooling surface of the refrigeration fin 14 can be effectively cooled. When the fan box 12 is sleeved and fixed, the cooling surface of the refrigeration fin 14 can abut against the surface of the heat conduction plate 2, so that the heat conduction plate 2 can be effectively cooled, and the heat conduction plate 2 can be quickly cooled. The design adopts a semiconductor refrigeration mode to cool the heat conduction plate, so that the heat conduction plate can be efficiently cooled, thereby the inside of the case can be quickly cooled, and the cooling effect is better. The semiconductor refrigeration module is a separate individual, which is convenient to disassemble, so that the inside of the case can not be exposed to the outside, and the protection effect is better.

[0027] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A rack-mount server auxiliary heat dissipation device, comprising a chassis body (1), characterized in that: A heat-conducting plate (2) is fixedly embedded in the center of the chassis body (1). Fixing blocks (3) are fixedly connected to the four corners of the back of the chassis body (1). Limiting fixing holes (4) are fixedly opened on the inner side of the fixing blocks (3). A retaining spring (5) is fixedly connected to one end of the limiting fixing hole (4). A retaining slider (6) is fixedly connected to one end of the retaining spring (5). The retaining slider (6) is slidably sleeved inside the limiting fixing hole (4). A heat dissipation device (7) is provided on the back of the chassis body (1). Fixing pins (8) are fixedly connected to the four corners of the heat dissipation device (7). The fixing pins (8) are sleeved inside the limiting fixing hole (4).

2. The auxiliary heat dissipation device for a rack-mounted server according to claim 1, characterized in that: A connection hole (9) is fixedly opened on one side of the chassis body (1), a fixing hole (10) is fixedly opened inside the chassis body (1), and a fixing support plate (11) is fixedly connected to the other side of the chassis body (1).

3. The auxiliary heat dissipation device for a rack-mounted server according to claim 1, characterized in that: The heat dissipation device (7) includes a fan box (12), a cooling plate (14), a heat dissipation motor (15), a heat dissipation fan (16) and a battery (17). Ventilation openings (13) are fixedly provided on both sides of the fan box (12).

4. The rack-mount server auxiliary heat dissipation device according to claim 3, characterized in that: A cooling plate (14) is fixedly embedded at the bottom of the fan box (12). A cooling motor (15) is fixedly connected to both sides inside the fan box (12). A cooling fan (16) is fixedly connected to the cooling motor (15) via a shaft. A storage battery (17) is fixedly connected to the center inside the fan box (12). The cooling motor (15) is electrically connected to the storage battery (17) via a wire.

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