Heat dissipation device of solid-state switch
By redesigning the heat dissipation structure in the solid-state circuit breaker and aligning the heat sink with the guide rail for heat conduction, the problems of poor heat dissipation and large space occupation are solved, achieving more efficient heat dissipation and a more reasonable component layout.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2026-03-20
AI Technical Summary
Existing solid-state circuit breakers have poor heat dissipation, resulting in excessively high temperatures that affect the current carrying capacity and lifespan of the devices. At the same time, the heat dissipation structure occupies too much space, affecting the device layout.
By redesigning the heat dissipation structure of the solid-state switch, the heat sink is placed at the bottom of the housing and corresponds to the guide rail. The guide rail is used for heat conduction, increasing the contact area to improve heat dissipation efficiency and save space.
This improved the heat dissipation efficiency of solid-state switches, reduced the temperature, extended the device's lifespan, and optimized the device layout.
Smart Images
Figure CN224022059U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of circuit breaker, specifically speaking is related to a kind of heat dissipation structure for fixing circuit breaker power semiconductor. BACKGROUND
[0002] With the increasing demand for electric power of the whole society, electrical equipment also increases accordingly, and the problem of how to ensure the safety of electricity is increasingly prominent. When the mechanical switch circuit breaker breaks the main circuit connected thereto, due to the inherent characteristics of the mechanical switch, it is easy to produce arc when cutting off the power supply, which is not conducive to safety. To make up for the harm caused by the mechanical circuit breaker during breaking, solid-state circuit breaker has been widely used, which has the characteristics of fast switching speed, no contact opening, long switching life, etc., so that it can overcome the shortcomings of traditional mechanical circuit breaker.
[0003] Among them, the low-voltage direct-current solid-state circuit breaker usually adds power electronic devices, i.e. N-type power semiconductor devices, to the positive voltage bus, i.e. the high side, for power distribution and breaking protection. The driving circuit of this high-side N-type power semiconductor device is complex, and generally uses a charge pump to power the driving circuit of the high-side power semiconductor device, or directly uses a high-side switch integrated with power supply and protection functions. However, in the prior art, the solid-state switch has the problems of high temperature and poor heat dissipation effect due to the volume during normal operation and frequent switching, which cannot fully exert the current-carrying capacity of the device; in addition, when an overload current or a short-circuit current flows through, it will also cause the switch to overheat, reducing the service life of the switch. The heat dissipation structure is usually located inside the shell and occupies too much space, affecting the arrangement of other devices, resulting in unreasonable device layout in the solid-state circuit breaker shell. SUMMARY
[0004] The purpose of the utility model is to solve the defects of the prior art, such as poor heat dissipation effect of fixed switch and too large space occupied by heat dissipation structure, and provide a heat dissipation device for solid-state switch, which improves the heat dissipation efficiency and saves space by rearranging and designing the position and structure of the solid-state switch heat dissipation structure.
[0005] TECHNICAL SCHEME
[0006] In order to achieve the above technical purpose, the heat dissipation device for solid-state switch provided by the utility model is characterized by: it comprises a shell, the shell is mounted on a guide rail at the bottom, the heat dissipation member is placed at a corresponding position of the shell and corresponds to the guide rail, and the heat dissipation member conducts heat to the guide rail.
[0007] In one of the embodiments, the heat dissipating member is arranged at the bottom of the inner cavity of the shell, the heat dissipating member is arranged on one side of the circuit board, the power device is arranged on the other side of the circuit board, and the fins of the heat dissipating member are arranged out of the through hole on the shell and correspond to the guide rail.
[0008] In one of the embodiments, the power device comprises a relay body and a semiconductor device, and the semiconductor device is communicated with the relay body through the circuit board and the heat dissipating member.
[0009] In one of the embodiments, the heat dissipating member is communicated with the circuit board through the pin of the relay body and the pin of the semiconductor device.
[0010] In one of the embodiments, the fins of the heat dissipating member 4 are matched with the inner side of the groove of the guide rail.
[0011] In one of the embodiments, the circuit board is arranged at the bottom of the shell.
[0012] In one of the embodiments, the semiconductor device and the circuit board are arranged in parallel.
[0013] In one of the embodiments, the surface of the heat dissipating member is provided with insulating and heat conducting sheets.
[0014] In one of the embodiments, the heat dissipating member comprises fins and a mounting base plate, the fins are arranged on one side of the mounting base plate, and the other side of the mounting base plate is arranged on the outer bottom surface of the shell.
[0015] In one of the embodiments, the heat dissipating member comprises fins, and the fins are arranged on the inner surface of the groove of the guide rail facing the outer bottom surface of the shell.
[0016] Advantages
[0017] The utility model provides a heat dissipation device of solid switch, it includes the shell, the shell bottom is arranged on the guide rail, the heat dissipating member is placed in the corresponding position of the shell and with the guide rail is corresponding, the heat dissipating member conduction heat to the guide rail. This heat dissipation device is through the position and structure of the re -arrangement and design of solid switch heat dissipation structure, the contact area is bigger, and the heat dissipation is faster improves the heat dissipation efficiency, and saves the space. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the following will be simply introduced to the drawing needed to be used in the embodiment, should understand, the following drawing only shows certain embodiment of the utility model, therefore should not be regarded as the limitation to the range, for the ordinary skilled person in the art comes, under the premise of not paying the creative labor, can also obtain other related drawings according to these drawings.
[0019] Figure 1 is a schematic diagram of a power device and a heat sink according to an embodiment of the present application; Figure 1 Figure 2 is a schematic diagram of a heat sink installation position according to an embodiment of the present application;
[0020] Figure 3 is a schematic diagram of a heat sink installation position according to an embodiment of the present application; Figure 2 Figure 4 is a schematic diagram of a heat sink installation position according to an embodiment of the present application; Figure 1 Figure 5 is an enlarged view of portion A in Figure 4;
[0021] Figure 6 is a schematic diagram of a heat sink installation position according to an embodiment of the present application; Figure 3 Figure 7 is a schematic diagram of a power device and a heat sink according to an embodiment of the present application;
[0022] Figure 8 is a schematic diagram of a heat sink installation position according to an embodiment of the present application; Figure 4 Figure 9 is a schematic diagram of a heat sink installation position according to an embodiment of the present application;
[0023] Figure 10 is a schematic diagram of a heat sink installation position according to an embodiment of the present application; Figure 5 Figure 11 is a schematic diagram of a heat sink installation position according to an embodiment of the present application;
[0024] Figure 12 is a schematic diagram of a heat sink installation position according to an embodiment of the present application; Figure 6 Figure 13 is a schematic diagram of a heat sink installation position according to an embodiment of the present application;
[0025] Figure 14 is a schematic diagram of a heat sink installation position according to an embodiment of the present application; Figure 7 Figure 15 is a schematic diagram of a heat sink installation position according to an embodiment of the present application;
[0026] Figure 8 Figure 16 is a schematic diagram of a heat sink installation position according to an embodiment of the present application;
[0027] Figure 17 is a schematic diagram of a heat sink installation position according to an embodiment of the present application; Figure 9a Figure 18 is a schematic diagram of a heat sink installation position according to an embodiment of the present application;
[0028] Figure 9b Figure 19 is a schematic diagram of a heat sink installation position according to an embodiment of the present application; DETAILED DESCRIPTION
[0029] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.
[0030] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it can be directly on the other component or there can be a middle component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or there can be a middle component. The terms "vertical", "horizontal", "upper", "lower", "left", "right", and similar expressions used in the specification of the present application are for the purpose of illustration only and are not intended to be the only implementation.
[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0032] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0033] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.
[0034] Example 1
[0035] In the prior art, solid-state switches suffer from problems such as excessive temperature and poor heat dissipation due to their size during normal operation and frequent switching, which prevents them from fully utilizing the current carrying capacity of the device. In addition, the flow of overload current or short-circuit current can also cause the switch temperature to rise too high, reducing the life of the switch. The heat dissipation structure is usually located inside the housing, occupying too much space and affecting the arrangement of other devices, resulting in an unreasonable layout of devices inside the solid-state circuit breaker housing.
[0036] To solve this problem, see attached... Figure 1 and 2 As shown, this embodiment provides a heat dissipation device for a solid-state switch, which includes a housing 1, the bottom of which is mounted on a guide rail 5, and a heat sink 4 placed at a corresponding position on the housing and corresponding to the guide rail 5, wherein the heat sink 4 conducts heat to the guide rail 5.
[0037] Specifically, in one embodiment, as shown in the appendix Figure 4 As shown, the heat sink 4 is placed at the bottom of the inner cavity of the housing 1, as illustrated in the attached diagram. Figure 3As shown, the heat sink 4 is disposed on one side of the circuit board 2, which is located at the bottom of the housing 1. A power device 3 is disposed on the other side of the circuit board 2. The heat sink 401 of the heat sink 4 extends through the through hole 101 on the housing 1 and corresponds to the guide rail 5. (See attached diagram) Figure 5 and 6 As shown, the heat sink 401 of the heat sink 4 and the inner side of the groove 501 of the guide rail 5 are in contact.
[0038] As attached Figure 3 and 7 As shown, the power device 3 includes a relay body 301 and a semiconductor device 302, with the semiconductor device 302 and the circuit board 2 placed in parallel. The semiconductor device 302 is connected to the relay body 301 through the circuit board 2 and a heat sink 4. The heat sink 4 is connected to the circuit board 2 through the pins of the relay body 301 and the pins of the semiconductor device 302. An insulating heat-conducting sheet 6 is disposed on the surface of the heat sink 4.
[0039] Example 2
[0040] As attached Figure 8 As shown, in this embodiment, the heat sink 4 includes heat sink 401 and mounting base plate 402. A plurality of heat sinks 401 are mounted on one side of the mounting base plate 401, and the other side of the mounting base plate 402 is mounted on the outer bottom surface of the housing 1. In this embodiment, the heat sink 4 can also conduct heat to the guide rail 5.
[0041] Example 3
[0042] As attached Figure 9a As shown in Figure 9b, the heat sink 4 includes a heat sink 401, which is disposed on the inner surface of the groove 501 of the guide rail 5 facing the outer bottom surface of the housing 1. In this embodiment, the heat sink 401 can also conduct heat to the guide rail 5.
[0043] This invention provides a heat dissipation device for a solid-state switch, comprising a housing 1, the bottom of which is mounted on a guide rail 5. A heat sink 4 is positioned at a corresponding location on the housing and corresponds to the guide rail 5, and the heat sink 4 conducts heat to the guide rail 5. This heat dissipation device, through a redesign and rearrangement of the position and structure of the solid-state switch's heat dissipation structure, achieves a larger contact area, faster heat dissipation, improved heat dissipation efficiency, and space savings.
[0044] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0045] The above-described embodiments are merely illustrative of several embodiments of the present application, which are described in more detail and in a specific and detailed manner, but should not be construed as limiting the scope of the patent of the present application. It should be noted that, for those of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.
Claims
1. A heat dissipation device for a solid-state switch, characterized in that: It includes a housing (1) with its bottom mounted on a guide rail (5), and a heat sink (4) placed at a corresponding position on the housing and corresponding to the guide rail (5), which conducts heat to the guide rail (5).
2. The heat dissipation device for a solid-state switch as described in claim 1, characterized in that: The heat sink (4) is placed at the bottom of the inner cavity of the housing (1). The heat sink (4) is set on one side of the circuit board (2). A power device (3) is set on the other side of the circuit board (2). The heat sink (401) of the heat sink (4) passes through the through hole (101) on the housing (1) and corresponds to the guide rail (5).
3. The heat dissipation device for a solid-state switch as described in claim 2, characterized in that: The power device (3) includes a relay body (301) and a semiconductor device (302), and the semiconductor device (302) is connected to the relay body (301) through a circuit board (2) and a heat sink (4).
4. The heat dissipation device for a solid-state switch as described in claim 3, characterized in that: The heat sink (4) is connected to the circuit board (2) through the pins of the relay body (301) and the pins of the semiconductor device (302).
5. The heat dissipation device for a solid-state switch as described in claim 4, characterized in that: The heat sink (401) of the heat sink (4) and the inner side of the groove (501) of the guide rail (5) are in contact.
6. The heat dissipation device for a solid-state switch as described in claim 2, characterized in that: The circuit board (2) is located at the bottom of the housing (1).
7. The heat dissipation device for a solid-state switch as described in claim 1, characterized in that: Semiconductor device (302) and circuit board (2) are placed in parallel.
8. The heat dissipation device for a solid-state switch as described in claim 1, characterized in that: The heat sink (4) has an insulating heat-conducting sheet (6) on its surface.
9. The heat dissipation device for a solid-state switch as described in claim 1, characterized in that: The heat sink (4) includes heat sinks (401) and mounting base plate (402). A plurality of heat sinks (401) are mounted on one side of the mounting base plate (402), and the other side of the mounting base plate (402) is mounted on the outer bottom surface of the housing (1).
10. The heat dissipation device for a solid-state switch as described in claim 1, characterized in that: The heat sink (4) includes a heat sink (401) disposed on the inner surface of the groove (501) of the guide rail (5) facing the outer bottom surface of the housing (1).