Power supply case

Abstract

The utility model relates to a power supply cabinet, comprising a heat conduction cabinet and a power supply module, the heat conduction cabinet is provided with a power supply heat conduction boss, the power supply module is arranged on the power supply heat conduction boss, and the heat conduction cabinet is provided with a heat radiation assembly used for generating a wind source. A wind source generated by the heat dissipation assembly flows through the power module and is discharged from the heat conduction case, the power module is arranged on the heat conduction boss of the case body, heat of the power module is concentrated at the position in contact with the case body, the heat is dissipated through the case body, meanwhile, auxiliary heat dissipation is conducted through the heat dissipation assembly, and the heat dissipation efficiency is extremely good.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of electronic equipment, especially a power supply case. BACKGROUND

[0002] As a type of electronic case, the core function of the power supply case is to accurately regulate the voltage and current of the input / output power supply. Due to the high power density and power conversion loss inside, significant heat accumulation occurs during operation of such equipment, resulting in a sharp increase in internal temperature rise, thus posing stringent requirements on the efficiency and reliability of the heat dissipation system.

[0003] Current mainstream heat dissipation solutions include air cooling and water cooling:

[0004] Air cooling: relies on forced convection to reduce temperature, but when the heat flux density inside the power supply case is too high, the low heat capacity of air medium easily leads to saturation of heat dissipation efficiency, making it difficult to meet the temperature control requirements under high heat conditions.

[0005] Water cooling: although the heat conduction capacity is improved through liquid phase working medium, it is necessary to precisely arrange cooling pipelines inside the case, especially in high heat sensitive areas, which requires the addition of redundant pipeline topology. This not only leads to an exponential increase in the complexity of the internal structure of the equipment (increasing assembly difficulty and maintenance cost), but also poses potential safety hazards of cooling liquid leakage causing electrical short circuit due to material fatigue and sealing failure risks during long-term operation.

[0006] Therefore, there is an urgent need to design a power supply case to solve the technical problems of low heat dissipation efficiency, complex structure, and difficult maintenance of existing power supply cases. INVENTION CONTENTS

[0007] Therefore, the utility model provides a power supply case, which optimizes the internal heat dissipation mode and component integration, and realizes simple and reliable structure, high heat dissipation efficiency, and water surface and underwater universality.

[0008] The utility model provides a power supply case adopts the following technical scheme:

[0009] A power supply case, comprising a heat-conducting case and a power supply module, wherein the heat-conducting case is provided with a power supply heat-conducting boss, the power supply module is arranged on the power supply heat-conducting boss, the heat-conducting case is provided with a heat dissipation assembly for generating air source, and the air source generated by the heat dissipation assembly flows through the power supply module and is discharged from the heat-conducting case.

[0010] Optionally, it further comprises a filter switch module, which is arranged on the filter heat-conducting boss, and the filter switch module is used for filtering and rectifying, on-off control of input and output.

[0011] Optionally, the heat-conducting enclosure includes an enclosure cover and an enclosure shell, wherein the enclosure cover is mounted on the enclosure shell to form a closed shell.

[0012] Optionally, the heat dissipation component includes an air inlet, a fan, and an air outlet. The fan is mounted on the chassis housing. The air source generated by the fan flows through the air inlet, passes through the power module and the filter switch module, and is discharged from the air outlet.

[0013] Optionally, the chassis cover is equipped with an electromagnetic shielding ventilation plate at the air inlet.

[0014] Optionally, the air inlet is located on the chassis cover, and the air outlet is located on the chassis housing.

[0015] Optionally, the heat-conducting housing is provided with a cable routing bracket.

[0016] Optionally, the heat-conducting chassis is provided with a cable plug cover assembly, which includes a cable plug cover and a cable plug. The cable plug cover is located at the front end of the chassis housing, and the cable plug serves as the input and output interface of the power supply chassis.

[0017] Optionally, the chassis cover and cable socket cover assembly are provided with conductive rubber strips.

[0018] Optionally, the filter switch module is located in the middle of the chassis housing, and the power supply module is located on both sides of the filter switch module.

[0019] In summary, this utility model includes at least one of the following beneficial technical effects: by setting the power module on the power heat conduction protrusion of the chassis body, the heat of the power module is concentrated at the contact position with the chassis body, and the heat is dissipated through the chassis body. At the same time, the heat dissipation component is used for auxiliary heat dissipation, resulting in excellent heat dissipation efficiency. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model;

[0021] Figure 2 This is a schematic diagram of the internal structure of an embodiment of this utility model;

[0022] Figure 3 This is a schematic diagram of the longitudinal section structure of an embodiment of this utility model;

[0023] Figure 4 This is a schematic diagram of the cable plug cover assembly structure according to an embodiment of the present utility model;

[0024] Figure 5 This is a structural schematic diagram of the chassis cover and electromagnetic shielding ventilation plate of this utility model embodiment.

[0025] Explanation of reference numerals in the attached drawings: 1. Chassis cover; 2. Chassis shell; 3. Power module; 4. Power supply heat conduction boss; 5. Air inlet; 6. Fan; 7. Handle; 8. Electromagnetic shielding ventilation plate; 9. Cable tray; 10. Cable plug cover; 11. Cable plug; 12. Filter switch module; 13. Filter heat conduction boss. Detailed Implementation

[0026] The following is in conjunction with the appendix Figures 1-5 The present invention will be described in further detail below.

[0027] This utility model discloses a power supply chassis.

[0028] Reference Figures 1-5 A power supply chassis includes a heat-conducting chassis and a power module 3. A heat-conducting protrusion 4 is provided on the chassis shell 2, and the power module 3 is disposed on the heat-conducting protrusion 4. A heat dissipation component for generating airflow is provided on the heat-conducting chassis. The airflow generated by the heat dissipation component flows through the power module 3 and is discharged from the chassis shell 2. By placing the power module 3 on the heat-conducting protrusion of the chassis body, the heat of the power module 3 is concentrated at the contact position with the chassis body, and the heat is dissipated through the chassis body. At the same time, the heat dissipation component provides auxiliary heat dissipation. The combination of the heat-conducting chassis and the heat dissipation component effectively improves the heat dissipation efficiency, simplifies the internal structure, facilitates assembly and maintenance, and improves safety. It has the advantages of high heat dissipation efficiency, simple structure, easy maintenance, and safety and reliability.

[0029] In this embodiment, a power supply heat-conducting protrusion 4 is provided on the chassis housing 2, and the power module 3 is directly mounted on the power supply heat-conducting protrusion 4, which increases the contact area between the power module 3 and the chassis housing 2, facilitating rapid heat conduction. Specifically, the chassis housing 2 is made of a thermally conductive material, such as aluminum alloy or steel. The power supply heat-conducting protrusion 4 is integrally formed with the chassis housing 2, and the mounting area of ​​the power module 3 is thickened to form the power supply heat-conducting protrusion 4. As the core heat-generating unit, the power module 3 is directly mounted on the power supply heat-conducting protrusion 4, ensuring good heat conduction between the power module 3 and the chassis housing 2.

[0030] The thermally conductive chassis includes a chassis cover 1 and a chassis shell 2. The chassis cover 1 is mounted on the chassis shell 2 to form a closed shell, providing mounting points and protection for all components. The chassis cover 1 and chassis shell 2 together constitute a closed space, which helps control the direction of internal airflow and improves heat dissipation efficiency. The closed shell prevents external heat from entering and also centrally manages the heat generated internally. The chassis shell 2 is used to install heat dissipation components, power modules 3, and other heat-generating elements, allowing heat to be effectively transferred from the heat source to the heat dissipation components and then exhausted to the outside of the chassis, thereby improving overall heat dissipation efficiency.

[0031] The seal between the chassis cover 1 and the chassis housing 2 can be achieved by a rubber sealing strip, ensuring the airtightness of the enclosed housing. This not only helps control internal airflow but also prevents external dust and moisture from entering, improving the reliability and service life of the power supply chassis.

[0032] For easy disassembly, the chassis cover 1 is detachably mounted on the chassis housing 2. The disassembly method can be any existing disassembly and fixing method, such as snap-fit ​​or bolt connection, which will not be described in detail here.

[0033] To further improve heat dissipation efficiency, a heat dissipation component is installed on the chassis cover 1. This component generates airflow, creating forced convection cooling. The airflow passes through the power module 3 and is then exhausted from the chassis housing 2, effectively carrying away heat. This not only simplifies the structure but also avoids the potential risks of water-cooling systems, solving the problem of low heat dissipation efficiency in power supply chassis, while maintaining a simple structure and ease of maintenance. Compared to traditional air-cooling systems, it is more effective and avoids the complexity of water-cooling systems.

[0034] During operation, the power module 3 generates heat, which is first transferred to the chassis housing 2 through the heat-conducting protrusions. At the same time, the airflow generated by the heat dissipation components enters from the chassis cover 1, flows through the power module 3, carries away some of the heat, and is finally exhausted from the chassis housing 2, improving heat dissipation efficiency. The design of the power heat-conducting protrusions 4 enhances heat conduction, while the directional airflow generated by the heat dissipation components accelerates heat dissipation.

[0035] The heat dissipation assembly includes an air inlet 5, a fan 6, and an air outlet. The fan 6 is located at the air outlet of the chassis housing 2. The air generated by the fan 6 flows through the air inlet 5, through the power module 3 and the filter switch module 12, and is then discharged from the air outlet. The fan 6 is a high-speed fan, which is fixed to the chassis cover 1 by anti-vibration washers to reduce vibration and noise during operation. A circular air outlet is provided on one side of the chassis housing 2, with a total area not less than 1.2 times the area of ​​the air inlet 5 to ensure smooth airflow. All seams are sealed with conductive sealing strips to improve electromagnetic shielding.

[0036] Specifically, the air inlet 5 is located at the front end of the chassis cover 1, and the air outlet is located at the rear end of the chassis shell 2, forming an effective airflow path. The airflow generated by the fan 6 enters through the air inlet 5 of the chassis cover 1, flows through the power module 3, carries away heat, and is then exhausted through the air outlet of the chassis shell 2, improving heat dissipation efficiency. This forms a forced convection channel running through the entire chassis, allowing cool air to fully contact the heat-generating components, improving heat exchange efficiency, and effectively controlling airflow direction, reducing eddies and dead zones. The enclosed structure of the thermally conductive chassis not only protects the internal components but also enhances overall heat dissipation performance through the use of thermally conductive materials. The design of the power supply thermally conductive protrusion 4 increases the contact area with the power module 3, improving heat conduction efficiency. Combined with the forced air cooling system, it ensures both heat conduction and convection cooling, thereby comprehensively improving heat dissipation efficiency.

[0037] Furthermore, this invention not only utilizes mechanical forced convection but also cleverly combines the principle of natural convection. The characteristics of hot air rising and cold air sinking are fully utilized, forming a natural thermal circulation system that significantly improves heat dissipation efficiency while reducing the load on the fan 6 and extending the system's service life.

[0038] Furthermore, the air inlet 5 is positioned near the top of the power module 3 to ensure that cool air directly contacts the heat source. The air outlet can be positioned diagonally opposite the power module 3 to create an angled airflow path, maximizing heat removal and forming a top-down airflow path. This design facilitates the removal of dust and impurities, reducing their accumulation inside the chassis. Therefore, even after long-term operation, the inside of the chassis remains relatively clean, maintaining good heat dissipation.

[0039] An electromagnetic shielding ventilation plate 8 is installed at the air inlet 5 on the chassis cover 1. The electromagnetic shielding ventilation plate 8 can be integrally formed with the chassis cover 1 or installed as a separate component. The integral forming method reduces assembly steps and improves production efficiency, not only solving the electromagnetic interference problem but also coordinating with the entire heat dissipation system. Located at the air inlet 5, the electromagnetic shielding ventilation plate 8 is the first barrier for air entering the chassis. It not only filters electromagnetic interference but also blocks some dust particles, extending the lifespan of internal components. Simultaneously, the presence of the ventilation plate ensures more uniform airflow into the chassis, improving overall heat dissipation.

[0040] The electromagnetic shielding ventilation panel 8 can be honeycomb or mesh-like. In one specific embodiment, the electromagnetic shielding ventilation panel 8 is made of 1mm thick aluminum alloy sheet, processed into a honeycomb structure by stamping. The honeycomb structure can effectively shield electromagnetic waves with frequencies up to 1GHz, while ensuring that the increase in airflow resistance does not exceed 5%. The ventilation panel is fixed to the air inlet 5 of the chassis cover 1 by a snap-fit ​​structure, facilitating disassembly and cleaning. To further improve the shielding effect, a conductive rubber sealing strip is also provided on the contact surface between the ventilation panel and the chassis cover 1.

[0041] The electromagnetic shielding ventilation plate 8 design of this application has significant advantages. Traditional power supply chassis often only focus on heat dissipation, neglecting electromagnetic compatibility (EMC) issues. Even when EMC is considered, the common approach is to coat the entire interior of the chassis with a conductive coating, which is costly and makes it difficult to optimize the critical air inlet 5. This invention, however, directly protects against the main entry point for electromagnetic interference, making it both efficient and economical. Furthermore, since the electromagnetic shielding function is integrated into the ventilation structure, it does not increase the chassis's size or weight, maintaining the product's compactness and significantly improving the power supply chassis's EMC performance while ensuring efficient heat dissipation. This not only enhances the operational stability of the power module 3 but also reduces EMC interference to surrounding electronic equipment, ensuring the reliable operation of the entire system.

[0042] The heat-conducting chassis is equipped with cable management brackets 9. Cable management brackets 9 provide a structure for fixing and guiding cables and wire harnesses, making the wiring inside the chassis neater and more orderly, and effectively solving the problem of complex wiring inside the power supply chassis.

[0043] Specifically, the cable management bracket 9 can be implemented in various ways. For example, the cable management bracket 9 can be a metal or plastic strip structure fixed to the inner wall of the heat dissipation chassis, with multiple slots or hooks for fixing cables; or, a grid-like cable management frame can be set inside the heat dissipation chassis, which can flexibly fix cables in different positions. Adjustable cable management brackets 9 can also be used, allowing the position and angle of the bracket to be adjusted according to actual needs. By properly arranging the cable management brackets 9, it can be ensured that cables and wire harnesses do not interfere with the heat dissipation path of the power module 3, thereby optimizing the heat dissipation effect of the entire system. At the same time, the setting of the cable management bracket 9 also facilitates the electrical connection between the power module 3 and other components, improving the overall assembly efficiency. The cable management bracket 9 helps to optimize the airflow distribution inside the chassis. Without the cable management bracket 9, messy cables may obstruct airflow and lead to the generation of local hot spots. However, by using the cable management bracket 9, cables can be centrally fixed, creating a smoother path for airflow, thereby improving the overall heat dissipation efficiency.

[0044] The cable management bracket 9 of this utility model not only solves these problems, but also indirectly improves the overall performance and reliability of the power supply chassis by optimizing the utilization of internal space and airflow distribution.

[0045] A cable plug cover assembly 10 is provided on the heat-conducting chassis. The cable plug cover assembly 10 includes a cable plug cover 10 and a cable plug 11. The cable plug cover 10 is located at the front end of the chassis housing 2, and the cable plug 11 serves as the input and output interface of the power supply chassis. In this embodiment, the cable plug cover assembly 10 is installed at the front end of the chassis housing 2. The cable plug cover 10 can be made of metal materials, such as aluminum alloy or stainless steel, to provide good mechanical strength and electromagnetic shielding performance. The cable plug cover 10 can be fixed to the front end of the chassis housing 2 by screws or clips, facilitating installation and removal. This utility model effectively solves the cable connection and electromagnetic shielding problems of the power supply chassis by providing the cable plug cover assembly 10 on the heat-conducting chassis. The cable plug cover 10 provides protection and fixation for the cable plug 11, while also enhancing the overall structural strength of the chassis. The cable plug 11, as a standardized input and output interface, simplifies the connection process between the power supply chassis and external devices, improving the convenience of installation and use.

[0046] Conductive rubber strips are provided on the chassis cover 1 and the cable socket cover assembly. The conductive rubber strips can be composed of a composite of conductive materials (such as metal particles) and elastic materials (such as silicone), exhibiting good conductivity and elasticity. When the chassis cover 1 and the cable socket cover assembly are assembled with the chassis housing 2, the conductive rubber strips are compressed, forming a tight electrical contact. As a preferred embodiment, the conductive rubber strips use silver-filled silicone material, which has excellent conductivity and durability. The conductive rubber strips can be designed as continuous strips, arranged along the edges of the chassis cover 1 and the cable socket cover assembly. On the chassis cover 1, the conductive rubber strips can form a complete rectangular ring, ensuring 360-degree electromagnetic shielding. For the cable socket cover assembly, the conductive rubber strips can be arranged around each socket opening, forming multiple independent sealing rings.

[0047] The power supply chassis also includes a filter switch module 12, which is mounted on a filter heat-conducting boss 13. The filter switch module 12 is used for filtering, rectifying, and controlling the input and output. The main function of the filter switch module 12 is to filter, rectify, and control the input and output. Through filtering and rectification, noise and spurious signals in the power supply can be eliminated, providing a more stable and cleaner power output. The on / off control function enables precise power management and improves energy efficiency. Placing the filter switch module 12 on the filter heat-conducting boss 13 increases the heat dissipation area and improves heat conduction efficiency. This ensures the normal operating temperature of the filter switch module 12 and allows the heat it generates to be quickly transferred to the outside of the chassis through the filter heat-conducting boss 13, thereby improving overall heat dissipation efficiency. By optimizing the internal layout and thermal management, the problem of low heat dissipation efficiency in the power supply chassis is effectively solved. At the same time, the introduction of the filter switch module 12 also improves power quality and enhances the functionality and reliability of the power supply chassis. Compared to a complex water-cooling system, this invention has a simpler structure, is easier to maintain, and avoids the leakage risks that may arise from a water-cooling system.

[0048] The filter switch module 12 is located in the middle of the chassis housing 2, and the power supply module 3 is located on both sides of the filter switch module 12. Traditional power supply chassis often have the filter switch module 12 and power supply module 3 installed in a dispersed manner, making it impossible to simultaneously dissipate heat from both modules through a single ventilation duct. This not only increases the complexity of internal wiring but also hinders centralized heat management. In contrast, this application places the power supply module 3 on both sides of the filter switch module 12 and uses thermally conductive protrusions for heat dissipation, greatly simplifying the internal structure and improving heat dissipation efficiency. Both the filter switch module 12 and power supply module 3 can be cooled simultaneously through a single ventilation duct. Furthermore, compared to water-cooling solutions, this invention not only avoids the risk of liquid leakage but also significantly reduces maintenance costs and complexity, offering higher reliability and a longer service life.

[0049] To facilitate the removal of the power supply chassis, a handle 7 is provided on the thermally conductive chassis.

[0050] This invention addresses the problems of existing power supply chassis, such as low heat dissipation efficiency, inability to effectively handle high-heat conditions, complex internal structure increasing assembly difficulty, difficult maintenance, and potential safety hazards with long-term operation. These issues severely restrict the performance and reliability of power supply chassis, affecting their effectiveness in practical applications.

[0051] This invention improves heat dissipation efficiency by combining structural optimization and forced convection. The design of the power supply heat-conducting protrusion 4 increases the contact area between the power supply module 3, the filter switch module 12 and the chassis shell 2, which is conducive to the rapid conduction of heat. The directional airflow generated by the heat dissipation components accelerates the heat dissipation. Compared with the traditional air-cooling system, it more effectively solves the problem of low heat dissipation efficiency, while avoiding the complexity and potential risks of water-cooling systems.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A power supply chassis, characterized in that: The device includes a heat-conducting housing and a power module. The heat-conducting housing is provided with a power-conducting heat-conducting protrusion, and the power module is disposed on the power-conducting heat-conducting protrusion. The heat-conducting housing is provided with a heat dissipation component for generating airflow. The airflow generated by the heat dissipation component flows through the power module and is discharged from the heat-conducting housing.

2. The power supply chassis according to claim 1, characterized in that: It also includes a filter switch module, which is disposed on the filter heat-conducting boss and is used to filter, rectify, and control the input and output.

3. The power supply chassis according to claim 1, characterized in that: The heat-conducting enclosure includes an enclosure cover and an enclosure shell, with the enclosure cover mounted on the enclosure shell to form a closed shell.

4. The power supply chassis according to claim 3, characterized in that: The heat dissipation component includes an air inlet, a fan, and an air outlet. The fan is installed in the chassis housing. The air source generated by the fan flows through the air inlet, through the power module and the filter switch module, and is discharged from the air outlet.

5. The power supply chassis according to claim 4, characterized in that: The chassis cover is equipped with an electromagnetic shielding ventilation plate at the air inlet.

6. The power supply chassis according to claim 4, characterized in that: The air inlet is located on the chassis cover, and the air outlet is located on the chassis shell.

7. The power supply chassis according to claim 1, characterized in that: The heat-conducting casing is equipped with a cable tray.

8. The power supply chassis according to claim 3, characterized in that: The heat-conducting chassis is equipped with a cable plug cover assembly, which includes a cable plug cover and a cable plug. The cable plug cover is located at the front end of the chassis housing, and the cable plug serves as the input and output interface of the power supply chassis.

9. The power supply chassis according to claim 8, characterized in that: Conductive rubber strips are provided on the chassis cover and cable socket cover assembly.

10. The power supply chassis according to claim 4, characterized in that: The filter switch module is located in the middle of the chassis housing, and the power supply module is located on both sides of the filter switch module.

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