High-power heat dissipation device

Abstract

The utility model discloses a high-power heat dissipation device which comprises an H-shaped heat source installation supporting framework, a first heat dissipation device and a second heat dissipation device. The first heat dissipation device and the second heat dissipation device are arranged on the side edges of the heat source installation supporting framework in a one-to-one correspondence mode. The heat source modules are installed on the upper portion and the lower portion of the heat source installation supporting framework. A plurality of heat conduction pipe mounting grooves are formed in the heat source mounting and supporting framework; a heat conduction pipe is embedded in the heat conduction pipe mounting groove; the heat source module is attached to the heat conduction pipe. Heat generated by the heat source module is transmitted to the first radiator and the second radiator through the heat source installation supporting framework and the heat conduction pipe. By means of the scheme, the heat dissipation device has the advantages of being simple in structure, reliable in heat dissipation and the like, and has high practical value and popularization value in the technical field of heat dissipation of power amplifiers.

Description

Technical Field

[0001] This utility model relates to the field of power amplifier heat dissipation technology, and in particular to a high-power heat dissipation device. Background Technology

[0002] This technology primarily addresses the heat dissipation requirements of power amplifiers (PAs), especially for high-power (CW 200W-500W), small-size, 4U / 5U, desktop or 19-inch standard rack applications, and supports both active air cooling and water cooling systems. Currently, existing power amplifier heat sinks are often bulky (e.g., one heat sink per power amplifier unit), which hinders miniaturization and integration, and has low heat dissipation efficiency, making it difficult to meet the heat dissipation requirements of high-power amplifiers.

[0003] Therefore, there is an urgent need to propose a high-power heat dissipation device with a simple structure and reliable heat dissipation. Utility Model Content

[0004] To address the above problems, the purpose of this utility model is to provide a high-power heat dissipation device. The technical solution adopted by this utility model is as follows:

[0005] A high-power heat dissipation device is disclosed, comprising several heat source modules, including an H-shaped heat source mounting support frame, and a first heat sink and a second heat sink respectively disposed on the side of the heat source mounting support frame; several heat source modules are mounted on the upper and lower parts of the heat source mounting support frame; several heat pipe mounting slots are formed inside the heat source mounting support frame; heat pipes are embedded in the heat pipe mounting slots; the heat source modules are attached to the heat pipes; the heat generated by the heat source modules is transferred to the first heat sink and the second heat sink through the heat source mounting support frame and the heat pipes.

[0006] Furthermore, the heat source mounting support frame includes a first side plate, a heat source mounting plate, and a second side plate that are integrally formed and together form an H shape; several heat source modules are mounted on the upper and lower parts of the heat source mounting plate.

[0007] Furthermore, several heat pipe mounting slots are formed on the first side plate, the heat source mounting plate, and the second side plate, and a pair of heat pipes are provided in any heat pipe mounting slot.

[0008] Furthermore, the heat source mounting plate is provided with a first notch and a second slot.

[0009] Furthermore, the heat source mounting plate is composed of a first mounting plate and a second mounting plate that are integrally formed and together form a Z-shape.

[0010] Furthermore, a thermally conductive contact portion is provided on the heat pipe and on the surface where the heat source mounting plate is located; the thermally conductive contact portion is thermally bonded to the heat source module.

[0011] Furthermore, the heat source module is a power amplifier.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] (1) This utility model sets up an H-shaped heat source mounting support frame and installs several heat source modules on the top and bottom of the heat source mounting plate. The heat generated is transferred to the first and second heat sinks through the heat source mounting support frame (made of aluminum or copper) and heat pipes, ensuring reliable heat dissipation. In addition, this utility model forms a heat sink air duct within the H-shaped heat source mounting support frame, which facilitates the planning and layout of the air duct in the case of multiple heat sources.

[0014] (2) The heat source mounting plate of this utility model is arranged in a Z-shaped stacked pattern. It works in conjunction with the first notch and the second slot to achieve electrical connection of several heat source modules and to disperse the heat generated by the several heat source modules, thereby further ensuring the reliability of heat dissipation. The heat source mounting plate of this utility model can make more efficient use of space, and at the same time, heat is conducted from the heat source modules to the heat sinks on both sides for heat exchange through heat pipes.

[0015] In summary, this utility model has the advantages of simple structure and reliable heat dissipation, and has high practical and promotional value in the field of power amplifier heat dissipation technology. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope of protection. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a structural schematic diagram of the present invention from a first angle.

[0018] Figure 2 This is a structural schematic diagram of the present invention from a second angle.

[0019] Figure 3 This is a schematic diagram of the heat source removal module of this utility model.

[0020] Figure 4 This is a schematic diagram of the structure of the heat source mounting support frame in this utility model.

[0021] Figure 5 This is a cross-sectional schematic diagram of the heat source mounting support frame in this utility model.

[0022] In the above figures, the component names corresponding to the reference numerals are as follows:

[0023] 1. Heat source mounting support frame; 2. First heat sink; 3. Second heat sink; 4. Heat source module; 11. First side plate; 12. Heat source mounting plate; 13. Second side plate; 14. First notch; 15. Second slot; 16. Heat pipe mounting groove; 17. Heat pipe; 121. First mounting plate; 122. Second mounting plate; 171. Heat-conducting contact part. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this application clearer, the present invention will be further described below with reference to the accompanying drawings and embodiments. The embodiments of this utility model include, but are not limited to, the following embodiments. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0025] In this embodiment, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0026] The terms "first" and "second," etc., used in the specification and claims of this embodiment are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.

[0027] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0028] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.

[0029] like Figures 1 to 5 As shown, this embodiment provides a high-power heat dissipation device for installing several heat source modules 4 and exchanging the heat generated by the heat source modules 4. The heat source module 4 is a power amplifier.

[0030] In this embodiment, the high-power heat dissipation device includes an H-shaped heat source mounting support frame 1, with a first heat sink 2 and a second heat sink 3 correspondingly arranged on the sides of the heat source mounting support frame 1. Several heat source modules 4 are mounted on the upper and lower parts of the heat source mounting support frame 1. The heat generated by the power amplifier is transferred to the first heat sink 2 and the second heat sink 3 through the heat source mounting support frame 1 and heat pipes 17. Here, the heat source mounting support frame 1 is made of aluminum or copper thermally conductive material.

[0031] In this embodiment, the heat source mounting support frame 1 includes a first side plate 11, a heat source mounting plate 12, and a second side plate 13, all integrally formed to form an H shape. Several heat-conducting pipe mounting grooves 16 are formed within the first side plate 11, the heat source mounting plate 12, and the second side plate 13, and heat-conducting pipes 17 are embedded within these grooves. A heat-conducting contact portion 171 is provided on the heat-conducting pipe 17, located on the surface of the heat source mounting plate 12, and this contact portion 171 is thermally bonded to the heat source module 4 to ensure reliable heat conduction.

[0032] In this embodiment, a first notch 14 and a second slot 15 are provided on the heat source mounting plate 12 to facilitate the electrical connection of several power amplifiers. Furthermore, the heat source mounting plate 12 in this embodiment is composed of a first mounting plate 121 and a second mounting plate 122 integrally formed and constituting a Z-shape. This heat source mounting plate 12 has a stacked structure, which can effectively utilize space, while simultaneously transferring heat from the heat source module to the heat sinks on both sides for heat exchange via heat pipes.

[0033] The above embodiments are merely preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Any changes made based on the design principles of this utility model, or any non-creative changes made on this basis, shall fall within the scope of protection of this utility model.

Claims

1. A high-power heat dissipation device, which installs several heat source modules (4), characterized in that, The system includes an H-shaped heat source mounting support frame (1), with a first radiator (2) and a second radiator (3) correspondingly arranged on the side of the heat source mounting support frame (1); several heat source modules (4) are installed on the upper and lower parts of the heat source mounting support frame (1); several heat pipe mounting slots (16) are opened in the heat source mounting support frame (1); heat pipes (17) are embedded in the heat pipe mounting slots (16); the heat source modules (4) are attached to the heat pipes (17); the heat generated by the heat source modules (4) is transferred to the first radiator (2) and the second radiator (3) through the heat source mounting support frame (1) and the heat pipes (17).

2. The high-power heat dissipation device according to claim 1, characterized in that, The heat source mounting support frame (1) includes a first side plate (11), a heat source mounting plate (12), and a second side plate (13) that are integrally formed and together form an H shape; several heat source modules (4) are installed on the upper and lower parts of the heat source mounting plate (12).

3. The high-power heat dissipation device according to claim 2, characterized in that, Several heat pipe mounting slots (16) are formed on the first side plate (11), the heat source mounting plate (12), and the second side plate (13), and a pair of heat pipes (17) are provided in any heat pipe mounting slot (16).

4. A high-power heat dissipation device according to claim 2 or 3, characterized in that, The heat source mounting plate (12) is provided with a first notch (14) and a second slot (15).

5. A high-power heat dissipation device according to claim 2 or 3, characterized in that, The heat source mounting plate (12) is composed of a first mounting plate (121) and a second mounting plate (122) that are integrally formed and together form a Z shape.

6. A high-power heat dissipation device according to claim 2, characterized in that, A thermally conductive contact part (171) is provided on the heat pipe (17) and on the surface where the heat source mounting plate (12) is located; the thermally conductive contact part (171) is thermally bonded to the heat source module (4).

7. A high-power heat dissipation device according to claim 1, characterized in that, The heat source module (4) is a power amplifier.

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