Semiconductor device

Abstract

The utility model discloses a semiconductor device. The semiconductor device comprises a glove box; the reaction cavity comprises a cavity body and a top cover, an opening is formed in the top of the cavity body, the top cover is arranged on the opening to open and close the cavity body, and at least the top cover is arranged in the glove box; the double-shaft lifting mechanism comprises two groups of lifting assemblies which are at least partially positioned in the glove box; each lifting assembly comprises a sliding part, a guide rod and a driving rod; the sliding piece is arranged on the guide rod and is connected with the top cover; the driving rod is used for driving the sliding part to slide up and down along the guide rod to drive the top cover to move up and down to open and close the cavity. According to the utility model, a cavity is opened in a mode of stably lifting the top cover by adopting double shafts, the device is suitable for stably lifting the top cover to an operation height in a limited space of the glove box, and sealing structures are arranged between the guide rod and the bottom plate and between the driving rod and the bottom plate, so that water and oxygen conditions in the glove box meet requirements.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to a semiconductor device. Background Technology

[0002] Some semiconductor devices have strict requirements for water and oxygen conditions, necessitating the installation of glove boxes in their reaction chambers to ensure the purity of the reaction environment. Existing methods for opening and closing the reaction chamber involve a single-axis lifting mechanism combined with a rotating top cover. However, for semiconductor devices with glove boxes, the limited space within the glove box prevents the top cover from rotating. Furthermore, without rotating the top cover, the single-axis lifting mechanism is insufficient to raise the top cover to the operating height. Therefore, the existing method for opening the reaction chamber is unusable in semiconductor devices with glove boxes, necessitating the development of a new semiconductor device. Utility Model Content

[0003] The purpose of this invention is to provide a semiconductor device that solves the problem that the original method of opening the reaction chamber cannot be used when a glove box is added to the existing semiconductor device.

[0004] To achieve the above objectives, this utility model provides a semiconductor device, comprising:

[0005] Glove box;

[0006] A reaction chamber, the reaction chamber including a cavity body and a top cover, the top of the cavity body being provided with an opening, the top cover being disposed on the opening to open and close the cavity body, and at least the top cover being disposed inside the glove box;

[0007] A dual-axis lifting mechanism, comprising two sets of lifting components at least partially located inside the glove box;

[0008] Each of the lifting components includes a slider, a guide rod, and a drive rod;

[0009] The sliding element is disposed on the guide rod and connected to the top cover;

[0010] The drive rod is used to drive the slider to slide up and down along the guide rod, so as to drive the top cover to move up and down and realize the opening and closing of the cavity.

[0011] Optionally, the semiconductor device further includes:

[0012] A maintenance compartment is located on one side of the glove box and is connected to the interior of the glove box via a valve.

[0013] Optionally, the sliding element includes a spline bushing and a mounting plate fixedly connected to the spline bushing;

[0014] The guide rod includes a splined shaft;

[0015] The splined shaft sleeve is fitted onto the splined shaft;

[0016] The mounting plate is connected to the top cover and the drive rod respectively; the drive rod drives the mounting plate to drive the spline bushing to slide up and down along the axial direction of the spline shaft.

[0017] Optionally, the spline bushing includes a lower spline bushing and an upper spline bushing, the lower spline bushing and the upper spline bushing being sequentially sleeved on the spline shaft, and the mounting plate including a cylindrical structure sleeved on the outside of the upper spline bushing and the lower spline bushing and an outwardly extending connecting plate, the connecting plate being connected to the top cover and the drive rod.

[0018] Optionally, one end of the spline shaft passes through the bottom plate of the glove box, and the other end is located below the bottom plate of the glove box.

[0019] Optionally, the guide rod further includes a bushing that passes through the base plate and is sealed to the base plate;

[0020] The splined shaft passes through the bushing and is sealed to the inner wall of the bushing.

[0021] Optionally, the bushing includes a first outer diameter section and a second outer diameter section, the outer diameter of the first outer diameter section is larger than that of the second outer diameter section, the first outer diameter section is located inside the glove box, and a sealing element is provided between the lower surface of the first outer diameter section and the upper surface of the base plate;

[0022] The second outer diameter section passes through the base plate.

[0023] Optionally, the drive rod includes a push rod;

[0024] The push rod includes a housing, which extends through the base plate;

[0025] The push rod body is disposed within the housing;

[0026] Drive mechanism;

[0027] One end of the push rod is fastened to the connecting plate, and the other end is connected to the driving mechanism. The driving mechanism is used to drive the push rod to move linearly within the housing, providing driving force for the spline bushing.

[0028] Optionally, the driving mechanism is a servo motor.

[0029] Optionally, the drive rod further includes a bellows sleeved on the outer shell of the push rod. The bottom of the bellows is sealed to the base plate via a seal, and the top of the bellows is sealed to the outer shell of the push rod via a seal.

[0030] Optionally, the seal is a sealing ring.

[0031] Optionally, the two sets of lifting components of the dual-axis lifting assembly are arranged along the same side of the glove box.

[0032] Optionally, the dual-axis lifting mechanism includes stiffening plates, and the sliding members of the two sets of lifting components are connected through the stiffening plates.

[0033] Optionally, the semiconductor device further includes a bracket for supporting the glove box, with the lower ends of the guide rod and the drive rod respectively fixedly connected to the bracket.

[0034] Compared with the prior art, this utility model has at least the following advantages:

[0035] The semiconductor device provided by this utility model includes a glove box, a reaction chamber, and a dual-axis lifting mechanism. The reaction chamber includes a cavity body and a top cover. An opening is provided at the top of the cavity body, and the top cover is disposed on the opening to open and close the cavity body. At least the top cover is located inside the glove box. The dual-axis lifting mechanism includes two sets of lifting components, each at least partially located inside the glove box. Each lifting component includes a sliding member, a guide rod, and a drive rod. The sliding member is disposed on the guide rod and connected to the top cover. The drive rod drives the sliding member to slide up and down along the guide rod, thereby causing the top cover to move up and down, realizing the opening and closing of the cavity body. The semiconductor device provided by this utility model achieves cavity opening by smoothly lifting the top cover using a dual-axis lifting mechanism, driven by the drive rod of the dual-axis lifting mechanism. This is suitable for smoothly lifting the top cover to the operating height within the limited space of the glove box. Furthermore, a sealing structure is provided between the guide rod and the base plate, and between the drive rod and the base plate, ensuring that the water and oxygen conditions inside the glove box meet the requirements. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the structure of a semiconductor device provided in an embodiment of the present invention;

[0037] Figure 2 This is a partial structural schematic diagram of a semiconductor device provided in an embodiment of the present invention;

[0038] Figure 3 This is a partial structural schematic diagram of a semiconductor device provided in an embodiment of the present invention;

[0039] Figure 4This is a schematic diagram of the structure of a dual-axis lifting mechanism provided in an embodiment of the present invention;

[0040] Figure 5 This is a schematic diagram of the structure of a sliding member provided in an embodiment of the present invention;

[0041] Figure 6 This is a schematic diagram of the structure of a bushing provided in an embodiment of the present invention;

[0042] Figure 7 This is a schematic diagram of the structure of the drive rod provided in one embodiment of the present invention.

[0043] Explanation of reference numerals in the attached figures:

[0044] 100 - Glove box; 110 - Base plate;

[0045] 200 - Reaction chamber; 210 - Chamber body; 220 - Top cover;

[0046] 300-Boosting Components;

[0047] 310 - Sliding component; 311 - Splined bushing; 311A ​​- Upper splined bushing; 311B - Lower splined bushing; 312 - Mounting plate;

[0048] 320 - Guide rod; 321 - Splined shaft; 322 - Shaft sleeve;

[0049] 330 - Drive rod; 331 - Housing; 332 - Push rod body; 333 - Bellows;

[0050] 400 - Maintenance bay;

[0051] 500-rib plate;

[0052] 10 - Seals. Detailed Implementation

[0053] The semiconductor device proposed by this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, only for the purpose of conveniently and clearly illustrating the embodiments of this utility model. Please refer to the drawings to make the objectives, features, and advantages of this utility model more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives achieved by this utility model, should still fall within the scope of the technical content disclosed in this utility model.

[0054] As described in the background art, there is a problem in existing semiconductor equipment where the original single-axis lifting and rotation opening method cannot be used due to the addition of a glove box. Because the space inside the glove box is limited, the single-axis lifting and rotation opening method will cause the top cover to collide with the side wall of the glove box.

[0055] In view of this, please refer to Figures 1-7 The semiconductor device provided in this embodiment includes: a glove box 100; a reaction chamber 200, the reaction chamber 200 including a cavity 210 and a top cover 220, the top of the cavity 210 having an opening, the top cover 220 being disposed on the opening to open and close the cavity 210, and at least the top cover 220 being disposed inside the glove box 100; a dual-axis lifting mechanism, the dual-axis lifting mechanism including two sets of lifting components 300 at least partially located inside the glove box 100; each lifting component 300 including a slider 310, a guide rod 320 and a drive rod 330; the slider 310 being disposed on the guide rod 320 and connected to the top cover 220; the drive rod 330 being used to drive the slider 310 to slide up and down along the guide rod 320, thereby driving the top cover 220 to move up and down, realizing the opening and closing of the cavity 210.

[0056] The semiconductor device provided in this embodiment features a dual-axis lifting mechanism comprising two sets of lifting components 300. Each lifting component 300 includes a guide rod 320, a sliding member 310 mounted on the guide rod 320 and capable of sliding up and down along the guide rod 320, and a driving member. The sliding member 310 is connected to the top cover 220 of the reaction chamber 200. The driving rod 330 drives the sliding member 310 to slide up and down, thereby lifting and lowering the top cover 220 and opening and closing the cavity 210 of the reaction chamber 200. Since this embodiment provides an up-and-down opening method, there is no interference with the side wall of the glove box during the up-and-down movement, solving the problem that the original single-axis lifting and rotation opening method cannot be used in existing semiconductor devices due to the addition of a glove box 100.

[0057] In some embodiments, please refer to Figure 1 The semiconductor device also includes a maintenance compartment 400, which is located on one side of the glove box 100 and connected to the inside of the glove box 100 via a valve. When the reaction chamber 200 requires maintenance, the valve is opened to transfer the components requiring maintenance from the reaction chamber 200 to the maintenance compartment 400.

[0058] In some embodiments, please refer to Figure 5The sliding member 310 includes a splined bushing 311 and a mounting plate 312 fixedly connected to the splined bushing 311. The guide rod 320 includes a splined shaft 321, and the splined bushing 311 is sleeved on the splined shaft 321. The mounting plate 312 is connected to the top cover 220 and the drive rod 330 respectively. The drive rod 330 drives the mounting plate 312 to drive the splined bushing 311 to slide up and down along the axial direction of the splined shaft 321. In this embodiment, the drive rod 330 drives the mounting plate 312 to move up and down. The mounting plate 312 is fastened to the splined bushing 311. The splined bushing 311 is sleeved on the splined shaft 321. The splined shaft 321 provides a guiding function, and the up and down sliding is achieved by the cooperation of the splined bushing 311 and the splined shaft 321, which improves the assembly accuracy of the lifting component 300 in the semiconductor device and ensures the stability of the lifting process of the top cover 220.

[0059] In the above embodiments, specifically, the spline bushing 311 includes a lower spline bushing 311B and an upper spline bushing 311A, which are sequentially sleeved on the spline shaft 321. The mounting plate 312 includes a cylindrical structure sleeved on the lower spline bushing 311B and the upper spline bushing 311A, and an outwardly extending connecting plate. The connecting plate is connected to the top cover 220 and the drive rod 330. Specifically, the top cover 220 and the connecting plate can be connected by fasteners, which is not specifically limited here. In this embodiment, the drive rod 330 is fastened to the connecting plate, and the drive rod 330 drives the connecting plate to move up and down. The connecting plate is fixedly connected to the top cover 220 to drive the top cover 220 to rise or fall. The mounting plate 312 also includes a cylindrical structure disposed on the lower spline bushing 311B and the upper spline bushing 311A. The cylindrical structure is fastened to the upper spline bushing 311A ​​and the lower spline bushing 311B. The lower spline bushing 311B and the upper spline bushing 311A ​​are sequentially sleeved on the spline shaft 321 and can slide up and down along the spline shaft 321. The spline shaft 321 provides guidance for the up and down movement of the top cover 220. The spline shaft 321, combined with two spline bushings, can provide a higher bending moment to meet the load of the top cover 220.

[0060] In some embodiments, please refer to Figure 1 and 6 One end of the spline shaft 321 penetrates the bottom plate 110 of the glove box 100 and is disposed inside the glove box 100, while the other end of the spline shaft 321 is located below the bottom plate 110 of the glove box 100.

[0061] In some embodiments, please refer to Figure 6The guide rod 320 also includes a bushing 322, which penetrates the base plate 110 and is sealed to the base plate 110. The spline shaft 321 penetrates the bushing 322 and is tightly connected to the inner wall of the bushing 322. It should be noted that there is no relative sliding between the spline shaft 321 and the bushing 322. The spline shaft 321 and the bushing 322 are tightly connected. The bushing 322 and the spline shaft 321 are connected by a hot-fitting process to isolate the glove box 100 from the external gas environment.

[0062] In the above embodiment, specifically, the bushing 322 includes a first outer diameter section and a second outer diameter section. The outer diameter of the first outer diameter section is larger than that of the second outer diameter section. The first outer diameter section is located inside the glove box 100, and a sealing element 10 is provided between the lower surface of the first outer diameter section and the upper surface of the base plate 110. The second outer diameter section passes through the base plate 110. In this embodiment, by providing a sealing element 10 between the lower surface of the first outer diameter section and the upper surface of the base plate 110, the gas environment inside the glove box 100 is isolated from the external environment, ensuring the water and oxygen conditions inside the glove box 100.

[0063] In some embodiments, please refer to Figure 7 The drive rod 330 includes a push rod; the push rod includes a housing 331, which penetrates the base plate 110; a push rod body 332 disposed within the housing 331; and a drive mechanism; one end of the push rod body 332 is fastened to the connecting plate, and the other end is connected to the drive mechanism, which drives the push rod body 332 to move linearly within the housing 331, providing driving force for the spline bushing 311.

[0064] In the above embodiments, the driving mechanism specifically includes a servo motor. Using a servo motor ensures that the two motors operate synchronously, guaranteeing the smooth rise of the top cover 220. Other driving mechanisms may be used in other embodiments, and no specific limitations are made here.

[0065] Specifically, in some embodiments, the push rod is an electric push rod, the housing 331 is a motor housing, the push rod body 332 is a motor push rod, the driving mechanism is a servo motor, one end of the motor push rod is fastened to the connecting plate, and the servo motor is used to drive the motor push rod to move linearly within the motor housing, providing driving force for the spline bushing 311.

[0066] In some embodiments, the drive rod 330 further includes a bellows 333, which is sleeved on the outer shell 331 of the push rod. The bottom of the bellows 333 is sealed to the base plate 110 via a seal 10, and the top of the bellows 333 is sealed to the outer shell 331 of the push rod via a seal 10. In this embodiment, the sealing method of the bellows 333 allows the push rod body 332 to have room for position adjustment when moving up and down, preventing the push rod body 332 from deforming due to bending moment. At the same time, by providing seals 10 between the bottom of the bellows 333 and the base plate 110, and between the top of the bellows 333 and the outer shell 331 of the push rod, the internal and external gas environments of the glove box 100 are isolated, ensuring the water and oxygen environment inside the glove box 100.

[0067] Specifically, in some embodiments, the sealing element 10 is a sealing ring, while in other embodiments, other sealing elements 10 may be used, and no specific limitation is made here.

[0068] In some embodiments, the two sets of lifting components 300 of the dual-axis lifting mechanism are arranged along the same side of the glove box 100. In this embodiment, by arranging two sets of lifting components 300 on the same side of the glove box 100, the space occupied by the lifting components 300 inside the glove box 100 is reduced, making it easier for operators to operate inside the glove box 100.

[0069] In some embodiments, the dual-axis lifting mechanism includes a stiffening plate 500, and the sliding members 310 of the two sets of lifting components 300 are connected through the stiffening plate 500. In this embodiment, the two sets of lifting components 300 are connected by the stiffening plate 500, and the stiffening plate 500 is fixedly connected to the sliding members 310 of the two sets of lifting components 300, so as to realize the synchronous lifting of the sliding members 310 in the two sets of lifting components 300, and at the same time improve the structural strength.

[0070] In some embodiments, the semiconductor device further includes a bracket (not shown) for supporting the glove box 100, and the lower ends of the guide rod 320 and the drive rod 330 are respectively fixedly connected to the bracket. Specifically, the lower ends of the spline shaft 321 and the push rod are both fixed to the bracket.

[0071] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0072] In the description of this utility model, it should be understood that the terms "center," "height," "thickness," "upper," "lower," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0073] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A semiconductor device, characterized in that, include: Glove box; A reaction chamber, the reaction chamber including a cavity body and a top cover, the top of the cavity body being provided with an opening, the top cover being disposed on the opening to open and close the cavity body, and at least the top cover being disposed inside the glove box; A dual-axis lifting mechanism, comprising two sets of lifting components at least partially located inside the glove box; Each of the lifting components includes a slider, a guide rod, and a drive rod; The sliding element is disposed on the guide rod and connected to the top cover; The drive rod is used to drive the slider to slide up and down along the guide rod, so as to drive the top cover to move up and down and realize the opening and closing of the cavity.

2. The semiconductor device as claimed in claim 1, characterized in that, The semiconductor device also includes: A maintenance compartment is located on one side of the glove box and is connected to the interior of the glove box via a valve.

3. The semiconductor device as claimed in claim 1, characterized in that, The sliding component includes a splined bushing and a mounting plate fixedly connected to the splined bushing; The guide rod includes a splined shaft; The splined shaft sleeve is fitted onto the splined shaft; The mounting plate is connected to the top cover and the drive rod respectively; the drive rod drives the mounting plate to drive the spline bushing to slide up and down along the axial direction of the spline shaft.

4. The semiconductor device as claimed in claim 3, characterized in that, The spline bushing includes a lower spline bushing and an upper spline bushing, which are sequentially sleeved on the spline shaft. The mounting plate includes a cylindrical structure sleeved on the outside of the upper spline bushing and the lower spline bushing, and an outwardly extending connecting plate. The connecting plate is connected to the top cover and the drive rod.

5. The semiconductor device as claimed in claim 4, characterized in that, One end of the splined shaft passes through the bottom plate of the glove box, and the other end is located below the bottom plate of the glove box.

6. The semiconductor device as claimed in claim 5, characterized in that, The guide rod also includes a bushing, which passes through the base plate and is sealed to the base plate; The splined shaft passes through the bushing and is sealed to the inner wall of the bushing.

7. The semiconductor device as claimed in claim 6, characterized in that, The bushing includes a first outer diameter section and a second outer diameter section. The outer diameter of the first outer diameter section is larger than that of the second outer diameter section. The first outer diameter section is located inside the glove box. A sealing element is provided between the lower surface of the first outer diameter section and the upper surface of the base plate. The second outer diameter section passes through the base plate.

8. The semiconductor device as claimed in claim 3, characterized in that, The drive rod includes a push rod; The push rod includes a housing that extends through the bottom plate of the glove box; The push rod body is disposed within the housing; Drive mechanism; One end of the push rod is fastened to the mounting plate, and the other end is connected to the drive mechanism. The drive mechanism is used to drive the push rod to move linearly within the housing, providing driving force for the spline bushing.

9. The semiconductor device as claimed in claim 8, characterized in that, The drive mechanism is a servo motor.

10. The semiconductor device as claimed in claim 8, characterized in that, The drive rod also includes a bellows, which is sleeved on the outer shell of the push rod. The bottom of the bellows is sealed to the base plate through a seal, and the top of the bellows is sealed to the outer shell of the push rod through a seal.

11. The semiconductor device as claimed in claim 7 or 10, characterized in that, The sealing element is a sealing ring.

12. The semiconductor device as claimed in claim 1, characterized in that, The two sets of lifting components of the dual-axis lifting mechanism are arranged along the same side of the glove box.

13. The semiconductor device as claimed in claim 1, characterized in that, The dual-axis lifting mechanism includes stiffening plates, and the sliding members of the two sets of lifting components are connected through the stiffening plates.

14. The semiconductor device as claimed in claim 1, characterized in that, The semiconductor device also includes a bracket for supporting the glove box, and the lower ends of the guide rod and the drive rod are respectively fixedly connected to the bracket.

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