Compatible wafer overturning and clamping system clamp
By using a compatible wafer flipping clamping system, the problem of compatibility in clamping wafers of different sizes has been solved, realizing automated clamping and flipping, improving production efficiency and equipment cleanliness, and increasing product yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2026-03-20
AI Technical Summary
In the existing technology, the flipping fixture cannot meet the compatibility of clamping wafers of different sizes, which leads to cumbersome operation, affects production efficiency and equipment cleanliness, and may introduce contaminants, reduce product yield and equipment stability.
Design a compatible wafer flipping clamping system fixture. The fixture adopts a compatible clamping mechanism, which detects the wafer position through a detector and uses the cooperation of clamping steps and clamping arms to realize automatic clamping and flipping of wafers of different sizes, avoiding the need for fixture replacement.
This technology enables direct clamping of wafers of different sizes without changing fixtures, reducing the entry of contaminants, improving production efficiency and equipment cleanliness, and ensuring product yield and equipment stability.
Smart Images
Figure CN224022228U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, specifically relating to a compatible wafer flipping clamping system fixture. Background Technology
[0002] In wafer manufacturing, single-wafer cleaning machines perform high-precision cleaning on individual wafers to ensure the cleaning quality of each process. Cleaning processes are integrated throughout the entire wafer manufacturing process, including pre-diffusion cleaning, post-etching cleaning, post-ion implantation cleaning, resist removal cleaning, pre / post-film deposition cleaning, and post-mechanical polishing cleaning. These processes are crucial for removing particles, chemical residues, and contaminants generated during processing, ensuring the cleanliness of the wafer surface. During these cleaning processes, the wafer needs to be flipped for cleaning, making the wafer flipping fixture a critical component in this process.
[0003] In existing technologies, to meet the production needs of wafers of different sizes (6-inch and 8-inch), it is common to use interchangeable flip-top fixtures to accommodate wafers of different specifications. This method is cumbersome, and the frequent fixture changes not only affect production efficiency but may also introduce contaminants during the changeover process, compromising the cleanliness of the equipment and impacting product yield and the long-term stability of the equipment.
[0004] Therefore, a compatible wafer flipping clamping system fixture is designed to solve the technical problem that existing flipping fixtures cannot meet the requirements for clamping wafers of different sizes.
[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content
[0006] This disclosure provides at least one compatible wafer flipping clamping system fixture.
[0007] In a first aspect, embodiments of this disclosure provide a compatible wafer flipping clamping system fixture, comprising:
[0008] The detector is mounted on the fixed plate and detects whether a wafer is placed in the wafer placement position;
[0009] The clamping mechanism includes a drive unit and a pair of clamping steps driven by the drive unit and arranged vertically; wherein
[0010] The proximal ends of the two clamping steps are mounted on a fixed plate, and the distal ends are provided with a pair of wafer clamping arms; and,
[0011] The control module is electrically connected with the driving device and the detector, and is configured to control the driving device to drive the two clamping steps to drive the wafer clamping arms to close to clamp the wafer after receiving the wafer storage signal of the detector.
[0012] In an alternative embodiment, the lower end surface of the upper wafer clamping arm is uniformly arrayed with a plurality of first wafer clamping pieces; and
[0013] A plurality of second wafer clamping pieces are arrayed on the lower end surface of the upper wafer clamping arm, and the distance between each second wafer clamping piece and the center of the wafer placement position is greater than the distance between each first wafer clamping piece and the center of the wafer placement position.
[0014] In an alternative embodiment, the upper end surface of the lower wafer clamping arm is uniformly arrayed with a plurality of first wafer clamping pieces; and
[0015] A plurality of second wafer clamping pieces are arrayed on the upper end surface of the lower wafer clamping arm, and the distance between each second wafer clamping piece and the center of the wafer placement position is greater than the distance between each first wafer clamping piece and the center of the wafer placement position.
[0016] In an alternative embodiment, the proximal ends of the upper clamping step and the lower clamping step are both in sliding connection with the fixed plate; wherein
[0017] A pull spring hanging hole is formed on the lower clamping step; and
[0018] A pull spring is arranged on the upper clamping step;
[0019] One end of the pull spring is connected with the upper clamping step, and the other end passes through the pull spring hanging hole and is connected with the lower clamping step.
[0020] In an alternative embodiment, the side opposite to the upper clamping step and the lower clamping step of the driving device is provided with a driver; wherein
[0021] The output end of the driver is connected with a T-shaped limiting piece;
[0022] Each T-shaped limiting piece is respectively in abutment with the upper clamping step and the lower clamping step to limit the movement of the upper clamping step and the lower clamping step.
[0023] In an alternative embodiment, the end surface of the upper clamping step and the lower clamping step close to the corresponding T-shaped limiting piece is provided with a limiting plate; wherein
[0024] The horizontal part of each T-shaped limiting piece is respectively in abutment with the corresponding limiting plate, thereby limiting the contraction of the pull spring when the driver is stopped.
[0025] In an alternative embodiment, the central bearing of the fixed plate is connected with a rotating disc; wherein
[0026] The clamping step is in sliding connection with the rotating disc; and
[0027] The lower clamping step is in sliding connection with the rotating disc.
[0028] In an alternative embodiment, a motor is arranged on the fixing plate.
[0029] An output end of the motor is provided with a rotating shaft; and
[0030] One end of the rotating shaft penetrates through the rotating disc and is connected with the rotating disc; wherein
[0031] The motor is adapted to drive the rotating disc to rotate through the rotating shaft when being started, thereby driving the wafer in the wafer placing position to overturn.
[0032] The beneficial effects of the present application are that the present clamp is provided with a pair of compatible clamping mechanisms arranged on the upper and lower wafer clamping arms, when it is necessary to clean wafers of different sizes, the clamp does not need to be replaced, the wafer is directly placed in the wafer placing position, and the compatible clamping mechanism is used to clamp the wafer to be cleaned, so that the wafer is fixed.
[0033] Other features and advantages of the present application will be described in the following description, and some of them will become apparent from the description, or will be understood by those skilled in the art through implementation of the present application. The purposes and other advantages of the present application are achieved and obtained by the structures specifically pointed out in the description, claims and drawings.
[0034] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application will be described in detail below with reference to the preferred embodiments and in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS
[0035] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or prior art description. Obviously, the drawings described below are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.
[0036] Figure 1 The overall side view provided by the embodiments of the present disclosure;
[0037] Figure 2 The first perspective view of the overall three-dimensional structure provided by the embodiments of the present disclosure;
[0038] Figure 3 The second perspective view of the overall three-dimensional structure provided by the embodiments of the present disclosure;
[0039] Figure 4 A partial structural enlarged view is provided for the embodiments of the present disclosure Figure 3 A partial structural enlarged view is provided for the embodiments of the present disclosure
[0040] Figure 5 A partial structural enlarged view is provided for the embodiments of the present disclosure
[0041] In the drawings:
[0042] 1, fixed plate; 10, detector; 11, motor; 110, rotating shaft; 12, wafer placement position; 13, rotating disc;
[0043] 2, compatible clamping mechanism; 20, upper wafer clamping arm; 200, upper clamping step; 21, lower wafer clamping arm; 210, lower clamping step; 22, first wafer clamping piece; 23, second wafer clamping piece; 24, driver; 241, T-shaped limiting piece; 25, tension spring; 250, tension spring hanging hole; 26, limiting plate;
[0044] 3, wafer. DETAILED DESCRIPTION
[0045] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0046] In this document, when a first component is referred to as being "on" a second component, it can be directly formed on the second component, or a third component can be interposed between the first component and the second component. Also, in the drawings, the thickness of components can be exaggerated or reduced for effective description of the technical content.
[0047] In this document, when an element or layer is referred to as being "on", "engaged to", "connected to", "attached to", or "coupled to" another element or layer, it can be directly on, engaged, connected, attached, or coupled to the other element or layer, or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on", "directly engaged to", "directly connected to", "directly attached to", or "directly coupled to" another element or layer, there are no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., "between" versus "directly between", "adjacent" versus "directly adjacent", etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.
[0048] In this document, example embodiments of the disclosure will be described in greater detail. As used herein, expressions such as "at least one of," when preceding a list of two or more items, modify the entire list of items and do not modify the list of items as a whole. For example, the expression "at least one of a, b, and c" should be understood to mean only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.
[0049] The terminology used herein is for the purpose of describing particular example configurations only and is not intended to be limiting. As used herein, the singular articles "a," "an," and "the" can be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "has" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order in which they are discussed or illustrated, unless specifically identified as an order of performance. Additional or alternative steps can be employed.
[0050] As used herein, the phrases "in an embodiment," "according to an embodiment," "in some embodiments," and the like, generally mean the particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of the present disclosure. Thus, appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment. As used herein, the term "example" or "exemplary" means "serving as an example, instance, or illustration." Any implementation, aspect or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations, aspects or designs. Rather, the use of the terms "example" or "exemplary" is intended to present concepts in a concrete manner.
[0051] It is found through research that, in the prior art, in order to meet the production needs of different sizes of wafers (6 inches and 8 inches), a replacement flip clamp is usually used to be compatible with wafers of different specifications. This way is cumbersome to operate, and frequent clamp replacement not only affects production efficiency, but also may introduce contaminants during the replacement process, destroy the cleanliness inside the equipment, and affect the yield of the product and the long-term stability of the equipment.
[0052] Based on the above research, the embodiment of the present disclosure provides a compatible wafer flip clamp, which is provided with a pair of compatible clamping mechanisms, respectively arranged on the upper and lower wafer clamping arms. When it is necessary to clean wafers of different sizes, the clamp does not need to be replaced, the wafer is directly placed in the wafer placing position, and the compatible clamping mechanism is used to clamp the wafer to be cleaned to fix the wafer.
[0053] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.
[0054] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0055] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0056] In some embodiments, such as Figure 1 and Figure 2 As shown, the detector 10 detects the wafer placement position 12 in real time. If the wafer 3 is placed in the wafer placement position 12, the control module receives a signal and prepares to perform subsequent clamping operations. That is, it controls the upper clamping step 200 and the lower clamping step 210 to drive the upper wafer clamping arm 20 and the lower wafer clamping arm 21, which are fixed to them respectively, to move closer to each other. The first and second wafer clamping components in the compatible clamping mechanism 2 are used to clamp the wafer 3 of the corresponding size.
[0057] In some embodiments, such as Figure 3 and Figure 4As shown, before placing the wafer 3, for the driver 24 on one side of the lower clamping step 210 (the driver 24 on one side of the upper clamping step 200 and the T-shaped limiting piece 241 are not drawn), at this time the driver 24 is static, the lower end surface of the horizontal part of the T-shaped limiting piece 241 connected with the output end of the driver 24 abuts against the upper end surface of the limiting plate 26 on the lower clamping step 210, that is, at this time the lower clamping step 210 is static (the upper clamping step 200 is the same), at this time the rebound of the tension spring 25 is limited, after the wafer 3 is placed in place, according to the above steps, the detector 10 detects that the wafer 3 is placed, the control module controls the corresponding driver 24 to start, the driver 24 is preferably a telescopic cylinder, the two T-shaped limiting pieces 241 move relative to each other, at this time the upper and lower clamping steps lose the limiting, under the action of the rebound force of the tension spring 25, the upper clamping step 200 and the lower clamping step 210 drive the corresponding upper wafer clamping arm 20 and the lower wafer clamping arm 21 to approach each other, a plurality of first wafer clamping pieces 22 or a plurality of second wafer clamping pieces 23 arranged on the opposite side of the two clamping arms are used to clamp the current wafer 3, since the circular radius formed by the array of the second wafer clamping pieces 23 is greater than the circular radius formed by the array of the first wafer clamping pieces 22, therefore, the two can be used for clamping wafers 3 of different sizes, and without the need to replace parts during clamping, external pollutants are reduced to enter the device, and the cleanliness of the equipment and the yield of the product are ensured.
[0058] Specifically, in the process of cleaning the wafer 3, for example, after the upper surface of the wafer 3 is cleaned, at this time the motor 11 is started, the output end drives the rotating shaft 110 to rotate, that is, the rotating disc 13 can be rotated on the fixed plate 1 by the rotating shaft 110, and the above-mentioned components are all arranged on the rotating disc 13, and then at this time the wafer 3 clamped can be turned over to clean the other surface of the wafer 3.
[0059] In the description of the embodiments of the utility model, unless there is definite provision and limitation, the terms "mounting", "connecting", "connecting" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected, it can be mechanical connection, or electrical connection, it can be directly connected, or indirectly connected through an intermediate medium, it can be the communication between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0060] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as the second element, component, region, layer, or segment.
[0061] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.
[0062] In the above discussion, unless otherwise stated, when used to describe numerical values, the terms “about,” “approximately,” “basically,” etc., indicate a change of + / - 10% in that value.
[0063] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.
Claims
1. A compatible wafer flipping clamping system fixture, characterized in that, include: The detector (10) is set on the fixed plate (1) and detects whether the wafer placement position (12) contains a wafer (3). The clamping mechanism (2) includes a driving device, an upper clamping step (200) and a lower clamping step (210) driven by the driving device and arranged vertically; wherein The proximal ends of the upper clamping step (200) and the lower clamping step (210) are disposed on the fixed plate (1), and the distal ends are respectively provided with an upper wafer clamping arm (20) and a lower wafer clamping arm (21); and, The control module is electrically connected to the drive unit and the detector (10) and is configured to receive the wafer (3) storage signal from the detector (10) and then control the drive unit to drive the upper clamping step (200) and the lower clamping step (210) to drive the upper wafer clamping arm (20) and the lower wafer clamping arm (21) to close together to clamp the wafer (3).
2. The compatible wafer flipping clamping system fixture as described in claim 1, characterized in that, The lower end face of the upper wafer clamping arm (20) is uniformly arrayed with a plurality of first wafer clamping elements (22); and A plurality of second wafer clamping members (23) are arrayed on the lower end face of the upper wafer clamping arm (20), and the center distance between each second wafer clamping member (23) and the wafer placement position (12) is greater than the center distance between each first wafer clamping member (22) and the wafer placement position (12).
3. The compatible wafer flipping clamping system fixture as described in claim 2, characterized in that, The upper surface of the lower wafer clamping arm (21) is uniformly arrayed with a plurality of first wafer clamping elements (22); and A plurality of second wafer clamping members (23) are arrayed on the upper end surface of the lower wafer clamping arm (21), and the distance between the center of each second wafer clamping member (23) and the wafer placement position (12) is greater than the distance between the center of each first wafer clamping member (22) and the wafer placement position (12).
4. The compatible wafer flipping clamping system fixture as described in claim 3, characterized in that, The proximal ends of both the upper clamping step (200) and the lower clamping step (210) are slidably connected to the fixed plate (1); wherein The lower clamping step (210) is provided with a tension spring hanging hole (250); and A tension spring (25) is provided on the upper clamping step (200); One end of the tension spring (25) is connected to the upper clamping step (200), and the other end passes through the tension spring hanging hole (250) and is connected to the lower clamping step (210).
5. The compatible wafer flipping clamping system fixture as described in claim 4, characterized in that, A driver (24) is provided on the opposite side of both the upper clamping step (200) and the lower clamping step (210); wherein The output end of the driver (24) is connected to a T-shaped limiting member (241). Each T-shaped limiting member (241) abuts against the upper clamping step (200) and the lower clamping step (210) respectively to restrict the movement of the upper clamping step (200) and the lower clamping step (210).
6. The compatible wafer flipping clamping system fixture as described in claim 5, characterized in that, Limit plates (26) are provided on one end face of the upper clamping step (200) and the lower clamping step (210) near the corresponding T-shaped limiting member (241); wherein The horizontal portion of each of the T-shaped limiting members (241) abuts against the corresponding limiting plate (26), thereby limiting the contraction of the tension spring (25) when the driver (24) stops.
7. The compatible wafer flipping clamping system fixture as described in claim 6, characterized in that, The central bearing of the fixed plate (1) is connected to a turntable (13); wherein The upper clamping step (200) is slidably connected to the turntable (13); and The lower clamping step (210) is connected to the turntable (13).
8. The compatible wafer flipping clamping system fixture as described in claim 7, characterized in that, A motor (11) is provided on the fixing plate (1); The output end of the motor (11) is provided with a rotating shaft (110); and One end of the rotating shaft (110) passes through the turntable (13) and is connected to the turntable (13); wherein The motor (11) is adapted to drive the turntable (13) to rotate via the rotating shaft (110) when starting, thereby causing the wafer (3) in the wafer placement position (12) to flip.