Chuck mechanism and wafer processing equipment

Abstract

The utility model relates to a chuck mechanism and wafer processing equipment. The chuck mechanism comprises a bearing disc which can controllably rotate around the axis of the bearing disc; the plurality of positioning columns are all arranged on the bearing disc and are arranged at intervals in the circumferential direction of the bearing disc, and the positioning columns jointly define a limiting space for accommodating wafers; the clamping assembly is installed on the bearing disc and provided with a plurality of clamping parts distributed in the circumferential direction of the bearing disc at intervals, and the clamping assembly is constructed to be controllably switched between a clamping state and a loosening state; when the clamping assembly is in a clamping state, the clamping parts are folded towards the interior of the limiting space and abut against the periphery of the wafer located in the limiting space. And when the clamping assembly is in a loosened state, each clamping part expands outwards towards the outside of the limiting space and is separated from the periphery of the wafer in the limiting space.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing equipment technology, specifically a chuck mechanism and wafer processing equipment. Background Technology

[0002] Semiconductor manufacturing processes typically include many steps such as photolithography, ion implantation, etching, and cleaning. For example, in the cleaning process, a chuck is typically used to fix the wafer on a support platform inside the cleaning chamber. The support platform rotates, and cleaning agent is sprayed onto the surface of the wafer through nozzles to remove impurities from the wafer surface.

[0003] Traditionally, chucks use multiple locating pins to hold wafers in place. To facilitate wafer loading and unloading, a certain gap is required between the locating pins and the wafer's perimeter. However, this gap prevents accurate and stable wafer positioning. If the wafer shifts due to inertia during rotation, it can easily collide with the locating pins, or even become flyaway, rendering the wafer unusable and impacting wafer production yield. Utility Model Content

[0004] Therefore, it is necessary to provide a chuck mechanism and wafer processing equipment that can improve the yield of wafer production in order to address the above problems.

[0005] A chuck mechanism, comprising:

[0006] The support plate can be rotated in a controlled manner around its own axis;

[0007] Multiple positioning posts are disposed on the carrier disk and are spaced apart along the circumference of the carrier disk. The positioning posts together enclose a limiting space for accommodating the wafer.

[0008] A clamping assembly is mounted on the carrier plate and has a plurality of clamping portions spaced circumferentially along the carrier plate. The clamping assembly is configured to controllably switch between a clamping state and a releasing state.

[0009] When the clamping assembly is in the clamping state, each of the clamping parts retracts toward the limiting space and abuts against the periphery of the wafer located in the limiting space; when the clamping assembly is in the releasing state, each of the clamping parts expands outward toward the limiting space and separates from the periphery of the wafer located in the limiting space.

[0010] In some embodiments, the chuck mechanism further includes a plurality of support columns, each of which is arranged at circumferential intervals along the carrier disk and located within the limiting space, and each of the support columns is used to jointly support the wafer entering the limiting space.

[0011] In some embodiments, each of the positioning posts corresponds one-to-one with each of the support posts, and each support post is located on the side of the corresponding positioning post facing the limiting space.

[0012] In some embodiments, each of the positioning posts is integrally formed with the corresponding support post.

[0013] In some embodiments, the clamping assembly includes a lifting seat and multiple linkage transmission units. The lifting seat is disposed on the bearing plate and located within the limiting space. Each clamping part is connected to the lifting seat through the linkage transmission unit.

[0014] The lifting seat can rise from a first position to a second position relative to the bearing plate, and drive each of the clamping parts to expand outward toward the limiting space through each of the linkage transmission units; the lifting seat can also descend from the second position to the first position relative to the bearing plate, and drive each of the clamping parts to retract toward the limiting space through each of the linkage transmission units.

[0015] In some embodiments, each of the linkage transmission units includes a first link and a second link, one end of the first link is hinged to the lifting seat, the second link is pivotally connected to the bearing plate, one end of the first link is hinged to one end of the second link, and the other end of the second link is fixedly connected to the clamping part.

[0016] In some embodiments, the clamping assembly further includes a lifting drive and a lifting rod. The carrier plate has a through hole. One end of the lifting rod is connected to the lifting drive, and the other end of the lifting rod passes through the through hole to the side of the carrier plate where the lifting seat is located and abuts against the lifting seat. The lifting drive is used to drive the lifting seat to rise from the first position to the second position via the lifting rod.

[0017] In some embodiments, the chuck mechanism further includes a hollow motor and a rotating bushing. One end of the rotating bushing is connected to the output end of the hollow motor, and the other end of the rotating bushing is connected to the side of the support plate away from the lifting seat. The hollow motor is used to drive the support plate to rotate around its own axis through the rotating bushing. The lifting rod is arranged to pass through the central hole of the hollow motor, the rotating bushing, and the through hole in sequence.

[0018] In some embodiments, the central hole of the hollow motor, the rotating bushing, the through hole, and the lifting rod are coaxially arranged.

[0019] A wafer processing apparatus includes a chuck mechanism as described in any of the above embodiments.

[0020] In actual use, the aforementioned chuck mechanism and wafer processing equipment first have the clamping assembly in a released state. The robotic arm that transports the wafer places the wafer into the limiting space between the positioning posts, and the positioning posts limit the wafer's position. Then, the clamping assembly switches from the released state to the clamping state, causing the clamping parts to retract into the limiting space until they abut against the periphery of the wafer, thus clamping the wafer together. At this point, the positioning posts limit the wafer's position, and the clamping parts clamp and fix the wafer, keeping it relatively fixed to the carrier tray. This ensures that the wafer rotates synchronously with the carrier tray, preventing collisions between the wafer and the positioning posts and preventing wafer slippage, thereby improving the yield rate of wafer production. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the chuck mechanism in one embodiment of this application;

[0022] Figure 2 for Figure 1 A cross-sectional view of the chuck mechanism shown;

[0023] Figure 3 for Figure 1 The diagram shows the assembly structure of the chuck mechanism, including the bearing plate, positioning column, support column, and rotating bushing.

[0024] Figure 4 for Figure 1 A schematic diagram of the linkage transmission unit of the chuck mechanism shown;

[0025] Figure 5 for Figure 4 The front view of the linkage transmission unit shown. Detailed Implementation

[0026] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0027] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0029] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0030] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0031] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0032] Please see Figures 1 to 3 This application provides a chuck mechanism, including a carrier disk 10, a plurality of positioning posts 20, and a clamping assembly (not shown). The carrier disk 10 is controllably rotatable about its own axis. The plurality of positioning posts 20 are disposed on the carrier disk 10 and spaced apart circumferentially along the carrier disk 10. The positioning posts 20 together enclose a limiting space A for accommodating a wafer. The clamping assembly is mounted on the carrier disk 10 and has a plurality of clamping portions 35 spaced apart circumferentially along the carrier disk 10. The clamping assembly is configured to controllably switch between a clamping state and a released state. When the clamping assembly is in the clamping state, each clamping portion 35 retracts towards the limiting space A and abuts against the periphery of the wafer located in the limiting space A, thereby clamping the wafer. When the clamping assembly is in the released state, each clamping portion 35 expands outwards towards the limiting space A and separates from the periphery of the wafer located in the limiting space A, thereby releasing the wafer located in the limiting space A.

[0033] In actual use, the aforementioned chuck mechanism first has the clamping assembly in a released state. The robotic arm that transports the wafer places the wafer into the limiting space A between the positioning posts 20, and uses the positioning posts 20 to limit the wafer. Then, the clamping assembly switches from the released state to the clamping state, causing the clamping parts 35 to retract into the limiting space A until each clamping part 35 abuts against the periphery of the wafer, so that all clamping parts 35 together clamp the wafer. At this time, the positioning posts 20 limit the wafer, and the clamping parts 35 clamp and fix the wafer, making the wafer relatively fixed to the carrier tray 10. This ensures that when the carrier tray 10 rotates, it can drive the wafer to rotate synchronously, avoiding collisions between the wafer and the positioning posts 20 and wafer slippage, which helps to improve the yield of wafer production.

[0034] When the robotic arm handling the wafer needs to remove the wafer, the clamping assembly switches from a clamping state to a released state, causing each clamping part 35 to expand outwards towards the limiting space A, thereby separating each clamping part 35 from the wafer, i.e., each clamping part 35 releases its grip on the wafer. At this time, the wafer in the limiting space A is only limited by each positioning post 20, and the robotic arm handling the wafer can remove the wafer from the limiting space A.

[0035] In some embodiments, the chuck mechanism further includes a plurality of support posts 40, which are spaced apart circumferentially along the carrier disk 10 and located within the limiting space A. Each support post 40 is used to collectively support the wafer entering the limiting space A. Thus, when a wafer-handling robot places the wafer into the limiting space A between the positioning posts 20, each positioning post 20 confines the wafer within the limiting space A, and each support post 40 supports the wafer, preventing direct contact between the wafer within the limiting space A and the carrier disk 10; that is, a certain distance exists between the wafer within the limiting space A and the carrier disk 10.

[0036] Furthermore, each positioning post 20 corresponds one-to-one with each support post 40, and each support post 40 is located on the side of the corresponding positioning post 20 facing the limiting space A, ensuring that the support for the wafer is relatively stable and preventing the wafer from becoming skewed.

[0037] Optionally, each positioning post 20 and its corresponding support post 40 are integrally formed, which helps to reduce the number of parts and the amount of assembly work. Of course, in other embodiments, each positioning post 20 and its corresponding support post 40 can also be separately provided, which is not limited here.

[0038] In the embodiments of this application, the clamping assembly includes a lifting seat 31, multiple linkage transmission units 33, and the aforementioned multiple clamping parts 35. The lifting seat 31 is disposed on the support plate 10 and located within the limiting space A. Each clamping part 35 is connected to the lifting seat 31 via a linkage transmission unit 33. The lifting seat 31 can rise from a first position to a second position relative to the support plate 10, and through each linkage transmission unit 33, drive each clamping part 35 to expand outward toward the limiting space A, thereby separating each clamping part 35 from the wafer located in the limiting space A, i.e., releasing the clamping of the wafer (at this time, the clamping assembly is in a released state). The lifting seat 31 can also descend from the second position to the first position relative to the support plate 10, and through each linkage transmission unit 33, drive each clamping part 35 to retract toward the limiting space A, thereby clamping the wafer located in the limiting space A (at this time, the clamping assembly is in a released state).

[0039] It should be noted that the wafers entering the limiting space A are supported on the various support pillars 40, creating a certain distance between the wafers and the carrier disk 10, thus reserving space for the installation and lifting of the lifting platform 31. In other words, the lifting platform 31 is located within the space between the wafers and the carrier disk 10. Furthermore, by designing the height of each support pillar 40 to be sufficiently large, it is ensured that the lifting platform 31 will not contact the wafers supported on the support pillars 40 when rising from the first position to the second position.

[0040] Please see Figure 4 and Figure 5Optionally, each linkage transmission unit 33 includes a first linkage 331 and a second linkage 333. The two ends of the first linkage 331 are a first end a1 and a second end a2, respectively, and the two ends of the second linkage 333 are a third end a3 and a fourth end a4, respectively. The first end a1 of the first linkage 331 is hinged to the lifting seat 31, the second linkage 333 is pivotally connected to the bearing plate 10, and the third end a3 of the second linkage 333 is hinged to the second end a2 of the first linkage 331. The fourth end a4 of the second linkage 333 is fixedly connected to the corresponding clamping part 35.

[0041] Thus, when the lifting seat 31 rises from the first position to the second position relative to the bearing plate 10, the lifting seat 31 drives the first connecting rod 331 to rise, and the first connecting rod 331 drives the second connecting rod 333 to rotate relative to the bearing plate 10, so that the third end a3 of the second connecting rod 333 rotates upward and the fourth end a4 of the second connecting rod 333 rotates downward, thereby causing the clamping part 35 on the fourth end a4 to separate from the periphery of the wafer, that is, to release the clamping of the wafer.

[0042] When the lifting seat 31 descends from the second position to the first position relative to the bearing plate 10, the lifting seat 31 drives the first connecting rod 331 to descend, and the first connecting rod 331 drives the second connecting rod 333 to rotate in the opposite direction relative to the bearing plate 10, so that the third end a3 of the second connecting rod 333 rotates downward and the fourth end a4 of the second connecting rod 333 rotates upward, thereby driving the clamping part 35 on the fourth end a4 to abut against the periphery of the wafer located in the limiting space A, that is, to achieve the clamping of the wafer.

[0043] Furthermore, the linkage transmission unit 33 also includes a hinge seat 335, which is fixedly connected to the bearing plate 10. The second link 333 is hinged to the hinge seat 335 at a position between the third end a3 and the fourth end a4, so that the second link 333 can rotate relative to the hinge seat 335.

[0044] It should be noted that the linkage transmission unit 33 can also adopt other linkage transmission structures, as long as it can realize the conversion of the rising and falling motion of the lifting seat 31 into the motion of the clamping part 35 releasing and clamping the wafer. There are no limitations here.

[0045] Please see again Figures 1 to 3 In a specific embodiment, the clamping assembly further includes a lifting drive 37 and a lifting rod 39. The carrier plate 10 has a through hole 11 (see...). Figure 3The through hole 11 penetrates both the side of the support plate 10 where the lifting seat 31 is located (i.e., the upper side of the support plate 10) and the side opposite to the lifting seat 31 (i.e., the lower side of the support plate 10). One end of the lifting rod 39 is connected to the lifting drive member 37, and the other end of the lifting rod 39 passes through the through hole 11 to the side of the support plate 10 where the lifting seat 31 is located, and abuts against the lifting seat 31. The lifting drive member 37 is used to drive the lifting seat 31 from a first position to a second position via the lifting rod 39. Optionally, the lifting drive member 37 can be a cylinder.

[0046] Thus, when it is necessary to release the wafer in the limiting space A, the lifting drive 37 drives the lifting rod 39 to rise, so that the lifting rod 39 lifts the lifting seat 31 from the first position to the second position. The lifting seat 31 drives each clamping part 35 to separate from the periphery of the wafer located in the limiting space A through each linkage transmission unit 33.

[0047] When it is necessary to clamp the wafer in the limiting space A, the lifting drive 37 drives the lifting rod 39 to descend, so that the lifting seat 31 descends from the second position to the first position under its own gravity. The lifting seat 31 drives each clamping part 35 to abut against the periphery of the wafer in the limiting space A through each linkage transmission unit 33, so that each clamping part 35 clamps the wafer in the limiting space A together.

[0048] In a specific embodiment, the chuck mechanism further includes a hollow motor 50 and a rotating sleeve 60. One end of the rotating sleeve 60 is connected to the output end of the hollow motor 50, enabling the hollow motor 50 to drive the rotating sleeve 60 to rotate. The other end of the rotating sleeve 60 is fixedly connected to the side of the support plate 10 away from the lifting seat 31, allowing the support plate 10 to rotate together with the rotating sleeve 60. The aforementioned lifting rod 39 is sequentially arranged through the central hole 51 of the hollow motor 50, the rotating sleeve 60, and the through hole 11, thereby ensuring that the lifting rod 39 does not interfere with the rotation of the rotating sleeve 60 and the support plate 10. Thus, when it is necessary to rotate the wafer located in the limiting space A, firstly, the lifting drive 37 drives the lifting rod 39 to descend, causing the lifting seat 31 to descend from the second position to the first position under its own gravity, thereby causing the various clamping parts 35 to jointly clamp and fix the wafer located in the limiting space A. Then, the hollow motor 50 drives the rotating bushing 60 to rotate, which in turn drives the bearing disk 10 to rotate, and the bearing disk 10 drives the clamped and fixed wafer to rotate together.

[0049] Optionally, the central hole 51, rotating bushing 60, and through hole 11 of the hollow motor 50 are coaxially arranged with the lifting rod 39 to ensure that the lifting rod 39 does not interfere with the rotating bushing 60 and the support plate 10 when the hollow motor 50 drives them to rotate. Of course, in other embodiments, the axis of the lifting rod 39 may also have a small deviation from the axis of the central hole 51, rotating bushing 60, and through hole 11 of the hollow motor 50, as long as the lifting rod 39 does not interfere with the rotating bushing 60 and the support plate 10, and this is not limited here.

[0050] Based on the aforementioned chuck mechanism, this application also provides a wafer processing apparatus, which includes a chuck mechanism for fixing wafers. It should be noted that the wafer processing apparatus can be a wafer cleaning apparatus, a wafer etching apparatus, or a resist stripping apparatus, etc., as long as it requires a chuck mechanism to fix the wafers; no limitation is made here.

[0051] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A chuck mechanism, characterized in that, include: The support plate (10) can be rotated in a controlled manner around its own axis; Multiple positioning posts (20) are all disposed on the carrier disk (10) and are arranged at intervals along the circumference of the carrier disk (10). The positioning posts (20) together enclose a limiting space (A) for accommodating the wafer. A clamping assembly is mounted on the carrier plate (10) and has a plurality of clamping portions (35) arranged circumferentially along the carrier plate (10). The clamping assembly is configured to controllably switch between a clamping state and a releasing state. When the clamping assembly is in the clamping state, each of the clamping parts (35) retracts toward the limiting space (A) and abuts against the periphery of the wafer located in the limiting space (A); when the clamping assembly is in the releasing state, each of the clamping parts (35) expands outward toward the limiting space (A) and separates from the periphery of the wafer located in the limiting space (A).

2. The chuck mechanism according to claim 1, characterized in that, The chuck mechanism also includes a plurality of support columns (40), each of which is arranged at intervals along the circumference of the bearing disk (10) and located within the limiting space (A). Each of the support columns (40) is used to jointly support the wafer entering the limiting space (A).

3. The chuck mechanism according to claim 2, characterized in that, Each of the positioning posts (20) corresponds to each of the support posts (40), and each support post (40) is located on the side of the corresponding positioning post (20) facing the limiting space (A).

4. The chuck mechanism according to claim 3, characterized in that, Each of the positioning posts (20) is integrally formed with the corresponding support post (40).

5. The chuck mechanism according to claim 1, characterized in that, The clamping assembly includes a lifting seat (31) and multiple linkage transmission units (33). The lifting seat (31) is disposed on the bearing plate (10) and located within the limiting space (A). Each clamping part (35) is connected to the lifting seat (31) through the linkage transmission unit (33). The lifting seat (31) can rise from the first position to the second position relative to the bearing plate (10), and drive the clamping parts (35) to expand outward toward the limiting space (A) through the linkage transmission units (33); the lifting seat (31) can also descend from the second position to the first position relative to the bearing plate (10), and drive the clamping parts (35) to retract toward the limiting space (A) through the linkage transmission units (33).

6. The chuck mechanism according to claim 5, characterized in that, Each of the linkage transmission units (33) includes a first link (331) and a second link (333). One end of the first link (331) is hinged to the lifting seat (31), and the second link (333) is pivotally connected to the bearing plate (10). One end of the first link (331) is hinged to one end of the second link (333), and the other end of the second link (333) is fixedly connected to the clamping part (35).

7. The chuck mechanism according to claim 5, characterized in that, The clamping assembly further includes a lifting drive (37) and a lifting rod (39). The bearing plate (10) has a through hole (11). One end of the lifting rod (39) is connected to the lifting drive (37), and the other end of the lifting rod (39) passes through the through hole (11) to the side of the bearing plate (10) where the lifting seat (31) is located, and abuts against the lifting seat (31). The lifting drive (37) is used to drive the lifting seat (31) to rise from the first position to the second position through the lifting rod (39).

8. The chuck mechanism according to claim 7, characterized in that, The chuck mechanism also includes a hollow motor (50) and a rotating bushing (60). One end of the rotating bushing (60) is connected to the output end of the hollow motor (50), and the other end of the rotating bushing (60) is connected to the side of the bearing plate (10) away from the lifting seat (31). The hollow motor (50) is used to drive the bearing plate (10) to rotate around its own axis through the rotating bushing (60). The lifting rod (39) is arranged to pass through the center hole (51) of the hollow motor (50), the rotating bushing (60) and the through hole (11) in sequence.

9. The chuck mechanism according to claim 8, characterized in that, The central hole (51) of the hollow motor (50), the rotating bushing (60), the through hole (11) and the lifting rod (39) are coaxially arranged.

10. A wafer processing apparatus, characterized in that, Includes the chuck mechanism as described in any one of claims 1 to 9.

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