Clamping tool for semiconductor device production
By designing the clamping structure and airflow channel of the clamping fixture, the problem of wafer displacement caused by inertia during the transportation of wafers by the robotic arm was solved, and stable wafer transportation was achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-26
- Publication Date
- 2026-03-20
AI Technical Summary
During the transport of existing semiconductor wafers by robotic arms, displacement is easily caused by inertia, resulting in unstable transport.
A clamping fixture for semiconductor device manufacturing has been designed, comprising a support frame and a clamping frame. The clamping frame is equipped with a positioning shaft and a clamping structure. The clamping structure consists of a pressing section and a clamping section, combined with an airflow channel and air holes, to use airflow to generate suction to fix the wafer.
It effectively prevents wafers from shifting due to inertia during transportation, ensuring transport stability, and fixes the wafer position through airflow.
Smart Images
Figure CN224022234U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor clamping, specifically to a clamping tool for semiconductor device production. BACKGROUND
[0002] The wafer robot is an automatic device specially designed for a semiconductor manufacturing environment, used for processing and carrying wafers in a clean room, which can complete accurate positioning and transportation of wafers in a narrow space, and the structure comprises a mechanical arm and a clamping frame.
[0003] However, when the mechanical arm runs and transports the wafers, inertia will be generated, and the wafer cannot be guaranteed to be stable when being lifted by the clamping frame, and displacement of the wafer will easily occur under the action of inertia. UTILITY MODEL CONTENT
[0004] The utility model solves the technical problem that the existing semiconductor wafer will produce displacement under the inertia of the mechanical arm when being transported, resulting in unstable transportation effect.
[0005] To solve the above problems, the utility model adopts the technical scheme of a clamping tool for semiconductor device production, which comprises a support frame, a clamping frame fixed at one end of the support frame, a pair of recesses symmetrically formed on the upper side of the clamping frame, a positioning shaft fixed on the inner side of the recess, a clamping structure rotatably arranged on the outer side of the positioning shaft, the clamping structure comprising a pressing section and a clamping section, a compression spring arranged between the pressing section and the recess, an airflow channel formed in the clamping frame, a plurality of openings symmetrically formed on the upper side of the clamping frame, a gas port fixed on one side of the opening and connected with the airflow channel, and a plurality of air holes formed on the upper side of the clamping frame and connected with the airflow channel.
[0006] As a further scheme of the utility model, the pressing section and the clamping section form an angle of 100 degrees, which facilitates clamping of the wafer.
[0007] As a further scheme of the utility model, the plurality of air holes are located between the two recesses.
[0008] As a further scheme of the utility model, the clamping section is fixed with an anti-slip silica gel pad on one side, which can clamp the wafer.
[0009] As a further scheme of the utility model, the height of the pressing section is less than the depth of the recess, so that the wafer can be attached to the upper side of the clamping frame.
[0010] As a further scheme of the utility model, the gas port is connected with an external clean air extraction device, which facilitates generation of suction force in the air holes.
[0011] The utility model discloses a clamping structure is added, when the wafer will be pressed down section downwardly, will drive the clamping section and clamp the wafer, can effectively prevent its displacement, and increase the airflow channel and air hole, can attract the wafer, prevent its displacement. BRIEF DESCRIPTION OF DRAWINGS
[0012] The accompanying drawings are included to provide a further understanding of the present application and are incorporated in and constitute a part of this specification, illustrate embodiments of the present application and are used to explain the present application, but do not constitute a limitation on the present application. In the drawings:
[0013] Figure 1 It is a whole structure perspective view of the utility model discloses a semiconductor device production clamping frock.
[0014] Figure 2 It is the clamping frame structure section view of the utility model discloses a semiconductor device production clamping frock.
[0015] Figure 3 It is the A department structure enlarged view of the utility model discloses a semiconductor device production clamping frock.
[0016] In the drawings:
[0017] 1, support frame;2, clamping frame;3, positioning shaft;4, clamping structure;5, compression spring;6, antiskid silica gel pad;2.1, recess;2.2, airflow channel;2.3, opening;2.4, air port;2.5, air hole;4.1, press down section;4.2, clamping section. DETAILED DESCRIPTION
[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0019] The utility model provides a technical scheme: in order to solve the existing problem in the background art.
[0020] In combination with the drawings Figures 1-3It can be known that the support frame 1 is fixed with the clamping frame 2 at one end, a pair of grooves 2.1 are symmetrically formed on the upper side of the clamping frame 2, the positioning shaft 3 is fixed in the inner side of the groove 2.1, the clamping structure 4 is rotatably arranged on the outer side of the positioning shaft 3, the clamping structure 4 comprises a pressing section 4.1 and a clamping section 4.2, the compression spring 5 is arranged between the pressing section 4.1 and the groove 2.1, so that the pressing section 4.1 can rebound upward, the pressing section 4.1 and the clamping section 4.2 have a one-hundred-degree angle, so that the clamping section 4.2 can clamp the wafer, the anti-slip silica gel pad 6 is fixed on one side of the clamping section 4.2, so that the wafer can be clamped, and the height of the pressing section 4.1 is less than the depth of the groove 2.1, so that the wafer can be attached to the upper side of the clamping frame 2.
[0021] The drawings are combined Figure 1 、 2 It can be known that the airflow channel 2.2 is formed in the clamping frame 2, the opening 2.3 is symmetrically formed on the upper side of the clamping frame 2, the air port 2.4 in communication with the airflow channel 2.2 is fixed on one side of the opening 2.3, the air holes 2.5 in communication with the airflow channel 2.2 are formed on the upper side of the clamping frame 2, and the air holes 2.5 are located between the two grooves 2.1, so that the air port 2.4 is in communication with the external cleaning air extraction equipment, and the air holes 2.5 can generate suction force.
[0022] The working principle of the present application is that when the wafer is conveyed, the support frame 1 and the clamping frame 2 are driven by the external mechanical arm to hold up the wafer, when the wafer is held up, the wafer will press the pressing section 4.1 downward, and the clamping section 4.2 will be driven to clamp the wafer, and the airflow channel 2.2 is exhausted, the air holes 2.5 generate suction force to suck the wafer tightly, so that the position of the wafer can be stabilized to prevent displacement.
[0023] The above describes the present application and its implementation, which is not limited, and the drawings only show one of the embodiments of the present application, and the actual structure is not limited thereto. In general, if a person skilled in the art is inspired, without departing from the creative purpose of the present application, without creative design, similar structure and embodiments of the technical solution can be designed, which should belong to the protection scope of the present application.
Claims
1. A clamping fixture for semiconductor device manufacturing, comprising a support frame (1), wherein a clamping frame (2) is fixed to one end of the support frame (1), characterized in that: The clamping frame (2) has a pair of grooves (2.1) symmetrically opened on the upper side. A positioning shaft (3) is fixed inside the groove (2.1). A clamping structure (4) is rotatably provided outside the positioning shaft (3). The clamping structure (4) includes a pressing section (4.1) and a clamping section (4.2). A compression spring (5) is clamped between the pressing section (4.1) and the groove (2.1). An airflow channel (2.2) is opened inside the clamping frame (2). An opening (2.3) is symmetrically opened on the upper side of the clamping frame (2). An air port (2.4) connected to the airflow channel (2.2) is fixed on one side of the opening (2.3). Several air holes (2.5) connected to the airflow channel (2.2) are opened on the upper side of the clamping frame (2).
2. The clamping fixture for semiconductor device manufacturing according to claim 1, characterized in that: The pressing section (4.1) and the clamping section (4.2) have a 100-degree angle.
3. The clamping fixture for semiconductor device manufacturing according to claim 1, characterized in that: Several of the pores (2.5) are located between two grooves (2.1).
4. The clamping fixture for semiconductor device manufacturing according to claim 1, characterized in that: An anti-slip silicone pad (6) is fixed on one side of the clamping section (4.2).
5. The clamping fixture for semiconductor device manufacturing according to claim 1, characterized in that: The height of the pressing section (4.1) is less than the depth of the groove (2.1).
6. The clamping fixture for semiconductor device manufacturing according to claim 1, characterized in that: The air inlet (2.4) is connected to an external cleaning and extraction device.