Vacuum adsorption disc

Abstract

The utility model relates to the field of semiconductor instruments, in particular to a vacuum adsorption disc. Comprising a tray body, an adsorption mechanism is arranged on the tray body, and the adsorption mechanism comprises an adsorption hole and an adsorption groove connected with the adsorption hole through an adsorption channel; a balance mechanism is arranged corresponding to the adsorption mechanism, and the balance mechanism comprises a balance hole and a balance channel which are respectively arranged corresponding to the adsorption hole and the adsorption groove; the disc body has the same mass on the two sides of a symmetry plane formed by the adsorption mechanism and the balance mechanism. The balance mechanism symmetrical to the adsorption mechanism is arranged and matched with the adjusting mechanism arranged on the peripheral side of the disc body, so that the instability during high-speed rotation is effectively reduced. And two groups of adsorption grooves with different sizes are arranged, so that the two groups of adsorption grooves can be used for correspondingly carrying 8-inch and 12-inch wafers.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor instrument especially, relates to a vacuum adsorption disc. BACKGROUND

[0002] Wafer as the basic material of semiconductor integrated circuit manufacturing, because of its fragility, needs to be cleaned through special equipment in the production process. In these links, using vacuum adsorption disc as the carrier of wafer is a common practice, and the vacuum adsorption disc will also carry wafer high-speed rotation under the drive of external motor to achieve better cleaning effect.

[0003] But the above technology at least has the following technical problems:

[0004] The opening of the vacuum air path on the adsorption disc in the prior art often leads to a large dynamic balance mass difference when the adsorption disc rotates at high speed, causing table vibration and noise problems. Secondly, the adsorption force of the prior art is unevenly distributed, and it is difficult to fully cover wafers of different thickness and material, especially when thin wafer (such as Taiko Wafer) needs to be processed, the adsorption effect is poor. INVENTION CONTENTS

[0005] The utility model aims at: provide a kind of vacuum adsorption disc, to solve the vibration and noise problems of adsorption disc in prior art when adsorption disc rotates at high speed.

[0006] The technical scheme of the utility model is: a kind of vacuum adsorption disc, including disc body, adsorption mechanism is arranged on the disc body, the adsorption mechanism includes adsorption hole and the adsorption groove connected with adsorption hole by adsorption channel;

[0007] Balancing mechanism is arranged in correspondence with adsorption mechanism, and the balancing mechanism includes balancing hole and balancing channel respectively arranged in correspondence with adsorption hole and adsorption groove;

[0008] The disc body has the same mass on the two sides of the symmetry plane formed by the adsorption mechanism and the balancing mechanism.

[0009] Preferably, adjusting mechanism is arranged, and the adjusting mechanism includes adjusting hole opened in the circumferential side of disc body, and the adjusting hole is uniformly arranged as multiple around the axis of disc body;

[0010] One or more adjusting blocks are arranged in cooperation with part of adjusting hole, and the adjusting block is arranged as one or more, and one or more adjusting blocks cooperate with corresponding adjusting hole.

[0011] Preferably, the adsorption groove is arranged as annular structure, the adsorption channel is arranged as multiple along radial direction, and the end of multiple adsorption channels away from the adsorption groove is communicated with the same adsorption hole.

[0012] Preferably, a cover plate is arranged corresponding to the adsorption mechanism, the upper surface of the cover plate is used to carry the wafer, and the cover plate has a plurality of micropores communicating with the upper surface and the lower surface, the micropores being communicated with the adsorption grooves.

[0013] Preferably, the adsorption grooves are arranged in multiple around the axis of the disc body, the disc body is arranged with a partition ring protruding between adjacent adsorption grooves, the cover plate is arranged in multiple corresponding to the inside and outside of the partition ring, and the disc body has a first carrying area located in the middle and a second carrying area located at the edge.

[0014] Preferably, the adjusting holes are arranged as bolt holes, and the corresponding adjusting blocks are arranged as bolts.

[0015] Compared with the prior art, the utility model has the advantages that:

[0016] (1) The balance mechanism symmetrical to the adsorption mechanism is arranged, and the adjusting mechanism arranged on the circumferential side of the disc body effectively reduces the instability during high-speed rotation.

[0017] (2) Two groups of adsorption grooves with different sizes are arranged, so that the wafer of 8 inches and 12 inches can be carried correspondingly.

[0018] (3) The cover plate made of porous ceramic is adopted, the adsorption force generated by the adsorption mechanism is uniformly adsorbed, and the wafer carried on the cover plate is more stable. BRIEF DESCRIPTION OF DRAWINGS

[0019] The utility model will be further described below in combination with the drawings and embodiments:

[0020] Figure 1 It is an exploded view of the vacuum adsorption disc;

[0021] Figure 2 It is a disc body perspective view;

[0022] Figure 3 It is a disc body back structure view;

[0023] Figure 4 It is an adsorption mechanism sectional view;

[0024] Wherein: 1, disc body, 2, adsorption mechanism, 21, adsorption hole, 21a, first adsorption hole, 21b, second adsorption hole, 22, adsorption channel, 22a, first adsorption channel, 22b, second adsorption channel, 23, adsorption groove, 23a, first adsorption groove, 23b, second adsorption groove, 3, balance mechanism, 31, balance hole, 32, balance channel, 4, adjusting hole, 5, cover plate, 6, partition ring, 71, first negative pressure interface, 72, second negative pressure interface. DETAILED DESCRIPTION

[0025] In this application, unless specifically stated and limited otherwise, "on" or "under" of a first feature with respect to a second feature can include that the first and second features are directly in contact, or that the first and second features are not directly in contact but are in contact through another feature between them. Moreover, "on", "above" and "over" of a first feature with respect to a second feature include that the first feature is directly above and obliquely above the second feature, or only means that the first feature is higher than the second feature in horizontal height. "Under", "below" and "underneath" of a first feature with respect to a second feature include that the first feature is directly below and obliquely below the second feature, or only means that the first feature is lower than the second feature in horizontal height.

[0026] Embodiments of the present application are described in detail below with reference to examples shown in the attached drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0027] As shown in the drawings, Figure 1 - Figure 2 A vacuum adsorption disc is used to carry a wafer during the cleaning process of the wafer. The disc body 1 is provided with an adsorption mechanism 2. In the actual working scene, the adsorption mechanism 2 is connected with the external negative pressure device to obtain negative pressure, so as to adsorb and fix the wafer carried thereon. And the disc body 1 is connected with the external driver, and under the driving of the driver, the wafer carried thereon is rotated, so as to realize better cleaning effect.

[0028] The adsorption mechanism 2 includes an adsorption hole 21 penetrating the disc body 1 along the parallel axis, and an adsorption groove 23 etched on the disc body 1. The adsorption groove 23 is indirectly communicated with the adsorption hole 21 through the adsorption channel 22, and the adsorption groove 23 is arranged to adapt to the annular structure of the wafer. The negative pressure device communicates with the adsorption hole 21 and transmits the generated negative pressure to the adsorption groove 23 through the adsorption channel 22, so that the wafer carried thereon is subjected to uniform adsorption force.

[0029] In order to make the wafer carried thereon subjected to more uniform adsorption force, the disc body 1 corresponding to the adsorption mechanism 2 is provided with a cover plate 5. The upper surface of the cover plate 5 is used to carry the wafer, and the inside of the cover plate 5 has a plurality of micro-hole structures communicating with the upper surface and the lower surface. When the cover plate 5 is placed on the disc body 1, the micro-holes can communicate with the adsorption groove 23. In this embodiment, the cover plate 5 is made of porous ceramic.

[0030] In order to be compatible with wafers of various sizes, the adsorption groove 23 is arranged in two around the axis of the disc body 1. As shown in the drawings, Figure 1As shown, the disc body 1 is provided with a partition ring 6 between adjacent adsorption grooves 23, and the cover plate 5 is provided with circular and annular shapes corresponding to the inside and outside of the partition ring 6, so that the disc body 1 has a first mounting area in the middle and a second mounting area at the edge, which are respectively used to mount 8-inch and 12-inch wafers of different sizes.

[0031] Specifically, as shown in Figure 2 and Figure 4 , Figure 4 The thick solid line in the figure represents the path of negative pressure generation. The disc body 1 is provided with a first negative pressure interface 71 and a second negative pressure interface 72, and the adsorption holes 21 are constructed as two, namely a first adsorption hole 21a and a second adsorption hole 21b; correspondingly, the adsorption channels 22 and the adsorption grooves 23 are also constructed as two, namely a first adsorption channel 22a, a second adsorption channel 22b, and a first adsorption groove 23a and a second adsorption groove 23b.

[0032] The first negative pressure interface 71 is in communication with the first adsorption groove 23a through the first adsorption hole 21a and the first adsorption channel 22a. The external negative pressure device is connected to the first negative pressure interface 71 to generate negative pressure in the first adsorption groove 23a, so that the 8-inch wafer can be adsorbed.

[0033] Similarly, the second negative pressure interface 72 is in communication with the second adsorption groove 23b through the second adsorption hole 21b and the second adsorption channel 22b. The external negative pressure device is connected to the second negative pressure interface 72 to generate negative pressure in the second adsorption groove 23b, so that the 12-inch wafer can be adsorbed.

[0034] The manufacturing method of the adsorption channel 22 is a material-removing process, that is, the adsorption channel 22 is generated by removing part of the entity on the disc body 1. The disc body 1 needs to mount the wafer to rotate at high speed, so the adsorption hole 21 and the adsorption channel 22 arranged in the radial direction will change the position of the rotating center of the disc body 1, and then affect the dynamic balance of the disc body 1 when rotating.

[0035] In order to solve this problem, as shown in Figure 3 The back side of the disc body 1 is provided with a balancing mechanism 3 corresponding to the adsorption mechanism 2. The balancing mechanism 3 includes balancing holes 31 and balancing channels 32 arranged at 180° corresponding to the adsorption holes 21 and the adsorption channels 22, respectively. The balancing holes 31 and the balancing channels 32 are also arranged on the disc body 1 by the material-removing process, and the sizes thereof correspond to the adsorption holes 21 and the adsorption channels 22, respectively, so that the disc body 1 has the same mass on both sides of the symmetry plane of the balancing mechanism 3 and the adsorption mechanism 2, thereby enabling the rotating center of the disc body 1 to be on its axis.

[0036] And, the disc body 1 has a certain degree of uneven mass distribution before the adsorption mechanism 2 is opened due to machining errors and other factors, and the balancing mechanism 3 eliminates the influence of the adsorption mechanism 2, and the rotation center of the disc body 1 still needs to be controlled by the adjusting mechanism.

[0037] Specifically, the adjusting mechanism includes adjusting holes 4 opened on the periphery of the disc body 1, and the adjusting holes 4 are uniformly arranged around the axis of the disc body 1. A plurality of adjusting blocks are arranged corresponding to the plurality of adjusting holes 4, the number of adjusting blocks is less than the number of adjusting holes 4, and the adjusting blocks can be detachably inserted into and taken out of any adjusting hole 4. Because the adjusting block itself has a certain mass, when the adjusting block cooperates with the adjusting hole 4 in different positions, the weight distribution of the disc body 1 can be changed, and then the rotation center is affected. In this embodiment, the adjusting hole 4 is provided as a bolt hole, and the corresponding adjusting block is provided as a bolt.

[0038] The adsorption channel 22 can be provided as one or multiple, when the adsorption channel 22 is provided as a single, the negative pressure generated from the adsorption hole 21 can only gradually spread from a point on the adsorption groove 23 to other areas on the adsorption groove 23. When the adsorption channel 22 is provided as multiple, one end of the multiple adsorption channels 22 is connected with the same adsorption hole 21, and the other end is respectively connected with different positions on the same adsorption groove 23. In this way, the negative pressure generated by the adsorption hole 21 connected with the negative pressure device can quickly act on the entire adsorption groove 23.

[0039] The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and it cannot limit the protection scope of the present application. For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or basic characteristics of the present application, therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application.

Claims

1. A vacuum adsorption disk, characterized in that, Includes a disc body (1), on which an adsorption mechanism (2) is provided, the adsorption mechanism (2) includes an adsorption hole (21) and an adsorption groove (23) connected to the adsorption hole (21) through an adsorption channel (22); A balancing mechanism (3) is provided corresponding to the adsorption mechanism (2). The balancing mechanism (3) includes a balancing hole (31) and a balancing channel (32) respectively provided for the adsorption hole (21) and the adsorption tank (23). The disk (1) has the same mass on both sides of the plane of symmetry formed by the adsorption mechanism (2) and the balancing mechanism (3).

2. The vacuum adsorption disk according to claim 1, characterized in that, An adjustment mechanism is provided, the adjustment mechanism including adjustment holes (4) opened on the periphery of the disk body (1), and the adjustment holes (4) are evenly arranged in a plurality around the axis of the disk body (1); The adjusting hole (4) is detachably provided with an adjusting block, wherein one or more adjusting blocks are provided, and one or more adjusting blocks are provided to cooperate with the corresponding adjusting hole (4).

3. A vacuum adsorption disk according to claim 2, characterized in that, The adsorption tank (23) is configured as an annular structure, and the adsorption channels (22) are configured as multiple in the radial direction, with the ends of the multiple adsorption channels (22) away from the adsorption tank (23) connected to the same adsorption hole (21).

4. A vacuum adsorption disk according to claim 3, characterized in that, A cover plate (5) is provided for the adsorption mechanism (2). The upper surface of the cover plate (5) is used to support the wafer, and the cover plate (5) has a plurality of micropores that connect the upper surface and the lower surface. The micropores are connected to the adsorption tank (23).

5. A vacuum adsorption disk according to claim 4, characterized in that, The adsorption grooves (23) are arranged in multiple ways around the axis of the disk body (1). The disk body (1) has a spacer ring (6) protruding between adjacent adsorption grooves (23). The cover plate (5) is arranged in various shapes corresponding to the inside and outside of the spacer ring (6), so that the disk body (1) has a first mounting area in the middle and a second mounting area at the edge.

6. A vacuum adsorption disk according to claim 3, characterized in that, The adjustment hole (4) is set as a bolt hole, and the corresponding adjustment block is set as a bolt.

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