Copper gap bridge and semiconductor device

Abstract

The utility model discloses a copper gap bridge and a semiconductor device, and relates to the technical field of semiconductors. The first welding end and the second welding end are formed at the two ends of the connecting section respectively, the first welding end is a first welding face at the end of the connecting section, the second welding end is a plurality of welding contacts at the other end of the connecting section, second welding faces are formed on the surfaces of the welding contacts, and the first welding face is used for being welded to a first chip. And the second welding surface is used for being welded with a second chip. The reliability of multi-chip welding can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a copper bridge and a semiconductor device. BACKGROUND

[0002] In the field of power devices today, with the rapid development of technology, the requirements for product packaging and performance are increasingly stringent. On the one hand, the market strongly demands power devices to move towards small packaging, aiming to reduce product size to meet the increasingly compact internal space layout requirements of various electronic equipment. On the other hand, large current-carrying capacity has also become a key indicator, as it is directly related to the stable operation and efficient work of power devices under high load conditions.

[0003] The traditional conventional copper bridge has great limitations in the design of the welding surface. Its welding surface is single and can only adapt to the welding operation of a single chip. This is not enough when facing the current trend of multi-chip integration. When a more complex and powerful circuit system needs to be built, involving the cooperative work of multiple chips, the conventional copper bridge cannot meet the requirements of simultaneous welding of multiple chips, greatly hindering the development process of multi-functional and high-performance power devices. At the same time, in the existing process of multi-chip welding, metal wire bonding is a relatively common method. However, this method has an insurmountable shortcoming - weak current-carrying capacity. In high-power operating scenarios, metal wire bonding is difficult to carry large current for stable transmission, which can easily cause overheating, circuit breakage and other faults, not only affecting the overall performance of the power device, but also threatening the stability of the equipment using these devices. CONTENT OF THE UTILITY MODEL

[0004] The purpose of the present application is to provide a copper bridge and a semiconductor device that can improve the reliability of multi-chip welding.

[0005] Embodiments of the present application are implemented as follows:

[0006] In one aspect of the embodiments of the present application, a copper bridge is provided, comprising a connection segment and first and second welding ends respectively formed at both ends of the connection segment. The first welding end is a first welding surface at the end of the connection segment, and the second welding end is a plurality of welding contacts at the other end of the connection segment. The surface of the welding contacts forms a second welding surface. The first welding surface is used for welding with a first chip, and the second welding surface is used for welding with a second chip.

[0007] Optionally, as one implementable way, the first welding end is provided with a first stress relief hole, and the first stress relief hole penetrates the first welding surface.

[0008] Optionally, as one implementable way, the first stress relief hole extends from the first welding end to the connection segment.

[0009] Optionally, as an implementable manner, the first stress relief hole comprises a plurality of first stress relief holes, and the plurality of first stress relief holes are arranged at intervals on the first welding end.

[0010] Optionally, as an implementable manner, the welding contact head is provided with a second stress relief hole, and the second stress relief hole penetrates the second welding surface.

[0011] Optionally, as an implementable manner, the second stress relief hole extends from the welding contact head to the connecting section.

[0012] Optionally, as an implementable manner, the two adjacent welding contact heads have a gap.

[0013] Optionally, as an implementable manner, the first welding end is further provided with a foolproof notch.

[0014] Optionally, as an implementable manner, the connecting section comprises a first bending section, a guide section and a second bending section, the first bending section is connected with the first welding end, and the second bending section is connected with the second welding end.

[0015] Another aspect of the embodiments of the present application provides a semiconductor device, comprising a plurality of chips and the copper bridge as described in any one of the above.

[0016] The beneficial effects of the embodiments of the present application include:

[0017] The copper bridge and the semiconductor device provided by the application include a connecting section, a first welding end and a second welding end formed at two ends of the connecting section respectively, the first welding end is a first welding surface at an end of the connecting section, the second welding end is a plurality of welding contacts at the other end of the connecting section, and a second welding surface is formed on the surface of the welding contacts, the first welding surface is used for welding with a first chip, and the second welding surface is used for welding with a second chip. Compared with the conventional copper bridge, the copper bridge of the application can realize welding with one chip at one end and welding with multiple chips at the other end, which perfectly conforms to the current trend of multi-chip integration of power devices. When constructing complex circuit systems such as intelligent power management modules and high-performance motor drive circuits, multiple functionally different chips can be effectively connected, greatly expanding the functional diversity of power devices and providing key support for the development of high-integration and multi-functional electronic products. Compared with the multi-chip welding method of metal wire bonding, the copper bridge of the application itself has excellent conductivity, and the large-area welding surface design can effectively disperse the current, greatly enhancing the current-carrying capacity. In high-power operating scenarios such as industrial-grade high-power power supplies and electric vehicle power systems, it can stably carry large current transmission and eliminate overheating, circuit breaking and other faults caused by insufficient current-carrying capacity, effectively ensuring the operation stability of power devices and even the entire equipment, and reducing maintenance costs and system failure risks. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0019] Figure 1 One of the structural schematic diagrams of the copper bridge provided by the embodiments of the application;

[0020] Figure 2 The second structural schematic diagram of the copper bridge provided by the embodiments of the application;

[0021] Figure 3 The third structural schematic diagram of the copper bridge provided by the embodiments of the application.

[0022] Figure: 100-copper bridge; 110-connecting section; 111-first bending section; 112-leading section; 113-second bending section; 120-first welding end; 121-first welding surface; 122-first stress relief hole; 123-foolproof notch; 130-second welding end; 131-welding contact; 132-second welding surface; 133-second stress relief hole; 200-first chip; 300-second chip. DETAILED DESCRIPTION

[0023] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will be combined with the accompanying drawings for the embodiments of the present application to make a clear and complete description of the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present application.

[0025] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", "third" and the like are only used to distinguish description, and cannot be understood as indicating or implying relative importance.

[0026] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "setting", "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0027] Please refer to Figure 1 , Figure 2 and Figure 3 , the present embodiment provides a copper bridge 100, comprising a connecting section 110 and a first welding end 120 and a second welding end 130 formed at both ends of the connecting section 110, the first welding end 120 is a first welding surface 121 at the end of the connecting section 110, the second welding end 130 is a plurality of welding contacts 131 at the other end of the connecting section 110, the surface of the welding contact 131 is formed with a second welding surface 132, the first welding surface 121 is used for welding with the first chip 200, and the second welding surface 132 is used for welding with the second chip 300.

[0028] Specifically, the copper bridge 100 of the present application is adapted to single-chip by setting a single welding surface at one end of the connecting segment 110 and is adapted to multi-chip welding by setting multiple welding contacts 131 at the other end, so that multiple chips can be flexibly integrated in a compact packaging space to realize complex circuit functions. The copper bridge 100 of the present application meets the requirements of multi-chip welding and large current carrying capacity without increasing excessive space occupation. Its compact and reasonable structure design is in harmony with the development trend of small packaging power devices, and can easily adapt to the increasingly compact internal space layout of various electronic equipment, creating favorable conditions for the research and development of small-sized and high-performance electronic equipment.

[0029] The copper bridge 100 provided by the present application includes a connecting segment 110 and first and second welding ends 120 and 130 formed at both ends of the connecting segment 110, the first welding end 120 is a first welding surface 121 at the end of the connecting segment 110, and the second welding end 130 is multiple welding contacts 131 at the other end of the connecting segment 110, the surface of the welding contact 131 is formed with a second welding surface 132, the first welding surface 121 is used for welding with a first chip 200, and the second welding surface 132 is used for welding with a second chip 300. Compared with the conventional copper bridge 100, the copper bridge 100 of the present application can realize welding with one chip at one end and welding with multiple chips at the other end, perfectly adapting to the current trend of multi-chip integration of power devices. When building complex circuit systems such as intelligent power management modules and high-performance motor drive circuits, multiple functionally different chips can be easily and effectively connected, greatly expanding the functional diversity of power devices and providing key support for the development of high-integration and multi-functional electronic products. Compared with the multi-chip welding method of metal wire bonding, the copper bridge 100 of the present application itself has excellent electrical conductivity, and the large-area welding surface design can effectively disperse the current, greatly enhancing the current carrying capacity. In high-power operating scenarios such as industrial-grade high-power power supplies and electric vehicle power systems, it can stably carry large current transmission and eliminate overheating, circuit breaking and other faults caused by insufficient current carrying capacity, effectively ensuring the operation stability of power devices and even the entire equipment, and reducing maintenance costs and system failure risks.

[0030] In one feasible embodiment of the present application, as shown in Figure 1 , Figure 2 and Figure 3 , the first welding end 120 is provided with a first stress relief hole 122, and the first stress relief hole 122 penetrates the first welding surface 121.

[0031] Specifically, during the operation of the power device, stress concentration is prone to occur at the welding position due to temperature changes, mechanical vibrations and other factors. As a key position connected with the first chip 200, the first welding end 120 bears complex stress. The first stress relief hole 122 penetrating the first welding surface 121 can effectively change the stress distribution path, avoid excessive accumulation of stress in a local area, prevent problems such as welding cracking and chip loosening caused by stress concentration, and ensure the long-term reliability of the connection between the chip and the copper bridge 100. The stability of the welding position of the copper bridge 100 and the first chip 200 is significantly improved, the product failure risk caused by stress problems is reduced, and it is especially suitable for power devices with complex working environment and frequent start-stop, such as chip connection in the battery management system of new energy vehicles, prolonging the service life of the product and reducing the maintenance frequency.

[0032] In an embodiment of the present application, as shown in Figure 1 , Figure 2 and Figure 3 , the first stress relief hole 122 extends from the first welding end 120 to the connecting section 110.

[0033] Specifically, the first stress relief hole 122 extends from the first welding end 120 to the connecting section 110 to further optimize the stress release path. Extending the first stress relief hole 122 to the connecting section 110 allows stress to be more smoothly conducted from the welding end to the entire copper bridge 100 structure for dispersion. As a force conduction component, the connecting section 110 can uniformly resolve stress with the help of its structural toughness and the stress relief hole, avoiding the formation of stress peaks in the transition area between the welding end and the connecting section 110. Moreover, the first stress relief hole 122 provides an additional flow channel for the plastic sealant or liquid glue during the filling process, allowing it to fill more deeply and uniformly around the welding area. Compared with the design without a stress relief hole, the filling cavity or gap formed by air retention is avoided, ensuring that the plastic seal layer or glue layer covers completely, effectively protecting the solder joints and chips from external moisture, dust and other erosion, and improving the long-term stability of the product. On the other hand, good filling effect enhances the mechanical strength of the overall structure, so that the copper bridge 100 and the chip as a whole can better resist external force impact. In the packaging of controller chips in industrial automation equipment, even in a long-term dusty and vibrating environment, the reliability can still be maintained.

[0034] In an embodiment of the present application, as shown in Figure 1 , Figure 2 and Figure 3 , the first stress relief hole 122 includes a plurality of first stress relief holes 122 arranged at intervals in the first welding end 120.

[0035] Specifically, in the face of complex and changeable stress environment, the stress dispersion effect of a single stress relief hole has limitations. By arranging multiple first stress relief holes 122 at intervals, the stress of the welding end can be guided from multiple points to form a more uniform stress release network. Different directions and sizes of stress can be dispersed through corresponding stress relief holes to avoid local stress overload.

[0036] In an embodiment of the present application, as shown in Figure 1 , Figure 2 and Figure 3 , a second stress relief hole 133 is arranged on each welding contact 131, and the second stress relief hole 133 penetrates the second welding surface 132.

[0037] Specifically, after the multiple welding contacts 131 of the second welding end 130 are welded with the second chip 300, they also face stress problems. Due to the involvement of multi-chip connection, the stress conditions of each welding point are complex and interact with each other. The second stress relief hole 133 penetrates the second welding surface 132, providing a release channel for the stress at each welding point, ensuring the stability of the multiple chip welding, preventing the connection between chips from failing due to stress concentration of individual welding points, and affecting the overall circuit function. Moreover, the second stress relief hole 133 provides an additional flow channel for the plastic encapsulant or liquid glue during the filling process, allowing it to penetrate more deeply and uniformly into the welding area around it. Compared with the design without stress relief holes, it avoids the formation of filling voids or gaps due to air retention, ensuring that the plastic encapsulant or glue layer covers completely, effectively protecting the welding points and chips from external moisture, dust, and other erosion, and improving the long-term stability of the product. On the other hand, good filling effect enhances the mechanical strength of the overall structure, so that the copper bridge 100 and the chip as a whole can better resist external force impact. In the packaging of controller chips in industrial automation equipment, even in a dusty and vibrating environment for a long time, the performance can still be reliable.

[0038] In an embodiment of the present application, as shown in Figure 1 , Figure 2 and Figure 3 , the second stress relief hole 133 extends from the welding contact 131 to the connecting segment 110.

[0039] Specifically, extending the second stress relief hole 133 to the connecting segment 110 allows the stress at the welding contact 131 to be released not only locally at the welding point but also further dispersed with the help of the connecting segment 110. The connecting segment 110 acts as a bridge in structure, coordinating the stress distribution of each welding contact 131, and avoiding stress accumulation at the junction of the welding point and the connecting segment 110, which causes structural weak points. Further, there is a gap between the two adjacent welding contacts 131.

[0040] In an embodiment of the present application, as shown in Figure 1 ,Figure 2 and Figure 3 As shown in FIG. 1, the first welding end 120 is further provided with a foolproof notch 123.

[0041] Specifically, in the mass production and assembly process, due to the relatively fine structure of the copper bridge 100, if the positive and negative directions or angles are installed incorrectly, it will cause serious problems such as chip welding misplacement and circuit short circuit. As a kind of mechanical identification feature, the foolproof notch 123 can be quickly determined by the operator or automatic equipment according to its position and shape to determine the correct installation direction, avoid installation errors, and improve the assembly efficiency and accuracy.

[0042] In an embodiment of the present application, as shown in FIG. 1, Figure 1 , Figure 2 and Figure 3 As shown in FIG. 1, the connection section 110 includes a first bending section 111, a guide section 112 and a second bending section 113, the first bending section 111 is connected with the first welding end 120, and the second bending section 113 is connected with the second welding end 130.

[0043] In actual internal layout of electronic equipment, the chip position is often not on the same plane or straight line, and the copper bridge 100 needs to have flexible shape adaptation capability. By setting the first bending section 111, the guide section 112 and the second bending section 113, the connection section 110 can be bent at different angles according to different chip layout requirements, and accurately connect chips at different positions, while the guide section 112 ensures smooth transition of the structure during bending, avoids stress concentration at the bending part, and maintains the overall structural strength.

[0044] The embodiment of the present application further discloses a semiconductor device, which comprises a plurality of chips and the copper bridge 100 in the foregoing embodiment. The semiconductor device comprises the same structure and beneficial effects as the copper bridge 100 in the foregoing embodiment. The structure and beneficial effects of the copper bridge 100 have been described in detail in the foregoing embodiment, which will not be repeated here.

[0045] The above only describes the preferred embodiments of the present application and is not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A copper bridge, characterized in that, The device includes a connecting segment and a first welding end and a second welding end formed at both ends of the connecting segment. The first welding end is a first welding surface at one end of the connecting segment, and the second welding end is a plurality of welding contacts at the other end of the connecting segment. A second welding surface is formed on the surface of each welding contact. The first welding surface is used to weld with a first chip, and the second welding surface is used to weld with a second chip. Each welding contact is provided with a second stress-relieving hole, which penetrates the second welding surface.

2. The copper bridge according to claim 1, characterized in that, The first welding end is provided with a first stress-relieving hole, which penetrates the first welding surface.

3. The copper bridge according to claim 2, characterized in that, The first stress-relieving hole extends from the first weld end to the connecting section.

4. The copper bridge according to claim 2, characterized in that, The first stress-relieving hole includes a plurality of holes, which are spaced apart at the first welding end.

5. The copper bridge according to claim 1, characterized in that, The second stress-relieving hole extends from the weld contact head to the connection section.

6. The copper bridge according to claim 1, characterized in that, There is a gap between two adjacent welding contacts.

7. The copper bridge according to claim 1, characterized in that, The first welding end is also provided with a foolproof notch.

8. The copper bridge according to claim 1, characterized in that, The connecting section includes a first bending section, a guide section, and a second bending section. The first bending section is connected to the first welding end, and the second bending section is connected to the second welding end.

9. A semiconductor device, characterized in that, It includes multiple chips and the copper bridge as described in any one of claims 1-8.

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