Multi-stage buffer type stamping device

Abstract

The utility model discloses a multistage buffer type stamping device, relates to stamping device field, including stamping mechanism, buffer mechanism and die fixing mechanism, the stamping mechanism includes base, top plate, slide bar, moving plate, hydraulic drive rod, upper mounting seat and lower mounting seat, buffer mechanism includes butt joint seat, insert link, buffer rod and multistage buffer subassembly, the die fixing mechanism includes the base, the top plate, slide bar, moving plate, hydraulic drive rod, upper mounting seat and lower mounting seat, buffer mechanism includes the butt joint seat, insert link, buffer rod and multistage buffer subassembly. And the two groups of mold fixing mechanisms are correspondingly arranged on the upper mounting seat and the lower mounting seat and are used for fixing a mold. By arranging the stamping mechanism, the buffering mechanism and the die fixing assembly, the stability and reliability of the whole structure can be improved, the universality and applicability of the device are improved, the impact transmission speed is reduced, the stamping accuracy is improved, impact force can be evenly dispersed, and structural deviation caused by single-side stress is avoided; and the precision of operation control can be improved, precise control over the punching action is achieved, operation is easy and convenient, and the overall performance and efficiency are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to punch device field, concretely relates to a multistage buffer formula punch device. BACKGROUND

[0002] At present, punch device as the core equipment of realizing punch process, its performance directly matters product's quality and production efficiency.

[0003] The existing punch device mostly adopts spring as buffer element, but the softness degree of these springs is usually fixed, cannot adjust according to the characteristics of the material to be punched, and the buffering force required by different materials is very different when punching, for example: when punching soft metal materials such as aluminum or copper, smaller buffering force can effectively avoid the deformation or damage of the material due to excessive impact; when punching hard materials such as high-strength alloy steel, larger buffering force is needed to offset the huge impact force generated in the moment of punching, so as to protect the die and equipment, therefore, there are some deficiencies. UTILITY MODEL CONTENT

[0004] The utility model provides a multistage buffer formula punch device to solve the above problems existing in the prior art.

[0005] Technical scheme: a multistage buffer formula punch device, comprising a punch mechanism, a buffer mechanism and a die fixing mechanism.

[0006] Among them, the punch mechanism comprises a base, a top plate, a slide rod, a moving plate, a hydraulic drive rod, an upper mounting seat and a lower mounting seat.

[0007] The top plate is arranged on the base, the slide rod is installed between the base and the top plate, the moving plate is arranged between the top plate and the base and is connected with the slide rod in sliding mode, the hydraulic drive rod is installed on the top plate and the driving end is connected with the moving plate, and the upper mounting seat and the lower mounting seat are respectively installed on the side of the moving plate and the base close to each other.

[0008] The buffer mechanism comprises a butt joint seat, a plug rod, a buffer rod and a multistage buffer assembly.

[0009] The butt joint seat is installed on the side of the upper mounting seat close to the lower mounting seat, the buffer rod is installed on the side of the lower mounting seat close to the upper mounting seat, the plug rod is arranged in sliding mode on the buffer rod and is arranged in correspondence with the butt joint seat, and the multistage buffer assembly is arranged in the plug rod and the buffer rod, which is used for adapting to the punching requirements of different materials.

[0010] The mold fixing mechanism is provided with two groups, and the two groups of mold fixing mechanisms are correspondingly arranged on the upper mounting seat and the lower mounting seat to fix the mold.

[0011] In further embodiments, the multi-stage buffer assembly includes a damping rod, a mounting ring, a slider, a first spring, and a second spring.

[0012] The damping rod is correspondingly mounted between the insertion rod and the inner wall of the buffer rod, the mounting ring is provided with a pair, the pair of mounting rings are correspondingly mounted on the upper and lower ends of the mounting ring, the slider is slidingly arranged on the damping rod and located between the pair of mounting rings, and the first spring and the second spring are correspondingly mounted between the slider and the pair of mounting rings.

[0013] In further embodiments, the multi-stage buffer assembly further includes a limiting ring.

[0014] The limiting ring is mounted on the damping rod and located between the slider and the lower end of the mounting ring, and is used to limit the movement distance of the slider.

[0015] In further embodiments, the stamping mechanism further includes a control button.

[0016] The control button is mounted on the base and is used to control the hydraulic drive rod.

[0017] In further embodiments, the mold fixing mechanism includes a movable groove, a bidirectional screw rod, a rotating wheel, a movable block, and a clamping plate.

[0018] The movable groove is correspondingly arranged on one side of the upper mounting seat and the lower mounting seat, the bidirectional screw rod is rotatably arranged in the movable groove, the rotating wheel is connected to the end of the bidirectional screw rod and is used to rotate the bidirectional screw rod, the movable block is provided with two, the two movable blocks are correspondingly arranged on the bidirectional screw rod, and the clamping plate is provided with two, the two clamping plates are correspondingly mounted on the two movable blocks and are used to cooperate to compress the mold.

[0019] In further embodiments, the mold fixing mechanism further includes a fixed groove, a sliding groove, a stop block, and a third spring.

[0020] The fixed groove and the sliding groove are correspondingly provided with two groups, the two groups of fixed grooves and sliding grooves are correspondingly arranged on the upper mounting seat and the lower mounting seat, the stop block is slidingly arranged on the fixed groove and the sliding groove, the third spring is connected between the stop block and the inner wall of the sliding groove, and the stop block is used to drive the stop block to adhere to the surface of the mold.

[0021] In further embodiments, the mold fixing mechanism further includes an extrusion block, an adjusting bolt, and a sleeve.

[0022] Wherein, the extrusion block is slidably arranged in the fixed groove and located on the upper side of the stop block, the sleeve is installed on the extrusion block, the adjusting bolt is arranged in cooperation with the sleeve for driving the sleeve to move and pushing the extrusion block to move towards the stop block.

[0023] In further embodiments, the mutually approaching surfaces of the extrusion block and the stop block are provided as matching wedge-shaped contact surfaces for generating greater normal force and friction under pressure.

[0024] Beneficial effects: the utility model discloses a multistage buffer formula stamping device, through setting up stamping mechanism, buffer mechanism and die fixed assembly, not only can promote the stability and reliability of overall structure, improve the versatility and applicability of device, slow down the impact transmission speed, improve the precision of stamping, can even disperse impact force, avoid the structure deviation caused by unilaterally stressed etc. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is the overall structure schematic diagram of the utility model.

[0026] Figure 2 It is the structure schematic diagram of die fixing mechanism of the utility model.

[0027] Figure 3 It is the explosion structure schematic diagram of die fixing mechanism of the utility model.

[0028] Figure 4 It is the internal structure schematic diagram of buffer mechanism of the utility model.

[0029] Figure 5 It is the structure schematic diagram of another view of the utility model.

[0030] The reference signs in the drawings are as follows: 1, stamping mechanism;101, base;102, top plate;103, sliding rod;104, moving plate;105, hydraulic drive rod;106, upper mounting seat;107, lower mounting seat;108, control button;2, buffer mechanism;201, butt joint seat;202, insertion rod;203, buffer rod;204, damping rod;205, mounting ring;206, sliding block;207, first spring;208, second spring;209, limiting ring;3, die fixing mechanism;301, movable groove;302, bidirectional screw;303, rotating wheel;304, movable block;305, clamping plate;306, fixed groove;307, sliding groove;308, extrusion block;309, adjusting bolt;310, sleeve;311, stop block;312, third spring. DETAILED DESCRIPTION

[0031] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one skilled in the art that the present application can be practiced without one or more of these specific details. In other instances, well-known features have not been described in detail to avoid obscuring the present application.

[0032] Applicant believes that most of the existing stamping devices use springs as buffer elements, but the softness and hardness of these springs are usually fixed and cannot be adjusted according to the characteristics of the material being stamped, and different materials require different buffer forces when stamping, so there are some deficiencies.

[0033] Therefore, the applicant proposes a multi-stage buffer type stamping device, as shown in Figures 1-5 It comprises a stamping mechanism 1, a buffer mechanism 2 and a die fixing mechanism 3.

[0034] Among them, the setting of relevant components in the stamping mechanism 1 and the buffer mechanism 2 can improve the overall structural stability and reliability of the device and the precision of the operation, etc., and the die fixing mechanism 3 is used to improve the overall buffering performance of the device, etc.

[0035] Specifically, as shown in Figures 1-5 The stamping mechanism 1 comprises a base 101, a top plate 102, a slide rod 103, a moving plate 104, a hydraulic drive rod 105, an upper mounting seat 106, a lower mounting seat 107 and a control button 108.

[0036] Among them, the top plate 102 is arranged on the base 101, the slide rod 103 is installed between the base 101 and the top plate 102, the moving plate 104 is arranged between the top plate 102 and the base 101 and is in sliding connection with the slide rod 103, the hydraulic drive rod 105 is installed on the top plate 102 and the driving end is connected with the moving plate 104, the upper mounting seat 106 and the lower mounting seat 107 are respectively installed on the side of the moving plate 104 and the base 101 which are close to each other, and the control button 108 is installed on the base 101 and is used to control the hydraulic drive rod 105.

[0037] In the present application, the stamping mechanism 1 is mainly composed of a base 101, a slide rod 103, a top plate 102, a moving plate 104, an upper mounting seat 106, a lower mounting seat 107, a hydraulic drive rod 105, a main frame and a control button 108. The base 101, the slide rod 103 and the top plate 102 can form a stable frame structure, which can provide stable foundation support for the whole device, ensure the stability of the whole device during operation, reduce the influence of structure shaking on stamping precision, etc. The slide rod 103 is provided with four, respectively located at the corresponding four corner positions of the top plate 102 and the base 101. The moving plate 104 can slide between the four slide rods 103 and cooperate with the hydraulic drive rod 105 to realize the stamping action in the vertical direction, meet the stamping demand in mechanical design and manufacturing, etc. The control button 108 is installed on both sides of the base 101 and electrically connected between the control button 108 and the hydraulic drive rod 105 through wires. The operator can directly start and stop the hydraulic system through the control button 108 to realize precise control of the stamping action, etc.

[0038] The setting of the stamping mechanism 1 of the present application improves the structural stability of the whole device, which not only can uniformly disperse the impact force and avoid structural deviation caused by unilateral force, but also can enhance the stability and reliability of the overall structure. At the same time, the setting of the control button 108 improves the precision of operation control. The operator can not only directly start and stop the hydraulic system through the control button 108 to realize precise control of the stamping action, but also the operation is simple and convenient, thereby improving the overall performance and efficiency, etc.

[0039] As shown in Figures 1-5 The buffer mechanism 2 includes a docking seat 201, a plug rod 202, a buffer rod 203, a damping rod 204, a mounting ring 205, a sliding block 206, a first spring 207, a second spring 208 and a limiting ring 209.

[0040] Among them, the docking seat 201 is installed on one side of the upper mounting seat 106 close to the lower mounting seat 107, the buffer rod 203 is installed on one side of the lower mounting seat 107 close to the upper mounting seat 106, the plug rod 202 is slidingly arranged on the buffer rod 203 and is correspondingly arranged with the docking seat 201, a multi-stage buffer assembly is arranged in the plug rod 202 and the buffer rod 203, which is used for adapting to the stamping demand of different materials, the damping rod 204 is correspondingly installed between the inner walls of the plug rod 202 and the buffer rod 203, the mounting ring 205 is provided with a pair, the pair of mounting rings 205 are correspondingly installed on the upper and lower ends of the mounting ring 205, the sliding block 206 is slidingly arranged on the damping rod 204 and located between the pair of mounting rings 205, the first spring 207 and the second spring 208 are correspondingly installed between the sliding block 206 and the pair of mounting rings 205, and the limiting ring 209 is installed on the damping rod 204 and located between the sliding block 206 and the lower end mounting ring 205, which is used for limiting the movement distance of the sliding block 206.

[0041] In the present application, the damping rod 204, the mounting ring 205, the sliding block 206, the first spring 207, the second spring 208 and the limiting ring 209 constitute a multi-stage buffer assembly, the buffer rod 203 is inserted with the butt joint seat 201 through the plug rod 202, and in the stamping process, the plug rod 202 is compressed into the buffer rod 203, which can effectively absorb the impact force. This setting can reduce the vibration of the equipment during the stamping process, reduce the loss of the mold, prolong the service life of the equipment, etc. At the same time, the upper mounting seat 106 and the lower mounting seat 107 are symmetrically arranged on the base 101 and the moving plate 104, and the layout of the buffer mechanism 2 is also symmetrical. When subjected to impact force, it can be evenly distributed, which can avoid the problem of structural deviation caused by unilateral force and further improve the stability and reliability of the overall structure.

[0042] In use, the inner bottom end of the buffer rod 203 is provided with a damping rod 204, the upper and lower ends of the damping rod 204 are respectively provided with a first spring 207 and a second spring 208, and a mounting ring 205 and a sliding block 206 are mounted, one end of the first spring 207 and the second spring 208 is connected with both ends of the sliding block 206, and the other end is fixed with the mounting ring 205. When the plug rod 202 is pressed, the second spring 208 is compressed under the depression of the sliding block 206. First, the soft spring is used for buffering. When the elastic force of the second spring 208 cannot be buffered, the sliding block 206 will not slide again when it moves to the limiting ring 209, so as to extrude the first spring 207. The first spring 207 is a hard spring. This setting facilitates the user to stamp different kinds of materials. And because the limiting ring 209 is installed at the bottom end of the damping rod 204, the top end of the damping rod 204 is connected with the inner top end of the plug rod 202. When the plug rod 202 is pressed, the damping effect of the damping rod 204 can slow down the impact transmission speed.

[0043] The setting of the buffer mechanism 2 of the present application can improve the buffering performance of the device. The setting of the two-stage spring can not only cope with larger impact force, but also adapt to the stamping needs of different materials, greatly reduce the vibration of the equipment, reduce the loss of the mold, prolong the service life of the equipment, improve the stamping precision and workpiece quality, etc.

[0044] As shown in Figures 2-3 The mold fixing mechanism 3 is provided with two groups, and the two groups of mold fixing mechanisms 3 are correspondingly arranged on the upper mounting seat 106 and the lower mounting seat 107 for fixing the mold. The mold fixing mechanism 3 comprises a movable slot 301, a bidirectional screw 302, a rotating wheel 303, a movable block 304, a clamping plate 305, a fixed slot 306, a sliding slot 307, a resisting block 311, a third spring 312, an extrusion block 308, an adjusting bolt 309 and a sleeve 310.

[0045] The movable slot 301 is arranged on the side of the upper mounting seat 106 and the lower mounting seat 107 which are close to each other, the bidirectional screw 302 is rotatably arranged in the movable slot 301, the rotating wheel 303 is connected to the end of the bidirectional screw 302 and is used to rotate the bidirectional screw 302, the movable block 304 is provided with two, the two movable blocks 304 are correspondingly arranged on the bidirectional screw 302, the clamping plate 305 is provided with two, the two clamping plates 305 are correspondingly arranged on the two movable blocks 304 and are used to cooperate with the compression mold.

[0046] In addition, the fixed slot 306 and the sliding slot 307 are correspondingly provided with two groups, the two groups of the fixed slot 306 and the sliding slot 307 are correspondingly arranged on the upper mounting seat 106 and the lower mounting seat 107, the abutting block 311 is slidably arranged on the fixed slot 306 and the sliding slot 307, the third spring 312 is connected between the abutting block 311 and the inner wall of the sliding slot 307 and is used to drive the abutting block 311 to be attached to the surface of the mold, the extrusion block 308 is slidably arranged in the fixed slot 306 and is located on the upper side of the abutting block 311, the sleeve 310 is arranged on the extrusion block 308, the adjusting screw 309 is arranged in cooperation with the sleeve 310 and is used to drive the sleeve 310 to move and push the extrusion block 308 to move towards the abutting block 311, the side of the extrusion block 308 and the abutting block 311 which are close to each other is arranged as a wedge-shaped contact surface and is used to generate greater normal force and friction force under the action of pressure.

[0047] In the application, the arrangement of the mold fixing mechanism 3 can provide a basis for the installation of the mold, can adapt to the installation and fixing of molds of different sizes, and can improve the universality and applicability of the device.

[0048] Working principle: when the stamping device is used, first, appropriate molds are respectively arranged on the upper mounting seat 106 and the lower mounting seat 107, the rotating wheel 303 is rotated, the bidirectional screw 302 is rotated, the movable block 304 is driven to move, and the distance between the clamping plates 305 is adjusted to preliminarily fix the molds from both sides.

[0049] At the same time, the abutting block 311 is automatically attached to the surface of the mold under the action of the third spring 312, the size error is compensated, the adjusting screw 309 is rotated, the sleeve 310 is driven to move, the extrusion block 308 is pushed to move towards the abutting block 311, and the greater normal force and friction force generated by the wedge-shaped contact surface of the abutting block 311 and the extrusion block 308 under the action of pressure can effectively prevent the mold from sliding or loosening during the stamping process, and at this time, the control button 108 is pressed.

[0050] The control button 108 is electrically connected with the hydraulic rod through a wire, and the hydraulic system is started.

[0051] During the stamping process, the insertion rod 202 is compressed to the inside of the buffer rod 203, the damping rod 204 installed at the bottom end of the buffer rod 203 is in sliding fit with the sliding block 206, the movement range is limited by the installation ring 205 and the limiting ring 209, the damping effect slows down the impact transmission speed, at the same time, the first spring 207 and the second spring 208 are respectively located at the upper and lower ends of the sliding block 206, when the insertion rod 202 is pressed, the second spring 208 first buffers, when the elastic force of the second spring 208 is not enough to buffer, the sliding block 206 moves to the limiting ring 209, and the first spring 207 is extruded, the two-stage spring buffer setting not only can adapt to the stamping requirements of different kinds of materials, but also can reduce the vibration of the equipment during the stamping process, reduce the mold loss, improve the stamping precision and workpiece quality, etc.

[0052] After the stamping is completed, the control button 108 is operated again to control the hydraulic rod to retract, drive the moving plate 104 to move vertically upward along the slide rod 103 to the initial position, and complete a stamping operation cycle.

[0053] As described above, although the present application has been described and expressed with reference to specific preferred embodiments, it should not be construed as a limitation on the present application itself. Various changes can be made in form and details without departing from the spirit and scope of the present application defined in the appended claims.

Claims

1. A multi-stage buffer-type stamping device, characterized in that, Includes a stamping mechanism, a buffer mechanism, and a die fixing mechanism; The stamping mechanism includes a base, a top plate, a slide bar, a moving plate, a hydraulic drive rod, an upper mounting base, and a lower mounting base; The top plate is disposed on the base, the sliding rod is installed between the base and the top plate, the movable plate is disposed between the top plate and the base and is slidably connected to the sliding rod, the hydraulic drive rod is installed on the top plate and the drive end is connected to the movable plate, and the upper mounting seat and the lower mounting seat are respectively installed on the side of the movable plate and the base that are close to each other. The buffer mechanism includes a docking seat, a plug rod, a buffer rod, and a multi-stage buffer assembly; The docking seat is installed on the side of the upper mounting seat near the lower mounting seat, the buffer rod is installed on the side of the lower mounting seat near the upper mounting seat, the insert rod is slidably disposed on the buffer rod and corresponding to the docking seat, and the multi-stage buffer assembly is disposed in the insert rod and the buffer rod to adapt to the stamping requirements of different materials; The mold fixing mechanism is provided in two sets, which are respectively arranged on the upper mounting base and the lower mounting base for fixing the mold.

2. The multi-stage buffer stamping device according to claim 1, characterized in that: The multi-stage buffer assembly includes a damping rod, a mounting ring, a slider, a first spring, and a second spring; The damping rod is installed between the inner wall of the insert rod and the buffer rod; The mounting ring is provided in pairs, and the pair of mounting rings are installed at the upper and lower ends of the mounting ring respectively; The slider is slidably mounted on the damping rod and located between a pair of mounting rings; The first spring and the second spring are respectively installed between the slider and a pair of mounting rings.

3. The multi-stage buffer stamping device according to claim 2, characterized in that: The multi-level buffer assembly also includes a limiting ring; The limiting ring is mounted on the damping rod and located between the slider and the lower mounting ring, and is used to limit the movement distance of the slider.

4. The multi-stage buffer stamping device according to claim 1, characterized in that: The stamping mechanism also includes control buttons; The control button is mounted on the base and is used to control the hydraulic drive rod.

5. The multi-stage buffer stamping device according to claim 1, characterized in that: The mold fixing mechanism includes a movable groove, a two-way screw, a rotating wheel, a movable block, and a clamping plate; The movable slot is correspondingly formed on the side of the upper mounting base and the lower mounting base that are close to each other; The bidirectional screw is rotatably mounted within the movable slot; The rotating wheel is connected to the end of the bidirectional screw and is used to rotate the bidirectional screw; Two movable blocks are provided, and the two movable blocks are correspondingly arranged on the bidirectional screw; Two clamping plates are provided, and the two clamping plates are installed on the two movable blocks respectively, for cooperating to clamp the mold.

6. A multi-stage buffer stamping device according to claim 5, characterized in that: The mold fixing mechanism also includes a fixing groove, a sliding groove, a stop block, and a third spring; Two sets of fixing grooves and sliding grooves are provided correspondingly, and the two sets of fixing grooves and sliding grooves are opened on the upper mounting base and the lower mounting base respectively; The abutment block is slidably disposed on the fixed groove and the sliding groove; A third spring is connected between the abutment block and the inner wall of the groove, which is used to drive the abutment block to fit against the mold surface.

7. A multi-stage buffer stamping device according to claim 6, characterized in that: The mold fixing mechanism also includes an extrusion block, an adjusting bolt, and a sleeve; The extrusion block is slidably disposed in the fixed groove and located on the upper side of the abutment block; The sleeve is mounted on the extrusion block; The adjusting bolt is configured to cooperate with the sleeve and is used to drive the sleeve to move, thereby pushing the extrusion block toward the abutment block.

8. A multi-stage buffer stamping device according to claim 7, characterized in that: The sides of the extrusion block and the abutment block that are close to each other are configured as matching wedge-shaped contact surfaces.

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