Gold and copper wire bonding device

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to a gold copper wire bonding device, a cleaning mechanism is arranged on the outer wall of a bonding machine, a controller is mounted on the outer wall of the bonding machine and close to the cleaning mechanism, and a storage battery is fixedly connected to the outer wall of the bonding machine; the cleaning mechanism comprises a fixed sleeve fixedly connected to the wire harness inlet of the bonding machine, a flow guide pipe is fixedly connected to the front face of the center of the interior of the fixed sleeve, spraying holes are formed in the inner wall of the flow guide pipe, and clamping plates are slidably connected to the top and the bottom of the inner wall of the fixed sleeve. According to the gold and copper wire bonding device, the gold and copper wires are cleaned through the cleaning mechanism in the gold and copper wire bonding device, and the problem that when an existing bonding machine operates and the gold and copper wires enter the bonding machine, dust is likely to be attached to the outer walls of the gold and copper wires, and therefore the welding and bonding effect is affected is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, specifically is a gold copper wire bonding device. BACKGROUND

[0002] Gold copper wire bonding is a process that uses gold wire or copper wire to connect the B and E poles of a chip to two pins of a lead frame by ultrasonic welding, in order to increase the contact area of the gold wire (or copper wire) and the chip, and improve the bonding strength and conductivity of the copper wire and the chip and the pins. The bonding machine is a device for welding gold wire and copper wire.

[0003] However, the existing bonding machine still has some shortcomings. Specifically, when the existing bonding machine is running, dust can easily adhere to the outer wall of the gold copper wire when it enters the interior, thereby affecting the welding bonding effect.

[0004] Therefore, there is a need for a gold copper wire bonding device to solve the problems raised in the background art. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a gold copper wire bonding device to solve the problems raised in the background art.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0007] A gold copper wire bonding device includes a bonding machine, a cleaning mechanism is arranged on the outer wall of the bonding machine, a controller is installed on the outer wall of the bonding machine near the cleaning mechanism, and a storage battery is fixedly connected to the outer wall of the bonding machine.

[0008] The cleaning mechanism includes a fixed sleeve fixedly connected to the wire harness inlet position of the bonding machine, a flow guide pipe is fixedly connected to the front surface of the center of the fixed sleeve, spray holes are formed in the inner wall of the flow guide pipe, clamping plates are slidingly connected to the top and bottom of the inner wall of the fixed sleeve, a miniature electric push rod is fixedly connected to the outer wall of the clamping plate, liquid outlet holes are formed in the inside of the fixed sleeve and on both sides of the flow guide pipe, a connecting adhesive tape is fixedly connected to the outer wall of the clamping plate away from the miniature electric push rod, a photoelectric sensor is fixedly connected to the front surface of the flow guide pipe in the inside of the fixed sleeve, a liquid inlet pipe is fixedly connected to the top of the flow guide pipe, and an absorbent pad is attached to the outer wall of the connecting adhesive tape.

[0009] As a preferred scheme of the utility model, the connection mode of the controller and the storage battery is electrical connection.

[0010] As a preferred scheme of the utility model, the fixed sleeve and the clamping plate are made of stainless steel, the flow guide pipe is designed in a ring structure, and the connection mode of the miniature electric push rod and the fixed sleeve is fixed connection.

[0011] As the preferred scheme of the utility model, the absorption pad is made of sponge, the absorption pad and the clamping plate are designed in arc structure, and the spray holes are provided with multiple groups.

[0012] As the preferred scheme of the utility model, the connecting adhesive tape is made of pressure-sensitive adhesive, and the liquid inlet pipe penetrates and extends to the outside of the fixing sleeve.

[0013] As the preferred scheme of the utility model, the micro electric push rod and the clamping plate are provided with two groups, and the connection mode of the micro electric push rod, the photoelectric sensor and the controller is electric connection.

[0014] Compared with the prior art, the utility model has the beneficial effects that:

[0015] 1、in the utility model, through design a kind of gold copper wire bonding device, utilize the cleaning mechanism in the device to wash gold copper wire, gold copper wire is inserted into bonding machine along fixed sleeve, cleaning fluid is injected into liquid inlet pipe, and the cleaning fluid in liquid inlet pipe will be sprayed along spray hole, and the sprayed cleaning fluid will flush gold copper wire, while controller starts micro electric push rod, and micro electric push rod will push clamping plate to move inwards, and the clamping plate moving inwards will drive absorption pad to adhere to gold copper wire, start bonding machine, and bonding machine will pull gold copper wire into interior, and the gold copper wire pulled will pass through absorption pad, and absorption pad will wipe the cleaning fluid remaining on gold copper wire, and the wiped gold copper wire enters bonding machine, and bonding machine starts to weld gold copper wire, to solve the problem that, when the existing bonding machine runs, the outer wall of gold copper wire entering interior is easy to adhere some dust, thereby affecting welding bonding effect. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is the three-dimensional structure schematic diagram of the utility model;

[0017] Figure 2 It is the fixed sleeve side sectional view of the utility model;

[0018] Figure 3 It is the utility model Figure 2 A enlarged view in the utility model.

[0019] In the drawing: 1, bonding machine;2, cleaning mechanism;3, controller;4, battery;201, fixed sleeve;202, flow guide pipe;203, spray hole;204, clamping plate;205, micro electric push rod;206, liquid outlet hole;207, connecting adhesive tape;208, photoelectric sensor;209, liquid inlet pipe;210, absorption pad. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0021] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings, several embodiments of the present application are given, however, the present application can be realized in many different forms and is not limited to the embodiments described herein, on the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0022] It should be noted that when an element is referred to as being "fixedly attached" to another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can also be present. The terms "vertical", "horizontal", "left", "right" and similar terms as used herein are for the purpose of illustration only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The use herein of the terms "including", "comprising", "having" and the like are specifically intended to be construed in a manner consistent with their use in the patent arts to mean "including, but not limited to".

[0024] Embodiments, please refer to Figures 1-3 The present application provides a technical solution:

[0025] The gold-copper wire bonding device comprises a bonding machine 1, a cleaning mechanism 2 is arranged on the outer wall of the bonding machine 1, a controller 3 is installed on the outer wall of the bonding machine 1 and close to the cleaning mechanism 2, and a storage battery 4 is fixedly connected to the outer wall of the bonding machine 1.

[0026] The connection mode of the controller 3 and the storage battery 4 is electrical connection.

[0027] In this embodiment, reference is made to Figure 2 and Figure 3The cleaning mechanism 2 comprises a fixed sleeve 201 fixedly connected at the wire harness inlet position of the bonding machine 1, a flow guide pipe 202 fixedly connected at the front center of the inside of the fixed sleeve 201, a plurality of spray holes 203 formed in the inner wall of the flow guide pipe 202, a clamping plate 204 slidingly connected to the top and bottom of the inner wall of the fixed sleeve 201, a micro electric push rod 205 fixedly connected to the outer wall of the clamping plate 204, a liquid outlet hole 206 formed in the inside of the fixed sleeve 201 and on both sides of the flow guide pipe 202, a connecting rubber strip 207 fixedly connected to the outer wall of the clamping plate 204 and away from the micro electric push rod 205, a photoelectric sensor 208 fixedly connected to the inside of the fixed sleeve 201 and in front of the flow guide pipe 202, and a liquid inlet pipe 209 fixedly connected to the top of the flow guide pipe 202, wherein the outer wall of the connecting rubber strip 207 is adhered with an absorption pad 210;

[0028] The fixed sleeve 201 and the clamping plate 204 are both made of stainless steel, the flow guide pipe 202 has an annular structure, the micro electric push rod 205 is fixedly connected to the fixed sleeve 201, the absorption pad 210 is made of sponge, the absorption pad 210 and the clamping plate 204 have an arc structure, the spray holes 203 are provided in multiple groups, the connecting rubber strip 207 is made of pressure-sensitive adhesive, the liquid inlet pipe 209 penetrates and extends out of the fixed sleeve 201, the micro electric push rod 205 and the clamping plate 204 are both provided in two groups, the micro electric push rod 205 and the photoelectric sensor 208 are both electrically connected to the controller 3, the gold-copper wire is inserted into the fixed sleeve 201 along the fixed sleeve 201, the gold-copper wire inserted into the fixed sleeve 201 blocks the photoelectric sensor 208, the photoelectric sensor 208 detects the insertion of the gold-copper wire into the fixed sleeve 201, inputs a signal into the controller 3, the controller 3 starts the micro electric push rod 205, the micro electric push rod 205 pushes the clamping plate 204 to move inward, the inwardly moving clamping plate 204 drives the absorption pad 210 to tightly adhere to the gold-copper wire in the fixed sleeve 201, the cleaning liquid is injected into the liquid inlet pipe 209, the cleaning liquid in the liquid inlet pipe 209 flows into the flow guide pipe 202 and is sprayed out through the spray holes 203 in the inner wall of the flow guide pipe 202, the sprayed cleaning liquid washes the gold-copper wire, and the bonding machine 1 is started at the same time, the bonding machine 1 pulls the gold-copper wire into the inside, the pulled gold-copper wire passes through the absorption pad 210, and the absorption pad 210 wipes the residual cleaning liquid on the gold-copper wire.

[0029] The utility model discloses a gold and copper wire bonding device, which comprises a fixed sleeve 201, a micro electric push rod 205, a clamping plate 204, an absorbent pad 210, a liquid inlet pipe 209, a photoelectric sensor 208 and a controller 3.

[0030] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A gold-copper wire bonding apparatus comprising a bonder (1), characterized in that: The outer wall of the bonding machine (1) is provided with a cleaning mechanism (2), the outer wall of the bonding machine (1) is provided with a controller (3) near the cleaning mechanism (2), and the outer wall of the bonding machine (1) is fixedly connected with a battery (4); The cleaning mechanism (2) comprises a fixed sleeve (201) fixedly connected at the wire harness inlet position of the bonding machine (1), a flow guide pipe (202) fixedly connected to the front surface of the inside center of the fixed sleeve (201), a plurality of spray holes (203) formed in the inner wall of the flow guide pipe (202), a clamping plate (204) slidably connected to the top and bottom of the inner wall of the fixed sleeve (201), a micro electric push rod (205) fixedly connected to the outer wall of the clamping plate (204), a liquid outlet hole (206) formed in the inside of the fixed sleeve (201) and on both sides of the flow guide pipe (202), a connecting rubber strip (207) fixedly connected to the outer wall of the clamping plate (204) and away from the micro electric push rod (205), a photoelectric sensor (208) fixedly connected to the inside of the fixed sleeve (201) and on the front surface of the flow guide pipe (202), and an inlet pipe (209) fixedly connected to the top of the flow guide pipe (202), wherein the outer wall of the connecting rubber strip (207) is adhered with an absorption pad (210).

2. The gold-copper wire bonding apparatus of claim 1, wherein: The controller (3) and the battery (4) are electrically connected.

3. The gold-copper wire bonding apparatus of claim 1, wherein: The fixed sleeve (201) and the clamping plate (204) are made of stainless steel, the flow guide pipe (202) is designed in an annular structure, and the micro electric push rod (205) and the fixed sleeve (201) are fixedly connected.

4. The gold-copper wire bonding apparatus of claim 1, wherein: The absorption pad (210) is made of sponge, the absorption pad (210) and the clamping plate (204) are designed in an arc structure, and the spray holes (203) are provided with multiple groups.

5. The gold-copper wire bonding apparatus of claim 1, wherein: The connecting rubber strip (207) is made of pressure-sensitive adhesive, and the inlet pipe (209) penetrates and extends out of the fixed sleeve (201).

6. The gold-copper wire bonding apparatus of claim 1, wherein: The micro electric push rod (205) and the clamping plate (204) are provided with two groups, and the micro electric push rod (205), the photoelectric sensor (208) and the controller (3) are electrically connected.

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