Wafer robot finger
By designing a robotic finger for wafers, employing a gripping cylinder and fiber optic sensors, the problem of traditional equipment being incompatible with different wafer types has been solved, achieving high-precision gripping and safe and stable transmission processes.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2026-03-24
AI Technical Summary
Traditional wafer transfer equipment cannot simultaneously accommodate frame wafers and parent-child ring wafers, resulting in inaccurate positioning and unstable clamping. It also lacks an effective detection mechanism to ensure the accuracy and safety of clamping and transfer.
Design a wafer robot finger that uses a clamping cylinder and a fiber optic sensor. The clamping cylinder drives the clamping plate to move up and down, and the fiber optic sensor is used to accurately detect wafer clamping. Combined with 7075-T6 aluminum alloy material and positioning posts, it ensures accurate positioning.
It improves the accuracy and stability of wafer clamping, reduces operational errors, and ensures precise positioning and safety of wafers during transport.
Smart Images
Figure CN224027672U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of wafer robots, in particular to a wafer robot finger. BACKGROUND
[0002] In the field of wafer processing and manufacturing, during the transmission of Frame wafers and sub-mother ring wafers, the Frame wafers and the sub-mother ring wafers are two different types of wafers, and the traditional transmission method uses single-function clamping equipment. These devices cannot simultaneously accommodate two different types of wafers, or there are problems such as inaccurate positioning and unstable clamping during clamping.
[0003] In addition, there is a lack of effective detection mechanism to ensure the accuracy and safety of wafers during clamping and transmission.
[0004] Therefore, the application provides a wafer robot finger to solve the above problems. CONTENT OF THE UTILITY MODEL
[0005] In order to solve the above problems, the application provides a wafer robot finger.
[0006] The wafer robot finger provided by the application adopts the following technical scheme:
[0007] A wafer robot finger comprises:
[0008] A prong mounting plate is provided with a clamping cylinder and a clamping prong at the top and the bottom, respectively; the finger movement direction of the clamping cylinder is vertical up and down; the clamping cylinder is connected with a clamping pressure plate, and the clamping pressure plate clamps Frame wafers or sub-mother ring wafers.
[0009] Further, the prong mounting plate is provided with a fiber sensor in the same plane as itself, the sensing range of the fiber sensor is within the range of the clamping pressure plate, and the fiber sensor is electrically connected with the clamping cylinder.
[0010] Through the above technical scheme, the setting of the fiber sensor enables the robot finger to accurately detect whether the wafer is clamped correctly, improves the accuracy of clamping, and reduces the possibility of incorrect operation.
[0011] Further, the prong mounting plate is fixedly connected with a mounting bracket, the mounting bracket is provided with an amplifier inside and is electrically connected with the fiber sensor.
[0012] Through the above technical scheme, the amplifier is used for detection, display and feedback of the fiber sensor data, enhances the signal transmission stability and reliability of the fiber sensor, and ensures the accurate transmission of signals.
[0013] Further, the material of the clamping prongs is aluminum alloy 7075-T6.
[0014] Through the above technical solution, the use of high-strength lightweight material improves the durability and stability of the clamping prongs, and also reduces the weight of the overall structure.
[0015] Further, the clamping prongs are symmetrically provided with positioning columns on the opposite surfaces of the clamping pressure plate, and the positioning columns match the outer edges of the Frame wafer.
[0016] Through the above technical solution, the precise positioning of the wafer during clamping is ensured, preventing the wafer from shifting or sliding during transmission.
[0017] In summary, the present application includes at least one of the following beneficial technical effects:
[0018] The present application sets up a clamping air cylinder to drive the clamping pressure plate to move up and down, thereby clamping the frame wafer or the mother ring wafer, ensuring the clamping of two types of wafers in the device, and ensuring the positioning accuracy and the accuracy of the clamped wafer type. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 The structure diagram when clamping the mother ring wafer of the present application;
[0020] Figure 2 The structure diagram when clamping the frame wafer of the present application Figure 1 ;
[0021] Figure 3 The structure diagram when clamping the frame wafer of the present application Figure 2 ;
[0022] Figure 4 The clamping prong part of the present application;
[0023] Figure 5 The clamping pressure plate part of the present application.
[0024] Explanation of figure numbers: 1, prong mounting plate; 2, clamping prong; 3, clamping air cylinder; 4, clamping pressure plate; 5, optical fiber sensor; 6, mounting bracket; 7, amplifier; 8, mother ring wafer; 9, Frame wafer. DETAILED DESCRIPTION
[0025] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described; obviously, the described embodiments are only a part of the embodiments of the present application, and not all the embodiments of the present application, and all other embodiments obtained by a person of ordinary skill in the art without creative work based on the embodiments of the present application shall fall within the scope of protection of the present application.
[0026] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom end" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0027] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "sleeved / connected", "connected" and the like should be broadly understood, for example, "connected" can be fixedly connected, or can be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be internal communication of two elements. For a person of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. Embodiments
[0028] The following will be further described in detail in combination with the drawings of the embodiments of the present application. Figure 1
[0029] The embodiments of the present application disclose a wafer robot finger, comprising:
[0030] The tooth fork mounting plate 1 is fixedly provided with a clamping cylinder 3 and a clamping tooth fork 2 at the top and the bottom thereof, respectively; the finger movement direction of the clamping cylinder 3 is vertically upward and downward; the clamping cylinder 3 is connected with a clamping pressing plate 4, and the clamping pressing plate 4 is used for clamping a Frame wafer 9 or a mother-daughter ring wafer 8.
[0031] Referring to Figure 1 , Figure 2 and Figure 3 , the tooth fork mounting plate 1 is provided with a fiber sensor 5 in the same plane as itself, the sensing range of the fiber sensor 5 is located within the range of the clamping pressing plate 4 and is electrically connected with the clamping cylinder 3; the arrangement of the fiber sensor 5 enables the robot finger to accurately detect whether the wafer is clamped correctly, improves the accuracy of clamping and reduces the possibility of incorrect operation.
[0032] Referring to FIG. and FIG., the prong mounting plate 1 is fixedly connected with a mounting bracket 6, the mounting bracket 6 is internally provided with an amplifier 7 and is electrically connected with the optical fiber sensor 5; the amplifier 7 is used for detection, display and feedback of data of the optical fiber sensor 5, enhances signal transmission stability and reliability of the optical fiber sensor 5, and ensures accurate transmission of signals.
[0033] Referring to Figure 1 , Figure 2 and Figure 3 , the material of the clamping prong 2 is aluminum alloy 7075-T6; the use of this high-strength lightweight material improves the durability and stability of the clamping prong 2, and also reduces the weight of the overall structure.
[0034] Referring to Figure 4 , the clamping prong 2 and the opposite surface of the clamping pressure plate 4 are symmetrically provided with positioning columns, which are matched with the outer edge of the Frame wafer 9; accurate positioning of the wafer during clamping is ensured, and deviation or sliding of the wafer during transmission is prevented.
[0035] The implementation principle of the wafer robot finger according to an embodiment of the present application is as follows:
[0036] The mounting bracket is mounted on the corresponding driving device, such as mounting the mounting bracket on the robot arm;
[0037] Firstly, the host computer gives the robot a task of taking a wafer, and then the arm of the robot moves to the position of the wafer (the position is input into the storage position of the robot by the debugging personnel during debugging); after reaching the position of the wafer, the host computer gives a clamping instruction, the clamping cylinder is operated from the open state to the closed state, and the clamping pressure plate is also moved together with the clamping cylinder; when the wafer is clamped after moving to the position, the optical fiber sensor starts to work, detects that the wafer is clamped accurately, and feeds back information to the host computer; then the host computer gives an instruction again to transmit the wafer to another position; after reaching the other position, the host computer gives an instruction to release the clamping cylinder, the clamping cylinder is operated from the clamped state to the open state, the robot arm is retracted, and the wafer is transmitted to the position.
[0038] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application, so that: equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.
Claims
1. A wafer robotic finger, characterized in that, include: A toothed fork mounting plate (1) is provided with a clamping cylinder (3) and a clamping toothed fork (2) fixedly installed at its top and bottom respectively; the finger movement direction of the clamping cylinder (3) is vertical; the finger of the clamping cylinder (3) is connected to a clamping pressure plate (4), which is used to clamp the Frame wafer (9) or the mother-daughter ring wafer (8); The tooth fork mounting plate (1) is provided with an optical fiber sensor (5) on the same plane as itself. The sensing range of the optical fiber sensor (5) is within the range of the clamping pressure plate (4) and is electrically connected to the clamping cylinder (3). The tooth fork mounting plate (1) is fixedly connected to a mounting bracket (6), and an amplifier (7) is provided inside the mounting bracket (6) and is electrically connected to the fiber optic sensor (5).
2. The wafer robotic finger according to claim 1, characterized in that: The clamping tooth fork (2) is made of aluminum alloy 7075-T6.
3. The wafer robotic finger according to claim 1, characterized in that: The clamping tooth fork (2) and the clamping pressure plate (4) are symmetrically provided with positioning posts, which are matched with the outer edge of the Frame wafer (9).