Polycrystalline silicon reduction furnace electrode and power regulation cabinet cooling device and polycrystalline silicon production system

Abstract

The utility model discloses a polycrystalline silicon reduction furnace electrode and power regulation cabinet cooling device and a polycrystalline silicon production system. The polycrystalline silicon reduction furnace electrode and power regulation cabinet cooling device comprises a polycrystalline silicon reduction furnace electrode, a power regulation cabinet, a cooler, a circulating pump, a pipeline and a heat-conducting medium, wherein the pipeline is used for being filled with a heat-conducting medium, the circulating pump is used for driving the heat-conducting medium to circulate in the pipeline, and the cooler is used for cooling the circulating heat-conducting medium. The cooling device for the electrode and the power adjusting cabinet of the polycrystalline silicon reduction furnace has the advantages of being small in occupied area and low in investment.

Description

Technical Field

[0001] This utility model relates to the electrode and power control cabinet cooling device of polycrystalline silicon reduction furnace and polycrystalline silicon production system, belonging to the field of applied chemical industry. Background Technology

[0002] Currently, the mainstream polysilicon production process in China adopts the modified Siemens process. In the reduction section, hydrogen is used to reduce gaseous trichlorosilane, and chemical vapor deposition is performed on the silicon core within the reduction furnace to generate rod-shaped polysilicon. During polysilicon production, a power control cabinet is used to adjust the current and voltage parameters of each phase in the reduction furnace. To maintain the power control cabinet within its optimal operating temperature range, circulating demineralized water is used for cooling. Conventional projects establish an independent power control cooling water system, consisting of a power control water tank, cooler, and circulating pump, which requires a significant land area and investment.

[0003] Therefore, developing a polycrystalline silicon reduction furnace electrode and power control cabinet cooling device with a smaller footprint and lower investment has become a research direction. Utility Model Content

[0004] This invention provides a cooling device for electrodes and power control cabinet of a polycrystalline silicon reduction furnace, which has the advantages of small footprint and low investment.

[0005] This utility model also provides a polysilicon production system, which has the advantages of small footprint and low investment.

[0006] This utility model provides a cooling device for polycrystalline silicon reduction furnace electrodes and power control cabinet, which includes polycrystalline silicon reduction furnace electrodes, power control cabinet, cooler, circulating pump, pipeline, and heat transfer medium;

[0007] The pipe is used to fill the heat-conducting medium, the circulating pump is used to drive the heat-conducting medium to circulate in the pipe, and the cooler is used to cool the heat-conducting medium in the circulation.

[0008] The logistics outlet of the circulating pump is connected to the heat-conducting medium inlet of the polycrystalline silicon reduction furnace electrode and the heat-conducting medium inlet of the power control cabinet through pipelines respectively.

[0009] The heat transfer medium outlet of the polycrystalline silicon reduction furnace electrode and the heat transfer medium outlet of the power control cabinet are respectively connected to the heat transfer medium inlet of the cooler through pipes.

[0010] The outlet of the heat transfer medium of the cooler is connected to the inlet of the circulating pump.

[0011] The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device described above further includes a heat transfer medium storage tank. The material inlet of the heat transfer medium storage tank is connected to the heat transfer medium outlet of the cooler, and the material outlet of the heat transfer medium storage tank is connected to the material inlet of the circulating pump.

[0012] In the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device described above, the heat-conducting medium is demineralized water.

[0013] In the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device described above, the water temperature of the heat-conducting medium is 30~35℃ and the return water temperature is 40~45℃.

[0014] The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device described above further includes a filter, wherein the filter's material inlet is connected to the material outlet of the heat transfer medium storage tank, and the filter's material outlet is connected to the material inlet of the circulating pump.

[0015] The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device described above further includes a heat transfer medium replenishment device, wherein the material outlet of the heat transfer medium replenishment device is connected to the material inlet of the heat transfer medium storage tank.

[0016] The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device described above, wherein the circulating pump is a variable frequency pump.

[0017] The polysilicon reduction furnace electrode and power control cabinet cooling device described above, wherein the heat transfer medium outlet of the polysilicon reduction furnace electrode is provided with a first thermometer;

[0018] The polysilicon reduction furnace electrode and power control cabinet cooling device also includes a controller;

[0019] The variable frequency pump and the first thermometer are respectively electrically connected to the controller.

[0020] The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device described above, wherein the heat transfer medium outlet of the power control cabinet is equipped with a second thermometer;

[0021] The second thermometer is electrically connected to the controller.

[0022] This utility model also provides a polycrystalline silicon production system, which includes any of the above-mentioned polycrystalline silicon reduction furnace electrodes and power control cabinet cooling devices.

[0023] The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model have the characteristics of small footprint and low investment. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced one by one below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A schematic diagram of the structure of the first type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model;

[0026] Figure 2 A schematic diagram of the structure of the second type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model;

[0027] Figure 3 A schematic diagram of the structure of the third type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model;

[0028] Figure 4 A schematic diagram of the structure of the fourth type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model;

[0029] Figure 5 A schematic diagram of the structure of the fifth type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model;

[0030] Figure 6 A schematic diagram of the structure of the sixth type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model.

[0031] Explanation of reference numerals in the attached figures:

[0032] A-Polycrystalline silicon reduction furnace electrode;

[0033] B-Cooler;

[0034] C-circulation pump;

[0035] D-Heat transfer medium storage tank;

[0036] E-Heat transfer medium replenishment device;

[0037] F - First thermometer;

[0038] G - Second thermometer;

[0039] H-pipe;

[0040] I-Power Adjustment Cabinet;

[0041] J-filter. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, of the embodiments of this application. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0043] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0044] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0045] The terms “first,” “second,” and “third” (if any) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0046] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or display that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or display.

[0047] The first aspect of this utility model provides a polysilicon reduction furnace electrode cooling device, which includes an A-polysilicon reduction furnace electrode, a B-cooler, and a C-circulation pump that are interconnected by an H-pipe.

[0048] Among them, H-pipe is used to fill the heat transfer medium, C-circulation pump is used to drive the heat transfer medium to circulate in H-pipe, and B-cooler is used to cool the heat transfer medium in circulation.

[0049] Figure 1 This is a schematic diagram of the structure of the first type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model. Figure 1 As shown, the device includes A-polysilicon reduction furnace electrode, I-power control cabinet, B-cooler, C-circulating pump, H-pipeline, and heat transfer medium;

[0050] Among them, H-pipe is used to fill the heat transfer medium, C-circulation pump is used to drive the heat transfer medium to circulate in H-pipe, and B-cooler is used to cool the heat transfer medium in circulation.

[0051] The C-circulating pump's outlet is connected to the A-polycrystalline silicon reduction furnace electrode's heat transfer medium inlet and the I-power control cabinet's heat transfer medium inlet via the H-pipe.

[0052] The heat transfer medium outlets of the A-polycrystalline silicon reduction furnace electrode and the I-power control cabinet are connected to the heat transfer medium inlet of the B-cooler via the H-pipe, respectively.

[0053] The heat transfer medium outlet of the B-cooler is connected to the material inlet of the C-circulating pump.

[0054] That is, A-the polycrystalline silicon reduction furnace electrode and I-the power control cabinet are connected in parallel.

[0055] The A-polysilicon reduction furnace electrode is one of the components of the polysilicon reduction furnace. The electrode assembly has a cavity through which the heat-conducting medium can pass, and it has a heat-conducting medium inlet and a heat-conducting medium outlet. The heat-conducting medium enters the A-polysilicon reduction furnace electrode through the heat-conducting medium inlet, absorbs heat from the A-polysilicon reduction furnace electrode, and then leaves the A-polysilicon reduction furnace electrode through the heat-conducting medium outlet, thus completing the cooling of the A-polysilicon reduction furnace electrode.

[0056] The I-power control cabinet is used to adjust the current and voltage parameters of each phase in the polycrystalline silicon reduction furnace. The I-power control cabinet also has a cavity through which the heat transfer medium can pass, and it has a heat transfer medium inlet and an outlet. The heat transfer medium enters the I-power control cabinet through the heat transfer medium inlet, absorbs heat from the I-power control cabinet, and then leaves the I-power control cabinet through the heat transfer medium outlet, thus completing the cooling of the I-power control cabinet.

[0057] B-coolers are used to cool down heat-conducting media with high temperatures, thereby reducing the temperature of the heat-conducting media. This utility model does not limit the specific type of B-cooler, as long as it can cool down the heat-conducting media.

[0058] This invention does not limit the choice of heat-conducting medium; commonly used heat-conducting media in the art can be used. In one embodiment, the heat-conducting medium can be selected from either water or heat-conducting oil.

[0059] In existing technologies, the A-polycrystalline silicon reduction furnace electrode and the I-power control cabinet typically have separate cooling water systems, each consisting of a power control water tank, a B-cooler, and a C-circulating pump. These cooling methods suffer from drawbacks such as large footprint and high investment. The inventors have discovered that the cooling systems of the A-polycrystalline silicon reduction furnace electrode and the I-power control cabinet can be combined, sharing a single cooler, C-circulating pump, H-pipeline, and heat transfer medium, thereby significantly reducing both the footprint and investment of the cooling system.

[0060] The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model have the characteristics of small footprint and low investment.

[0061] Figure 2 This is a schematic diagram of the structure of the first type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model. Figure 2 As shown, the device also includes a D-heat transfer medium storage tank, the material inlet of which is connected to the heat transfer medium outlet of the B-cooler, and the material outlet of the D-heat transfer medium storage tank is connected to the material inlet of the C-circulation pump.

[0062] The D-heat-conducting medium storage tank is used to store heat-conducting medium, enabling the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model to have higher cooling efficiency.

[0063] This utility model does not limit the specific location of the D-heat-conducting medium storage tank, as long as it meets the requirement of being interconnected with the A-polycrystalline silicon reduction furnace electrode, B-cooler and C-circulation pump through the H-pipe.

[0064] In one embodiment, the heat transfer medium is demineralized water. Demineralized water is inexpensive, readily available, and has a high specific heat capacity. When used in the electrode cooling device for the polycrystalline silicon reduction furnace provided by this invention, the device can achieve higher cooling efficiency while maintaining lower operating costs.

[0065] In one embodiment, the operating temperature of the water supply to the polycrystalline silicon reduction furnace electrode cooling device provided by this invention is 30~35℃, and the temperature of the return water is 40~45℃. Specifically, before entering the A-polycrystalline silicon reduction furnace electrode and the I-power control cabinet for heat exchange, the temperature of the heat-conducting medium is 30~35℃; after heat exchange, the temperature of the heat-conducting medium leaving the A-polycrystalline silicon reduction furnace electrode and the I-power control cabinet is 40~45℃. The above operating temperatures can be matched with the operating temperatures of the A-polycrystalline silicon reduction furnace electrode and the I-power control cabinet, enabling the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this invention to have higher cooling efficiency.

[0066] Figure 3 This is a schematic diagram of the structure of the third type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model. Figure 3 As shown, the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model also includes a J-filter. The inlet of the J-filter is connected to the outlet of the D-heat transfer medium storage tank, and the outlet is connected to the inlet of the C-circulation pump. The J-filter can trap solid impurities in the heat transfer medium and prevent the H-pipe from being blocked. This utility model does not limit the specific selection of the J-filter; commonly used J-filters in the art can be selected as needed to meet the requirement of trapping solid impurities in the heat transfer medium.

[0067] Figure 4 This is a schematic diagram of the structure of the fourth type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model. Figure 4 As shown, the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model also includes an E-heat conduction medium replenishment device connected to the D-heat conduction medium storage tank. The E-heat conduction medium replenishment device is used to replenish the heat conduction medium to the A-polycrystalline silicon reduction furnace electrode and the I-power control cabinet cooling device. When the heat conduction medium leaks, the E-heat conduction medium replenishment device can replenish the heat conduction medium to the A-polycrystalline silicon reduction furnace electrode and the I-power control cabinet cooling device, thereby ensuring the cooling effect of the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model.

[0068] This invention does not limit the specific equipment selection for the E-heat transfer medium replenishment device, and can be determined according to different heat transfer media. In one embodiment, when the heat transfer medium is demineralized water, the E-heat transfer medium replenishment device is the demineralized water inlet in the plant area.

[0069] Furthermore, in one embodiment, in the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model, the C-circulation pump is a variable frequency pump. The variable frequency pump can adjust the flow rate of the heat transfer medium entering the A-polycrystalline silicon reduction furnace electrode for heat exchange by changing the flow rate of the heat transfer medium, thereby enhancing the adjustment capability of the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device. The flow rate of the heat transfer medium can be adjusted according to the actual production load, making the energy-saving and consumption-reducing advantages of the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model even more prominent.

[0070] Figure 5 This is a schematic diagram of the structure of the fifth type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model. Figure 5 As shown, in the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model, A-polycrystalline silicon reduction furnace electrode heat conduction medium outlet is provided with F-first thermometer;

[0071] The cooling device for the electrodes and power control cabinet of the polycrystalline silicon reduction furnace also includes a controller;

[0072] The variable frequency pump and the F-first thermometer are electrically connected to the controller.

[0073] F-The first thermometer is used to detect the temperature T1 of the heat transfer medium leaving the A-polycrystalline silicon reduction furnace electrode. When T1 is detected to be higher than a preset value, the controller controls the variable frequency pump to increase the flow rate, allowing a larger flow of heat transfer medium to enter the A-polycrystalline silicon reduction furnace electrode, increasing the circulation speed of the heat transfer medium and improving the heat dissipation capacity of the A-polycrystalline silicon reduction furnace electrode cooling device. This invention does not limit the preset value of T1; in one embodiment, the preset value of T1 is 50°C.

[0074] Figure 6 This is a schematic diagram of the structure of the sixth type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model. Figure 6 As shown, the heat transfer medium outlet of the I-power control cabinet is equipped with a G-second thermometer;

[0075] G - The second thermometer is electrically connected to the controller.

[0076] F-The first thermometer is used to detect the temperature T2 of the heat transfer medium leaving the I-power control cabinet. When T2 is detected to be higher than the preset value, the controller controls the variable frequency pump to increase the flow rate, allowing a larger flow of heat transfer medium to enter the I-power control cabinet, thereby increasing the circulation speed of the heat transfer medium. This invention does not limit the preset value of T2; in one embodiment, the preset value of T2 is 50°C.

[0077] Furthermore, in one embodiment, when T1 or T2 is detected to be higher than a preset value, the controller can control the variable frequency pump to increase the flow rate, allowing a larger flow rate of heat transfer medium to enter the A-polysilicon reduction furnace electrode and the I-power control cabinet, increasing the circulation speed of the heat transfer medium and improving the heat dissipation capacity of the cooling devices of the polysilicon reduction furnace electrode and the power control cabinet.

[0078] The second aspect of this utility model provides a polycrystalline silicon production apparatus, which includes the polycrystalline silicon reduction furnace electrodes and the power regulating cabinet cooling device provided in the first aspect of this utility model. The polycrystalline silicon production apparatus provided by this utility model has the advantages of small footprint and low investment.

[0079] The following examples further illustrate the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model.

[0080] Example 1

[0081] This embodiment uses Figure 6 The polycrystalline silicon reduction furnace electrodes and the power-adjusting cooling device shown are used to cool the electrodes. For example... Figure 6As shown, the polysilicon reduction furnace electrode and power-adjusting cooling device includes A-polysilicon reduction furnace electrode, I-power-adjusting cabinet, B-cooler, C-circulating pump, H-pipeline, and heat transfer medium;

[0082] In this system, H-pipe is used to fill the heat transfer medium, C-circulation pump is used to drive the heat transfer medium to circulate in H-pipe, and B-cooler is used to cool the heat transfer medium in circulation. The material outlet of C-circulation pump is connected to the heat transfer medium inlet of A-polycrystalline silicon reduction furnace electrode and I-power control cabinet through H-pipe. The heat transfer medium outlet of A-polycrystalline silicon reduction furnace electrode and I-power control cabinet are connected to the heat transfer medium inlet of B-cooler through H-pipe. The heat transfer medium outlet of B-cooler is connected to the material inlet of C-circulation pump.

[0083] In addition, the device also includes a D-heat transfer medium storage tank, the material inlet of which is connected to the heat transfer medium outlet of the B-cooler, and the material outlet of the D-heat transfer medium storage tank is connected to the material inlet of the C-circulation pump.

[0084] In addition, the device also includes an E-heat transfer medium replenishment device, the logistics outlet of which is connected to the logistics inlet of the D-heat transfer medium storage tank.

[0085] In addition, the device also includes a J-filter, the inlet of which is connected to the outlet of the D-heat transfer medium storage tank, and the outlet of the J-filter is connected to the inlet of the C-circulation pump.

[0086] A - The outlet of the electrode heat transfer medium of the polycrystalline silicon reduction furnace is equipped with F - the first thermometer; I - The outlet of the heat transfer medium of the power control cabinet is equipped with G - the second thermometer; the heat transfer medium is demineralized water; D - The heat transfer medium storage tank is connected to the demineralized water interface of the plant area; in addition, there is a controller (not shown).

[0087] When the above device is running, the variable frequency pump drives the demineralized water to flow in the H-pipeline. After absorbing heat from the A-polycrystalline silicon reduction furnace electrode and the I-power control cabinet, the temperature rises. Then, it enters the B-cooler for heat exchange to lower the temperature of the demineralized water. After passing through the D-heat transfer medium storage tank, it is circulated again by the variable frequency pump to complete the cooling of the A-polycrystalline silicon reduction furnace electrode and the I-power control cabinet.

[0088] Meanwhile, when the F-first thermometer detects a temperature higher than 50℃, or the G-second thermometer detects a temperature higher than 50℃, the controller controls the frequency converter pump to increase the flow rate of the demineralized water, so that the demineralized water can better cool the A-polycrystalline silicon reduction furnace electrode.

[0089] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0090] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0091] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the technical solutions of the embodiments of this utility model.

Claims

1. A cooling device for electrodes and a power control cabinet in a polycrystalline silicon reduction furnace, characterized in that, Includes polysilicon reduction furnace electrodes, power control cabinet, cooler, circulating pump, piping, and heat transfer medium; The pipe is used to fill the heat-conducting medium, the circulating pump is used to drive the heat-conducting medium to circulate in the pipe, and the cooler is used to cool the heat-conducting medium in the circulation. The logistics outlet of the circulating pump is connected to the heat-conducting medium inlet of the polycrystalline silicon reduction furnace electrode and the heat-conducting medium inlet of the power control cabinet through pipelines respectively. The heat transfer medium outlet of the polycrystalline silicon reduction furnace electrode and the heat transfer medium outlet of the power control cabinet are respectively connected to the heat transfer medium inlet of the cooler through pipes. The outlet of the heat transfer medium of the cooler is connected to the inlet of the circulating pump.

2. The apparatus according to claim 1, characterized in that, It also includes a heat transfer medium storage tank, the inlet of which is connected to the heat transfer medium outlet of the cooler, and the outlet of which is connected to the inlet of the circulating pump.

3. The apparatus according to claim 2, characterized in that, The heat-conducting medium is demineralized water.

4. The apparatus according to claim 3, characterized in that, The temperature of the heat-conducting medium is 30~35℃ for the water entering the system and 40~45℃ for the water returning to the system.

5. The apparatus according to claim 4, characterized in that, It also includes a filter, the inlet of which is connected to the outlet of the heat transfer medium storage tank, and the outlet of which is connected to the inlet of the circulation pump.

6. The apparatus according to claim 5, characterized in that, It also includes a heat transfer medium replenishment device, the logistics outlet of which is connected to the logistics inlet of the heat transfer medium storage tank.

7. The apparatus according to claim 6, characterized in that, The circulating pump is a variable frequency pump.

8. The apparatus according to claim 7, characterized in that, The heat-conducting medium outlet of the polycrystalline silicon reduction furnace electrode is equipped with a first thermometer; The polysilicon reduction furnace electrode and power control cabinet cooling device also includes a controller; The variable frequency pump and the first thermometer are respectively electrically connected to the controller.

9. The apparatus according to claim 8, characterized in that, The heat transfer medium outlet of the power control cabinet is equipped with a second thermometer; The second thermometer is electrically connected to the controller.

10. A polycrystalline silicon production system, characterized in that, The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device are included in any one of claims 1-9.

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