An experimental horizontal plating device

Abstract

The present application relates to the technical field of electroplating, and particularly relates to a horizontal plating device for experiments, which comprises a tank body, the upper end of the tank body is provided with a cover plate, a plating groove is formed in the cover plate, a rubber ring is arranged at the outer ring of the plating groove, a workpiece to be plated is placed on the plating groove with the electroplating surface downward and in contact with the rubber ring, a mounting seat is hung on the inner wall of the cover plate, a sub-tank is arranged on the mounting seat, a cavity for containing plating solution is formed in the sub-tank, an anode plate is arranged in the cavity, a cathode conductive pin is arranged in the cavity and in contact with the electroplating surface of the workpiece to be plated, a plating solution inlet is formed in the side surface of the sub-tank, the upper end of the sub-tank is inserted into the plating groove and sprays plating solution to the electroplating surface of the workpiece to be plated, the wiring ends of the anode plate and the cathode conductive pin are respectively led out from the bottom of the mounting seat, and a waterproof ring is arranged on the bottom surface of the mounting seat to shield the wiring ends. The horizontal plating device for experiments has compact structure, good protection of the anode and cathode components, small plating solution overflow and low maintenance cost.

Description

A horizontal plating apparatus for experiments Technical Field

[0001] This invention relates to the field of electroplating technology, and more particularly to an experimental horizontal plating apparatus. Background Technology

[0002] Electroplating is a traditional and mature surface processing technology that is widely used in integrated circuit technology. It is a process of depositing a thin layer of other metals or alloys onto the surface of certain metals using the principle of electrolysis. It is a process that uses electrolysis to attach a metal film to the surface of metal or other material parts, thereby preventing metal oxidation, improving wear resistance, conductivity, reflectivity, corrosion resistance, and enhancing aesthetics.

[0003] Horizontal electroplating is a method where the workpiece is placed horizontally to be parallel to the plating bath level. The plating tank contains an anode and a cathode, and a conductive needle connects the cathode of the power source to the plating area of ​​the workpiece, allowing for localized plating. However, due to limitations of experimental settings and structural requirements, the anode and cathode are located within the plating tank, making them highly susceptible to contamination or plating by the plating bath, affecting subsequent plating quality and resulting in high maintenance costs. Summary of the Invention

[0004] Based on the above problems, the purpose of this invention is to provide an experimental horizontal plating apparatus that effectively protects the anode and cathode components from contamination by the plating solution or plating.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An experimental horizontal plating apparatus includes a tank body with a cover plate at the top. The cover plate has a plating tank opening, and a rubber ring is provided around the outer circumference of the plating tank opening. The workpiece to be plated is placed on the plating tank opening with the electroplating surface facing down and is sealed in contact with the rubber ring. A mounting base is suspended on the inner wall of the cover plate, and a sub-tank is provided on the mounting base. The sub-tank has a cavity for holding plating solution inside, an anode plate is provided in the cavity, and a cathode conductive needle protrudes from the cavity to contact the electroplating surface of the workpiece to be plated. A plating solution inlet is provided on the side of the sub-tank, and the upper end of the sub-tank extends into the plating tank opening and sprays plating solution onto the electroplating surface of the workpiece to be plated. The terminals of the anode plate and the cathode conductive needle are respectively led out from the bottom of the mounting base, and a waterproof ring is provided on the bottom surface of the mounting base to cover the terminals.

[0007] Optionally, a sleeve is installed on the mounting base, the lower end of the cathode conductive needle passes through the sleeve and extends out from the bottom end of the sleeve, a protrusion is provided on the cathode conductive needle and inside the sleeve, and a spring is clamped between the protrusion and the end face of the sleeve, so that the cathode conductive needle can move up and down relative to the sub-slot.

[0008] Optionally, a sleeve extends upward along the surface of the cathode conductive needle inside the sub-tank. The sleeve is used to separate the anode plate from the cathode conductive needle and reduce the flow of plating solution downward along the cathode conductive needle.

[0009] Optionally, a drain port is provided at the bottom of the sleeve.

[0010] Optionally, the waterproof ring is cylindrical, with its upper end embedded in the mounting base and its lower end open. The positive and negative power lines are electrically connected from the lower end of the waterproof ring to the corresponding anode plate and cathode conductive pin, respectively.

[0011] Optionally, the anode plate is placed flat in the cavity, and several flow equalization holes are opened on the anode plate. The plating solution entering from the plating solution inlet is sprayed out after passing through each flow equalization hole, so as to achieve uniform flow guidance and discharge.

[0012] Optionally, a limiting step for installing the anode plate is provided on the inner side wall of the sub-tank.

[0013] Optionally, a bracket is provided on the inner wall of the cover plate, and the mounting base is connected to the bracket by bolts. The connection distance between the mounting base and the bracket can be adjusted by adding or removing shims, so that the distance between the anode plate and the workpiece to be plated is adjustable.

[0014] Optionally, a stop step that abuts against the rubber ring is provided on the outer wall of the sub-slot.

[0015] Optionally, the bottom of the tank is equipped with an outlet pipe, which is connected to a circulation pump. The outlet of the circulation pump is equipped with an inlet pipe, which passes through the cover plate and is connected to the plating solution inlet.

[0016] In summary, compared with the prior art, the experimental horizontal plating apparatus has the following advantages:

[0017] 1) The structure is compact and occupies little space, meeting the requirements for experimental use;

[0018] 2) The anode and cathode components have good protection, effectively avoiding contamination by the plating solution or plating.

[0019] 3) The amount of plating solution overflowing is small, and the recycling rate is high;

[0020] 4) High coating quality and low maintenance cost. Attached Figure Description

[0021] Figure 1 is a schematic diagram of the experimental horizontal plating apparatus provided in an embodiment of the present invention;

[0022] Figure 2 is a detailed view of the interior of the tank in the experimental horizontal plating apparatus provided in an embodiment of the present invention.

[0023] In the picture:

[0024] 1. Tank body; 2. Cover plate; 3. Plating tank opening; 4. Rubber ring; 5. Mounting base; 6. Sub-tank; 7. Cavity; 8. Anode plate; 9. Cathode conductive needle; 10. Plating solution inlet; 11. Waterproof ring; 12. Sleeve; 13. Protrusion; 14. Spring; 15. Sleeve; 16. Drain outlet; 17. Flow equalization hole; 18. Limiting step; 19. Bracket; 20. Gasket; 21. Stop step; 22. Outlet pipe; 23. Circulation pump; 24. Inlet pipe; 25. Workpiece to be plated. Detailed Implementation

[0025] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0026] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, a mechanical connection, an electrical connection, or an indirect connection via an intermediate medium. They can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0027] In the description of this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature. The technical solutions of this invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0028] Please refer to Figures 1 and 2. This preferred embodiment provides an experimental horizontal plating apparatus, including a tank 1, a cover plate 2 at the upper end of the tank 1, a plating opening 3 on the cover plate 2, and a rubber ring 4 on the outer ring of the plating opening 3. The workpiece 25 to be plating is pressed onto the plating opening 3 with the plating surface facing down and is sealed in contact with the rubber ring 4.

[0029] An installation base 5 is suspended on the inner wall of the cover plate 2. A sub-slot 6 is provided on the installation base 5. A cavity 7 for holding plating solution is opened inside the sub-slot 6. An anode plate 8 is provided in the cavity 7, and a cathode conductive needle 9 protrudes from the cavity 7 to contact the electroplating surface of the workpiece 25 to be plated.

[0030] Specifically, the side of the sub-tank 6 is provided with a plating solution inlet 10. The upper port of the sub-tank 6 extends into the plating tank opening 3 and sprays the plating solution onto the electroplating surface of the workpiece 25 to be plated. The terminals of the anode plate 8 and the cathode conductive pin 9 are respectively led out from the bottom of the mounting base 5, and a waterproof ring 11 is provided on the bottom surface of the mounting base 5 to shield the terminals, so as to avoid contact between the terminal components and the plating solution as much as possible.

[0031] In one embodiment, a sleeve 12 is installed on the mounting base 5. The lower end of the cathode conductive needle 9 passes through the sleeve 12 and extends out from the bottom end of the sleeve 12. A protrusion 13 is provided on the cathode conductive needle 9 and inside the sleeve 12. A spring 14 is sandwiched between the protrusion 13 and the end face of the sleeve 12, so that the cathode conductive needle 9 can move up and down relative to the sub-groove 6 to flexibly contact the workpiece 25 to be plated and adapt to changes in the anode-cathode spacing.

[0032] Specifically, a sleeve 15 extends upward from the inside of the sub-tank 6 along the surface of the cathode conductive needle 9. The sleeve 15 is used to separate the anode plate 8 from the cathode conductive needle 9 and reduce the downward flow of plating solution along the cathode conductive needle 9. Furthermore, a drain port 16 is provided at the bottom of the sleeve 12 so that even if a small amount of plating solution seeps into the sleeve 12 along the cathode conductive needle 9, the plating solution can be discharged in time through the drain port 16.

[0033] The waterproof ring 11 here is preferably cylindrical, with its upper end embedded in the mounting base 5 and its lower end open. The positive and negative power lines are electrically connected from the lower end of the waterproof ring 11 to the corresponding anode plate 8 and cathode conductive pin 9, respectively, which facilitates wiring and avoids plating solution accumulation.

[0034] The anode plate 8 is placed flat in the cavity 7, and several flow equalization holes 17 are opened on the anode plate 8. The plating solution entering from the plating solution inlet 10 is sprayed out after passing through each flow equalization hole 17, which can achieve uniform flow guidance and discharge.

[0035] Specifically, the inner wall of the sub-slot 6 is provided with a limiting step 18 for installing the anode plate 8, and the anode plate 8 is fixed by titanium screws.

[0036] Specifically, a bracket 19 is provided on the inner wall of the cover plate 2. The mounting base 5 is connected to the bracket 19 by bolts, and the connection distance between the mounting base 5 and the bracket 19 is adjusted by adding or removing shims 20, so that the distance between the anode plate 8 and the workpiece 25 to be plated is adjustable, and the distance between the anode and cathode is adjustable.

[0037] Furthermore, a stop step 21 is provided on the outer wall of the sub-tank 6 to abut against the rubber ring 4, achieving partial sealing. Since the sub-tank 6 does not contact the workpiece 25 to be plated, the liquid level of the plating solution can be increased through the rubber ring 4 and the stop step 21, ensuring the quality of the plating layer.

[0038] In addition, a liquid outlet pipe 22 is provided at the bottom of the tank 1. The liquid outlet pipe 22 is connected to a circulation pump 23. The liquid outlet of the circulation pump 23 is provided with an inlet pipe 24. The inlet pipe 24 passes through the cover plate 2 and is connected to the plating solution inlet 10 to realize the recycling of the plating solution. Given the above structure, the amount of plating solution loss is very small and the reuse rate is high.

[0039] In summary, the horizontal plating apparatus used in the above experiments has a compact structure and occupies little space; the anode and cathode components are well protected, effectively avoiding contamination or plating by the plating solution; the amount of plating solution overflow is small, and the recycling rate is high; the plating quality is high, and the maintenance cost is low.

[0040] The above embodiments merely illustrate the basic principles and characteristics of the present invention. The present invention is not limited to the above embodiments. Various changes and modifications can be made to the present invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. An experimental horizontal plating apparatus, characterized in that, The system includes a tank (1), with a cover plate (2) at the upper end of the tank (1). The cover plate (2) has a plating opening (3), and a rubber ring (4) is provided around the outer ring of the plating opening (3). The workpiece (25) to be plated is placed on the plating opening (3) with the plating surface facing down and is sealed in contact with the rubber ring (4). A mounting base (5) is suspended on the inner wall of the cover plate (2), and a sub-slot (6) is provided on the mounting base (5). The sub-slot (6) has a cavity (7) for holding the plating solution, and an anode plate (8) is provided in the cavity (7). The sub-slot (6) has a cathode conductive pin (9) extending from the cavity (7) to contact the electroplating surface of the workpiece (25). The side of the sub-slot (6) is provided with a plating solution inlet (10). The upper end of the sub-slot (6) extends into the plating tank opening (3) and sprays plating solution onto the electroplating surface of the workpiece (25). The terminals of the anode plate (8) and the cathode conductive pin (9) are respectively led out from the bottom of the mounting base (5). A waterproof ring (11) is provided on the bottom surface of the mounting base (5) to cover the terminals. A sleeve is installed on the mounting base (5). The lower end of the cathode conductive needle (9) is inserted into the sleeve (12) and extends out from the bottom end of the sleeve (12). A protrusion (13) is provided on the cathode conductive needle (9) and inside the sleeve (12). A spring (14) is clamped between the protrusion (13) and the end face of the sleeve (12), so that the cathode conductive needle (9) can move up and down relative to the sub-groove (6). A sleeve (15) extends upward from the inside of the sub-groove (6) along the surface of the cathode conductive needle (9). The sleeve (15) is used for... To separate the anode plate (8) from the cathode conductive needle (9) and reduce the flow rate of the plating solution downward along the cathode conductive needle (9); the bottom of the sleeve (12) is provided with a drain port (16); the anode plate (8) is placed flat in the cavity (7), and a plurality of flow equalization holes (17) are provided on the anode plate (8). The plating solution entering from the plating solution inlet (10) is sprayed out after passing through each of the flow equalization holes (17), so as to achieve uniform flow and discharge; the outer wall of the sub-tank (6) is provided with a stop step (21) that abuts against the rubber ring (4).

2. The experimental horizontal plating apparatus according to claim 1, characterized in that, The waterproof ring (11) is cylindrical, and the upper end of the waterproof ring (11) is embedded in the mounting base (5). The lower end of the waterproof ring (11) is open, and the positive and negative power lines are electrically connected from the lower port of the waterproof ring (11) to the corresponding anode plate (8) and cathode conductive pin (9).

3. The experimental horizontal plating apparatus according to claim 1, characterized in that, The inner wall of the sub-slot (6) is provided with a limiting step (18) for installing the anode plate (8).

4. The experimental horizontal plating apparatus according to claim 1, characterized in that, A bracket (19) is provided on the inner wall of the cover plate (2). The mounting base (5) is connected to the bracket (19) by bolts. The connection distance between the mounting base (5) and the bracket (19) is adjusted by adding or removing shims (20), so that the distance between the anode plate (8) and the workpiece (25) to be plated is adjustable.

5. The experimental horizontal plating apparatus according to claim 1, characterized in that, The bottom of the tank (1) is provided with a liquid outlet pipe (22), which is connected to a circulation pump (23). The outlet of the circulation pump (23) is provided with a liquid inlet pipe (24), which passes through the cover plate (2) and is connected to the plating solution inlet (10).

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