Polycrystalline silicon reduction furnace electrode and power regulation cabinet cooling device and polycrystalline silicon production system

Abstract

The utility model discloses a polycrystalline silicon reduction furnace electrode and power regulation cabinet cooling device and a polycrystalline silicon production system. The polycrystalline silicon reduction furnace electrode and power regulation cabinet cooling device comprises a power regulation cabinet, a polycrystalline silicon reduction furnace electrode, a first cooler, a second cooler, a circulating pump, a pipeline and a heat-conducting medium. The cooling device for the electrode and the power regulation cabinet of the polycrystalline silicon reduction furnace has the advantages of being small in occupied area, low in investment and good in cooling effect of the power regulation cabinet.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of polycrystalline silicon reduction furnace electrode and power regulating cabinet cooling device and polycrystalline silicon production system, belong to application chemical industry field. BACKGROUND

[0002] At present, the mainstream polycrystalline silicon production process in domestic adopts improved siemens method, and hydrogen is used in reduction section to reduce gaseous trichlorosilane, and rod-shaped polycrystalline silicon is generated by chemical vapor deposition on silicon core in reduction furnace. In the production process of polycrystalline silicon, the power regulating cabinet is used to adjust the current and voltage parameters of each phase in the reduction furnace. In order to keep the power regulating cabinet in the best working temperature range, circulating desalted water is used to cool the power regulating cabinet. The conventional project sets up an independent power regulating cooling water system, which is composed of a power regulating water tank, a cooler and a circulating pump, and has the defects of large occupation and investment. Because the power regulating cabinet needs more cooling capacity than the reduction furnace electrode, when the same cooling water system is used for power regulation and reduction furnace electrode, the defect of poor cooling effect of the power regulating cabinet often occurs.

[0003] Therefore, it has become a research direction to develop a polycrystalline silicon reduction furnace electrode and power regulating cabinet cooling device with smaller occupation area, lower investment and better cooling effect of the power regulating cabinet. CONTENT OF THE UTILITY MODEL

[0004] The utility model provides a kind of polycrystalline silicon reduction furnace electrode and power regulating cabinet cooling device, and the device has the characteristics of smaller occupation area, lower investment and better cooling effect of the power regulating cabinet.

[0005] The utility model also provides a kind of polycrystalline silicon production system, and the system has the characteristics of smaller occupation area, lower investment and better cooling effect of the power regulating cabinet.

[0006] The utility model provides a kind of polycrystalline silicon reduction furnace electrode and power regulating cabinet cooling device, wherein, including power regulating cabinet, polycrystalline silicon reduction furnace electrode, first cooler, second cooler, circulating pump, pipeline, heat conducting medium;

[0007] The pipeline is used to fill heat conducting medium, and the circulating pump is used to drive the heat conducting medium to circulate in the pipeline, and the first cooler and the second cooler are used to cool the heat conducting medium in the circulation;

[0008] The heat conducting medium outlet of the first cooler is communicated with the heat conducting medium inlet of the power regulating cabinet;

[0009] The heat conducting medium outlet of the polycrystalline silicon reduction furnace electrode is communicated with the heat conducting medium inlet of the second cooler;

[0010] The material flow outlet of the circulating pump is communicated with the heat conducting medium inlet of the first cooler and the heat conducting medium inlet of the polycrystalline silicon reduction furnace electrode respectively through the pipeline.

[0011] The heat transfer medium outlet of the second cooler and the heat transfer medium outlet of the power control cabinet are respectively connected to the material inlet of the circulating pump through pipelines.

[0012] The device described above further includes a heat transfer medium storage tank, the inlet of which is connected to the heat transfer medium outlet of the second cooler and the heat transfer medium outlet of the power control cabinet, and the outlet of which is connected to the inlet of the circulating pump.

[0013] In the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device described above, the heat-conducting medium is demineralized water.

[0014] In the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device described above, the water temperature of the heat-conducting medium is 30-35°C and the return water temperature is 40-45°C.

[0015] The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device described above further includes a filter, wherein the filter's material inlet is connected to the material outlet of the heat transfer medium storage tank, and the filter's material outlet is connected to the material inlet of the circulating pump.

[0016] The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device described above further includes a heat transfer medium replenishment device, wherein the material outlet of the heat transfer medium replenishment device is connected to the material inlet of the heat transfer medium storage tank.

[0017] The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device described above, wherein the circulating pump is a variable frequency pump.

[0018] The polysilicon reduction furnace electrode and power control cabinet cooling device described above, wherein the heat transfer medium outlet of the polysilicon reduction furnace electrode is provided with a first thermometer;

[0019] The polysilicon reduction furnace electrode and power control cabinet cooling device also includes a controller;

[0020] The variable frequency pump and the first thermometer are respectively electrically connected to the controller.

[0021] The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device described above, wherein the heat transfer medium outlet of the power control cabinet is equipped with a second thermometer;

[0022] The second thermometer is electrically connected to the controller.

[0023] This utility model also provides a polycrystalline silicon production system, which includes any of the above-mentioned polycrystalline silicon reduction furnace electrodes and power control cabinet cooling devices.

[0024] The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model have the characteristics of small footprint and low investment. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced one by one below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A schematic diagram of the structure of the first type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model;

[0027] Figure 2 A schematic diagram of the structure of the second type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model;

[0028] Figure 3 A schematic diagram of the structure of the third type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model;

[0029] Figure 4 A schematic diagram of the structure of the fourth type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model;

[0030] Figure 5 A schematic diagram of the structure of the fifth type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model;

[0031] Figure 6 A schematic diagram of the structure of the sixth type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model.

[0032] Explanation of reference numerals in the attached figures:

[0033] A-Polycrystalline silicon reduction furnace electrode;

[0034] B1 - First Cooler;

[0035] B2 - Second Cooler;

[0036] C-Circulation Pump;

[0037] D-Heat transfer medium storage tank;

[0038] E-Heat transfer medium replenishment device;

[0039] F - First thermometer;

[0040] G - Second thermometer;

[0041] H-pipe;

[0042] I-Power Adjustment Cabinet;

[0043] J-filter. Detailed Implementation

[0044] To enable those skilled in the art to better understand the present invention, a further detailed description of the present invention is provided below. The specific embodiments listed below are merely descriptions of the principles and features of the present invention, and the examples are only used to explain the present invention and are not intended to limit its scope. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the protection scope of the present invention.

[0045] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0046] The first aspect of this utility model provides an electrode cooling device for a polycrystalline silicon reduction furnace. Figure 1 This is a schematic diagram of the structure of the first type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model. Figure 1 As shown, the device includes A-polysilicon reduction furnace electrode, I-power control cabinet, B1-first cooler, B2-second cooler, C-circulating pump, H-pipeline, and heat transfer medium;

[0047] Among them, H-pipe is used to fill the heat transfer medium, C-circulation pump is used to drive the heat transfer medium to circulate in H-pipe, B1-first cooler and B2-second cooler are used to cool the heat transfer medium in circulation.

[0048] The heat transfer medium outlet of the A-polycrystalline silicon reduction furnace electrode is connected to the heat transfer medium inlet of the B2-second cooler;

[0049] The C-circulating pump's outlet is connected via pipelines to the B1-first cooler's heat transfer medium inlet and the A-polycrystalline silicon reduction furnace electrode's heat transfer medium inlet.

[0050] The heat transfer medium outlet of B2-second cooler and the heat transfer medium outlet of I-power control cabinet are connected to the material inlet of C-circulating pump via pipelines.

[0051] That is, the A-polysilicon reduction furnace electrode and the I-power control cabinet are connected in parallel. The heat transfer medium after being cooled by the B1-first cooler enters the I-power control cabinet for cooling. The cooling medium heated by the A-polysilicon reduction furnace electrode enters the B2-second cooler for cooling and then merges with the heat transfer medium heated by the I-power control cabinet. After being driven by the C-circulation pump, they enter the B1-first cooler and the A-polysilicon reduction furnace electrode respectively.

[0052] The A-polysilicon reduction furnace electrode is one of the components of the polysilicon reduction furnace. It has a cavity through which a heat-conducting medium can pass, and includes a heat-conducting medium inlet and an outlet. The heat-conducting medium enters the A-polysilicon reduction furnace electrode through the heat-conducting medium inlet, absorbs heat from the electrode, and then exits through the heat-conducting medium outlet, thus completing the cooling of the A-polysilicon reduction furnace electrode.

[0053] The I-power control cabinet is used to adjust the current and voltage parameters of each phase in the polycrystalline silicon reduction furnace. The I-power control cabinet also has a cavity through which the heat transfer medium can pass, and it has a heat transfer medium inlet and an outlet. The heat transfer medium enters the I-power control cabinet through the heat transfer medium inlet, absorbs heat from the I-power control cabinet, and then leaves the I-power control cabinet through the heat transfer medium outlet, thus completing the cooling of the I-power control cabinet.

[0054] B1-First Cooler and B2-Second Cooler are used to cool the high-temperature heat transfer medium, thereby lowering its temperature. The two coolers are located in different positions and have different functions. Specifically, B1-First Cooler first cools the heat transfer medium before it enters I-Power Control Cabinet; B2-Second Cooler receives the heated heat transfer medium from A-Polycrystalline Silicon Reduction Furnace Electrode and cools it.

[0055] This utility model does not limit the specific types of B1-first cooler and B2-second cooler, as long as they can cool the heat transfer medium.

[0056] This invention does not limit the choice of heat-conducting medium; commonly used heat-conducting media in the art can be used. In one embodiment, the heat-conducting medium can be selected from either water or heat-conducting oil.

[0057] In existing technologies, the A-polycrystalline silicon reduction furnace electrode and the I-power control cabinet typically have separate cooling water systems, each consisting of a power control water tank, a cooler, and a circulating pump. These cooling methods suffer from drawbacks such as large footprint and high investment costs. When the power control cabinet and the reduction furnace electrode share the same cooling water system, the power control cabinet often experiences poor cooling performance because it requires significantly more cooling capacity than the reduction furnace electrode.

[0058] The inventors discovered that the cooling systems of the polysilicon reduction furnace electrodes and the power control cabinet can be partially merged, with both sharing a single circulating pump, piping, and heat transfer medium. Coolers are then installed separately for the polysilicon reduction furnace electrodes and the power control cabinet. The cooling requirements of the polysilicon reduction furnace electrodes and the power control cabinet are met by different locations of the coolers (specifically, the power control cabinet has a higher cooling requirement, so the heat transfer medium is cooled first before entering the power control cabinet; the polysilicon reduction furnace electrodes have a lower cooling requirement, so the heat transfer medium enters the polysilicon reduction furnace electrodes first and then cools them). This significantly reduces the footprint and investment of the cooling system while maintaining good cooling performance in the power control cabinet.

[0059] The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model has the characteristics of small footprint, low investment and good cooling effect of power control cabinet.

[0060] Figure 2 This is a schematic diagram of the structure of the first type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model. Figure 2 As shown, the device also includes a D-heat transfer medium storage tank. The material inlet of the D-heat transfer medium storage tank is connected to the heat transfer medium outlet of B2-the second cooler and the heat transfer medium outlet of I-power control cabinet, respectively. The material outlet of the D-heat transfer medium storage tank is connected to the material inlet of C-circulation pump.

[0061] The D-heat-conducting medium storage tank is used to store heat-conducting medium, enabling the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model to have higher cooling efficiency.

[0062] In one embodiment, the heat transfer medium is demineralized water. Demineralized water is clean and does not easily form scale, which is beneficial for long-term equipment operation. When used in the polycrystalline silicon reduction furnace electrode cooling device provided by this invention, demineralized water is only added during the initial operation phase, with no consumption during normal operation, thus enabling the device to have lower operating costs.

[0063] In one embodiment, the operating temperature of the water supply to the polycrystalline silicon reduction furnace electrode cooling device provided by this invention is 30-35°C, and the return water temperature is 40-45°C. Specifically, before heat exchange occurs between the A-polycrystalline silicon reduction furnace electrode and B1-the first cooler, the temperature of the heat-conducting medium is 30-35°C; after heat exchange, the temperature of the heat-conducting medium leaving the A-polycrystalline silicon reduction furnace electrode and I-power control cabinet is 40-45°C. The above operating temperatures can be matched with the operating temperatures of the A-polycrystalline silicon reduction furnace electrode and I-power control cabinet, enabling the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this invention to have higher cooling efficiency while also ensuring the cooling effect of the power control cabinet.

[0064] Figure 3This is a schematic diagram of the structure of the third type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model. Figure 3 As shown, the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model also includes a J-filter. The inlet of the J-filter is connected to the outlet of the D-heat transfer medium storage tank, and the outlet is connected to the inlet of the C-circulation pump. The J-filter can trap solid impurities in the heat transfer medium and prevent the H-pipe from being blocked. This utility model does not limit the specific selection of the J-filter; commonly used J-filters in the art can be selected as needed to trap solid impurities in the heat transfer medium.

[0065] Figure 4 This is a schematic diagram of the structure of the fourth type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model. Figure 4 As shown, the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model also includes an E-heat-conducting medium replenishment device connected to the D-heat-conducting medium storage tank. The E-heat-conducting medium replenishment device is used to replenish the heat-conducting medium to the cooling device. When the heat-conducting medium leaks, the E-heat-conducting medium replenishment device can replenish the heat-conducting medium to the A-polycrystalline silicon reduction furnace electrode and the I-power control cabinet cooling device, thereby ensuring the cooling effect of the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model.

[0066] This invention does not limit the specific equipment selection for the E-heat transfer medium replenishment device, and can be determined according to different heat transfer media. In one embodiment, when the heat transfer medium is demineralized water, the E-heat transfer medium replenishment device is the demineralized water inlet in the plant area.

[0067] Furthermore, in one embodiment, in the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model, the C-circulation pump is a variable frequency pump. The variable frequency pump can adjust the flow rate of the heat transfer medium entering the A-polycrystalline silicon reduction furnace electrode for heat exchange by changing the flow rate of the heat transfer medium, thereby enhancing the adjustment capability of the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device. The flow rate of the heat transfer medium can be adjusted according to the actual production load, making the energy-saving and consumption-reducing advantages of the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model even more prominent.

[0068] Figure 5 This is a schematic diagram of the structure of the fifth type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model. Figure 5 As shown, in the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model, A-polycrystalline silicon reduction furnace electrode heat conduction medium outlet is provided with F-first thermometer;

[0069] The cooling device for the electrodes and power control cabinet of the polycrystalline silicon reduction furnace also includes a controller;

[0070] The variable frequency pump and the F-first thermometer are electrically connected to the controller.

[0071] F-The first thermometer is used to detect the temperature T1 of the heat transfer medium leaving the A-polycrystalline silicon reduction furnace electrode. When T1 is detected to be higher than a preset value, the controller controls the variable frequency pump to increase the flow rate, allowing a larger flow of heat transfer medium to enter the A-polycrystalline silicon reduction furnace electrode, increasing the circulation speed of the heat transfer medium and improving the heat dissipation capacity of the A-polycrystalline silicon reduction furnace electrode cooling device. This invention does not limit the preset value of T1; in one embodiment, the preset value of T1 is 50°C.

[0072] Figure 6 This is a schematic diagram of the structure of the sixth type of polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model. Figure 6 As shown, the heat transfer medium outlet of the I-power control cabinet is equipped with a G-second thermometer;

[0073] G - The second thermometer is electrically connected to the controller.

[0074] F-The first thermometer is used to detect the temperature T2 of the heat transfer medium leaving the I-power control cabinet. When T2 is detected to be higher than the preset value, the controller controls the variable frequency pump to increase the flow rate, allowing a larger flow of heat transfer medium to enter the I-power control cabinet, thereby increasing the circulation speed of the heat transfer medium. This invention does not limit the preset value of T2; in one embodiment, the preset value of T2 is 50°C.

[0075] Furthermore, in one embodiment, when T1 or T2 is detected to be higher than a preset value, the controller can control the variable frequency pump to increase the flow rate, allowing a larger flow rate of heat transfer medium to enter the A-polysilicon reduction furnace electrode and the I-power control cabinet, increasing the circulation speed of the heat transfer medium and improving the heat dissipation capacity of the cooling devices of the polysilicon reduction furnace electrode and the power control cabinet.

[0076] The second aspect of this invention provides a polysilicon production system, which includes the polysilicon reduction furnace electrodes and power control cabinet cooling device provided in the first aspect of this invention. The polysilicon production system provided by this invention has the advantages of small footprint and low investment.

[0077] The following examples further illustrate the polycrystalline silicon reduction furnace electrode and power control cabinet cooling device provided by this utility model.

[0078] Example 1

[0079] This embodiment uses Figure 6 The polycrystalline silicon reduction furnace electrodes and the power-adjusting cooling device shown are used to cool the electrodes. For example... Figure 6 As shown, the polysilicon reduction furnace electrode and power-adjusting cooling device includes A-polysilicon reduction furnace electrode, I-power-adjusting cabinet, B1-first cooler, B2-second cooler, C-circulating pump, H-pipeline, and heat transfer medium;

[0080] Among them, H-pipe is used to fill the heat transfer medium, C-circulation pump is used to drive the heat transfer medium to circulate in H-pipe, B1-first cooler and B2-second cooler are used to cool the heat transfer medium in circulation; the material outlet of C-circulation pump is connected to the heat transfer medium inlet of A-polycrystalline silicon reduction furnace electrode and the heat transfer medium inlet of B1-first cooler through H-pipe respectively; the heat transfer medium outlet of A-polycrystalline silicon reduction furnace electrode is connected to the material inlet of C-circulation pump through B2-second cooler, and the heat transfer medium outlet of I-power control cabinet is connected to the material inlet of C-circulation pump.

[0081] In addition, the device also includes a D-heat transfer medium storage tank, the material inlet of which is connected to the heat transfer medium outlet of the B-cooler, and the material outlet of the D-heat transfer medium storage tank is connected to the material inlet of the C-circulation pump.

[0082] In addition, the device also includes an E-heat transfer medium replenishment device, the logistics outlet of which is connected to the logistics inlet of the D-heat transfer medium storage tank.

[0083] In addition, the device also includes a J-filter, the inlet of which is connected to the outlet of the D-heat transfer medium storage tank, and the outlet of the J-filter is connected to the inlet of the C-circulation pump.

[0084] A - The outlet of the electrode heat transfer medium of the polycrystalline silicon reduction furnace is equipped with F - the first thermometer; I - The outlet of the heat transfer medium of the power control cabinet is equipped with G - the second thermometer. The heat transfer medium is demineralized water; D - The heat transfer medium storage tank is connected to the demineralized water interface of the plant area. In addition, there is a controller (not shown).

[0085] During operation, the variable frequency pump drives the demineralized water to flow in the H-pipe. After the C-circulation pump, the water flows in two paths. One path enters B1-the first cooler, where the cooled heat transfer medium enters the I-power control cabinet for cooling. The other path enters the A-polycrystalline silicon reduction furnace electrode, where it is heated. The cooling medium heated by the A-polycrystalline silicon reduction furnace electrode enters B2-the second cooler for further cooling, then merges with the heat transfer medium heated by the I-power control cabinet. Driven by the C-circulation pump, the medium then re-enters the B1-first cooler and the A-polycrystalline silicon reduction furnace electrode, completing the circulation and cooling of both the A-polycrystalline silicon reduction furnace electrode and the I-power control cabinet.

[0086] Meanwhile, when the F-first thermometer detects a temperature higher than 50℃, or the G-second thermometer detects a temperature higher than 50℃, the controller controls the frequency converter pump to increase the flow rate of the demineralized water, so that the demineralized water can better cool the A-polycrystalline silicon reduction furnace electrode.

[0087] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0088] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0089] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the technical solutions of the embodiments of this utility model.

Claims

1. A cooling device for electrodes and a power control cabinet in a polycrystalline silicon reduction furnace, characterized in that, Includes power control cabinet, polysilicon reduction furnace electrodes, first cooler, second cooler, circulating pump, pipelines, and heat transfer medium; The pipe is used to fill the heat-conducting medium, the circulating pump is used to drive the heat-conducting medium to circulate in the pipe, and the first cooler and the second cooler are used to cool the heat-conducting medium in the circulation. The heat transfer medium outlet of the first cooler is connected to the heat transfer medium inlet of the power control cabinet; The heat transfer medium outlet of the polycrystalline silicon reduction furnace electrode is connected to the heat transfer medium inlet of the second cooler; The logistics outlet of the circulating pump is connected to the heat transfer medium inlet of the first cooler and the heat transfer medium inlet of the polycrystalline silicon reduction furnace electrode via pipelines. The heat transfer medium outlet of the second cooler and the heat transfer medium outlet of the power control cabinet are respectively connected to the material inlet of the circulating pump through pipelines.

2. The apparatus according to claim 1, characterized in that, It also includes a heat transfer medium storage tank, the inlet of which is connected to the heat transfer medium outlet of the second cooler and the heat transfer medium outlet of the power control cabinet, and the outlet of which is connected to the inlet of the circulating pump.

3. The apparatus according to claim 2, characterized in that, The heat-conducting medium is demineralized water.

4. The apparatus according to claim 3, characterized in that, The temperature of the heat-conducting medium is 30-35℃ for the water entering the system and 40-45℃ for the water returning to the system.

5. The apparatus according to claim 4, characterized in that, It also includes a filter, the inlet of which is connected to the outlet of the heat transfer medium storage tank, and the outlet of which is connected to the inlet of the circulation pump.

6. The apparatus according to claim 5, characterized in that, It also includes a heat transfer medium replenishment device, the logistics outlet of which is connected to the logistics inlet of the heat transfer medium storage tank.

7. The apparatus according to claim 6, characterized in that, The circulating pump is a variable frequency pump.

8. The apparatus according to claim 7, characterized in that, The heat transfer medium outlet of the polycrystalline silicon reduction furnace electrode is equipped with a first thermometer; The polysilicon reduction furnace electrode and power control cabinet cooling device also includes a controller; The variable frequency pump and the first thermometer are respectively electrically connected to the controller.

9. The apparatus according to claim 8, characterized in that, The heat transfer medium outlet of the power control cabinet is equipped with a second thermometer; The second thermometer is electrically connected to the controller.

10. A polycrystalline silicon production system, characterized in that, The polycrystalline silicon reduction furnace electrode and power control cabinet cooling device are included in any one of claims 1-9.

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