Vapor chamber capable of guiding medium to circulate and flow back
By introducing a stepped top edge and copper powder capillary ring design into the heat spreader, the problem of inconsistent medium circulation and return was solved, achieving more efficient medium circulation and heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2026-03-24
AI Technical Summary
Existing heat spreaders have inconsistent medium circulation and recirculation directions and lack effective structural design to accelerate the circulation and recirculation rate, thus affecting heat dissipation efficiency.
The system employs a combination structure consisting of a lower cover plate, a lower capillary layer, a copper powder capillary ring, an upper capillary layer, and an upper cover plate. Through the design of the stepped top edge and the copper powder capillary ring, the gas medium is guided to diffuse into the condensation zone and flow back to the heat source zone under the action of gravity, ensuring a unified medium circulation path.
It improves the medium circulation return rate, enhances the heat dissipation efficiency of the heat spreader, effectively guides medium circulation within a limited space, and improves the heat dissipation effect.
Smart Images
Figure CN224034453U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of the uniform temperature plate, especially a uniform temperature plate that can guide medium circulation backflow. BACKGROUND
[0002] The uniform temperature plate, also called heat conduction plate or super heat conduction plate, has a working principle similar to that of heat conduction pipe, and based on phase change heat transfer principle, through evaporation and condensation circulation of internal medium, quickly transfers heat from heat source to the whole heat dissipation surface to realize uniform temperature distribution, and the equivalent heat conduction coefficient is far higher than that of traditional metal heat dissipation fin, so the heat dissipation efficiency is extremely high.
[0003] The uniform temperature plate generally comprises a shell, a liquid absorbing core, a medium and a supporting structure, the shell is often composed of upper and lower cover plates to form a sealed cavity, and the liquid absorbing core, the medium and the supporting structure are accommodated in the cavity, the liquid medium boils and evaporates into gas medium at the evaporation end near the heat source or the heat source area, the gas medium condenses and releases heat at the position far away from the heat source area, the liquid absorbing core drives the condensed liquid medium to flow back to the heat source area through capillary action to maintain circulation, and the supporting structure can support the cavity to prevent the cavity from collapsing.
[0004] In actual use of the uniform temperature plate, the gas medium formed by evaporation of the heat source area after being heated diffuses to the surrounding, and the condensation of the gas medium into liquid at the upper cover plate lacks the guidance of the liquid absorbing core, so that the circulation backflow direction is not uniform, and the prior art lacks a scheme for improving the structure of the uniform temperature plate to reasonably guide the medium circulation backflow, so as to speed up the circulation backflow rate and improve the heat dissipation efficiency of the uniform temperature plate. UTILITY MODEL CONTENTS
[0005] Therefore, the utility model aims to provide a uniform temperature plate that can guide medium circulation backflow to solve the above problems.
[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme:
[0007] The utility model provides a uniform temperature plate that can guide medium circulation backflow, which comprises a lower cover plate, a lower capillary structure layer, a copper powder capillary ring, an upper capillary structure layer and an upper cover plate.
[0008] The lower cover plate is concave to form a cavity, the cavity comprises a heat source area and a condensation area surrounding the heat source area, and a plurality of support copper columns are arranged on the cavity; the lower capillary structure layer is provided with through holes corresponding to the support copper columns, the lower capillary structure layer covers the cavity through the support copper columns, a plurality of copper powder capillary rings are sleeved outside the corresponding support copper columns and are stacked on the lower capillary structure layer; the upper capillary structure layer is provided with an opening avoiding the heat source area, and the upper capillary structure layer covers the plurality of copper powder capillary rings above the condensation area, so that the plurality of copper powder capillary rings are clamped between the lower capillary structure layer and the upper capillary structure layer, and the upper capillary structure layer is also provided with through holes corresponding to the support copper columns on the condensation area; the upper cover plate covers the upper capillary structure layer and is connected with the lower cover plate, so as to seal the cavity, and the bottom surface of the upper cover plate abuts against the top surface of each support copper column. Wherein, above the corresponding heat source area, the bottom of the upper cover plate is provided with a stepped top edge extending towards the edge, so that the thickness of the upper cover plate gradually decreases in the direction towards the edge.
[0009] Preferably, the copper powder capillary rings corresponding to the edges of the condensation area are connected to form a strip structure.
[0010] Preferably, the opening edge of the upper capillary structure layer extends along the copper powder capillary ring at the outermost periphery of the condensation area.
[0011] Preferably, the heat source area is in a rectangular shape, and the plurality of copper powder capillary rings are arranged in an array on the cavity, and the spacing between the adjacent copper powder capillary rings in the condensation area is smaller than the spacing between the adjacent copper powder capillary rings in the heat source area.
[0012] Preferably, the stepped top edge comprises a continuously arranged transversely extending section and an inclined section, and the transversely extending section is parallel to the lower cover plate and abuts against the top surface of the support copper column.
[0013] Preferably, the height of the support copper column in the heat source area is three quarters of the height of the support copper column at the edge of the condensation area.
[0014] Preferably, the edge of the cavity extends inward to form a clamping tongue for clamping the lower capillary structure layer, and the edge of the upper cover plate also extends inward to form a clamping tongue for clamping the upper capillary structure layer.
[0015] The technical effects achieved by the technical scheme of the utility model mainly include:
[0016] The shape structure of the stepped top edge extending towards the edge guides the gaseous medium to rapidly diffuse to the condensation area away from the heat source area, and the liquid medium condensed on the stepped top edge can be gathered and fall back to the central heat source area under the action of inclined flow, and can be rapidly absorbed by the copper powder capillary ring at the heat source area and guided to the lower capillary structure layer and the lower cover plate below;
[0017] And by setting the copper powder capillary ring at the condensation area abutting the upper capillary structure layer at the bottom of the upper cover plate, the liquid medium condensed on the upper cover plate can sequentially flow back to the lower capillary structure layer of the heat source area through the upper capillary structure layer, the copper powder capillary ring of the condensation area and the lower capillary structure layer of the condensation area, and the upper capillary structure layer is provided with an opening avoiding the heat source area, so that the liquid medium absorbed by the upper capillary structure layer can be prevented from flowing reversely in a stepped top along, and the flow back path is prevented from being guided in disorder.
[0018] The liquid medium directly condensed on the lower capillary structure layer of the condensation area can naturally flow back to the lower capillary structure layer of the heat source area, the liquid medium is not easy to flow reversely along the copper powder capillary ring against gravity, and the unity of the flow back path is maintained.
[0019] Based on the reasonable design of the above-mentioned uniform temperature plate structure, the limited space inside the uniform temperature plate is fully utilized to guide the circulation and flow back of the medium, the flow back rate is accelerated, and the heat dissipation efficiency of the uniform temperature plate is improved. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 An explosion diagram of the uniform temperature plate capable of guiding circulation and flow back of medium is provided in the utility model.
[0021] Figure 2 A structural schematic diagram of the uniform temperature plate is provided.
[0022] Figure 3 A partial enlarged view corresponding to the circular dashed line frame area A in Figure 1
[0023] The various reference signs in the above-mentioned drawings are as follows:
[0024] Lower cover plate 1, cavity 10, heat source area 101, condensation area 102, support copper column 11, clamping tongue 12.
[0025] Lower capillary structure layer 2.
[0026] Copper powder capillary ring 3.
[0027] Upper capillary structure layer 4.
[0028] Upper cover plate 5, stepped top along 51, transversely extending section 511, inclined section 512. DETAILED DESCRIPTION
[0029] In order to make the purpose, technical scheme and advantages of the utility model more clear, the specific implementation manners of the utility model are described in detail below with reference to the drawings. The examples of these preferred implementation manners are illustrated in the drawings. The implementation manners of the utility model shown in the drawings and described according to the drawings are merely exemplary, and the utility model is not limited to these implementation manners.
[0030] In order to avoid unnecessary details from obscuring the present application, only structures and / or processing steps closely related to the scheme according to the present application are shown in the drawings, and other details not closely related are omitted. Among them Figure 1 The rectangular dashed line in the figure represents the area boundary divided by the heat source area 101, Figure 2 The wavy line represents the omission of part of the length extension structure, so as to more clearly show other key structures.
[0031] As shown in Figures 1 to 3 The utility model discloses a heat spreader capable of guiding medium circulation backflow, which comprises a lower cover plate 1, a lower capillary structure layer 2, copper powder capillary rings 3, an upper capillary structure layer 4 and an upper cover plate 5.
[0032] The lower cover plate 1 is recessed to form a cavity 10, the cavity 10 comprises a heat source area 101 and a condensation area 102 surrounding the periphery of the heat source area 101, and a plurality of support copper columns 11 are arranged on the cavity 10;
[0033] The lower capillary structure layer 2 is provided with through holes corresponding to the support copper columns 11, and the lower capillary structure layer 2 covers the cavity 10 through the support copper columns 11,
[0034] The copper powder capillary rings 3 are sleeved outside the corresponding support copper columns 11 and are stacked on the lower capillary structure layer 2;
[0035] The upper capillary structure layer 4 is provided with openings avoiding the heat source area 101, and the upper capillary structure layer 4 covers the copper powder capillary rings 3 above the condensation area 102, so that the copper powder capillary rings 3 are clamped between the lower capillary structure layer 2 and the upper capillary structure layer 4, and the upper capillary structure layer 4 is also provided with through holes avoiding the support copper columns 11 on the corresponding condensation area 102;
[0036] The upper cover plate 5 covers the upper capillary structure layer 4 and is connected with the lower cover plate 1, so as to close the cavity 10, and the bottom surface of the upper cover plate 5 abuts against the top surface of each support copper column 11;
[0037] Among them, the bottom of the upper cover plate 5 is provided with a stepped top edge 51 extending towards the edge above the corresponding heat source area 101, so that the thickness of the upper cover plate 5 gradually decreases in the direction towards the edge.
[0038] The uniform temperature plate capable of guiding the circulation and return of the medium in application, the liquid medium evaporates into gas medium in the heat source area 101, the gas medium first rises to the stepped top edge 31, and the stepped top edge 31 is extended towards the edge, which guides the gas medium to quickly diffuse away from the heat source area 101, and the liquid medium condensed on the stepped top edge 31 can be gathered and falls back to the center heat source area 101 under the action of inclined flow, and can be quickly absorbed by the copper powder capillary ring 3 at the heat source area 101 and guided to the lower capillary structure layer 2 and the lower cover plate 1 below.
[0039] Then a large amount of gas medium is generally concentrated at the far end of the condensation area 102 away from the heat source area to release heat, and the liquid medium condensed on the upper cover plate 5 can also sequentially pass through the upper capillary structure layer 4, the copper powder capillary ring 3 of the condensation area 102 and the lower capillary structure layer 2 of the condensation area to return to the lower capillary structure layer 2 of the heat source area 101, because the upper capillary structure layer 4 is provided with an opening avoiding the heat source area 101, the liquid medium absorbed by the upper capillary structure layer 4 can avoid flowing reversely to the stepped top edge 31, preventing the flow path from being guided in disorder and affecting the return rate;
[0040] And the gas medium directly condensed into liquid medium on the lower capillary structure layer 2 of the condensation area 102 can naturally return to the lower capillary structure layer 2 of the heat source area 101, and the liquid medium is also not easy to flow reversely along the copper powder capillary ring 3 under the action of gravity.
[0041] In summary, based on the structure of the uniform temperature plate, the circulation and return of the medium can be more smoothly guided, the return rate can be improved, and the heat dissipation efficiency of the uniform temperature plate can be improved.
[0042] Because a large amount of gas medium is generally concentrated at the far end of the condensation area 102 away from the heat source area to release heat, the capillary structure on the edge of the condensation area 102 can be appropriately more concentrated, and in the embodiment, the copper powder capillary rings 3 corresponding to the edge of the condensation area 102 are connected into a strip structure, covering more area.
[0043] Similarly, the opening edge of the upper capillary structure layer 4 extends along the copper powder capillary ring 3 at the outermost periphery of the condensation area 102.
[0044] In the embodiment, further, the heat source area 101 is rectangular, and a plurality of copper powder capillary rings 3 are arranged in an array on the cavity 10, and the spacing between adjacent copper powder capillary rings 3 located in the condensation area 102 is smaller than the spacing between adjacent copper powder capillary rings 3 located in the heat source area 101, that is, the copper powder capillary rings 3 at the condensation area 102 have a more dense arrangement, a larger number, and can absorb more liquid medium.
[0045] Specifically, the stepped top edge 51 comprises continuously arranged transversely extending segments 511 and inclined segments 512, the transversely extending segments 511 are in abutment with the top surface of the support copper pillars 11 parallel to the lower cover plate 1. The transversely extending segments 511 serve as contact points of the support copper pillars 11, and the inclined segments 512 serve to guide the circulating flow.
[0046] The height of the support copper pillars 11 is affected by the thickness of the upper cover plate 5 above it, and the size of the stepped top edge 51 needs to be selected and set according to the application requirements. Exemplarily, the height of the support copper pillars 11 in the heat source area 101 is three-fourths of the height of the support copper pillars 11 at the edge of the condensation area 102.
[0047] The plurality of copper powder capillary rings 3 are clamped between the lower capillary structure layer 2 and the upper capillary structure layer 4, so the plurality of copper powder capillary rings 3 themselves can serve to press the upper capillary structure layer 4 tightly against the bottom of the upper cover plate 5 and press the lower capillary structure layer 2 tightly against the lower cover plate 1, so that the liquid medium condensed on the upper cover plate 5 and the lower cover plate 1 can be timely and fully absorbed. Further, in order to facilitate positioning and installing the upper capillary structure layer 4 and the lower capillary structure layer 2 during manufacturing, the edge of the cavity 10 extends inward to form a clamping tongue 12 for clamping the lower capillary structure layer 2, and the edge of the upper cover plate 5 also extends inward to form a clamping tongue 12 for clamping the upper capillary structure layer 4.
[0048] It should be noted that the relational terms herein such as first and second and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by an "including a" statement does not exclude the existence of additional identical elements in the process, method, article, or apparatus that includes the element.
[0049] The above description is merely a specific implementation of the present application, and it should be noted that those skilled in the art can make a number of improvements and refinements without departing from the principles of the present application, and these improvements and refinements should also be considered within the scope of the present application.
Claims
1. A vapor chamber capable of guiding circulation of a medium backflow, characterized by, It comprises: a lower cover plate (1) having a cavity (10) formed by concave recessing inside, the cavity (10) comprising a heat source area (101) and a condensation area (102) surrounding the heat source area (101), and a plurality of support copper columns (11) arranged on the cavity (10); a lower capillary structure layer (2) having a plurality of through holes corresponding to the support copper columns (11), the lower capillary structure layer (2) covering the cavity (10) through the support copper columns (11); a plurality of copper powder capillary rings (3) arranged on the lower capillary structure layer (2) and surrounding the support copper columns (11); an upper capillary structure layer (4) having a plurality of openings corresponding to the heat source area (101), the upper capillary structure layer (4) covering the copper powder capillary rings (3) above the condensation area (102) and clamping the copper powder capillary rings (3) between the lower capillary structure layer (2) and the upper capillary structure layer (4), the upper capillary structure layer (4) also having a plurality of through holes corresponding to the support copper columns (11) on the condensation area (102); an upper cover plate (5) covering the upper capillary structure layer (4) and abutting with the lower cover plate (1) to seal the cavity (10), the bottom surface of the upper cover plate (5) abutting with the top surface of the support copper columns (11). The bottom of the upper cover plate (5) above the heat source area (101) is provided with a stepped top edge (51) extending towards the edge, so that the thickness of the upper cover plate (5) gradually decreases towards the edge.
2. The vapor chamber according to claim 1, wherein The copper powder capillary rings (3) located on the edge of the condensation area (102) are connected to form a strip structure.
3. The vapor chamber according to claim 1, wherein The opening edge of the upper capillary structure layer (4) extends along the outermost copper powder capillary ring (3) of the condensation area (102).
4. The vapor chamber of claim 1, wherein, The heat source area (101) is rectangular, and the copper powder capillary rings (3) are arranged in an array on the cavity (10), the distance between the adjacent copper powder capillary rings (3) located in the condensation area (102) being smaller than the distance between the adjacent copper powder capillary rings (3) located in the heat source area (101).
5. The vapor chamber of claim 1, wherein, The stepped top edge (51) comprises a continuously arranged transversely extending section (511) and an inclined section (512), the transversely extending section being parallel to the lower cover plate (1) and abutting with the top surface of the support copper columns (11).
6. The vapor chamber of claim 1, wherein, The height of the support copper column (11) located in the heat source area (101) is three-fourths of the height of the support copper column (11) located at the edge of the condensation area (102).
7. The vapor chamber of claim 1, wherein, The edge of the cavity (10) extends inwardly to form a clamping tongue (12) for clamping the lower capillary structure layer (2), and the edge of the upper cover plate (5) also extends inwardly to form a clamping tongue (12) for clamping the upper capillary structure layer (4).