Semiconductor thickness detection device

Abstract

The utility model discloses a semiconductor thickness detection device, which belongs to the technical field of thickness detection devices and comprises a mounting frame, a fixing groove is arranged at the top of the mounting frame, a translation mechanism is arranged on the inner side of the fixing groove, a base is fixedly connected to the bottom of the mounting frame, and a sliding table is arranged at the top of the translation mechanism. A rotating mechanism is arranged at the top of the sliding table, a connecting mechanism is arranged on the outer side of the mounting frame, and a detector body is arranged on the side, away from the mounting frame, of the side face of the connecting mechanism. After a certain semiconductor is measured by the detector main body, the turntable rotates, a next to-be-detected article is automatically placed below the detector, the semiconductor is clamped by the electric push rod, and the turntable is matched to automatically change materials, so that semiconductors of any size can be clamped, a plurality of semiconductors can be measured at one time, and the efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the thickness detection device technical field, concretely relates to a semiconductor thickness detection device. BACKGROUND

[0002] Semiconductor wafer, also known as chip or integrated circuit, is a kind of micro electronic device based on semiconductor material manufacturing, which is built on a thin and flat silicon substrate, and integrates thousands of electronic components such as transistors, resistors and capacitors, etc., and the design and manufacture of semiconductor wafer adopts advanced microelectronic technology, which can realize complex circuit function in very small space.

[0003] Chinese patent application No. CN202322788141.1 discloses a semiconductor wafer thickness detection device, relating to the thickness detection device technical field. The utility model discloses a mounting bracket, the top fixed mounting of mounting bracket has detection instrument body, the top of mounting bracket is provided with placing plate, still includes lifting mechanism, the lifting mechanism is used for connecting the placing plate with the mounting bracket and controls the height of placing plate, the surface of placing plate is equipped with placing groove, the inner wall of placing groove is equipped with annular groove. The utility model discloses, when using, the height of placing plate is controlled by the user through lifting mechanism, and the wafer is placed in the inner wall of annular groove, and the thickness of wafer is detected through detection instrument body, and after detection, the wafer can be directly taken out by stretching hand into placing groove and pinching wafer, so the problem that traditional wafer is difficult to take because it is thin is solved, and the practicability of the device is embodied.

[0004] 1. The above-mentioned disclosed patent cannot clamp the semiconductor, and the placing groove cannot adjust the tightness, which can cause different placing effects of different sizes of semiconductor, and only one can be measured at a time, which also causes low efficiency; 2. The above-mentioned disclosed patent can only measure a certain fixed position of single semiconductor, cannot change the measurement position and measure multiple times, and the result is full of randomness. UTILITY MODEL CONTENTS

[0005] To solve the problems in the above background art, the utility model provides a semiconductor thickness detection device, which has the characteristics of good clamping effect, simultaneous measurement of multiple and change of measurement position.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a semiconductor thickness detection device, comprising a mounting bracket, a fixing groove is formed in the top of the mounting bracket, a translation mechanism is arranged on the inner side of the fixing groove, a base is fixedly connected to the bottom of the mounting bracket, a sliding table is arranged on the top of the translation mechanism, a rotating mechanism is arranged on the top of the sliding table, a connecting mechanism is arranged on the outer side of the mounting bracket, and a detection instrument body is arranged on the side of the connecting mechanism away from the mounting bracket.

[0007] Preferably, the rotating mechanism comprises a motor, a rotating disc, a support frame and a clamping mechanism, wherein the bottom of the motor is fixedly connected with the sliding table, the rotating shaft of the motor is fixedly connected with the rotating disc, the bottom of the rotating disc is rotatably connected with the support frame, the bottom of the support frame is fixedly connected with the sliding table, and the top of the rotating disc is provided with a plurality of clamping mechanisms.

[0008] Preferably, the clamping mechanism comprises a mounting plate, an electric push rod, a push plate and a supporting plate, wherein the bottom of the mounting plate is fixedly connected with the rotating disc, the side surface of the upper end of the mounting plate is provided with the electric push rod, one side of the electric push rod is fixedly connected with the push plate, and the side surface of the lower end of the push plate is fixedly connected with the supporting plate.

[0009] Preferably, the push plate is fixedly connected with an antiskid pad on the side away from the electric push rod.

[0010] Preferably, the translating mechanism comprises two motors, a lead screw, a sliding rod, a moving frame, three motors and two lead screws, wherein the rotating shaft of the two motors is provided with the lead screw, the outer side of the lead screw is provided with the moving frame, the side of the moving frame away from the lead screw is provided with the sliding rod, the outer side of the upper end of the moving frame is fixedly connected with the three motors, and the rotating shaft of the three motors is provided with the two lead screws.

[0011] Preferably, the top of the moving frame is provided with a sliding groove, and the sliding table is provided with two pulleys on the two sides close to the sliding groove.

[0012] Compared with the prior art, the utility model has the advantages that:

[0013] 1、The utility model discloses a rotating mechanism, a motor drives the rotating disc to rotate around the support frame, the support frame keeps the rotating disc stable, the electric push rod pushes the push plate and the antiskid pad to clamp the semiconductor, after the detection instrument main part measures a certain semiconductor, the rotating disc rotates, and the next article to be detected is placed under the detection instrument automatically, the semiconductor is clamped through the electric push rod, and the rotating disc is automatically changed with material, can clamp the semiconductor of arbitrary size and measure multiple at a time, and the efficiency is improved greatly.

[0014] 2、The utility model discloses a translating mechanism, two motors drive the rotation of a lead screw, so that the moving frame translates along the sliding rod, three motors drive the rotation of two lead screws, make the horizontal movement of the sliding table, the pulley slides in the sliding groove and can reduce the friction and keep stable, the sliding table is driven to move in the horizontal through the lead screw transmission, can change the relative position of the semiconductor on the rotating disc and the detection instrument, thereby measuring the thickness of multiple positions, and taking the last average value, so that the result is more rigorous. DRAWINGS

[0015] Figure 1 It is the structural schematic diagram of the utility model;

[0016] Figure 2It is the structure schematic view of the utility model from the front view;

[0017] Figure 3 It is the structure schematic view of the rotating mechanism of the utility model;

[0018] Figure 4 It is the structure schematic view of the utility model Figure 3 It is the structure schematic view of the utility model from the enlarged view of A place in the middle;

[0019] Figure 5 It is the structure schematic view of the utility model from the enlarged view of B place in the middle;

[0020] Figure 6 It is the structure schematic view of the utility model from the enlarged view of B place in the middle; Figure 5

[0021] In the drawing: 1, mounting frame; 2, fixed groove; 3, rotating mechanism; 31, motor; 32, turntable; 33, support frame; 34, clamping mechanism; 341, mounting plate; 342, electric push rod; 343, push plate; 344, supporting plate; 35, non-slip pad; 4, base; 5, sliding table; 6, translation mechanism; 61, two motors; 62, lead screw; 63, sliding rod; 64, moving frame; 65, three motors; 66, two lead screws; 7, connecting mechanism; 8, detector main body; 9, pulley; 10, sliding groove. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0023] Embodiment 1

[0024] Please refer to Figures 1-6 The utility model provides the following technical scheme: a semiconductor thickness detection device, including mounting frame 1, the top of mounting frame 1 is opened with fixed groove 2, the inside of fixed groove 2 is provided with translation mechanism 6, the bottom of mounting frame 1 is fixedly connected with base 4, the top of translation mechanism 6 is provided with sliding table 5, the top of sliding table 5 is provided with rotating mechanism 3, the outside of mounting frame 1 is provided with connecting mechanism 7, the side of connecting mechanism 7 away from the side of mounting frame 1 is provided with detector main body 8.

[0025] ​Specifically, the rotating mechanism 3 comprises a motor 31, a rotating disc 32, a support frame 33 and a clamping mechanism 34, wherein the bottom of the motor 31 is fixedly connected with the sliding table 5, the rotating shaft of the motor 31 is fixedly connected with the rotating disc 32, the bottom of the rotating disc 32 is rotatably connected with the support frame 33, the bottom of the support frame 33 is fixedly connected with the sliding table 5, and the top of the rotating disc 32 is provided with a plurality of clamping mechanisms 34.

[0026] By adopting the above technical scheme, the motor 31 drives the rotating disc 32 to rotate around the support frame 33, the support frame 33 keeps the rotating disc 32 stable, and the clamping mechanism 34 clamps the semiconductor material on the inner side.

[0027] Specifically, the clamping mechanism 34 comprises a mounting plate 341, an electric push rod 342, a push plate 343 and a supporting plate 344, wherein the bottom of the mounting plate 341 is fixedly connected with the rotating disc 32, the side surface upper end of the mounting plate 341 is provided with the electric push rod 342, one side of the electric push rod 342 is fixedly connected with the push plate 343, and the side surface lower end of the push plate 343 is fixedly connected with the supporting plate 344.

[0028] By adopting the above technical scheme, the semiconductor material is placed on the supporting plate 344, the electric push rod 342 pushes the push plate 343 to clamp the semiconductor material, and the clamping effect is achieved.

[0029] Specifically, the push plate 343 is fixedly connected with the anti-skid pad 35 on the side away from the electric push rod 342.

[0030] By adopting the above technical scheme, when the semiconductor is clamped, the anti-skid pad 35 prevents the semiconductor from being deviated laterally and plays a role of buffering and shock absorption.

[0031] When the embodiment is used, the motor 31, the electric push rod 342 and the detector main body 8 are connected with the external power supply, the mounting frame 1 is fixed on the ground through the base 4, the detector main body 8 is fixedly connected with the mounting frame 1 through the connecting mechanism 7, the sliding table 5 and the rotating disc 32 are sent to the detection position by the translation mechanism 6, the semiconductor material is placed on the supporting plate 344, the electric push rod 342 is started to push the push plate 343 and the anti-skid pad 35 to clamp the semiconductor material, the clamping effect is achieved, the motor 31 drives the rotating disc 32 to rotate around the support frame 33, the semiconductor material on the supporting plate 344 is sent to the detection position, the detector main body 8 is started to detect the thickness of the semiconductor material, after the detection is completed, the next material to be detected is sent to the detection position by starting the motor 31 again, as many materials as needed to be detected can be placed on the supporting plate 344, the step of manual material replacement is saved, the semiconductor is clamped by the electric push rod 342, and the automatic material replacement is realized by the rotating disc 32, so that the semiconductor of any size can be clamped and multiple semiconductors can be measured at a time, and the efficiency is greatly improved.

[0032] Embodiment 2

[0033] The embodiment differs from embodiment 1 in that the translation mechanism 6 comprises two motors 61, a lead screw 62, a sliding rod 63, a moving frame 64, three motors 65 and two lead screws 66, wherein the rotating shaft of the two motors 61 is provided with the lead screw 62, the outer side of the lead screw 62 is provided with the moving frame 64, the side of the moving frame 64 away from the lead screw 62 is provided with the sliding rod 63, the outer side of the moving frame 64 is fixedly connected with the three motors 65 at the upper end, and the rotating shaft of the three motors 65 is provided with the two lead screws 66.

[0034] By adopting the above technical scheme, the two motors 61 drive the lead screw 62 to rotate, so that the moving frame 64 translates along the sliding rod 63, the three motors 65 drive the two lead screws 66 to rotate, so that the sliding table 5 moves horizontally, and finally the position of the semiconductor material on the rotating disc 32 changes.

[0035] Specifically, the top of the moving frame 64 is provided with a sliding groove 10, and the bottom of the sliding table 5 is provided with a pulley 9 on both sides close to the sliding groove 10.

[0036] By adopting the above technical scheme, the sliding of the pulley 9 in the sliding groove 10 can reduce the friction between the sliding table 5 and the moving frame 64 and keep the movement stable.

[0037] In use, the two motors 61 and the three motors 65 are connected with an external power supply, the two motors 61 drive the lead screw 62 to rotate, so that the moving frame 64 translates along the sliding rod 63, the three motors 65 drive the two lead screws 66 to rotate, so that the sliding table 5 moves horizontally, and finally the position of the semiconductor material on the rotating disc 32 changes, when the sliding table 5 slides on the moving frame 64, the sliding of the pulley 9 in the sliding groove 10 can reduce the friction between the sliding table 5 and the moving frame 64 and keep the movement stable, the sliding table 5 is driven to move horizontally through the lead screw transmission, the relative position of the semiconductor and the detector on the rotating disc 32 can be changed, so that the thickness of multiple positions can be measured, and the last average value is taken, so that the result is more rigorous.

[0038] The structure and use principle of the mounting frame 1, the base 4, the connecting mechanism 7 and the detector main body 8 in the semiconductor wafer thickness detection device have been disclosed in Chinese Patent Application No. CN202322788141.1.

[0039] The utility model discloses a working principle and use flow: the utility model discloses when using, one motor 31, electric push rod 342 and detector main body 8 are connected with outside power supply, and the mounting bracket 1 is fixed on the ground through the base 4, and the detector main body 8 is fixedly connected with the mounting bracket 1 through the connecting mechanism 7, and the translation mechanism 6 sends the slide table 5 and carousel 32 to the position to be detected, and the semiconductor material is placed on the supporting plate 344, and the electric push rod 342 is started, and the push plate 343 and the antiskid pad 35 clamp the semiconductor material, reach the clamping fixed effect, and one motor 31 drives carousel 32 to rotate around the support frame 33, and the semiconductor material on the supporting plate 344 is sent to the detection position, and the detector main body 8 is started to the thickness detection of semiconductor material, and after detection, one motor 31 is started again, and the next material to be detected is sent to the detection position, and how many materials need to be detected can be placed on the supporting plate 344, and the step of manual material changing is saved, and the semiconductor is clamped through the electric push rod 342, and the carousel 32 is automatically changed, and the semiconductor of arbitrary size can be clamped and multiple is measured at a time, and the efficiency is greatly improved, and two motors 61 and three motors 65 are connected with outside power supply, and two motors 61 drive a lead screw 62 to rotate, so that the moving frame 64 moves along the slide rod 63, and three motors 65 drive two lead screws 66 to rotate, so that the slide table 5 moves horizontally, and finally the semiconductor material position on the carousel 32 is changed, when the slide table 5 slides on the moving frame 64, the pulley 9 slides in the sliding groove 10, and the friction between the slide table 5 and the moving frame 64 can be reduced and kept moving smoothly, and the slide table 5 moves horizontally through the lead screw drive, and the relative position of the semiconductor on the carousel 32 and the detector can be changed, so that the thickness of multiple positions can be measured, and the last average value is taken, so that the result is more rigorous.

[0040] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor thickness detection device, comprising a mounting bracket (1), characterized in that: The mounting bracket (1) has a fixing groove (2) on its top, a translation mechanism (6) is provided on the inner side of the fixing groove (2), a base (4) is fixedly connected to the bottom of the mounting bracket (1), a slide (5) is provided on the top of the translation mechanism (6), a rotating mechanism (3) is provided on the top of the slide (5), a connecting mechanism (7) is provided on the outer side of the mounting bracket (1), and a detector body (8) is provided on the side of the connecting mechanism (7) away from the mounting bracket (1).

2. The semiconductor thickness detection device according to claim 1, characterized in that: The rotating mechanism (3) includes a motor (31), a turntable (32), a support frame (33), and a clamping mechanism (34). The bottom of the motor (31) is fixedly connected to the slide (5), the rotating shaft of the motor (31) is fixedly connected to the turntable (32), the bottom of the turntable (32) is rotatably connected to the support frame (33), the bottom of the support frame (33) is fixedly connected to the slide (5), and a plurality of clamping mechanisms (34) are provided on the top of the turntable (32).

3. The semiconductor thickness detection device according to claim 2, characterized in that: The clamping mechanism (34) includes a mounting plate (341), an electric push rod (342), a push plate (343), and a support plate (344). The bottom of the mounting plate (341) is fixedly connected to the turntable (32). An electric push rod (342) is provided on the upper side of the mounting plate (341). A push plate (343) is fixedly connected to one side of the electric push rod (342). A support plate (344) is fixedly connected to the lower side of the push plate (343).

4. The semiconductor thickness detection device according to claim 3, characterized in that: An anti-slip pad (35) is fixedly connected to the side of the push plate (343) away from the electric push rod (342).

5. The semiconductor thickness detection device according to claim 1, characterized in that: The translation mechanism (6) includes two motors (61), a lead screw (62), a slide bar (63), a moving frame (64), a three motors (65), and two lead screws (66). The shaft of the two motors (61) is provided with a lead screw (62). The moving frame (64) is provided on the outside of the lead screw (62). The slide bar (63) is provided on the side of the moving frame (64) away from the lead screw (62). The upper outer side of the moving frame (64) is fixedly connected to the three motors (65). The shaft of the three motors (65) is provided with two lead screws (66).

6. The semiconductor thickness detection device according to claim 5, characterized in that: The top of the movable frame (64) is provided with a slide groove (10), and the bottom of the slide table (5) is provided with pulleys (9) on both sides near the slide groove (10).

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