Test socket for silicon carbide high-power device
By using aluminum nitride ceramic and beryllium copper alloy materials and gas channel structure design, the thermal management, mechanical stability and electrical performance problems of silicon carbide high-power device test sockets have been solved, achieving high-precision testing and reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-18
- Publication Date
- 2026-03-24
AI Technical Summary
Existing silicon carbide high-power device test sockets are prone to damage under high-power conditions, have insufficient thermal management, electrical performance and mechanical stability, and high contact resistance, which affects test accuracy and reliability.
The device features a probe holder and pin seat made of aluminum nitride ceramic, a beryllium copper alloy probe, a copper-plated gold chip fixing block and an air passage structure, combined with a positioning pin and a sealing ring to ensure thermal stability, mechanical strength and low contact resistance, and an integrated heat dissipation system.
It improves the high temperature and high power performance of the test socket, reduces contact resistance, improves test accuracy, ensures precise alignment and stable fixation of the device and the socket, and effectively manages heat during the test process.
Smart Images
Figure CN224035451U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor testing application technology, specifically relating to a test socket for silicon carbide high-power devices, mainly used for testing silicon carbide (SiC) high-power devices. Background Technology
[0002] Currently, the problems with test sockets for high-power silicon carbide (SiC) devices are: (1) thermal management issues in high-power device testing; (2) insufficient electrical performance and mechanical stability of the test sockets; and (3) reliability issues of existing test sockets under high voltage and high current conditions.
[0003] The existing test sockets are prone to damage under high-power conditions and cannot meet the testing requirements of silicon carbide devices. Furthermore, the high contact resistance of the existing sockets affects testing accuracy.
[0004] To address the aforementioned issues, this utility model provides a POP chip test socket. Utility Model Content
[0005] Purpose of the utility model: The purpose of this utility model is to address the shortcomings of the prior art by providing a test socket for silicon carbide high-power devices, thereby solving the problems existing in the background art, namely, the problems of thermal management, electrical performance and mechanical stability in the prior art.
[0006] Technical Solution: This utility model provides a test socket for silicon carbide high-power devices, comprising an upper test assembly and a lower test assembly, with a chip to be tested fixed between the upper and lower test assemblies. The upper test assembly includes a pinhole probe limiting seat, a pinhole pin seat, and probes. The pinhole probe limiting seat is fixed on the pinhole pin seat, and the probes are vertically assembled through the pinhole probe limiting seat and the pinhole pin seat, respectively. The lower test assembly includes a central mounting block with an air passage, a set of upper air passage interfaces, a chip positioning frame, a chip fixing block, a lower air passage base, and a lower air passage interface. The set of upper air passage interfaces is fixed on the central mounting block with an air passage, and the lower air passage interface is fixed on the lower air passage base. The chip positioning frame is assembled on the chip fixing block, and the chip positioning frame and the chip fixing block are located within the cavity formed by the central mounting block with an air passage and the lower air passage base.
[0007] In this technical solution, the upper test component further includes a first screw for fixing the pinhole probe limiting seat and the pinhole needle seat, and a first positioning pin disposed in the same end connecting surface of the pinhole probe limiting seat and the pinhole needle seat.
[0008] In this technical solution, the probe limiting seat with pinhole and the pin seat with pinhole are respectively made of aluminum nitride ceramic, and the probe is made of beryllium copper alloy.
[0009] In this technical solution, the lower test component further includes a second screw for fixing the intermediate mounting block with air passage and the lower base with air passage, and a third screw for fixing the chip positioning frame and the chip fixing block; wherein the chip fixing block and the lower base with air passage are respectively made of copper-plated gold blocks.
[0010] In this technical solution, the lower test component further includes a second positioning pin disposed within the connection surface of the chip fixing block and the lower air passage base.
[0011] The test socket for silicon carbide high-power devices in this technical solution also includes a sealing ring disposed in the middle mounting block with air passage and the connecting surface of the pin seat with pin hole.
[0012] The test socket for silicon carbide high-power devices in this technical solution further includes a fourth screw for fixing the lower air duct base and a third positioning pin for fixing and limiting the lower air duct base.
[0013] Compared with the prior art, the beneficial effects of the present invention for a test socket for silicon carbide high-power devices are as follows: (1) Improved high temperature resistance and high power performance. The pinhole probe limit seat and the pinhole probe seat are made of high-strength aluminum nitride ceramic, which ensures the thermal stability and mechanical strength of the test socket in high-power testing; (2) Optimized contact pin design reduces contact resistance and improves test accuracy. The contact probe is made of beryllium copper alloy with high conductivity and high temperature resistance, and its surface is gold-plated to reduce contact resistance; (3) Integrated heat dissipation system effectively manages the heat during the test. The cooling medium (such as air or liquid) flows through the cooling channel to effectively dissipate the heat generated during the test. The test socket is equipped with air channels in the middle mounting block with air channels and the lower base with air channels, and air channel interfaces are installed at the same time; (4) When assembling the overall structure, the first positioning pin, the second positioning pin and the third positioning pin are used for installation limit. Such an alignment mechanism ensures the accurate alignment and stable fixation of the silicon carbide device and the test socket. Attached Figure Description
[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0015] Figure 1 This is a schematic diagram of the split structure of a test socket for silicon carbide high-power devices according to this utility model;
[0016] Figure 2 This is an exploded structural diagram of a test socket for silicon carbide high-power devices according to this utility model;
[0017] Figure 3 This is an exploded structural diagram of the upper test component of this utility model;
[0018] Figure 4 This is an exploded structural diagram of the lower test component of this utility model;
[0019] The numbers in the diagram are as follows: 10-Probe limiting seat with pinhole, 11-Pin seat with pinhole, 12-Probe, 13-First screw, 14-First positioning pin, 15-Intermediate mounting block with air passage, 16-Upper air passage interface, 17-Sealing ring, 18-Second screw, 19-Chip positioning frame, 20-Third screw, 21-Chip fixing block, 22-Lower base with air passage, 23-Lower air passage interface, 24-Chip to be tested, 25-Second positioning pin, 26-Fourth screw, 27-Third positioning pin, 150-Sealing ring slot. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.
[0021] In the description of this utility model, it should be noted that the terms "top," "bottom," "one side," "the other side," "front," "back," "middle part," "inner," "top," and "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "joined" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0022] Example 1
[0023] like Figure 1 , Figure 2 , Figure 3 and Figure 4 The test socket for silicon carbide high-power devices shown consists of an upper test component and a lower test component, with the chip to be tested 24 fixed between the upper test component and the lower test component.
[0024] The upper test assembly includes a probe limiting seat 10 with pinholes, a needle holder 11 with pinholes, and a probe 12. The probe limiting seat 10 with pinholes is fixed on the needle holder 11 with pinholes, and the probe 12 is assembled vertically through the probe limiting seat 10 with pinholes and the needle holder 11 with pinholes.
[0025] The lower test component includes an intermediate mounting block 15 with an airway, a set of upper airway interfaces 16, a chip positioning frame 19, a chip fixing block 21, a lower airway base 22, and a lower airway interface 23. The set of upper airway interfaces 16 are respectively fixed on the intermediate mounting block 15 with an airway, the lower airway interface 23 is fixed on the lower airway base 22, and the chip positioning frame 19 is assembled on the chip fixing block 21. The chip positioning frame 19 and the chip fixing block 21 are located in the cavity formed by the intermediate mounting block 15 with an airway and the lower airway base 22.
[0026] The chip under test 24 is located on the end face of the chip fixing block 21. The probe 12 passes through the probe limiting seat 10 with pinhole and the pin seat 11 with pinhole respectively and then abuts against the surface of the chip under test 24. A set of upper air channel interface 16 and lower air channel interface 23 are respectively connected to the air outlet of the blowing device to realize air blowing heat dissipation in the cavity formed by the middle mounting block 15 with air channel and the lower air channel base 22 (the blowing device is not shown in the figure and does not affect the disclosure of the technical solution of this application).
[0027] In addition, the upper test assembly preferably includes a first screw 13 for fixing the pinhole probe limiting seat 10 and the pinhole needle seat 11, and a first positioning pin 14 disposed in the same end connecting surface of the pinhole probe limiting seat 10 and the pinhole needle seat 11. The first screw 13 enables convenient assembly or disassembly between the pinhole probe limiting seat 10 and the pinhole needle seat 11. The first positioning pin 14 limits the pinhole probe limiting seat 10 and the pinhole needle seat 11 during assembly (the opposite surfaces of the pinhole probe limiting seat 10 and the pinhole needle seat 11 are respectively provided with circular slots, which are not shown in the figure and do not affect the disclosure of the technical solution of this application), and at the same time ensures the stability between the two after assembly.
[0028] In addition, the probe holder 10 with pinhole and the pin holder 11 with pinhole are preferably made of aluminum nitride ceramic to ensure thermal stability during testing and have strong mechanical strength and durability; the probe 12 is made of beryllium copper alloy, which has high conductivity, high temperature resistance and reduced contact resistance, so as to achieve accurate test information acquisition.
[0029] In addition, the preferred test assembly also includes a second screw 18 for fixing the intermediate mounting block 15 with air passage and the lower base 22 with air passage, and a third screw 20 for fixing the chip positioning frame 19 and the chip fixing block 21, so as to realize quick assembly or disassembly between the intermediate mounting block 15 with air passage and the lower base 22 with air passage, and between the chip positioning frame 19 and the chip fixing block 21.
[0030] Among them, the chip fixing block 21 and the lower air channel base 22 are made of copper-plated gold blocks, which have good chip heat dissipation performance.
[0031] In addition, the preferred test assembly also includes a second positioning pin 25 (the chip fixing block 21 and the lower air duct base 22 are respectively provided with circular slots on their opposite surfaces, which are not shown in the figure and do not affect the disclosure of the technical solution of this application) to achieve precise positioning of the chip fixing block 21 and the lower air duct base 22 during assembly, and at the same time ensure the stability between the two after assembly.
[0032] Example 2
[0033] Based on Embodiment 1, the test socket for silicon carbide high-power devices further includes a sealing ring 17 disposed in the connecting surface of the mounting block 15 with air passage and the pin seat 11 with pin hole. One side of the sealing ring 17 abuts against the side of the pin seat 11 with pin hole to achieve a seal.
[0034] The intermediate mounting block 15 with air passage has a sealing ring groove 150 that matches the sealing ring 17 on one side, so as to realize the quick alignment and assembly of the sealing ring 17 and prevent it from falling off the intermediate mounting block 15 with air passage; the sealing ring 17 is not limited to being made of rubber, which has high temperature resistance and good sealing performance.
[0035] Example 3
[0036] Based on Embodiment 1 or Embodiment 2, the test socket for silicon carbide high-power devices further includes a fourth screw 26 for fixing the lower air passage base 22, and a third positioning pin 27 for fixing and limiting the lower air passage base 22.
[0037] When the aforementioned fourth screw 26 is in operation, it fixes the lower air duct base 22 to the worktable (not shown in the figure, but it does not affect the disclosure of the technical solution of this application). At the same time, the third positioning pin 27 realizes the limitation of the assembly between the lower air duct base 22 and the worktable (the opposite surfaces of the lower air duct base 22 and the worktable are provided with circular slots, not shown in the figure, but they do not affect the disclosure of the technical solution of this application), and ensures the stability and reliability of the two after assembly.
[0038] The working principle or structural principle of this test socket for high-power silicon carbide devices:
[0039] First, the chip to be tested 24 is placed in the chip positioning frame 19, at which point the chip to be tested 24 is located on the surface of the chip fixing block 21.
[0040] Then, the probe 12 is inserted vertically into the probe limiting seat 10 with pinhole and the needle seat 11 with pinhole, respectively.
[0041] Finally, the pin holder 11 with pinhole is placed horizontally on the surface of the mounting block 15 with air channel in the middle. At the same time, the sealing ring 17 completes the sealing between the pin holder 11 with pinhole and the mounting block 15 with air channel. At this time, one end of the probe 12 contacts the solder ball pin of the chip 24 to be tested, and the other end is powered on to test the PAD on the PCB (not shown in the figure, which does not affect the disclosure of the technical solution of this application).
[0042] It should be noted that, in this document, terms such as "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0043] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A high power silicon carbide device test socket comprising: The upper test assembly and the lower test assembly are fixed with a chip (24) to be tested; The upper test assembly comprises a pinhole probe limiting seat (10), a pinhole needle seat (11) and a probe (12), the pinhole probe limiting seat (10) is fixed on the pinhole needle seat (11), and the probe (12) is vertically assembled through the pinhole probe limiting seat (10) and the pinhole needle seat (11) respectively. The lower test assembly comprises a gas channel intermediate mounting block (15), a group of upper gas channel interfaces (16), a chip positioning frame (19), a chip fixing block (21), a lower gas channel base (22) and a lower gas channel interface (23), the group of upper gas channel interfaces (16) are fixed on the gas channel intermediate mounting block (15) respectively, the lower gas channel interface (23) is fixed on the lower gas channel base (22), the chip positioning frame (19) is assembled on the chip fixing block (21), and the chip positioning frame (19) and the chip fixing block (21) are located in a cavity formed by the gas channel intermediate mounting block (15) and the lower gas channel base (22).
2. A high power silicon carbide device test socket according to claim 1, wherein: The upper test assembly further comprises a first screw (13) for fixing the pinhole probe limiting seat (10) and the pinhole needle seat (11), and a first positioning pin (14) arranged in a same-end connecting surface of the pinhole probe limiting seat (10) and the pinhole needle seat (11).
3. A high power silicon carbide device test socket according to claim 1, wherein: The pinhole probe limiting seat (10) and the pinhole needle seat (11) are respectively made of aluminum nitride ceramic, and the probe (12) is made of beryllium copper alloy.
4. A high power silicon carbide device test socket according to claim 1, wherein: The lower test assembly further comprises a second screw (18) for fixing the gas channel intermediate mounting block (15) and the lower gas channel base (22), and a third screw (20) for fixing the chip positioning frame (19) and the chip fixing block (21). The chip fixing block (21) and the lower gas channel base (22) are respectively made of copper-plated gold blocks.
5. A high power silicon carbide device test socket according to claim 4, wherein: The lower test assembly further comprises a second positioning pin (25) arranged in a connecting surface of the chip fixing block (21) and the lower gas channel base (22).
6. A high power silicon carbide device test socket according to any one of claims 1-5, wherein: The high-power silicon carbide device test socket further comprises a sealing ring (17) arranged in a connecting surface of the gas channel intermediate mounting block (15) and the pinhole needle seat (11).
7. A high power silicon carbide device test socket according to claim 6, wherein: The lower test assembly further comprises a fourth screw (26) for fixing the lower gas channel base (22), and a third positioning pin (27) for fixing the lower gas channel base (22).