Semiconductor chip processing and testing device

By designing clamping components and easy-to-disassemble components, the problems of high structural cost, inconvenient operation, and inconvenient probe replacement in existing semiconductor chip processing and testing equipment are solved. Stable clamping of semiconductor chips and convenient replacement of probes are achieved, improving the efficiency and stability of the equipment.

CN224035566UActive Publication Date: 2026-03-24SHAANXI FUTURE TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-02
Publication Date
2026-03-24

AI Technical Summary

Technical Problem

Existing semiconductor chip processing and testing equipment suffers from high structural costs, inconvenient operation, and difficulty in replacing probes. Furthermore, the clamping components are unstable and prone to falling off.

Method used

It employs clamping and easy-to-disassemble components, including a traverse component, clamping motor, bidirectional trapezoidal lead screw, square slider, clamping plate, adjusting screw, and easy-to-disassemble components. Through structures such as electric push rod, buffer component, and guide slide, it achieves stable clamping of semiconductor chips and convenient replacement of probes.

Benefits of technology

This method achieves stable clamping and fixation of semiconductor chips, reduces structural costs, facilitates the replacement of probes and continuous operation of the device, and improves the convenience and stability of operation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a semiconductor chip processing and testing device, which belongs to the technical field of semiconductor chip processing and comprises a base, an L-shaped plate is fixedly connected to one end above the base, an electric push rod is fixedly connected to the middle of the L-shaped plate, a buffer assembly is fixedly connected to the lower portion of the electric push rod, and a mounting plate is mounted below the buffer assembly. The lower portion of the mounting plate is fixedly connected with a probe, one end of the upper portion of the L-shaped plate is fixedly connected with a detector, the middle of the upper portion of the base is fixedly connected with a clamping assembly, and a convenient disassembly and assembly assembly is installed at the joint of the buffer assembly and the mounting plate. According to the utility model, the convenient dismounting assembly is arranged, the mounting plate is convenient to dismount, the probe is convenient to replace, and the structure is convenient to guide and limit the movement of the mounting plate and the probe through the guide sliding rod, so that the mounting plate and the probe can move stably.
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Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor chip processing, specifically relates to a semiconductor chip processing test device. BACKGROUND

[0002] A semiconductor chip is a kind of micro electronic device manufactured on semiconductor material, mainly used to realize specific electronic function, and is usually made of silicon, germanium or gallium arsenide etc., and the resistivity of these materials is relatively high in pure state, but the conductivity thereof can be changed by doping, and a test device needs to be used when the semiconductor chip is processed.

[0003] Chinese patent application No.202420292972.1 discloses a semiconductor chip processing test device, relating to the technical field of semiconductor chip processing, solving the problems of low work efficiency of the existing test device, inconvenient operation when taking down the semiconductor chip, and the fixed installation of the probe needle, which cannot be replaced according to different semiconductor chips, thereby reducing the practicability.

[0004] The above-mentioned patent, 1, when used, is fixed by a plurality of electric telescopic rods, so as to clamp and fix the semiconductor chip, the structure cost is high, and when used, the two clamping assemblies need to be manually pushed to move, and the loading and unloading are not convenient to use; 2, when used, the clamping plate is driven by the bidirectional screw rod to move, so as to disassemble and assemble the mounting plate and replace the probe needle of different specifications, but the disassembly structure is not stable when used, and the bidirectional screw rod has no locking structure, which is easy to fall off. UTILITY MODEL CONTENTS

[0005] To solve the problems in the above background art, the utility model provides a semiconductor chip processing test device, which has the characteristics of convenient clamping and fixing of semiconductor chip, low setting cost, convenient disassembly and assembly of mounting plate, convenient replacement of probe needle and practical structure.

[0006] In order to achieve the above object, the utility model provides the following technical scheme: A semiconductor chip processing test device, including the base, one end of base top is connected with L type board fixedly, the middle of L type board is connected with electric push rod fixedly, the lower side of electric push rod is connected with buffer assembly fixedly, the lower side of buffer assembly is installed with mounting plate, the lower side of mounting plate is connected with detection needle fixedly, one end of L type board top is connected with detector fixedly, the middle of base top is connected with clamping assembly fixedly, the connecting place of buffer assembly and mounting plate is installed with convenient dismounting assembly.

[0007] Preferably, the clamping assembly comprises a horizontal movement assembly, a clamping seat, a bidirectional trapezoidal screw rod, a clamping motor, a square slide block, a clamping plate, a side plate and an adjusting screw rod, wherein the middle of the base top is fixedly connected with the horizontal movement assembly, the upper side of the horizontal movement assembly is provided with the clamping seat, the inside of the clamping seat is rotatably connected with the bidirectional trapezoidal screw rod, one end of the bidirectional trapezoidal screw rod is fixedly connected with the clamping motor, the surface of the bidirectional trapezoidal screw rod is symmetrically connected with the square slide block in a threaded manner, the upper side of the square slide block is fixedly connected with the clamping plate, one end of the clamping seat top is connected with the adjusting screw rod in a threaded manner, one end of the adjusting screw rod is rotatably connected with the side plate, and the side plate and the clamping seat are slidably connected.

[0008] Preferably, the horizontal movement assembly comprises a horizontal movement seat, a horizontal movement trapezoidal screw rod, a horizontal movement motor, a horizontal movement slide block, a support plate and a limiting slide block, wherein the middle of the base top is fixedly connected with the horizontal movement seat, the inside of the horizontal movement seat is rotatably connected with the horizontal movement trapezoidal screw rod, one end of the horizontal movement trapezoidal screw rod is fixedly connected with the horizontal movement motor, the surface of the horizontal movement trapezoidal screw rod is connected with the horizontal movement slide block in a threaded manner, the upper side of the horizontal movement slide block is fixedly connected with the support plate, and the lower side of the horizontal movement slide block is fixedly connected with the limiting slide block.

[0009] Preferably, the surface of the bidirectional trapezoidal screw rod is sleeved with a corrugated dustproof pipe, and the surface of the horizontal movement trapezoidal screw rod is also sleeved with a corrugated dustproof pipe.

[0010] Preferably, the convenient dismounting assembly comprises a dismounting seat, a T-shaped plug block, a fixed rod, a fixed slide block and a fixed spring, wherein the lower side of the buffer assembly is fixedly connected with the dismounting seat, the side of the dismounting seat is tightly inserted with the T-shaped plug block, the side of the T-shaped plug block is tightly inserted with the fixed rod, the lower side of the fixed rod is fixedly connected with the fixed slide block, and the side of the fixed slide block is fixedly connected with the fixed spring.

[0011] Preferably, the two ends of the dismounting seat top are fixedly connected with guide slide rods, and the guide slide rods and the L-shaped plate are slidably connected.

[0012] Compared with the prior art, the utility model has the beneficial effects that:

[0013] 1. The utility model discloses a clamping assembly is set up, realized convenient semiconductor chip clamping fixed, the effect of lower structure cost, and through the horizontal displacement component, it is convenient to drive two clamping assemblies to move, can make the continuous work, this structure does not need to manually push the clamping assembly to move, and through the corrugated dustproof pipe, it is convenient to the protection of bidirectional trapezoidal screw rod and horizontal displacement trapezoidal screw rod, prevents dust adhesion.

[0014] 2. The utility model discloses a convenient dismounting assembly is set up, realized convenient installation plate dismounting to convenient replacement of detection needle, the effect of practical structure, and this structure is through the guide slide rod, and it is convenient to the movement of installation plate and detection needle is oriented and is limited to make it can move stably. DRAWINGS

[0015] Figure 1 It is the whole structure schematic view of the utility model;

[0016] Figure 2 It is the structure schematic view of the main view of the utility model;

[0017] Figure 3 It is the structure schematic view of the clamping assembly of the utility model;

[0018] Figure 4 It is the structure schematic view of the horizontal displacement component of the utility model;

[0019] Figure 5 It is the structure schematic view of the convenient dismounting assembly of the utility model.

[0020] In the drawing: 1, base; 2, clamping assembly; 21, horizontal displacement component; 22, clamping seat; 23, bidirectional trapezoidal screw rod; 24, clamping motor; 25, square slide block; 26, clamping plate; 27, corrugated dustproof pipe; 28, side plate; 29, adjusting screw; 211, horizontal displacement seat; 212, horizontal displacement trapezoidal screw rod; 213, horizontal displacement motor; 214, horizontal displacement slide block; 215, support plate; 216, limit slide block; 3, L-shaped plate; 4, electric push rod; 5, buffer assembly; 6, installation plate; 7, detection needle; 8, convenient dismounting assembly; 81, dismounting seat; 82, T-shaped plug-in block; 83, fixed rod; 84, fixed slide block; 85, fixed spring; 86, guide slide rod; 9, detector. DETAILED DESCRIPTION

[0021] The technical scheme in the embodiments of the utility model will be described below in conjunction with the drawings of the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0022] Embodiment 1

[0023] Please refer to Figures 1-5 The utility model provides the following technical scheme: a semiconductor chip processing test device, including base 1, one end fixedly connected with L type board 3 in the top of base 1, the middle fixedly connected with electric push rod 4 in L type board 3, the lower fixedly connected with buffer assembly 5 of electric push rod 4, install mounting plate 6 in the lower of buffer assembly 5, the lower fixedly connected with detection needle 7 of mounting plate 6, one end fixedly connected with detector 9 in the top of L type board 3, the middle fixedly connected with clamping assembly 2 in the top of base 1, install convenient dismounting assembly 8 at the junction of buffer assembly 5 and mounting plate 6.

[0024] Specifically, the clamping assembly 2 includes a horizontal moving assembly 21, a clamping seat 22, a bidirectional trapezoidal screw 23, a clamping motor 24, a square slide block 25, a clamping plate 26, a side plate 28, and an adjusting screw 29. The middle of the top of the base 1 is fixedly connected with the horizontal moving assembly 21. The horizontal moving assembly 21 is provided with the clamping seat 22 on the top. The clamping seat 22 is rotatably connected with the bidirectional trapezoidal screw 23 inside. One end of the bidirectional trapezoidal screw 23 is fixedly connected with the clamping motor 24. The surface of the bidirectional trapezoidal screw 23 is symmetrically connected with the square slide block 25 by screwing. The clamping plate 26 is fixedly connected with the square slide block 25 on the top. One end of the clamping seat 22 is screwedly connected with the adjusting screw 29 on the top. One end of the adjusting screw 29 is rotatably connected with the side plate 28. The side plate 28 and the clamping seat 22 are slidably connected.

[0025] By adopting the above technical scheme, the semiconductor chip is placed on the clamping seat 22, one side of the semiconductor chip is abutted with the side plate 28, and then the clamping motor 24 is started. The clamping motor 24 drives the bidirectional trapezoidal screw 23 to rotate. The rotation of the bidirectional trapezoidal screw 23 drives the square slide block 25 to move, thereby driving the clamping plate 26 to move, and the semiconductor chip is clamped and fixed. When different specifications and batches of semiconductor chips are processed, the position of the side plate 28 can be adjusted by the adjusting screw 29.

[0026] Specifically, the horizontal moving assembly 21 includes a horizontal moving seat 211, a horizontal moving trapezoidal screw 212, a horizontal moving motor 213, a horizontal moving slide block 214, a support plate 215, and a limiting slide block 216. The middle of the top of the base 1 is fixedly connected with the horizontal moving seat 211. The horizontal moving seat 211 is rotatably connected with the horizontal moving trapezoidal screw 212 inside. One end of the horizontal moving trapezoidal screw 212 is fixedly connected with the horizontal moving motor 213. The surface of the horizontal moving trapezoidal screw 212 is screwedly connected with the horizontal moving slide block 214. The horizontal moving slide block 214 is fixedly connected with the support plate 215 on the top. The horizontal moving slide block 214 is fixedly connected with the limiting slide block 216 on the bottom.

[0027] By adopting the above technical scheme, when one semiconductor chip is processed, the horizontal moving motor 213 is started, the horizontal moving motor 213 drives the horizontal moving trapezoidal screw rod 212 to rotate, the horizontal moving trapezoidal screw rod 212 rotating drives the horizontal moving sliding block 214 to move, thereby driving the supporting plate 215 to move, the clamping seat 22 is moved to one side, when the limiting sliding block 216 moves to the maximum limit, the other clamping seat 22 is moved to the position directly below the detection needle 7, and then detection is performed. During detection, the worker takes down the semiconductor chip on the clamping seat 22 after detection, and then installs a new one, so that uninterrupted testing work can be performed.

[0028] Specifically, the surface of the bidirectional trapezoidal screw rod 23 is sleeved with a corrugated dustproof pipe 27, and the surface of the horizontal moving trapezoidal screw rod 212 is also sleeved with a corrugated dustproof pipe 27.

[0029] By adopting the above technical scheme, the corrugated dustproof pipe 27 facilitates dustproof protection of the bidirectional trapezoidal screw rod 23 and the horizontal moving trapezoidal screw rod 212.

[0030] In use, the semiconductor chip is placed on the clamping seat 22, one side of the semiconductor chip is abutted against the side plate 28, the clamping motor 24 is started, the clamping motor 24 drives the bidirectional trapezoidal screw rod 23 to rotate, the bidirectional trapezoidal screw rod 23 rotating drives the square sliding block 25 to move, thereby driving the clamping plate 26 to move, the semiconductor chip is clamped and fixed, when different specifications and batches of semiconductor chips are processed, the position of the side plate 28 can be adjusted by adjusting the screw rod 29, when one semiconductor chip is processed, the horizontal moving motor 213 is started, the horizontal moving motor 213 drives the horizontal moving trapezoidal screw rod 212 to rotate, the horizontal moving trapezoidal screw rod 212 rotating drives the horizontal moving sliding block 214 to move, thereby driving the supporting plate 215 to move, the clamping seat 22 is moved to one side, when the limiting sliding block 216 moves to the maximum limit, the other clamping seat 22 is moved to the position directly below the detection needle 7, and then detection is performed. During detection, the worker takes down the semiconductor chip on the clamping seat 22 after detection, and then installs a new one, so that uninterrupted testing work can be performed. In use, the device facilitates clamping and fixing of the semiconductor chip, and has a relatively low structure cost.

[0031] Embodiment 2

[0032] The difference between the embodiment and the embodiment 1 is that specifically, the convenient disassembly and assembly assembly 8 comprises a disassembly and assembly seat 81, a T-shaped plug block 82, a fixing rod 83, a fixing sliding block 84 and a fixing spring 85, wherein the lower portion of the buffer assembly 5 is fixedly connected with the disassembly and assembly seat 81, one side of the disassembly and assembly seat 81 is tightly inserted with the T-shaped plug block 82, one side of the T-shaped plug block 82 is tightly inserted with the fixing rod 83, the lower portion of the fixing rod 83 is fixedly connected with the fixing sliding block 84, and one side of the fixing sliding block 84 is fixedly connected with the fixing spring 85.

[0033] By adopting the above technical scheme, the fixed rod 83 is pulled, the fixed rod 83 drives the fixed sliding block 84 to move and compress the fixed spring 85, the fixed rod 83 is separated from the fixed hole on one side of the T-shaped plug block 82, then the T-shaped plug block 82 and the dismounting seat 81 can be separated from one side, the mounting plate 6 is removed, different detection needles 7 are replaced, and the T-shaped plug block 82 will not directly fall off after the limiting thereof is released.

[0034] Specifically, the two ends of the dismounting seat 81 are fixedly connected with guide sliding rods 86, and the guide sliding rods 86 are slidingly connected with the L-shaped plate 3.

[0035] By adopting the above technical scheme, the movement of the mounting plate 6 and the detection needle 7 is guided and limited by the guide sliding rods 86, so that the mounting plate 6 and the detection needle 7 can stably move.

[0036] In use, the fixed rod 83 is pulled, the fixed rod 83 drives the fixed sliding block 84 to move and compress the fixed spring 85, the fixed rod 83 is separated from the fixed hole on one side of the T-shaped plug block 82, then the T-shaped plug block 82 and the dismounting seat 81 can be separated from one side, the mounting plate 6 is removed, different detection needles 7 are replaced, the T-shaped plug block 82 will not directly fall off after the limiting thereof is released, the movement of the mounting plate 6 and the detection needle 7 is guided and limited by the guide sliding rods 86, so that the mounting plate 6 and the detection needle 7 can stably move, the device is convenient to disassemble and assemble the mounting plate 6, so that the detection needle 7 is replaced, and the structure is practical.

[0037] The structure and use principle of the electric push rod 4, the buffer assembly 5, the mounting plate 6, the detection needle 7 and the detector 9 in the utility model have been disclosed in a semiconductor chip processing test device with Chinese patent application No. 202420292972.1, and the working principle is that the electric push rod 4 can drive the detection needle 7 above to move downward to detect the semiconductor chip, when the detection needle 7 contacts the pin of the semiconductor chip, at this time, the spring can buffer the detection needle 7 during detection, so that the pin of the semiconductor chip is prevented from being damaged, and the detector 9 is connected with the detection needle 7 through a wire, so that the semiconductor chip is conveniently detected.

[0038] The utility model discloses a working principle and use flow: the utility model, for semiconductor chip processing, test, use, through the clamping assembly 2 semiconductor chip clamping fixed, then through the electric push rod 4 drive mounting plate 6 and detection needle 7 remove, test, when detection needle 7 and semiconductor chip's pin contact, at this moment, through the spring of buffer assembly 5 setting can buffer detection needle 7 when testing, test, through horizontal shift subassembly 21, conveniently drive two clamping parts reciprocating motion, carry out uninterrupted testing work, when needing to replace detection needle 7, through convenient dismouting subassembly 8, can quickly dismouting mounting plate 6 to replace different specifications detection needle 7, clamping assembly 2 use, through the semiconductor chip is placed on the clamping seat 22, with the side plate 28 abuts on its side, then starts clamping motor 24, clamping motor 24 drive bi-directional trapezoidal screw 23 rotates, and bi-directional trapezoidal screw 23 rotates will drive square slide 25 to remove, thereby drive the clamping plate 26 to remove, semiconductor chip clamping fixed, when the different specifications batch semiconductor chip processing, through the position of side plate 28 can be adjusted when one semiconductor chip processing is completed, then starts horizontal shift motor 213, and horizontal shift motor 213 drive horizontal shift trapezoidal screw 212 rotates, and horizontal shift trapezoidal screw 212 rotates will drive horizontal shift slide 214 to remove, thereby drive support plate 215 to remove, and the clamping seat 22 is moved to one side, when the limit slide 216 removes to the maximum limit, another clamping seat 22 moves to the just below detection needle 7, then detects, when detecting, the staff will take down the semiconductor chip on the clamping seat 22 of detection completion, then installs new, thereby can uninterrupted testing work, make the device when using, it is convenient to semiconductor chip clamping fixed, the structure cost is lower, and convenient dismouting subassembly 8 uses, pulls fixed rod 83, and fixed rod 83 drive fixed slide 84 to remove compression fixed spring 85, make fixed rod 83 separate T type insert block 82 one side's fixed hole, then can from one side with T type insert block 82 and dismouting seat 81 separate, thereby remove mounting plate 6, replace different detection needle 7, and T type insert block 82 is convenient to remove its limit, and it will not directly fall, through guide slide 86, it is convenient to guide limit the movement of mounting plate 6 and detection needle 7, make it can stably move, make the device when using, it is convenient to mounting plate 6 dismouting to replace detection needle 7, the structure is practical.

[0039] Although the embodiments of the utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made thereto without departing from the principles and spirit of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip processing and testing device, comprising a base (1), wherein an L-shaped plate (3) is fixedly connected to one end of the base (1), an electric push rod (4) is fixedly connected to the middle of the L-shaped plate (3), a buffer assembly (5) is fixedly connected below the electric push rod (4), a mounting plate (6) is installed below the buffer assembly (5), a probe (7) is fixedly connected below the mounting plate (6), and a detector (9) is fixedly connected to one end of the L-shaped plate (3), characterized in that: The middle of the base (1) is fixedly connected with a clamping assembly (2), and the connecting part of the buffer assembly (5) and the mounting plate (6) is provided with a convenient disassembly assembly (8).

2. The apparatus of claim 1, wherein: The clamping assembly (2) comprises a horizontal moving assembly (21), a clamping seat (22), a bidirectional trapezoidal screw rod (23), a clamping motor (24), a square sliding block (25), a clamping plate (26), a side plate (28) and an adjusting screw rod (29), wherein the middle of the base (1) is fixedly connected with the horizontal moving assembly (21), the upper portion of the horizontal moving assembly (21) is provided with the clamping seat (22), the clamping seat (22) is rotatably connected with the bidirectional trapezoidal screw rod (23) in the inside, one end of the bidirectional trapezoidal screw rod (23) is fixedly connected with the clamping motor (24), the square sliding block (25) is symmetrically connected with the surface of the bidirectional trapezoidal screw rod (23) through threads, the upper portion of the square sliding block (25) is fixedly connected with the clamping plate (26), one end of the upper portion of the clamping seat (22) is threadedly connected with the adjusting screw rod (29), one end of the adjusting screw rod (29) is rotatably connected with the side plate (28), and the side plate (28) and the clamping seat (22) are slidably connected.

3. The apparatus of claim 2 wherein: the plurality of semiconductor chips are mounted on a semiconductor wafer; and the plurality of semiconductor chips are tested simultaneously. The horizontal moving assembly (21) comprises a horizontal moving seat (211), a horizontal moving trapezoidal screw rod (212), a horizontal moving motor (213), a horizontal moving sliding block (214), a supporting plate (215) and a limiting sliding block (216), wherein the middle of the base (1) is fixedly connected with the horizontal moving seat (211), the inside of the horizontal moving seat (211) is rotatably connected with the horizontal moving trapezoidal screw rod (212), one end of the horizontal moving trapezoidal screw rod (212) is fixedly connected with the horizontal moving motor (213), the surface of the horizontal moving trapezoidal screw rod (212) is threadedly connected with the horizontal moving sliding block (214), the upper portion of the horizontal moving sliding block (214) is fixedly connected with the supporting plate (215), and the lower portion of the horizontal moving sliding block (214) is fixedly connected with the limiting sliding block (216).

4. The apparatus of claim 3 wherein: The surface of the bidirectional trapezoidal screw rod (23) is sleeved with a corrugated dustproof pipe (27), and the surface of the horizontal moving trapezoidal screw rod (212) is also sleeved with a corrugated dustproof pipe (27).

5. The apparatus of claim 1 wherein: the plurality of semiconductor chips are mounted on a semiconductor wafer; and the plurality of semiconductor chips are tested simultaneously. The convenient disassembly assembly (8) comprises a disassembly seat (81), a T-shaped plug block (82), a fixed rod (83), a fixed sliding block (84) and a fixed spring (85), wherein the lower portion of the buffer assembly (5) is fixedly connected with the disassembly seat (81), the side of the disassembly seat (81) is tightly inserted with the T-shaped plug block (82), the side of the T-shaped plug block (82) is tightly inserted with the fixed rod (83), the lower portion of the fixed rod (83) is fixedly connected with the fixed sliding block (84), and the side of the fixed sliding block (84) is fixedly connected with the fixed spring (85).

6. The apparatus of claim 5 wherein: The two ends of the upper portion of the disassembly seat (81) are fixedly connected with guide sliding rods (86), and the guide sliding rods (86) and the L-shaped plate (3) are slidably connected.

Citation Information

Patent Citations

  • Semiconductor chip processing and testing device

    CN222167080U