Integrated host of audio and video processing and control system

Abstract

The utility model provides an audio and video processing and control system integrated host, which comprises a shell, a circuit board and at least one semiconductor heat dissipation assembly, the bottom of a heat dissipation fan is in screw connection with a heat dissipation fin, the heat dissipation fan is fixedly connected with the top of the shell, the bottom of the heat dissipation fin is welded with the hot end of the top of a semiconductor chilling plate, and the semiconductor chilling plate is fixedly connected with the shell. The semiconductor chilling plate is further attached to the top of the shell, a plurality of copper pipes are distributed and welded to the cold end of the bottom of the semiconductor chilling plate, and the copper pipes penetrate through the top of the shell to extend into the shell to be welded to the circuit board. When the circuit board is cooled, the semiconductor chilling plate is started to operate, the cold end at the bottom of the semiconductor chilling plate transmits cold temperature to the circuit board through the multiple copper pipes so as to rapidly cool the circuit board, heat generated by the hot end at the top of the semiconductor is transmitted to the heat dissipation fins, and the heat in the heat dissipation fins is dissipated by the heat dissipation fan outside the shell. Therefore, the circuit board can be rapidly cooled.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of integrated host computer, especially to an audio and video processing and control system integrated host computer. BACKGROUND

[0002] The audio and video processing and control system integrated host computer is a host device integrating audio and video processing, network communication and intelligent control functions, mainly used for efficient processing of multimedia audio and video signals, remote control and intelligent management of network devices. This device is commonly used in various places requiring audio and video processing and network control, such as conference rooms, exhibition displays, multimedia classrooms and smart homes, etc.

[0003] At present, when the integrated host computer is running, the internal circuit board generates a large amount of heat, and the existing technology usually uses a cooling fan to dissipate the heat of the circuit board, but the cooling fan is slow in dissipating the heat of the circuit board, cannot quickly cool the circuit board, and the cooling efficiency of the cooling fan cannot meet the requirements for the circuit board of some high-frequency working integrated host computers, so it needs to be improved. INVENTION CONTENTS

[0004] The utility model aims at providing an audio and video processing and control system integrated host computer to solve the problem that the internal circuit board generates a large amount of heat when the integrated host computer is running in the above background technology, and the existing technology usually uses a cooling fan to dissipate the heat of the circuit board, but the cooling fan is slow in dissipating the heat of the circuit board, cannot quickly cool the circuit board, and the cooling efficiency of the cooling fan cannot meet the requirements for the circuit board of some high-frequency working integrated host computers, so it needs to be improved.

[0005] The utility model solves technical problem adopts the technical scheme as follows: an audio and video processing and control system integrated host computer, including shell, circuit board and at least one semiconductor cooling assembly, the circuit board sets up in the shell, the semiconductor cooling assembly sets up at the top of the shell and is connected with the circuit board, the semiconductor cooling assembly includes cooling fan, heat dissipation fin and semiconductor refrigeration piece, the bottom of cooling fan is connected with the heat dissipation fin screw, and the cooling fan is still connected with the top of the shell fixedly, the bottom of heat dissipation fin is welded with the top hot end of semiconductor refrigeration piece, and the semiconductor refrigeration piece is still pasted with the top of the shell, the bottom cold end of semiconductor refrigeration piece is welded with a plurality of copper pipes, and each copper pipe extends in the shell and is welded with the circuit board through the top of the shell.

[0006] In some embodiments, a temperature sensor is provided on the circuit board, and the temperature sensor is electrically connected to the semiconductor refrigeration piece.

[0007] In some embodiments, the temperature sensor is an NTC thermistor temperature sensor.

[0008] In some embodiments, the bottom end of the heat dissipation fan is provided with a plate on both sides, the plate is provided with a connecting block, and a screw is embedded in the connecting block to be screwed with the top of the shell.

[0009] In some embodiments, the shell is provided with a honeycomb heat dissipation hole on both sides.

[0010] In some embodiments, the shell comprises a top shell and a bottom shell, and the top shell and the bottom shell are detachably connected.

[0011] In some embodiments, the top shell and the bottom shell are screwed.

[0012] Compared with the prior art, the utility model has the beneficial effects that:

[0013] In the utility model, a large amount of heat is generated when the circuit board is running, the heat of the circuit board can be efficiently dissipated by the semiconductor heat dissipation assembly, preferably two semiconductor heat dissipation assemblies simultaneously dissipate heat of the circuit board. When the semiconductor heat dissipation assembly is running to dissipate heat of the circuit board, the semiconductor refrigerating fin is started to run, the principle of the semiconductor refrigerating fin is based on thermoelectric effect, the top of the semiconductor refrigerating fin forms a hot end and the bottom forms a cold end, the cold end of the bottom of the semiconductor refrigerating fin transmits cold temperature to the circuit board through a plurality of copper pipes to rapidly cool the circuit board, and the hot temperature generated by the hot end of the top of the semiconductor is transmitted to the heat dissipation fin, and the heat dissipation fin is outside the shell, so that the hot temperature of the heat dissipation fin is prevented from being dissipated inside the shell, and the hot temperature in the heat dissipation fin is blown away outside the shell by the heat dissipation fan. In this way, the circuit board can be rapidly cooled, and the cooling efficiency of the circuit board is good, and the bottom cold end of the semiconductor refrigerating fin transmits cold temperature to the circuit board through a plurality of copper pipes, so that the bottom cold end of the semiconductor refrigerating fin is prevented from directly contacting the circuit board to cause the circuit board to be frozen, so that the semiconductor heat dissipation assembly used in the integrated host has the advantages of practicality and high efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0014] One or more embodiments are illustrated by way of example in the accompanying drawings that are not intended to be limiting of the embodiments. Like reference numbers in the drawings indicate like elements unless otherwise specified. The drawings in which:

[0015] Fig. 1 It is a whole structure schematic view of the audio and video processing and control system integrated host;

[0016] Fig. 2It is a structure schematic view of a top shell in a split state in an audio and video processing and control system integrated host.

[0017] Mark number explanation: 100, audio and video processing and control system integrated host; 10, shell; 101, top shell; 1011, honeycomb heat dissipation hole; 102, bottom shell; 20, circuit board; 201, temperature sensor; 30, semiconductor heat dissipation assembly; 301, heat dissipation fan; 3011, plate; 30111, connecting block; 302, heat dissipation fin; 303, semiconductor refrigeration sheet; 3031, copper pipe. Specific implementation

[0018] The technical scheme in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0019] In addition, in the present application, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features.

[0020] Please refer to Figs. 1-2 as shown, Fig. 1 It is a whole structure schematic view of an audio and video processing and control system integrated host 100; Fig. 2 It is a structure schematic view of a top shell 101 in a split state in an audio and video processing and control system integrated host 100.

[0021] The present application provides the following technical scheme: an audio and video processing and control system integrated host 100, comprising a shell 10, a circuit board 20 and at least one semiconductor heat dissipation assembly 30, the circuit board 20 is arranged in the shell 10, the semiconductor heat dissipation assembly 30 is arranged at the top of the shell 10 and connected with the circuit board 20, the semiconductor heat dissipation assembly 30 comprises a heat dissipation fan 301, a heat dissipation fin 302 and a semiconductor refrigeration sheet 303, the bottom of the heat dissipation fan 301 is screw-connected with the heat dissipation fin 302, and the heat dissipation fan 301 is further fixedly connected with the top of the shell 10, the bottom of the heat dissipation fin 302 is welded with the top hot end of the semiconductor refrigeration sheet 303, and the semiconductor refrigeration sheet 303 is further attached to the top of the shell 10, and a plurality of copper pipes 3031 are welded at the bottom cold end of the semiconductor refrigeration sheet 303, each copper pipe 3031 extends in the shell 10 through the top of the shell 10 and is welded with the circuit board 20.

[0022] In the audio and video processing and control system integration host 100 provided by the embodiment, a large amount of heat is generated when the circuit board 20 is running, and the heat of the circuit board 20 can be efficiently dissipated by the semiconductor heat dissipation assembly 30, and preferably two semiconductor heat dissipation assemblies 30 are used to dissipate heat from the circuit board 20. When the semiconductor heat dissipation assembly 30 is running to dissipate heat from the circuit board 20, the semiconductor refrigeration sheet 303 is started to run, and the principle of the semiconductor refrigeration sheet 303 is based on the thermoelectric effect. The top of the semiconductor refrigeration sheet 303 forms a hot end and a cold end at the bottom. The cold end at the bottom of the semiconductor refrigeration sheet 303 transmits cold temperature to the circuit board 20 through a plurality of copper pipes 3031 to quickly cool the circuit board 20, and the hot end at the top of the semiconductor generates heat which is transmitted to the heat dissipation fins 302. The heat dissipation fins 302 are outside the shell 10, so that the heat dissipation fins 302 can avoid emitting heat inside the shell 10. The heat in the heat dissipation fins 302 is dissipated by the heat dissipation fan 301 outside the shell 10. In this way, the circuit board 20 can be quickly cooled, and the cooling efficiency of the circuit board 20 is good. The bottom cold end of the semiconductor refrigeration sheet 303 transmits cold temperature to the circuit board 20 through a plurality of copper pipes 3031, which avoids the bottom cold end of the semiconductor refrigeration sheet 303 directly contacting the circuit board 20 and causing the circuit board 20 to be frozen. Therefore, the semiconductor heat dissipation assembly 30 used in the integrated host to dissipate heat from the circuit board 20 has the advantages of practicality and high efficiency.

[0023] In some embodiments, the temperature sensor 201 is arranged on the circuit board 20 and electrically connected to the semiconductor refrigeration sheet 303.

[0024] In specific implementation: the temperature sensor 201 is used to monitor the temperature of the circuit board 20 in real time, and the temperature sensor 201 controls the refrigeration operation of the semiconductor refrigeration sheet 303 to dissipate heat from the circuit board 20 according to the monitored temperature of the circuit board 20. Through such a setting, the semiconductor refrigeration sheet 303 can start the refrigeration and heat dissipation operation according to the temperature of the circuit board 20.

[0025] In some embodiments, the temperature sensor 201 is an NTC thermistor temperature sensor.

[0026] In specific implementation: the temperature sensor 201 is an NTC thermistor temperature sensor, which can effectively monitor the temperature of the circuit board 20. Through such a setting, the temperature sensor 201 can effectively monitor the temperature of the circuit board 20.

[0027] In some embodiments, the bottom two sides of the heat dissipation fan 301 are provided with plate blocks 3011, the plate blocks 3011 have connecting blocks 30111, and screws are embedded in the connecting blocks 30111 to be screwed with the top of the shell 10.

[0028] In the implementation, when the semiconductor heat dissipation assembly 30 is fixed on the top of the shell 10, the bottom end of the heat dissipation fan 301 is provided with a plate 3011 on both sides, and the connecting block 30111 on each plate 3011 is embedded into a screw to be fixed with the top of the shell 10, so that the semiconductor heat dissipation assembly 30 is fixed on the top of the shell 10. Through such a setting, the semiconductor heat dissipation assembly 30 can be effectively fixed on the top of the shell 10 for use.

[0029] In some embodiments, the shell 10 is provided with a honeycomb heat dissipation hole 1011 on both sides.

[0030] In the implementation, the honeycomb heat dissipation hole 1011 on both sides of the shell 10 is used to dissipate the heat inside the shell 10. Through such a setting, the honeycomb heat dissipation hole 1011 can dissipate the heat inside the shell 10 to improve the heat dissipation efficiency of the circuit board 20 inside the shell 10.

[0031] In some embodiments, the shell 10 includes a top shell 101 and a bottom shell 102, and the top shell 101 and the bottom shell 102 are detachably connected.

[0032] In the implementation, the shell 10 is composed of the top shell 101 and the bottom shell 102 which are detachably connected, so that the user can detach the bottom shell 102 from the top shell 101 to maintain the parts inside the shell 10. Through such a setting, the shell 10 is composed of the top shell 101 and the bottom shell 102 which are detachably connected, so as to facilitate the user to maintain the parts inside the shell 10.

[0033] In some embodiments, the top shell 101 and the bottom shell 102 are screw connected.

[0034] In the implementation, the top shell 101 and the bottom shell 102 are screw connected, so that when the user disassembles the shell 10, the user can disassemble the screw between the bottom shell 102 and the top shell 101 to remove the bottom shell 102 to open the inside of the shell 10 for maintenance of the internal parts. Through such a setting, the top shell 101 and the bottom shell 102 can be effectively disassembled by the user.

[0035] The basic principle and main features of the present application and the advantages of the present application are shown and described above, for those skilled in the art, obviously the present application is not limited to the details of the above exemplary embodiments, and can be realized in other specific forms without departing from the spirit or basic characteristics of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be considered as limiting the claims involved.

[0036] In addition, it should be understood that, although the present application is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that those skilled in the art can understand.

Claims

1. An audio and video processing and control system integration host, characterized in that, The application relates to a semiconductor heat dissipation assembly, which comprises a shell, a circuit board and at least one semiconductor heat dissipation component, the circuit board is arranged in the shell, the semiconductor heat dissipation component is arranged at the top of the shell and is connected with the circuit board, the semiconductor heat dissipation component comprises a heat dissipation fan, heat dissipation fins and a semiconductor refrigeration sheet, the bottom of the heat dissipation fan is screwed with the heat dissipation fins, the heat dissipation fan is further fixedly connected with the top of the shell, the bottom of the heat dissipation fins is welded with the top of the semiconductor refrigeration sheet, the semiconductor refrigeration sheet is further attached to the top of the shell, and the bottom of the semiconductor refrigeration sheet is welded with a plurality of copper pipes, each copper pipe extends in the shell through the top of the shell and is welded with the circuit board.

2. The audio video processing and control system integrated host as claimed in claim 1, wherein, A temperature sensor is arranged on the circuit board and is electrically connected with the semiconductor refrigeration sheet.

3. The audio video processing and control system integrated host as claimed in claim 2, wherein, The temperature sensor is an NTC thermistor temperature sensor.

4. The audio video processing and control system integrated host of claim 1, wherein, Plate blocks are arranged on both sides of the bottom end of the heat dissipation fan, the plate blocks are provided with connecting blocks, and screws are embedded in the connecting blocks to screw with the top of the shell.

5. The audio video processing and control system integrated host of claim 1, wherein, Honeycomb heat dissipation holes are arranged on both sides of the shell.

6. The audio video processing and control system integrated host of claim 1, wherein, The shell comprises a top shell and a bottom shell, and the top shell and the bottom shell are detachably connected.

7. The audio video processing and control system integrated host as claimed in claim 6, wherein, The top shell and the bottom shell are screwed.

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