OGS screen stacking structure
By introducing a grid-like sensing structure and a conductive shielding layer into the OGS screen stacking structure, the problem of high-frequency signal interference to image output is solved, achieving image stability and EMC compliance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-20
- Publication Date
- 2026-03-24
AI Technical Summary
In the field of in-vehicle central control system displays, the induced current caused by high-frequency antenna signals affects the image signal output, resulting in image distortion.
The OGS screen stacking structure includes a grid-like sensing structure formed by etching conductive metal material, a conductive shielding layer, and an insulating spacer, forming a closed loop to shield high-frequency signals. The induced electromotive force is dissipated through Joule heating to reduce signal interference.
It effectively reduces the interference of high-frequency signals on image signals, ensures the stability of image output, and meets EMC requirements.
Smart Images
Figure CN224035880U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to OGS screen technical field, specifically, relate to a kind of OGS screen stacking structure. BACKGROUND
[0002] There is strict EMC requirement in the field of vehicle-mounted central control system display screen at present, and many central control screens will produce image disorder risk under strong antenna radiation (such as mobile phone, interphone), the main reason is that antenna signal belongs to high frequency signal (more than 100MHz), and central control screen image output LVDS signal is about 100MHz, antenna signal (electromagnetic wave) produces induced current on the LVDS signal line on central control screen, thereby affecting normal image signal output, causing image disorder. SUMMARY
[0003] The utility model discloses a kind of OGS screen stacking structure, to solve the problems existing in prior art.
[0004] Specifically, the technical scheme of the utility model is as follows: a kind of OGS screen stacking structure is proposed, comprising:
[0005] The base material layer is composed of aluminum-silicon base material or sodium-calcium base material with a thickness of 1-2mm;
[0006] The coating layer is uniformly covered on the surface of the base material layer, and the material is AG layer, AR layer and AF layer including laminated plating;
[0007] The induction functional area is set in the VA area of the base material layer, comprising:
[0008] The sensor pattern layer is a grid-shaped induction structure etched from conductive metal material;
[0009] The first black ink layer and the second black ink layer are covered on the periphery of the sensor pattern layer;
[0010] The conductive shielding layer is set between the first black ink layer and the second black ink layer, and forms a ring-shaped shielding structure from conductive ink with a thickness of 10-20um;
[0011] The short-circuit prevention isolation area is located between the OGS binding area of the OGS screen and the conductive shielding layer, and forms an insulating separation belt with a width of
[0012] 0.3-0.8mm.
[0013] As a preferred technical scheme, the conductive shielding layer contains 1-3 concentric ring-shaped conductive belts, the distance between adjacent ring-shaped conductive belts is 0.5-1.2mm, and the width of each ring-shaped conductive belt is 0.3-0.6mm.
[0014] As a preferred technical scheme, the total thickness of the first black ink layer and the second black ink layer is 8-12 mu m.
[0015] As a preferred technical scheme, the visible light transmittance of the first ink layer and the second ink layer is <0.5%, and the near-infrared transmittance is >80%.
[0016] As a preferred technical scheme, the short-circuit prevention isolation area comprises a three-layer composite structure: a bottom solder mask layer, an epoxy resin layer with a thickness of 8-12 mu m, a middle spacing layer, and a polyimide film with a thickness of 20-30 mu m; and a surface protection layer, a UV-cured acrylic coating layer with a thickness of 5-8 mu m.
[0017] As a preferred technical scheme, the grid structure of the sensor pattern layer comprises:
[0018] First direction wires with a line width of 15-25 mu m and a pitch of 0.8-1.2 mm;
[0019] Second direction wires arranged in cross with the first direction wires at an included angle of 80-85°;
[0020] Node connection parts in the form of circular pads with a diameter of 50-80 mu m arranged at the intersection of the wires.
[0021] As a preferred technical scheme, the light transmittance of the grid structure of the sensor pattern layer is >85%.
[0022] As a preferred technical scheme, the thickness of the substrate layer is specifically 1.2 mm, 1.5 mm or 1.8 mm.
[0023] As a preferred technical scheme, the surface roughness Ra of the substrate layer is ≤0.02 mu m.
[0024] As a preferred technical scheme, the size of the OGS screen is 1-2 inches.
[0025] The beneficial effect of the utility model is: the utility model provides an OGS screen stacking structure, transparent conductive ink is screen printed between the first layer of black ink and the second layer of black ink, and it is required that the conductive ink forms a closed loop, so that the induced electromotive force becomes Joule heat and is dissipated + the conductive ink directly shields the high-frequency signal radiated to the IC or molybdenum-aluminum-molybdenum. When the high-frequency signal passes through the closed conductive coil, an induced current is formed, and the induced current is slowly removed with Joule heat, thereby indirectly weakening the signal entering the display screen. BRIEF DESCRIPTION OF DRAWINGS
[0026] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained from these drawings without creative labor.
[0027] Figure 1 A schematic diagram of an OGS screen stacking structure is provided for the embodiments of the present application.
[0028] Figure 2 A front structure schematic diagram of an OGS screen is provided for the embodiments of the present application. Figure 1 ;
[0029] Figure 3 A back structure schematic diagram of an OGS screen is provided for the embodiments of the present application. Figure 2 .
[0030] Legend of the drawings: substrate layer 1; coating layer 2; sensing function area 3; first black ink layer 4; second black ink layer 5; molybdenum-aluminum-molybdenum layer 6; conductive shielding layer 7; VA area 8; FPC 9. DETAILED DESCRIPTION
[0031] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations may, however, be implemented in many different forms and should not be construed as limited to the implementations set forth herein; rather, these implementations are provided so that this disclosure will be thorough and complete, and will fully convey the inventive aspects of example implementations to those skilled in the art. Like reference numerals may refer to like elements throughout.
[0032] Moreover, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the
[0033] The block diagrams shown in the drawings are only functional entities, and do not necessarily have to correspond to physically independent entities. That is, these functional entities can be implemented in the form of software, or in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.
[0034] The flowchart shown in the drawing is only an exemplary illustration, not necessarily including all contents and operations / steps, and not necessarily executed in the order described. For example, some operations / steps can be further decomposed, and some operations / steps can be combined or partially combined, so the actual execution order can be changed according to the actual situation.
[0035] It should be noted that "multiple" referred to in this paper means two or more.
[0036] Examples
[0037] As Figure 1 described, an OGS screen stacking structure proposed for the present embodiment includes:
[0038] The substrate layer 1 is composed of an aluminum-silicon substrate or a sodium-calcium substrate with a thickness of 1-2 mm, which improves the mechanical strength while ensuring the optical performance.
[0039] The coating layer 2 is uniformly covered on the surface of the substrate layer 1, and the material is composed of an AG layer, an AR layer and an AF layer deposited in layers; which enhances the surface hardness (up to 9H) and anti-reflection performance.
[0040] The induction functional area 3 is set in the VA area 8 of the substrate layer 1, which includes:
[0041] The sensor pattern layer is a grid-shaped induction structure etched from conductive metal material;
[0042] The first black ink layer 4 and the second black ink layer 5 are covered on the periphery of the sensor pattern layer;
[0043] As Figures 2-3 shown, it also includes a conductive shielding layer 7, which is set between the first black ink layer 4 and the second black ink layer 5, and forms a ring-shaped shielding structure from conductive ink with a thickness of 10-20 um; so that the induced electromotive force becomes Joule heat dissipation + conductive ink directly shields the high-frequency signal intended to be radiated to the IC or molybdenum-aluminum-molybdenum layer 6.
[0044] The short-circuit prevention isolation area is located between the OGS binding area of the OGS screen and the conductive shielding layer 7, forming an insulating separation strip with a width of 0.3-0.8 mm. It avoids the binding area of the OGS and prevents short circuit at the binding of the FPC 9.
[0045] Preferably, the conductive shielding layer 7 contains 1-3 concentric ring-shaped conductive strips, the distance between adjacent ring-shaped conductive strips is 0.5-1.2 mm, and the width of each ring-shaped conductive strip is 0.3-0.6 mm. The design of multiple turns of conductive shielding layer 7 improves the electromagnetic shielding effectiveness (SE≥35 dB).
[0046] Preferably, the total thickness of the first black ink layer 4 and the second black ink layer 5 can be set to 8-12 μm.
[0047] Preferably, the visible light transmittance of the first ink layer and the second ink layer is <0.5%, and the near-infrared transmittance is >80%.
[0048] Preferably, the short-circuit prevention isolation area comprises a three-layer composite structure: a bottom solder mask layer, an epoxy resin layer with a thickness of 8-12 μm, an intermediate spacing layer, a polyimide film with a thickness of 20-30 μm; a surface protection layer, a UV-cured acrylic coating layer with a thickness of 5-8 μm.
[0049] Preferably, the grid structure of the sensor pattern layer comprises:
[0050] First direction wires, line width 15-25 μm, spacing 0.8-1.2 mm;
[0051] Second direction wires, arranged in a cross shape with the first direction wires at an angle of 80-85°;
[0052] Node connection parts, circular pads with a diameter of 50-80 μm, arranged at the intersection of the wires. The above grid structure of the sensor pattern layer has a light transmittance of >85%.
[0053] Preferably, the thickness of the substrate layer 1 is specifically 1.2 mm, 1.5 mm or 1.8 mm. And the surface roughness Ra of the substrate layer 1 is ≤0.02 μm.
[0054] The above structure does not specifically limit the size, but requires the conductive ink to form a closed loop. However, the effect will be better for small-sized OGS screens, and therefore, preferably, the size of the OGS screen is set to 1-2 inches.
[0055] The above specific embodiments further specifically describe the purpose, technical scheme and beneficial effects of the present application, and it should be understood that the above description is only a specific embodiment of the present application and is not used to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. An OGS screen stacking structure, characterized in that, include: The substrate layer is composed of an aluminum-silicon substrate or a sodium-calcium substrate with a thickness of 1-2 mm; The coating layer is uniformly covered on the surface of the substrate layer, and the material includes a laminated AG layer, an AR layer and an AF layer; The sensing functional area, disposed in the VA region of the substrate layer, includes: The sensor pattern layer is a grid-like sensing structure formed by etching conductive metal material. The first black ink layer and the second black ink layer cover the periphery of the sensor pattern layer; A conductive shielding layer is disposed between the first black ink layer and the second black ink layer, and is formed into a ring shielding structure by conductive ink with a thickness of 10-20 μm; The short-circuit protection isolation zone is located between the OGS bonding area of the OGS screen and the conductive shielding layer, forming an insulating spacer with a width of 0.3-0.8mm.
2. The OGS screen stacking structure according to claim 1, characterized in that, The conductive shielding layer comprises 1-3 concentric annular conductive strips, with a spacing of 0.5-1.2 mm between adjacent annular conductive strips and a width of 0.3-0.6 mm for each annular conductive strip.
3. The OGS screen stacking structure according to claim 1, characterized in that, The total thickness of the first black ink layer and the second black ink layer is 8-12 μm.
4. The OGS screen stacking structure according to claim 3, characterized in that, The visible light transmittance of the first ink layer and the second ink layer is <0.5%, and the near-infrared transmittance is >80%.
5. The OGS screen stacking structure according to claim 1, characterized in that, The short-circuit protection isolation zone comprises a three-layer composite structure: a bottom solder resist layer, an epoxy resin layer with a thickness of 8-12μm, an intermediate spacer layer, a polyimide film with a thickness of 20-30μm, and a surface protective layer, a UV-curable acrylic coating with a thickness of 5-8μm.
6. The OGS screen stacking structure according to claim 1, characterized in that, The grid structure of the sensor pattern layer includes: The first direction conductor has a line width of 15-25μm and a spacing of 0.8-1.2mm; The second directional conductor is arranged to intersect the first directional conductor at an angle of 80-85°. The node connection part has a circular pad with a diameter of 50-80μm, which is set at the intersection of the wires.
7. The OGS screen stacking structure according to claim 6, characterized in that, The light transmittance of the grid structure of the sensor pattern layer is >85%.
8. An OGS screen stacking structure according to any one of claims 1-7, characterized in that, The thickness of the substrate layer is specifically 1.2 mm, 1.5 mm, or 1.8 mm.
9. The OGS screen stacking structure according to claim 8, characterized in that, The surface roughness Ra of the substrate layer is ≤0.02μm.
10. An OGS screen stacking structure according to any one of claims 1-7, characterized in that, The OGS screen has a size of 1 to 2 inches.