License plate

By designing a hollow structure on the license plate that corresponds to the reflective film and the groove of the substrate, stable transmission of license plate information is achieved in complex environments, solving the problems of insufficient accuracy and stability of license plate recognition in existing technologies and simplifying the system structure.

CN224035909UActive Publication Date: 2026-03-24SVG TECH GRP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-21
Publication Date
2026-03-24

AI Technical Summary

Technical Problem

Existing license plate recognition technologies lack accuracy and stability in complex environments (such as dirty, reflective, or obstructed license plate surfaces), and radio frequency identification (RFID) becomes less accurate at high speeds, increasing system complexity.

Method used

Design a license plate structure comprising a substrate, a pressure-sensitive adhesive layer, and a reflective film stacked together. The reflective film has partial cutouts that correspond to the grooves in the substrate, and a chip is embedded therein. Millimeter wave signals are used to penetrate the reflective film and communicate with the chip, ensuring stable information transmission.

Benefits of technology

In complex environments such as low visibility, dirt, strong glare, or partial obstruction, the license plate information transmission is stable and accurate, reducing system complexity and improving the reliability of license plate recognition and the communication stability of the recognition device.

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Abstract

The license plate is used for transmitting license plate information to a license plate recognition device and comprises a substrate, a pressure-sensitive adhesive layer and a reflective film which are arranged in a stacked mode, a groove is formed in the substrate, a chip is arranged in the groove, the reflective film comprises a reflective layer, the reflective layer is provided with a local hollow part, and the position of the hollow part corresponds to the position of the groove in an up-down mode. The area of the hollow is equal to the area of the chip, so that signal waves emitted by the license plate recognition device can penetrate through the reflective film and communicate with the chip arranged in the groove of the substrate. The license plate can still stably and accurately transmit license plate information even in complex environments such as low visibility, fouling, strong reflection or partial shielding.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a license plate, in particular to a license plate that can be identified by millimeter wave. BACKGROUND

[0002] Currently, the recognition of license plates mainly relies on high-definition cameras continuously capturing license plate images and using computer vision and image processing techniques for license plate recognition. This method is widely used in traffic monitoring, automatic toll collection, and parking management, etc. However, in some specific situations, the license plate images captured by the camera may be affected by external factors, leading to incorrect identification of license plate information. For example, factors such as dirty license plate surface, glare, or human obstruction may cause the quality of the license plate image to decrease, thereby affecting the accuracy and stability of the recognition system.

[0003] To solve this problem, in the related art, a radio frequency tag is embedded in the license plate, and a radio frequency reader of the license plate recognition device is combined. The system can directly read the license plate information without relying on camera shooting. Although the above-mentioned method overcomes the problem of limited environment for image recognition, the accuracy of radio frequency identification may decrease when the vehicle is running at high speed, especially in the case of high speed and long distance, signal attenuation and reflection problems may cause identification failure. In addition, the radio frequency identification technology relies on additional hardware support, such as vehicle-mounted tags and readers, which increases the complexity of the system. SUMMARY

[0004] Therefore, the purpose of the utility model is to provide a license plate that can still stably and accurately transmit license plate information in complex environments.

[0005] The utility model provides a license plate for transmitting license plate information to a license plate recognition device, comprising a substrate, a pressure-sensitive adhesive layer and a reflective film arranged in layers, the substrate is internally provided with a groove, the groove is internally provided with a chip, the reflective film comprises a reflection layer, the reflection layer is provided with a local hollow, the position of the hollow corresponds to the position of the groove, and the area of the hollow is greater than or equal to the area of the chip.

[0006] In an embodiment, the reflective film further comprises a film layer, a bead layer and a focal point layer arranged in sequence, the reflection layer is close to one side of the pressure-sensitive adhesive layer, and the film layer is away from one side of the pressure-sensitive adhesive layer.

[0007] In an embodiment, the reflective film further comprises a printing layer and a bonding layer, and the printing layer is attached to the surface of the film layer through the bonding layer.

[0008] In an embodiment, the thickness of the printing layer is 50-200 microns, the bonding layer is UV glue, the transmittance of the bonding layer is greater than 90%, and the thickness of the bonding layer is 5-20 microns.

[0009] In an embodiment, the reflective layer is a metal material, and the metal material is any one of aluminum, silver, titanium, chromium, copper, nickel or indium-tin alloy.

[0010] In an embodiment, the film layer is an acrylic adhesive layer, and the thickness is 20-40 microns.

[0011] In an embodiment, the bead layer is a semi-implanted glass bead in an acrylic adhesive, the thickness of the bead layer is 20-80 microns, the glass bead is 200-500 mesh, and the refractive index of the glass bead is 1.9 or 2.2.

[0012] In an embodiment, the groove is filled with potting glue.

[0013] In an embodiment, the potting glue is a thermosetting acrylic adhesive or a light-cured adhesive.

[0014] The license plate provided by the utility model has the advantages that a local hollow is arranged on the reflective film corresponding to the position of the groove of the substrate, so that the signal wave emitted by the license plate recognition device can penetrate the reflective film and communicate with the chip arranged in the groove of the substrate. Even in a complex environment such as low visibility, pollution, strong reflection or partial shielding, the license plate can still stably and accurately transmit license plate information. In addition, the groove arranged in the substrate provides a special accommodating space for the chip, and a larger specification chip can be designed according to actual requirements, so that the storage capacity and processing performance of the chip are improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments, and it should be understood that the following drawings only show some embodiments of the utility model, and should not be regarded as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0016] Fig. 1 A structure diagram of a license plate provided by the preferred embodiment of the utility model.

[0017] Fig. 2 A structure diagram of a reflective layer provided by the preferred embodiment of the utility model.

[0018] Reference signs:

[0019] 1, reflective film; 2, pressure-sensitive adhesive layer; 3, chip; 4, substrate; 11, printing layer; 12, laminating layer; 13, film layer; 14, bead layer; 15, focal point layer; 16, reflective layer; 41, groove; 161, hollow. DETAILED DESCRIPTION

[0020] Specific embodiments of the present application will be described in detail hereinafter with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the description of the present application, all the other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0021] In the description of the present application, unless explicitly defined and limited otherwise, the terms "set", "install", "connect" and the like should be understood in a broad sense, for example, can be fixedly connected, can also be detachably connected, or integrally connected; can be mechanically connected, can also be electrically connected; can be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to the specific circumstances.

[0022] The terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, or the orientation or positional relationship of the product of the present application when it is usually placed, and are only for the convenience of description and simplification of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0023] The terms "first", "second", "third" and the like are only used to distinguish similar attributes of elements, and do not indicate or imply relative importance or a specific order.

[0024] The terms "include", "contain" or any other variant thereof are intended to cover non-exclusive inclusion, in addition to containing the listed elements, other elements not explicitly listed can also be contained.

[0025] Please refer to Figs. 1-2The utility model embodiment provides a license plate for transmitting license plate information to license plate recognition device, and the license plate comprises substrate 4, pressure sensitive adhesive layer 2 and reflective film 1 which are arranged in layers. Wherein, the recess 41 is arranged in the substrate 4, and the chip 3 for storing license plate information is arranged in the recess 41, and the chip 3 communicates with license plate recognition device through signal wave. The reflective film 1 is adhered on the substrate 4 through pressure sensitive adhesive layer 2, and it comprises reflecting layer 16, the reflecting layer 16 is provided with partial hollow 161, and the position of hollow 161 corresponds to the position of recess 41, and the area of hollow 161 is greater than or equal to the area of chip 3. When license plate recognition device emits signal wave, signal wave passes through partial hollow 161 on reflecting layer 16 and interacts with chip 3 in the recess 41. After receiving signal wave, the chip 3 encodes and modulates the stored license plate information on the returned signal wave, and finally feeds back to license plate recognition device. Through the above setting, the license plate can maintain good data transmission performance in various complex environments, for example, when the license plate surface is contaminated, appears reflective or is partially blocked, the license plate information can still be effectively transmitted to license plate recognition equipment.

[0026] In the embodiment, the reflective film 1 further comprises a surface film layer 13, a bead implantation layer 14 and a focal point layer 15 arranged in sequence, the reflecting layer 16 is close to the pressure sensitive adhesive layer 2, and the surface film layer 13 is away from the pressure sensitive adhesive layer 2. Wherein, the surface film layer 13 is made of acrylic acid, and the thickness is 20-40 μm, which has good flexibility and transparency, can effectively protect the bead implantation layer 14, the reflecting layer 16 is mainly used for reflecting the light irradiated on the license plate, and the focal point layer 15 is used for adjusting the propagation path of the reflected light, so that it is more focused, and the high visibility of the license plate under low light conditions is ensured.

[0027] Preferably, the reflective film 1 further comprises a printing layer 11, the printing layer 11 is attached to the surface of the surface film layer 13 through the adhesive layer 12, and is made of anti-aging PVC material, and the thickness is 50-200 μm. The license plate identification information, such as vehicle number and related patterns, is printed on the surface of the printing layer 11. The anti-aging PVC material has excellent ultraviolet resistance and weather resistance, and can effectively resist the aging phenomenon of long-term exposure to sunlight, rain and high temperature and other harsh environments, thereby prolonging the service life of the license plate. Specifically, the adhesive layer 12 is UV glue, and the thickness is 5-20 μm, and the transmittance is greater than 90%, which can effectively ensure the transmission of light and signal wave, and avoid affecting the performance of other functional layers in the reflective film 1.

[0028] In this embodiment, the signal wave is a millimeter wave, which has the characteristics of short wavelength and strong penetration ability, can pass through the reflective film 1 and interact with the chip 3 embedded therein. The reflective layer 16 in the reflective film 1 is made of indium-tin alloy material. Indium-tin alloy has high reflectivity, which can effectively enhance the reflective performance of the license plate and improve the visibility of the license plate in low light or complex environment. At the same time, indium-tin alloy has excellent millimeter wave penetration performance, which can ensure that the reflective film 1 has high reflectivity without affecting the propagation of millimeter waves, thereby ensuring the stability and accuracy of communication between the chip 3 and the millimeter wave identification device.

[0029] Specifically, the pressure-sensitive adhesive layer 2 is an acrylic pressure-sensitive adhesive with a thickness of 30-80 μm. The acrylic pressure-sensitive adhesive not only has excellent adhesion, but also can maintain stable adhesion under different temperature and humidity conditions, thereby improving the environmental adaptability of the license plate.

[0030] Preferably, the bead layer 14 is a semi-embedded glass bead in acrylic glue, and the thickness of the bead layer 14 is 20-80 μm. The glass bead is 200-500 mesh, and the refractive index of the glass bead is 1.9 or 2.2, so that it can be stably fixed, and the exposed part of the glass bead can effectively reflect light under light, thereby enhancing the visibility and identification effect of the license plate.

[0031] In this embodiment, the reflective layer 16 is a metal material, which is any one of aluminum, silver, titanium, chromium, copper, nickel or indium-tin alloy. These metal materials all have high reflectivity, which can effectively improve the reflective performance. At the same time, in order to facilitate the millimeter wave to pass through, a certain size of area is positioned and marked on the surface of the metal material by laser technology, and the metal layer in the area is accurately removed, thereby forming a local hollow 161 in the reflective layer 16. Then, the whole reflective film 1 is attached to the surface of the substrate 4 and subjected to stamping processing, so that the laser-marked hollow 161 area is combined with the groove 41 on the substrate 4 to form an integrated structure.

[0032] Further, in order to protect the chip 3 and improve the structural stability, the groove 41 in the substrate 4 is filled with potting glue to seal the chip 3. The potting glue is a thermosetting acrylic glue or a light-curing glue. The thermosetting acrylic glue can form a dense cross-linked structure through a thermosetting reaction, which can provide excellent mechanical strength and weather resistance, and is especially suitable for protecting the chip 3 in harsh environments such as high temperature and humidity. The light-curing glue can be quickly cured by ultraviolet (UV) or visible light irradiation to form a uniform sealing layer, which can effectively prevent external moisture and dust from entering the groove 41 and ensure the long-term functionality of the chip 3.

[0033] It should be noted that each of the embodiments in the specification adopts a progressive manner for description, and each embodiment focuses on the difference from other embodiments, and the same and similar parts between the embodiments can be referred to each other.

[0034] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A license plate for transmitting license plate information to a license plate recognition device, characterized in that, The substrate (4), pressure-sensitive adhesive layer (2), and reflective film (1) are stacked together. The substrate (4) has a groove (41) inside, and a chip (3) is disposed inside the groove (41). The reflective film (1) includes a reflective layer (16) with a partial cutout (161). The position of the cutout (161) corresponds vertically to the position of the groove (41), and the area of ​​the cutout (161) is greater than or equal to the area of ​​the chip (3).

2. The license plate as described in claim 1, characterized in that, The reflective film (1) further includes a face film layer (13), a bead layer (14) and a focal layer (15) arranged in sequence. The reflective layer (16) is on the side close to the pressure-sensitive adhesive layer (2), and the face film layer (13) is on the side away from the pressure-sensitive adhesive layer (2).

3. The license plate as described in claim 2, characterized in that, The reflective film (1) further includes a printing layer (11) and an adhesive layer (12), wherein the printing layer (11) is attached to the surface of the mask layer (13) through the adhesive layer (12).

4. The license plate as described in claim 3, characterized in that, The thickness of the printed layer (11) is 50μm-200μm, and the bonding layer (12) is a UV adhesive with a transmittance greater than 90% and a thickness of 5μm-20μm.

5. The license plate as described in claim 1, characterized in that, The reflective layer (16) is a metallic material, which is any one of aluminum, silver, titanium, chromium, copper, nickel or indium tin alloy.

6. The license plate as described in claim 2, characterized in that, The mask layer (13) is an acrylic adhesive layer with a thickness of 20μm-40μm.

7. The license plate as described in claim 2, characterized in that, The thickness of the bead layer (14) is 20μm-80μm.

8. The license plate as described in claim 1, characterized in that, The groove (41) is filled with potting compound.

9. The license plate as described in claim 8, characterized in that, The potting compound is a thermosetting acrylic adhesive or a UV-curing adhesive.