Rectifier bridge applied to new energy automobile

Abstract

The utility model relates to the technical field of rectifier bridges, in particular to a rectifier bridge applied to a new energy automobile, which comprises a rectifier bridge body installed on a circuit board of the new energy automobile, and the rectifier bridge body comprises a substrate, a first lead, a second lead, an outer shell and a supporting heat dissipation clamping block. A rectifier bridge chip is welded above the substrate, and a plurality of micro grooves are formed in the bottom of the substrate; the micro-grooves are connected with heat conduction assemblies, and the heat conduction assemblies are used for forming heat conduction channels with the micro-grooves to conduct out heat of the substrate. The first lead and the second lead are respectively connected to the rectifier bridge chip; a dovetail groove is formed in the bottom of the outer shell, and the outer shell is clamped with the circuit board through the dovetail groove; the number of the supporting heat dissipation clamping blocks is two, and the two supporting heat dissipation clamping blocks are connected to the two sides of the bottom of the outer shell in a clamped mode and are in contact connection with the surface of the circuit board. The rectifier bridge applied to the new energy automobile provided by the utility model has the advantages of high heat dissipation efficiency and rapid installation.

Description

Technical Field

[0001] This utility model relates to the field of rectifier bridge technology, and in particular to a rectifier bridge applied to new energy vehicles. Background Technology

[0002] In recent years, severe environmental pollution has made environmental protection and energy conservation hot topics, which has also promoted the rise of some new energy industries, including new energy electric vehicles. As a power component, the rectifier bridge is widely used in various power supply equipment, including new energy vehicle charger circuits. Currently, most new energy chargers on the market use a single rectifier bridge.

[0003] The power electronic systems of new energy vehicles place increasingly stringent performance requirements on rectifier bridges, demanding high power density, high temperature resistance, lightweight design, and long lifespan. Traditional rectifier bridges suffer from the following problems: a single heat dissipation path makes it difficult to quickly dissipate the high heat generated during chip operation, leading to performance degradation or even failure; and the traditional bolt-fixing method requires significant space and is complex to disassemble during maintenance, resulting in low efficiency. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide a rectifier bridge with high heat dissipation efficiency and quick installation for use in new energy vehicles.

[0005] The present invention adopts the following technical solution:

[0006] A rectifier bridge for use in new energy vehicles includes a rectifier bridge body mounted on a circuit board of the new energy vehicle. The rectifier bridge body includes a substrate, a first lead, a second lead, a housing, and supporting heat dissipation blocks. A rectifier bridge chip is soldered onto the top of the substrate, and several micro-grooves are formed on the bottom of the substrate. The micro-grooves are connected to a heat-conducting component, which forms a heat conduction path with the micro-grooves to dissipate heat from the substrate. The first lead and the second lead are respectively connected to the rectifier bridge chip. A dovetail groove is formed on the bottom of the housing, and the housing is snapped into the circuit board through the dovetail groove. Two supporting heat dissipation blocks are provided, which are snapped into the bottom sides of the housing and respectively contact the surface of the circuit board.

[0007] A further improvement to the above technical solution is that the substrate is a silicon carbide ceramic substrate.

[0008] A further improvement to the above technical solution is that a support column is connected to the bottom end of the substrate away from the second lead, and the lower part of the support column passes through the bottom of the outer casing and is connected to the heat dissipation support block.

[0009] A further improvement to the above technical solution is that one end of the first lead is provided with a first welding section; one end of the second lead is provided with a second welding section, and one end of the second welding section is bent toward the substrate and connected to the bottom side of the substrate.

[0010] A further improvement to the above technical solution is that two first leads are provided, and the first leads are bonded to the first welding segment through a first metal wire; two second leads are provided, and the second leads are bonded to the second welding segment through a second metal wire.

[0011] A further improvement to the above technical solution is that a plurality of the microgrooves are arranged in an array along the bottom of the substrate, and the cross-sectional shape of the microgrooves is one of rectangle, trapezoid or V-shape.

[0012] A further improvement to the above technical solution is that the heat-conducting component includes several U-shaped heat-conducting bends, each U-shaped heat-conducting bend consisting of a straight section and a circular arc bend, with multiple U-shaped heat-conducting bends arranged in parallel.

[0013] A further improvement to the above technical solution is that the outer shell is a carbon fiber reinforced polymer shell.

[0014] A further improvement to the above technical solution is that the supporting heat dissipation block includes a U-shaped plate and several heat dissipation fins. The U-shaped plate is engaged with the bottom of the outer shell and abuts against the bottom of the support column. The several heat dissipation fins are arranged in an array at the bottom of the U-shaped plate.

[0015] A further improvement to the above technical solution is that the upper surface of the circuit board is provided with a locking post structure, the locking post structure including a shim block and a dovetail block, the two ends of the shim block being connected to the circuit board and the dovetail block respectively, and the dovetail block being engaged with the dovetail groove.

[0016] The beneficial effects of this utility model are as follows:

[0017] This invention increases the contact area between the substrate and the heat-conducting component by creating microgrooves in the substrate. Combined with the efficient heat conduction path design of the heat-conducting component, the heat from the substrate is quickly dissipated, improving heat dissipation efficiency. The outer shell and the circuit board are quickly snapped together via dovetail grooves, simplifying the installation process and making disassembly and assembly convenient, thus adapting to the compact space requirements of new energy vehicles. The bottom of the supporting heat dissipation block contacts the surface of the circuit board, providing mechanical support while heat is dissipated sequentially from the substrate, the heat-conducting component, the supporting heat dissipation block, and the circuit board, forming a dual heat dissipation path. This also enhances structural stability and improves shock resistance. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the rectifier bridge of this utility model applied to new energy vehicles;

[0019] Figure 2 for Figure 1 A schematic diagram of the rectifier bridge used in new energy vehicles from another angle;

[0020] Figure 3 for Figure 1 A schematic diagram of the structure of the substrate of the rectifier bridge used in new energy vehicles;

[0021] Figure 4 for Figure 3 Exploded view of the substrate and heat-conducting components of the rectifier bridge used in new energy vehicles;

[0022] Figure 5 for Figure 1 A top view of a rectifier bridge used in new energy vehicles;

[0023] Figure 6 for Figure 5 A cross-sectional view of the rectifier bridge used in new energy vehicles along the AA direction;

[0024] Figure 7 for Figure 1 A partial schematic diagram of the circuit board and the rectifier bridge body used in new energy vehicles.

[0025] Figure 8 for Figure 7 A magnified view of a portion of the circuit board and the rectifier bridge body, specifically circle A.

[0026] The numbers on the map are:

[0027] 10. Circuit board; 20. Rectifier bridge body; 30. Substrate; 31. Rectifier bridge chip; 32. Micro-groove; 33. Support column; 40. First lead; 41. First soldering section; 42. First metal wire; 50. Second lead; 51. Second soldering section; 52. Second metal wire; 60. Housing; 61. Dovetail groove; 70. Support heat dissipation block; 71. U-shaped plate; 72. Heat dissipation fins; 80. Thermal conductive component; 81. U-shaped thermal conductive bend; 90. Column structure; 91. Elevating block; 92. Dovetail block. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] In the description of this utility model, it should be noted that the terms "vertical direction," "up," "down," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or a connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] like Figures 1 to 8 The diagram illustrates an embodiment of this utility model, relating to a rectifier bridge for use in new energy vehicles. It includes a rectifier bridge body 20 mounted on a circuit board 10 of the new energy vehicle. The rectifier bridge body 20 comprises a substrate 30, a first lead 40, a second lead 50, a housing 60, and supporting heat dissipation blocks 70. A rectifier bridge chip 31 is soldered onto the top of the substrate 30, and several micro-grooves 32 are formed at the bottom of the substrate 30. A heat-conducting component 80 is connected to each micro-groove 32, forming a heat conduction path with the micro-grooves 32 to dissipate heat from the substrate 30. The first lead 40 and the second lead 50 are respectively connected to the rectifier bridge chip 31. A dovetail groove 61 is formed at the bottom of the housing 60, and the housing 60 is snapped into the circuit board 10 via the dovetail groove 61. Two supporting heat dissipation blocks 70 are provided, snapped onto the bottom sides of the housing 60, and respectively contacting the surface of the circuit board 10.

[0032] Furthermore, the substrate 30 is a silicon carbide ceramic substrate 30. Specifically, the silicon carbide ceramic substrate 30 has a high thermal conductivity, effectively withstanding the high-temperature environment during the high-power operation of new energy vehicles and extending the device lifespan.

[0033] Furthermore, a support column 33 is connected to the bottom end of the substrate 30 away from the second lead 50. The lower part of the support column 33 penetrates the bottom of the outer casing 60 and connects to the heat dissipation support block 70. Specifically, the support column 33 connects the substrate 30 to the heat dissipation support block 70, reducing the impact of vibration on the internal structure and improving shock resistance. In some embodiments, the support column 33 is a metal column, which can additionally conduct heat to the heat dissipation support block 70, enhancing the heat dissipation effect.

[0034] Furthermore, one end of the first lead 40 is provided with a first soldering section 41; one end of the second lead 50 is provided with a second soldering section 51, one end of the second soldering section 51 is bent toward the substrate 30 and connected to the bottom side of the substrate 30. Specifically, the first soldering section 41 and the bent design of the second soldering section 51 optimize the contact area between the lead and the substrate 30, reduce contact resistance, and reduce energy loss; at the same time, the bent layout of the second soldering section 51 avoids interference between the lead and other components, improving integration.

[0035] Furthermore, there are two first leads 40, which are bonded to the first solder section 41 via a first metal wire 42; there are also two second leads 50, which are bonded to the second solder section 51 via a second metal wire 52. Specifically, the metal wire bonding reduces lead inductance and signal transmission loss, making it suitable for high-frequency power electronics applications in new energy vehicles. At the same time, the dual-lead structure improves current carrying capacity and enhances system reliability.

[0036] Furthermore, a plurality of the microgrooves 32 are arranged in an array along the bottom of the substrate 30, and the cross-sectional shape of the microgrooves 32 is one of rectangular, trapezoidal or V-shaped. Specifically, the arrayed microgrooves 32 increase the contact area between the substrate 30 and the heat-conducting component 80, and the rectangular, trapezoidal or V-shaped cross-section design can be adapted to different heat-conducting media (such as coolant or air) to improve heat exchange efficiency.

[0037] Furthermore, the heat-conducting component 80 includes a plurality of U-shaped heat-conducting bends 81, each consisting of a straight section and a circular arc bend, with multiple U-shaped heat-conducting bends arranged in parallel. Specifically, the combination design of the straight and circular arc sections of the U-shaped heat-conducting bends ensures structural strength while forming dense heat dissipation channels through parallel arrangement; in some embodiments, the U-shaped heat-conducting bends 81 are made of copper alloy, which has good heat dissipation performance, strong corrosion resistance, and adaptability to complex vehicle environments.

[0038] Furthermore, the outer shell 60 is a carbon fiber reinforced polymer shell. Specifically, the carbon fiber reinforced polymer shell 60 is lightweight while possessing high rigidity, meeting the lightweight requirements of automobiles, and also effectively shielding electromagnetic interference and providing electrical insulation protection.

[0039] Furthermore, the supporting heat dissipation block 70 includes a U-shaped plate 71 and a plurality of heat dissipation fins 72. The U-shaped plate 71 is engaged with the bottom of the outer casing 60 and abuts against the lower part of the support column 33. The plurality of heat dissipation fins 72 are arrayed at the bottom of the U-shaped plate 71. Specifically, the arrayed heat dissipation fins 72 significantly increase the heat dissipation area, and combined with the structural design of the U-shaped plate, promote air convection. The abutment structure between the U-shaped plate and the support column 33 can absorb vibration energy and protect internal components.

[0040] Furthermore, the upper surface of the circuit board 10 is provided with a locking post structure 90, which includes a shim block 91 and a dovetail block 92. The two ends of the shim block 91 are respectively connected to the circuit board 10 and the dovetail block 92, and the dovetail block 92 is engaged with the dovetail groove 61. Specifically, the shim block 91 and the dovetail block 92 of the locking post structure 90 ensure the precise alignment of the outer casing 60 and the circuit board 10, avoiding poor contact caused by vibration. In some embodiments, the shim block 91 can be made of a thermally conductive material to transfer heat from the outer casing 60 to the heat dissipation structure on the back of the circuit board 10.

[0041] This invention increases the contact area between the substrate 30 and the heat-conducting component 80 by creating microgrooves 32 in the substrate 30. Combined with the efficient heat conduction path design of the heat-conducting component 80, the heat from the substrate 30 is quickly dissipated, improving heat dissipation efficiency. The outer shell 60 and the circuit board 10 are quickly connected by a dovetail groove 61, simplifying the installation process and making disassembly and assembly convenient, thus meeting the compact space requirements of new energy vehicles. The bottom of the supporting heat dissipation block 70 contacts the surface of the circuit board 10, providing mechanical support. At the same time, heat is dissipated sequentially from the substrate 30, the heat-conducting component 80, the supporting heat dissipation block 70, and the circuit board 10, forming a dual heat dissipation path. This also enhances structural stability and improves shock resistance.

[0042] The above description merely illustrates the preferred technical solution of this utility model, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and this utility model also intends to include these modifications and variations.

Claims

1. A rectifier bridge applied to a new energy vehicle, comprising a rectifier bridge body mounted on a circuit board of the new energy vehicle, characterized in that, The rectifier bridge body comprises a substrate, a first lead wire, a second lead wire, an outer shell and a supporting heat dissipation block; a rectifier bridge chip is welded above the substrate, and a plurality of micro grooves are formed in the bottom of the substrate; a heat conduction component is connected to the micro grooves, and the heat conduction component is used to form a heat conduction path with the micro grooves to conduct heat out of the substrate; the first lead wire and the second lead wire are respectively connected to the rectifier bridge chip; a dovetail groove is formed in the bottom of the outer shell, and the outer shell is clamped to the circuit board through the dovetail groove; the number of the supporting heat dissipation blocks is two, and the two supporting heat dissipation blocks are clamped to the bottom of the outer shell on both sides and are respectively connected to the surface of the circuit board.

2. The rectifier bridge for new energy vehicles according to claim 1, characterized in that, The substrate is a silicon carbide ceramic substrate.

3. The rectifier bridge for new energy vehicles according to claim 1, characterized in that, The bottom of the substrate is connected to a support column away from the second lead wire, and the support column is connected to the supporting heat dissipation block through the bottom of the outer shell.

4. The rectifier bridge for new energy vehicles according to claim 1, characterized in that, One end of the first lead wire is provided with a first welding section; one end of the second lead wire is provided with a second welding section, and one end of the second welding section is bent towards the substrate and connected to one side of the bottom of the substrate.

5. The rectifier bridge for new energy vehicles according to claim 4, characterized in that, The first lead wire is provided with two first lead wires, and the first lead wire is connected to the first welding section through a first metal wire; the second lead wire is provided with two second lead wires, and the second lead wire is connected to the second welding section through a second metal wire.

6. The rectifier bridge for new energy vehicles according to claim 1, characterized in that, The plurality of micro grooves are arrayed along the bottom of the substrate, and the cross-sectional shape of the micro groove is one of a rectangle, a trapezoid or a V shape.

7. The rectifier bridge for new energy vehicles according to claim 1, characterized in that, The heat conduction component comprises a plurality of U-shaped heat conduction bends, the U-shaped heat conduction bend is composed of a straight line segment and a circular arc bending segment, and a plurality of U-shaped heat conduction bends are arranged in parallel.

8. The rectifier bridge for new energy vehicles according to claim 1, characterized in that, The outer shell is a carbon fiber reinforced polymer shell.

9. The rectifier bridge for new energy vehicles according to claim 1, characterized in that, The supporting heat dissipation block comprises a U-shaped plate and a plurality of heat dissipation fins, the U-shaped plate is clamped to the bottom of the outer shell, the U-shaped plate abuts the lower side of the support column, and the plurality of heat dissipation fins are arrayed on the bottom of the U-shaped plate.

10. The rectifier bridge for new energy vehicles according to claim 1, characterized in that, The upper surface of the circuit board is provided with a clamping column structure, the clamping column structure comprises a pad block and a dovetail block, the two ends of the pad block are respectively connected to the circuit board and the dovetail block, and the dovetail block is clamped to the dovetail groove.

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