Wafer film pasting device

Abstract

The utility model relates to the field of wafer production, in particular to a wafer film pasting device which comprises a workbench, an L-shaped frame is fixedly connected to the upper portion of the workbench, a film pasting mechanism is installed on the outer wall of the L-shaped frame, the upper end face of the workbench is rotationally connected with a rotating disc, and two fixing mechanisms are arranged on the upper end face of the rotating disc. The film pasting mechanism comprises an electric push rod mounted on the upper end face of the L-shaped frame, the output end of the electric push rod extends to the position below the L-shaped frame and is fixedly connected with a first mounting plate, and an unwinding roller and a winding roller are mounted on the lower side of the first mounting plate through supports. A second servo motor with the output end fixedly connected with the winding roller is installed on the outer wall of the support, an electric push rod drives the unwinding roller, a pressing plate and an annular cutter to cooperatively act, integrated operation of wafer film pasting, pressing and cutting is achieved, the film pasting efficiency is remarkably improved, alternate feeding and film pasting of wafers are supported through the double-fixing-disc design of a rotary disc, and the film pasting efficiency is improved. The idle time of equipment is reduced, and the production efficiency is further optimized.

Description

TECHNICAL FIELD

[0001] The utility model relates to the wafer production field, specifically disclose a wafer film sticking device. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor circuit, and its raw material is silicon. High-purity polysilicon is dissolved and added into silicon crystal seeds, and then slowly pulled out to form cylindrical monocrystalline silicon. After the silicon rod is ground, polished and sliced, the silicon wafer is formed, that is, the wafer. At present, the domestic wafer production line mainly uses 8-inch and 12-inch wafers. The main processing method of wafer is slice processing and batch processing, that is, processing one or more wafers at the same time. With the increasing smallness of semiconductor feature size, the processing and measuring equipment is becoming more and more advanced, which makes the wafer processing appear new data characteristics. At the same time, the reduction of feature size increases the influence of the number of particles in the air on the quality and reliability of the wafer after processing, and with the improvement of cleanliness, the number of particles also shows new data characteristics.

[0003] Chinese patent CN214848564U discloses a wafer bottom film sticking device, which comprises a bottom table, a film sticking disc, a bottom film roller and a winding roller. The middle part of the upper surface of the bottom table is provided with a film sticking disc, one side of the film sticking disc is rotatably connected with a bottom film roller, the end of the bottom table away from the bottom film roller is rotatably connected with a winding roller, and the two sides of the bottom table are provided with damping rods. The bottom table is fixedly connected with a lifting frame through the damping rods, the inner wall of the lifting frame is slidably connected with a film sticking roller, one side of the lifting frame is hingedly connected with a top cover, the surface of the top cover is rotatably connected with a disc, and the surface of the disc is fixedly installed with a cutting mechanism. The lifting frame, the winding roller and the film sticking roller are arranged to pull out the bottom film at the bottom film roller and fix it to the winding roller, then the personnel can pull open the blue film, then press down the lifting frame, and the bottom film is stuck on the wafer by moving the film sticking roller. Compared with the existing two-person cooperation operation, the production labor is reduced, and the film sticking speed is improved.

[0004] The wafer bottom film sticking device disclosed in the above document needs to be manually operated by the operator to stick and cut the film on the wafer, which is complicated, and needs to be put into another wafer for sticking film after the film on one wafer is stuck, so the film sticking efficiency is low. Therefore, a wafer film sticking device is needed to solve this problem. UTILITY MODEL CONTENTS

[0005] The utility model provides a wafer film sticking device, which can complete the film sticking and cutting on the wafer at one time, and the two fixing discs are used alternately, so the film sticking speed is fast.

[0006] The utility model discloses a wafer film pasting device, including the work table, the upper fixed connection of work table has the L shape frame, the outer wall of L shape frame is installed with the film pasting mechanism, the upper end surface rotation of work table is connected with the turntable, the upper end surface of turntable is provided with two fixed mechanisms,

[0007] The film pasting mechanism includes an electric push rod mounted on the upper end surface of the L-shaped frame, the output end of the electric push rod extends to the lower side of the L-shaped frame and is fixedly connected with a first mounting plate, the lower side of the first mounting plate is provided with a pay-off roller and a winding roller through a support, the outer wall of the support is provided with a second servo motor with the output end fixedly connected with the winding roller, the lower end surface of the first mounting plate is fixedly connected with a second mounting plate through a connecting rod, the lower end surface of the second mounting plate is fixedly connected with an annular cutter, the lower side of the second mounting plate is provided with a pressing plate, the upper end surface of the pressing plate is fixedly connected with two second limiting rods, and the outer wall of the two second limiting rods is sleeved with a second spring located between the pressing plate and the second mounting plate.

[0008] As a wafer film pasting device of the utility model, the fixed mechanism includes a fixed disc and an air pump, the fixed disc is fixedly connected to the upper end surface of the turntable, a second cavity is formed in the fixed disc, a plurality of suction cups are arranged on the upper end surface of the fixed disc and communicated with the second cavity, a first cavity is formed in the turntable, and the air pump is installed in the first cavity and communicated with the second cavity through the air inlet.

[0009] As a wafer film pasting device of the utility model, the fixed mechanism further includes a limiting ring sleeved on the outer part of the fixed disc, a plurality of first limiting rods are fixedly connected to the lower end surface of the limiting ring and slidably connected with the turntable, and a first spring is sleeved on the outer wall of the plurality of first limiting rods and located between the limiting ring and the turntable.

[0010] As a wafer film pasting device of the utility model, the first servo motor is fixedly connected to the output end of the turntable and installed in the inner part of the work table.

[0011] As a wafer film pasting device of the utility model, the upper end surface of the first mounting plate is fixedly connected with two third limiting rods slidably connected with the L-shaped frame.

[0012] As a wafer film pasting device of the utility model, the outer wall of the work table is provided with a heat dissipation hole.

[0013] As a wafer film pasting device of the utility model, the outer wall of the turntable is provided with an air outlet communicated with the first cavity.

[0014] As a kind of wafer film sticking device preferred of the utility model, the outer wall of the workbench is provided with a controller, the first servo motor, electric push rod and second servo motor are all electrically connected with the controller.

[0015] The utility model has the advantages of:

[0016] 1. The coordinated action of electric push rod driving unwinding roller, pressing plate and annular cutter realizes the integrated operation of wafer film sticking, pressing and cutting, and significantly improves the film sticking efficiency.

[0017] 2. The double fixed disc design of turntable supports the alternate feeding and film sticking of wafer, reduces the idle time of equipment, and further optimizes the production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the specific embodiment of the utility model or the technical scheme in the prior art, the drawings needed in the specific embodiment or prior art description will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn according to the actual proportion.

[0019] Figure 1 It is the overall structure diagram of the utility model a kind of wafer film sticking device;

[0020] Figure 2 It is the front view sectional view of the utility model a kind of wafer film sticking device;

[0021] Figure 3 It is the right view sectional view of the utility model a kind of wafer film sticking device;

[0022] Figure 4 It is the utility model Figure 2 Enlarged view of A in the;

[0023] Figure 5 It is the utility model Figure 3 Enlarged view of B in.

[0024] In the drawing, 1, workbench;2, L-shaped frame;3, turntable;4, first servo motor;5, fixed disc;6, suction cup;7, air pump;8, limit ring;9, first limit rod;10, first spring;11, electric push rod;12, first mounting plate;13, unwinding roller;14, winding roller;15, second servo motor;16, second mounting plate;17, annular cutter;18, pressing plate;19, second limit rod;20, second spring;21, third limit rod. DETAILED DESCRIPTION

[0025] The utility model discloses make further explanation to the utility model with the help of understanding the content of the utility model with the specific embodiment and the drawing. The method used in the utility model is conventional if no special provision, and the raw material and device used are conventional market products if no special provision.

[0026] Please refer to Figures 1-5 A wafer film pasting device, including work table 1, the upper portion fixed connection of work table 1 has L-shaped frame 2, and the outer wall of L-shaped frame 2 is installed with film pasting mechanism, and the upper end surface of work table 1 is rotatably connected with carousel 3, and the upper end surface of carousel 3 is provided with two fixed mechanisms;

[0027] Film pasting mechanism includes electric push rod 11 installed on the upper end surface of L-shaped frame 2, and the output end of electric push rod 11 extends to the lower portion of L-shaped frame 2 and is fixedly connected with first mounting plate 12, and the lower side of first mounting plate 12 is installed with unwinding roller 13 and winding roller 14 through support, and the outer wall of support is installed with second servo motor 15, and the output end of second servo motor 15 is fixedly connected with winding roller 14, and the lower end surface of first mounting plate 12 is fixedly connected with second mounting plate 16 through connecting rod, and the lower end surface of second mounting plate 16 is fixedly connected with annular cutter 17, and the lower side of second mounting plate 16 is provided with pressing plate 18, and the upper end surface of pressing plate 18 is fixedly connected with two second limit rods 19, and the outer wall of two second limit rods 19 is all sleeved with second spring 20 located between pressing plate 18 and second mounting plate 16.

[0028] In the embodiment: one end of the film material is wound on unwinding roller 13, the other end is wound on winding roller 14, and the width of the film material is greater than the diameter of the wafer, the wafer is placed in the fixed mechanism, the electric push rod 11 is started, the electric push rod 11 drives the first mounting plate 12 to move downward, and then the film material is moved downward to be pasted on the wafer through unwinding roller 13 and winding roller 14, when the first mounting plate 12 moves downward, the second mounting plate 16 is driven to move downward, the second mounting plate 16 further drives the pressing plate 18 to move downward through the second limit rod 19 and the second spring 20, the film material is pressed on the wafer, the first mounting plate 12 continues to move downward, the second spring 20 is compressed, and the annular cutter 17 is driven to move downward, the film material is cut off, after film pasting is finished, the first mounting plate 12 is lifted through the electric push rod 11, the second servo motor 15 is started, the second servo motor 15 drives the winding roller 14 to rotate, the film material is pulled out again, and the excess material after cutting is wound on the winding roller 14, which is convenient for subsequent film pasting, the utility model can complete film pasting and film cutting on the wafer at one time, and the two fixed discs 5 are used alternately, so that the film pasting speed is fast.

[0029] As a technical optimization scheme of the utility model, the fixed mechanism includes fixed disc 5 and air pump 7, fixed disc 5 is fixedly connected to the upper end surface of rotating disc 3, the inside of fixed disc 5 is provided with second cavity, the upper end surface of fixed disc 5 is provided with multiple suction discs 6 that communicate with second cavity, the inside of rotating disc 3 is provided with first cavity, air pump 7 is installed in the inside of first cavity, and the air inlet communicates with second cavity.

[0030] In the embodiment: the wafer is placed on fixed disc 5, air pump 7 is started, air pump 7 generates negative pressure in second cavity, and then the wafer is adsorbed on fixed disc 5 through suction disc 6, which is convenient for fixing the wafer.

[0031] As a technical optimization scheme of the utility model, the fixed mechanism further includes the limiting ring 8 that is sleeved on the outside of fixed disc 5, the lower end surface of limiting ring 8 is fixedly connected with multiple first limiting rods 9 that are slidingly connected with rotating disc 3, and the outer wall of multiple first limiting rods 9 is sleeved with first spring 10 between limiting ring 8 and rotating disc 3.

[0032] In the embodiment: through limiting ring 8, the wafer is limited (the size of the wafer is matched with limiting ring 8), so that the wafer is located in the center of fixed disc 5, the wafer is prevented from being located outside fixed disc 5, the wafer is prevented from being damaged when cutting the film, when the annular cutter 17 moves downward and contacts limiting ring 8, limiting ring 8 is driven by annular cutter 17 to slide downward along first limiting rod 9, and the film material is conveniently cut off.

[0033] As a technical optimization scheme of the utility model, the inside of workbench 1 is installed with first servo motor 4 whose output end is fixedly connected with rotating disc 3.

[0034] In the embodiment: first servo motor 4 is started, rotating disc 3 is driven by first servo motor 4 to rotate, and then two fixed mechanisms alternately perform film pasting, and the film pasting efficiency is high.

[0035] As a technical optimization scheme of the utility model, the upper end surface of first mounting plate 12 is fixedly connected with two third limiting rods 21 that are slidingly connected with L-shaped frame 2.

[0036] In the embodiment: through third limiting rod 21, first mounting plate 12 is limited, and first mounting plate 12 moves stably up and down.

[0037] As a technical optimization scheme of the utility model, the outer wall of workbench 1 is provided with heat dissipation holes.

[0038] In the embodiment: through the heat dissipation holes arranged on the outer wall of workbench 1, first servo motor 4 is conveniently heat-dissipated.

[0039] As a technical optimization scheme of the utility model, the outer wall of rotating disc 3 is provided with air outlet that communicates with first cavity.

[0040] In the embodiment, the air outlet communicated with the first cavity is arranged on the outer wall of the rotating disc 3, so that the air pump 7 can conveniently discharge air.

[0041] As a technical optimization scheme of the utility model, the outer wall of the workbench 1 is provided with a controller, the first servo motor 4, the electric push rod 11 and the second servo motor 15 are all electrically connected with the controller.

[0042] In the embodiment, the controller is used to control the normal work of the first servo motor 4, the electric push rod 11 and the second servo motor 15.

[0043] The working principle and use process of the utility model are as follows: when used, firstly, the wafer is placed above the front fixing disc 5 (the upper surface of the wafer protrudes from the limiting ring 8), then the air pump 7 is started, the air pump 7 generates negative pressure in the second cavity, then the wafer is adsorbed on the fixing disc 5 through the suction disc 6, then the first servo motor 4 is started, the first servo motor 4 drives the rotating disc 3 to rotate, so that the fixing disc 5 on which the wafer is placed rotates to the rear side, meanwhile, the wafer is placed in the other fixing disc 5 and fixed through the suction disc 6, then the electric push rod 11 is started, the electric push rod 11 drives the first mounting plate 12 to move downwards, then the film material is moved downwards and attached to the wafer through the unwinding roller 13 and the winding roller 14, when the first mounting plate 12 moves downwards, the second mounting plate 16 is driven to move downwards, the second mounting plate 16 further drives the pressing plate 18 to move downwards through the second limiting rod 19 and the second spring 20, so that the film material is pressed on the wafer, the first mounting plate 12 continues to move downwards, so that the second spring 20 is compressed, and the annular cutter 17 is driven to move downwards, so that the film material is cut off, after the film attaching is completed, the first mounting plate 12 is lifted through the electric push rod 11, the second servo motor 15 is started, the second servo motor 15 drives the winding roller 14 to rotate, so that the film material is pulled out again, and the excess material after cutting is wound on the winding roller 14, the first servo motor 4 is continuously started to drive the rotating disc 3 to rotate, so that the film is attached to the other wafer, and meanwhile, the wafer after the film attaching is completed is taken off, the utility model can complete the film attaching and cutting of the wafer at one time through the downward pressing of the electric push rod 11, and the film attaching speed is fast through the alternate use of the two fixing discs 5.

[0044] In the description of the utility model, it should be understood that the terms "left", "right", "up", "down", "top", "bottom", "front", "rear", "inner", "outer", "back", "middle" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the utility model.

[0045] The above is only a specific embodiment of the present application, and cannot limit the scope of the present application. The replacement of equivalent components or equivalent changes and modifications within the scope of the present application should still be within the scope of the present application.

Claims

1. A wafer lamination apparatus, comprising a worktable (1), characterized in that: An L-shaped frame (2) is fixedly connected above the workbench (1). A film-applying mechanism is installed on the outer wall of the L-shaped frame (2). A turntable (3) is rotatably connected to the upper end face of the workbench (1). Two fixing mechanisms are provided on the upper end face of the turntable (3). The film application mechanism includes an electric push rod (11) mounted on the upper surface of an L-shaped frame (2). The output end of the electric push rod (11) extends to the lower part of the L-shaped frame (2) and is fixedly connected to a first mounting plate (12). A unwinding roller (13) and a take-up roller (14) are mounted on the lower side of the first mounting plate (12) via a bracket. A second servo motor (15) with its output end fixedly connected to the take-up roller (14) is mounted on the outer wall of the bracket. A second mounting plate (16) is fixedly connected to the lower surface of the first mounting plate (12) via a connecting rod. A ring cutter (17) is fixedly connected to the lower surface of the second mounting plate (16). A pressure plate (18) is provided on the lower side of the second mounting plate (16). Two second limiting rods (19) are fixedly connected to the upper surface of the pressure plate (18). A second spring (20) located between the pressure plate (18) and the second mounting plate (16) is sleeved on the outer wall of each of the two second limiting rods (19).

2. The wafer bonding device according to claim 1, characterized in that: The fixing mechanism includes a fixing plate (5) and an air pump (7). The fixing plate (5) is fixedly connected to the upper end face of the turntable (3). The fixing plate (5) has a second cavity inside. The upper end face of the fixing plate (5) is provided with a plurality of suction cups (6) communicating with the second cavity. The turntable (3) has a first cavity inside. The air pump (7) is installed inside the first cavity and its air inlet is communicating with the second cavity.

3. The wafer lamination device according to claim 2, characterized in that: The fixing mechanism also includes a limiting ring (8) sleeved on the outside of the fixing plate (5). The lower end face of the limiting ring (8) is fixedly connected with a plurality of first limiting rods (9) that are slidably connected to the turntable (3). The outer walls of the plurality of first limiting rods (9) are all sleeved with a first spring (10) located between the limiting ring (8) and the turntable (3).

4. The wafer bonding device according to claim 1, characterized in that: The workbench (1) is equipped with a first servo motor (4) whose output end is fixedly connected to the turntable (3).

5. A wafer lamination device according to claim 1, characterized in that: The upper end face of the first mounting plate (12) is fixedly connected to two third limiting rods (21) that are slidably connected to the L-shaped frame (2).

6. The wafer bonding device according to claim 1, characterized in that: The outer wall of the workbench (1) is provided with heat dissipation holes.

7. A wafer lamination device according to claim 2, characterized in that: The outer wall of the turntable (3) is provided with an air outlet that communicates with the first cavity.

8. A wafer bonding device according to claim 4, characterized in that: The outer wall of the workbench (1) is equipped with a controller, and the first servo motor (4), the electric push rod (11) and the second servo motor (15) are all electrically connected to the controller.

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